JP2002230829A - Optical disk substrate - Google Patents
Optical disk substrateInfo
- Publication number
- JP2002230829A JP2002230829A JP2001027855A JP2001027855A JP2002230829A JP 2002230829 A JP2002230829 A JP 2002230829A JP 2001027855 A JP2001027855 A JP 2001027855A JP 2001027855 A JP2001027855 A JP 2001027855A JP 2002230829 A JP2002230829 A JP 2002230829A
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- bis
- group
- hydroxyphenyl
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 230000003287 optical effect Effects 0.000 title claims abstract description 36
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 36
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 36
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 21
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000002430 hydrocarbons Chemical group 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 125000002102 aryl alkyloxo group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 125000004104 aryloxy group Chemical group 0.000 claims description 2
- IYVIAOCRWMKWLD-UHFFFAOYSA-N 1-(3-methylphenyl)-9h-fluorene Chemical compound CC1=CC=CC(C=2C=3CC4=CC=CC=C4C=3C=CC=2)=C1 IYVIAOCRWMKWLD-UHFFFAOYSA-N 0.000 claims 1
- UWDMKTDPDJCJOP-UHFFFAOYSA-N 4-hydroxy-2,2,6,6-tetramethylpiperidin-1-ium-4-carboxylate Chemical compound CC1(C)CC(O)(C(O)=O)CC(C)(C)N1 UWDMKTDPDJCJOP-UHFFFAOYSA-N 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000000 cycloalkoxy group Chemical group 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 20
- 238000010521 absorption reaction Methods 0.000 abstract description 16
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001577 copolymer Polymers 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000007334 copolymerization reaction Methods 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 14
- -1 alkyl carboxylic acid chlorides Chemical class 0.000 description 14
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 239000012760 heat stabilizer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 239000002685 polymerization catalyst Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 3
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 2
- XTEGBRKTHOUETR-UHFFFAOYSA-N 4-(4-hydroxy-3-methylphenyl)sulfonyl-2-methylphenol Chemical compound C1=C(O)C(C)=CC(S(=O)(=O)C=2C=C(C)C(O)=CC=2)=C1 XTEGBRKTHOUETR-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- OKWDECPYZNNVPP-UHFFFAOYSA-N 4-[1-[4-[2-(4-hydroxyphenyl)propyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C=C1)=CC=C1CC(C)C1=CC=C(O)C=C1 OKWDECPYZNNVPP-UHFFFAOYSA-N 0.000 description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001339 alkali metal compounds Chemical class 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001341 alkaline earth metal compounds Chemical class 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229940117389 dichlorobenzene Drugs 0.000 description 2
- VBVCYAZECWLFHP-UHFFFAOYSA-N dodecyl benzenesulfonate;tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 VBVCYAZECWLFHP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- XKMCVHMWMWTINX-UHFFFAOYSA-N (2,3,4-trichlorophenyl) dihydrogen phosphate Chemical compound OP(O)(=O)OC1=CC=C(Cl)C(Cl)=C1Cl XKMCVHMWMWTINX-UHFFFAOYSA-N 0.000 description 1
- XMNDMAQKWSQVOV-UHFFFAOYSA-N (2-methylphenyl) diphenyl phosphate Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 XMNDMAQKWSQVOV-UHFFFAOYSA-N 0.000 description 1
- RMTMGXCQEXSWLI-UHFFFAOYSA-N (2-tert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=CC=C1OP(O)O RMTMGXCQEXSWLI-UHFFFAOYSA-N 0.000 description 1
- GPFJHNSSBHPYJK-UHFFFAOYSA-N (3-methylphenyl) hydrogen carbonate Chemical compound CC1=CC=CC(OC(O)=O)=C1 GPFJHNSSBHPYJK-UHFFFAOYSA-N 0.000 description 1
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- GJDRKHHGPHLVNI-UHFFFAOYSA-N 2,6-ditert-butyl-4-(diethoxyphosphorylmethyl)phenol Chemical compound CCOP(=O)(OCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 GJDRKHHGPHLVNI-UHFFFAOYSA-N 0.000 description 1
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- DNCLEPRFPJLBTQ-UHFFFAOYSA-N 2-cyclohexyl-4-[1-(3-cyclohexyl-4-hydroxyphenyl)cyclohexyl]phenol Chemical compound OC1=CC=C(C2(CCCCC2)C=2C=C(C(O)=CC=2)C2CCCCC2)C=C1C1CCCCC1 DNCLEPRFPJLBTQ-UHFFFAOYSA-N 0.000 description 1
- WKVWOPDUENJKAR-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(3-cyclohexyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(C2CCCCC2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1CCCCC1 WKVWOPDUENJKAR-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- WJASVEQGPTWZHE-UHFFFAOYSA-N 2-phenylphenol propane Chemical compound CCC.OC1=C(C=CC=C1)C=1C=CC=CC1 WJASVEQGPTWZHE-UHFFFAOYSA-N 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-M 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=CC(CCC([O-])=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-M 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- ILQWYZZOCYARGS-UHFFFAOYSA-N 4-(4-hydroxy-3-phenylphenyl)sulfonyl-2-phenylphenol Chemical compound OC1=CC=C(S(=O)(=O)C=2C=C(C(O)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 ILQWYZZOCYARGS-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- KOWHWSRFLBFYRR-UHFFFAOYSA-N 4-[1-[3-[2-(4-hydroxyphenyl)propyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C=1)=CC=CC=1CC(C)C1=CC=C(O)C=C1 KOWHWSRFLBFYRR-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- DNLWYVQYADCTEU-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-1-adamantyl]phenol Chemical compound C1=CC(O)=CC=C1C1(CC(C2)(C3)C=4C=CC(O)=CC=4)CC3CC2C1 DNLWYVQYADCTEU-UHFFFAOYSA-N 0.000 description 1
- ZJNKCNFBTBFNMO-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-5,7-dimethyl-1-adamantyl]phenol Chemical compound C1C(C)(C2)CC(C3)(C)CC1(C=1C=CC(O)=CC=1)CC23C1=CC=C(O)C=C1 ZJNKCNFBTBFNMO-UHFFFAOYSA-N 0.000 description 1
- FWQBPSITROUNSV-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)cyclohexyl]phenol Chemical compound C1=CC(O)=CC=C1C1CC(C=2C=CC(O)=CC=2)CCC1 FWQBPSITROUNSV-UHFFFAOYSA-N 0.000 description 1
- WZCQOMUGRAWORP-UHFFFAOYSA-N 4-[4-(4-hydroxyphenyl)cyclohexyl]phenol Chemical compound C1=CC(O)=CC=C1C1CCC(C=2C=CC(O)=CC=2)CC1 WZCQOMUGRAWORP-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical class OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- NIRSLTRUGPOWCX-UHFFFAOYSA-N C1=CC(O)=CC=C1C1CC2C(C(C3)C=4C=CC(O)=CC=4)CC3C2C1 Chemical compound C1=CC(O)=CC=C1C1CC2C(C(C3)C=4C=CC(O)=CC=4)CC3C2C1 NIRSLTRUGPOWCX-UHFFFAOYSA-N 0.000 description 1
- 125000000041 C6-C10 aryl group Chemical group 0.000 description 1
- JYFHYPJRHGVZDY-UHFFFAOYSA-N Dibutyl phosphate Chemical compound CCCCOP(O)(=O)OCCCC JYFHYPJRHGVZDY-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910005872 GeSb Inorganic materials 0.000 description 1
- 101000650817 Homo sapiens Semaphorin-4D Proteins 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 241000556720 Manga Species 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 102100027744 Semaphorin-4D Human genes 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- XDODWINGEHBYRT-UHFFFAOYSA-N [2-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1CO XDODWINGEHBYRT-UHFFFAOYSA-N 0.000 description 1
- LUSFFPXRDZKBMF-UHFFFAOYSA-N [3-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCC(CO)C1 LUSFFPXRDZKBMF-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- ZVQOOHYFBIDMTQ-UHFFFAOYSA-N [methyl(oxido){1-[6-(trifluoromethyl)pyridin-3-yl]ethyl}-lambda(6)-sulfanylidene]cyanamide Chemical compound N#CN=S(C)(=O)C(C)C1=CC=C(C(F)(F)F)N=C1 ZVQOOHYFBIDMTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920003232 aliphatic polyester Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical class ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- MUCRFDZUHPMASM-UHFFFAOYSA-N bis(2-chlorophenyl) carbonate Chemical compound ClC1=CC=CC=C1OC(=O)OC1=CC=CC=C1Cl MUCRFDZUHPMASM-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- QYJXDIUNDMRLAO-UHFFFAOYSA-N butyl 4-methylbenzenesulfonate Chemical compound CCCCOS(=O)(=O)C1=CC=C(C)C=C1 QYJXDIUNDMRLAO-UHFFFAOYSA-N 0.000 description 1
- NIKBCKTWWPVAIC-UHFFFAOYSA-N butyl benzenesulfonate Chemical compound CCCCOS(=O)(=O)C1=CC=CC=C1 NIKBCKTWWPVAIC-UHFFFAOYSA-N 0.000 description 1
- ZWRWUGGYDBHANL-UHFFFAOYSA-N butyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCC)OC1=CC=CC=C1 ZWRWUGGYDBHANL-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- GLOQRSIADGSLRX-UHFFFAOYSA-N decyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCC)OC1=CC=CC=C1 GLOQRSIADGSLRX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- QLVWOKQMDLQXNN-UHFFFAOYSA-N dibutyl carbonate Chemical compound CCCCOC(=O)OCCCC QLVWOKQMDLQXNN-UHFFFAOYSA-N 0.000 description 1
- NMAKPIATXQEXBT-UHFFFAOYSA-N didecyl phenyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OC1=CC=CC=C1 NMAKPIATXQEXBT-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- WZPMZMCZAGFKOC-UHFFFAOYSA-N diisopropyl hydrogen phosphate Chemical compound CC(C)OP(O)(=O)OC(C)C WZPMZMCZAGFKOC-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- MKZVQIIAAIPNGH-UHFFFAOYSA-N dioctyl phenyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OC1=CC=CC=C1 MKZVQIIAAIPNGH-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- XDRMBCMMABGNMM-UHFFFAOYSA-N ethyl benzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=CC=C1 XDRMBCMMABGNMM-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 150000002291 germanium compounds Chemical class 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 1
- CZXGXYBOQYQXQD-UHFFFAOYSA-N methyl benzenesulfonate Chemical compound COS(=O)(=O)C1=CC=CC=C1 CZXGXYBOQYQXQD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KDQQMEAEIKFPLQ-UHFFFAOYSA-N n-(1-cyanocyclohexyl)-2-fluorobenzamide Chemical compound FC1=CC=CC=C1C(=O)NC1(C#N)CCCCC1 KDQQMEAEIKFPLQ-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- GVMDZMPQYYHMSV-UHFFFAOYSA-N octyl benzenesulfonate Chemical compound CCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVMDZMPQYYHMSV-UHFFFAOYSA-N 0.000 description 1
- KCRLWVVFAVLSAP-UHFFFAOYSA-N octyl dihydrogen phosphite Chemical compound CCCCCCCCOP(O)O KCRLWVVFAVLSAP-UHFFFAOYSA-N 0.000 description 1
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- RJMTUAMLNHKEJL-UHFFFAOYSA-N octyl phenylmethanesulfonate Chemical compound CCCCCCCCOS(=O)(=O)CC1=CC=CC=C1 RJMTUAMLNHKEJL-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000002908 osmium compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- KZQFPRKQBWRRHQ-UHFFFAOYSA-N phenyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC1=CC=CC=C1 KZQFPRKQBWRRHQ-UHFFFAOYSA-N 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- SMIZARYCGYRDGF-UHFFFAOYSA-N phenyl dipropan-2-yl phosphite Chemical compound CC(C)OP(OC(C)C)OC1=CC=CC=C1 SMIZARYCGYRDGF-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-M toluene-4-sulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-M 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Landscapes
- Polyesters Or Polycarbonates (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、特定の脂肪族−芳
香族共重合ポリカーボネート樹脂より形成された光ディ
スク基板に関する。更に詳しくは、低吸水性で、流動性
に優れ、光弾性定数が小さい特定の脂肪族−芳香族共重
合ポリカーボネート樹脂より形成された反りの少ない光
ディスク基板に関するものである。The present invention relates to an optical disk substrate formed of a specific aliphatic-aromatic copolymer polycarbonate resin. More particularly, the present invention relates to an optical disk substrate having low water absorption, excellent fluidity, and low warpage formed from a specific aliphatic-aromatic copolymer polycarbonate resin having a small photoelastic constant.
【0002】[0002]
【従来の技術】従来、2,2−ビス(4−ヒドロキシフ
ェニル)プロパン(以下、ビスフェノールAと称する)
にカーボネート前駆物質を反応させて得られるポリカー
ボネート樹脂は透明性、耐熱性、機械的特性、寸法安定
性が優れているがゆえにエンジニアリングプラスチック
として多くの分野に幅広く使用されている。更に近年そ
の透明性を生かして光ディスク、光ファイバー、レンズ
等の分野への光学用材料としての利用が展開されてお
り、特に光ディスクの分野で情報記録媒体用基板の素材
として広く使用されている。2. Description of the Related Art Conventionally, 2,2-bis (4-hydroxyphenyl) propane (hereinafter referred to as bisphenol A).
Polycarbonate resins obtained by reacting a carbonate precursor with phenol are excellent in transparency, heat resistance, mechanical properties, and dimensional stability, and are therefore widely used as engineering plastics in many fields. Further, in recent years, utilization of the transparency as an optical material in the fields of optical disks, optical fibers, lenses, and the like has been developed, and in particular, it has been widely used as a material for substrates for information recording media in the field of optical disks.
【0003】しかしながら、近年の記録情報の大容量化
は、情報を記録再生する際の光ディスクの寸法安定性へ
の要求をますます厳しいものにしてきており、ビスフェ
ノールAから得られる従来のポリカーボネート樹脂では
その要求を十分に満足できなくなりつつある。特に吸水
により生じる光ディスクの反りによって起こるエラー
は、成形品における寸法の制御精密化に伴い、重要な問
題となってきており、早急な改善が求められている。However, the recent increase in the capacity of recorded information has made the requirements for the dimensional stability of optical discs for recording and reproducing information more and more severe, and the conventional polycarbonate resin obtained from bisphenol A has The demands are no longer being fully satisfied. In particular, an error caused by warpage of an optical disk caused by water absorption has become an important problem with precise control of dimensions of a molded product, and urgent improvement is required.
【0004】一方、ビスフェノールAから得られるポリ
カーボネート樹脂は、ベンゼン環の光学異方性から光弾
性定数が大きく、成形品の複屈折が大きい欠点がある。
また、複屈折は成形条件によってある程度の改善が可能
である。すなわち、ディスク基板の射出成形時におい
て、粘性の低い条件で樹脂を射出させて、樹脂の配向性
を低減化させることにより、光学異方性が少なく、複屈
折の小さいディスク基板を成形することが試みられてい
る。On the other hand, the polycarbonate resin obtained from bisphenol A has a disadvantage that the photoelastic constant is large due to the optical anisotropy of the benzene ring, and the birefringence of the molded product is large.
The birefringence can be improved to some extent depending on the molding conditions. That is, during the injection molding of the disk substrate, the resin is injected under low viscosity conditions to reduce the orientation of the resin, whereby a disk substrate with low optical anisotropy and small birefringence can be formed. Attempted.
【0005】しかしながら、射出条件のみでディスクの
複屈折の低減を図るには限度があり、ポリマーの構造自
体を変えることにより、光弾性定数の低い、高流動性を
有する樹脂が求められている。However, there is a limit in reducing the birefringence of the disk only by the injection conditions, and a resin having a low photoelastic constant and a high fluidity is required by changing the structure of the polymer itself.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は、上記
問題点を解決しようとするものであり、透明性、耐熱
性、耐衝撃性が良好で、低吸水性で、流動性に優れ、光
弾性定数の小さいポリカーボネート樹脂より形成される
反りが少なく複屈折の小さい光ディスク基板を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and has good transparency, heat resistance and impact resistance, low water absorption and excellent fluidity. An object of the present invention is to provide an optical disk substrate having a small birefringence and a small warpage formed from a polycarbonate resin having a small photoelastic constant.
【0007】本発明者らは上記課題を解決すべく鋭意検
討した結果、ある特定の構造を有する脂肪族ジオールを
二価フェノールと共重合させることにより得られる共重
合ポリカーボネート樹脂を用いて光ディスク基板とする
ことによって、上記目的を達成できることを見出した。The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems. As a result, an optical disc substrate was formed using a copolymerized polycarbonate resin obtained by copolymerizing an aliphatic diol having a specific structure with a dihydric phenol. By doing so, it has been found that the above object can be achieved.
【0008】[0008]
【課題を解決するための手段】すなわち、本発明によれ
ば、下記一般式[1]According to the present invention, the following general formula [1]
【0009】[0009]
【化4】 Embedded image
【0010】で表わされる構成単位および下記一般式
[2]And a structural unit represented by the following general formula [2]:
【0011】[0011]
【化5】 Embedded image
【0012】[上記式[2]において、R1及びR2はそ
れぞれ独立して水素原子、ハロゲン原子、炭素数1〜1
0のアルキル基、炭素数1〜10のアルコキシ基、炭素
数6〜20のシクロアルキル基、炭素数6〜20のシク
ロアルコキシ基、炭素数6〜10のアリール基、炭素数
7〜20のアラルキル基、炭素数6〜10のアリールオ
キシ基、炭素数7〜20のアラルキルオキシ基、であっ
て、m及びnは夫々0〜4の整数であり、Wは炭素数5
〜12の脂環式炭化水素基もしくは[In the above formula [2], R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a carbon atom of 1 to 1;
0 alkyl group, C1-C10 alkoxy group, C6-C20 cycloalkyl group, C6-C20 cycloalkoxy group, C6-C10 aryl group, C7-C20 aralkyl A aryloxy group having 6 to 10 carbon atoms and an aralkyloxy group having 7 to 20 carbon atoms, wherein m and n are each an integer of 0 to 4, and W is 5 carbon atoms.
~ 12 alicyclic hydrocarbon groups or
【0013】[0013]
【化6】 Embedded image
【0014】好ましくはPreferably,
【0015】[0015]
【化7】 Embedded image
【0016】であり、ここにR3、R4は同一又は異な
り、水素原子または炭素数1〜10の炭化水素基を表わ
し、R5及びR6はそれぞれ独立して水素原子又は炭素数
1〜3のアルキル基、pは4〜7の整数、R7及びR8は
それぞれ独立して水素原子、ハロゲン原子又は炭素数1
〜3のアルキル基である。]で表わされる構成単位から
なり、且つ一般式[1]で表される構成単位のモル分率
が15〜90モル%である共重合ポリカーボネート樹脂
から形成される光ディスク基板が提供される。Wherein R 3 and R 4 are the same or different and each represent a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and R 5 and R 6 are each independently a hydrogen atom or a carbon atom having 1 to 10 carbon atoms. 3 is an alkyl group, p is an integer of 4 to 7, R 7 and R 8 are each independently a hydrogen atom, a halogen atom or a carbon atom of 1;
To 3 alkyl groups. An optical disk substrate is provided which is formed from a copolymerized polycarbonate resin comprising the structural unit represented by the general formula [1] and having a molar fraction of 15 to 90 mol% of the structural unit represented by the general formula [1].
【0017】本発明の前記一般式[1]で表わされる構
成単位を誘導する脂肪族ジオールとしては、シス体、ト
ランス体又はシス/トランス体の混合物でも良く、1,
2−シクロヘキサンジメタノール、1,3−シクロヘキ
サンジメタノール、1,4−シクロヘキサンジメタノー
ルが挙げられる。中でも、1,4−シクロヘキサンジメ
タノールが好ましい。また、これらは単独または二種以
上組み合わせて用いてもよい。The aliphatic diol for deriving the structural unit represented by the above general formula [1] of the present invention may be a cis-form, a trans-form or a mixture of cis-trans-forms.
2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, and 1,4-cyclohexanedimethanol are exemplified. Among them, 1,4-cyclohexanedimethanol is preferred. These may be used alone or in combination of two or more.
【0018】また、前記一般式[2]で表わされる構成
単位を誘導する二価フェノールとしては、例えば、4,
4’−ジヒドロキシビフェニル、ビス(4−ヒドロキシ
フェニル)メタン、1,1−ビス(4−ヒドロキシフェ
ニル)エタン、1,1−ビス(4−ヒドロキシフェニ
ル)−1−フェニルエタン、2,2−ビス(4−ヒドロ
キシフェニル)プロパン、2,2−ビス(4−ヒドロキ
シ−3−メチルフェニル)プロパン、1,1−ビス(4
−ヒドロキシフェニル)−3,3,5−トリメチルシク
ロヘキサン、2,2−ビス(4−ヒドロキシ−3,3’
−ビフェニル)プロパン、2,2−ビス(4−ヒドロキ
シ−3−イソプロピルフェニル)プロパン、2,2−ビ
ス(3−t−ブチル−4−ヒドロキシフェニル)プロパ
ン、2,2−ビス(4−ヒドロキシフェニル)ブタン、
2,2−ビス(4−ヒドロキシフェニル)オクタン、
2,2−ビス(3−ブロモ−4−ヒドロキシフェニル)
プロパン、2,2−ビス(3,5−ジブロモ−4−ヒド
ロキシフェニル)プロパン、2,2−ビス(3,5−ジ
クロロ−4−ヒドロキシフェニル)プロパン、2,2−
ビス(3,5−ジメチル−4−ヒドロキシフェニル)プ
ロパン、2,2−ビス(3−シクロヘキシル−4−ヒド
ロキシフェニル)プロパン、1,1−ビス(3−シクロ
ヘキシル−4−ヒドロキシフェニル)シクロヘキサン、
ビス(4−ヒドロキシフェニル)ジフェニルメタン、
9,9−ビス(4−ヒドロキシフェニル)フルオレン、
9,9−ビス(4−ヒドロキシ−3−メチルフェニル)
フルオレン、1,1−ビス(4−ヒドロキシフェニル)
シクロヘキサン、1,1−ビス(4−ヒドロキシフェニ
ル)シクロペンタン、4,4’−ジヒドロキシジフェニ
ルエ−テル、4,4’−ジヒドロキシ−3,3’−ジメ
チルジフェニルエ−テル、4,4’−スルホニルジフェ
ノール、4,4’−ジヒドロキシジフェニルスルホキシ
ド、4,4’−ジヒドロキシジフェニルスルフィド、
2,2’−ジメチル−4,4’−スルホニルジフェノー
ル、4,4’−ジヒドロキシ−3,3’−ジメチルジフ
ェニルスルホキシド、4,4’−ジヒドロキシ−3,
3’−ジメチルジフェニルスルフィド、2,2’−ジフ
ェニル−4,4’−スルホニルジフェノール、4,4’
−ジヒドロキシ−3,3’−ジフェニルジフェニルスル
ホキシド、4,4’−ジヒドロキシ−3,3’−ジフェ
ニルジフェニルスルフィド、1,3−ビス{2−(4−
ヒドロキシフェニル)プロピル}ベンゼン、1,4−ビ
ス{2−(4−ヒドロキシフェニル)プロピル}ベンゼ
ン、1,4−ビス(4−ヒドロキシフェニル)シクロヘ
キサン、1,3−ビス(4−ヒドロキシフェニル)シク
ロヘキサン、4,8−ビス(4−ヒドロキシフェニル)
トリシクロ[5.2.1.02,6]デカン、4,4’−
(1,3−アダマンタンジイル)ジフェノール、1,3
−ビス(4−ヒドロキシフェニル)−5,7−ジメチル
アダマンタン等が挙げられる。Examples of the dihydric phenol for deriving the structural unit represented by the general formula [2] include, for example, 4,
4'-dihydroxybiphenyl, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 1,1-bis (4
-Hydroxyphenyl) -3,3,5-trimethylcyclohexane, 2,2-bis (4-hydroxy-3,3 ′
-Biphenyl) propane, 2,2-bis (4-hydroxy-3-isopropylphenyl) propane, 2,2-bis (3-t-butyl-4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy Phenyl) butane,
2,2-bis (4-hydroxyphenyl) octane,
2,2-bis (3-bromo-4-hydroxyphenyl)
Propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 2,2-bis (3,5-dichloro-4-hydroxyphenyl) propane, 2,2-
Bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3-cyclohexyl-4-hydroxyphenyl) propane, 1,1-bis (3-cyclohexyl-4-hydroxyphenyl) cyclohexane,
Bis (4-hydroxyphenyl) diphenylmethane,
9,9-bis (4-hydroxyphenyl) fluorene,
9,9-bis (4-hydroxy-3-methylphenyl)
Fluorene, 1,1-bis (4-hydroxyphenyl)
Cyclohexane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxy-3,3′-dimethyldiphenyl ether, 4,4′- Sulfonyldiphenol, 4,4'-dihydroxydiphenylsulfoxide, 4,4'-dihydroxydiphenylsulfide,
2,2′-dimethyl-4,4′-sulfonyldiphenol, 4,4′-dihydroxy-3,3′-dimethyldiphenylsulfoxide, 4,4′-dihydroxy-3,
3'-dimethyldiphenyl sulfide, 2,2'-diphenyl-4,4'-sulfonyldiphenol, 4,4 '
-Dihydroxy-3,3'-diphenyldiphenylsulfoxide, 4,4'-dihydroxy-3,3'-diphenyldiphenylsulfide, 1,3-bis {2- (4-
(Hydroxyphenyl) propyl} benzene, 1,4-bis {2- (4-hydroxyphenyl) propyl} benzene, 1,4-bis (4-hydroxyphenyl) cyclohexane, 1,3-bis (4-hydroxyphenyl) cyclohexane , 4,8-bis (4-hydroxyphenyl)
Tricyclo [5.2.1.0 2,6 ] decane, 4,4′-
(1,3-adamantandiyl) diphenol, 1,3
-Bis (4-hydroxyphenyl) -5,7-dimethyladamantane.
【0019】なかでも、1,1−ビス(4−ヒドロキシ
フェニル)−1−フェニルエタン、2,2−ビス(4−
ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒ
ドロキシ−3−メチルフェニル)プロパン、2,2−ビ
ス(3,5−ジブロモ−4−ヒドロキシフェニル)プロ
パン、1,1−ビス(4−ヒドロキシフェニル)シクロ
ヘキサン、1,1−ビス(4−ヒドロキシフェニル)−
3,3,5−トリメチルシクロヘキサン、4,4’−ス
ルホニルジフェノール、2,2’−ジメチル−4,4’
−スルホニルジフェノール、9,9−ビス(4−ヒドロ
キシ−3−メチルフェニル)フルオレン、1,3−ビス
{2−(4−ヒドロキシフェニル)プロピル}ベンゼ
ン、1,4−ビス{2−(4−ヒドロキシフェニル)プ
ロピル}ベンゼンが好ましく、特に2,2−ビス(4−
ヒドロキシフェニル)プロパン(BPA)、1,1−ビ
ス(4−ヒドロキシフェニル)シクロヘキサン、4,
4’−スルホニルジフェノール、9,9−ビス(4−ヒ
ドロキシ−3−メチルフェニル)フルオレンが好まし
い。また、これらは単独または二種以上組み合わせて用
いてもよい。Among them, 1,1-bis (4-hydroxyphenyl) -1-phenylethane and 2,2-bis (4-
(Hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 1,1-bis (4-hydroxy Phenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl)-
3,3,5-trimethylcyclohexane, 4,4'-sulfonyldiphenol, 2,2'-dimethyl-4,4 '
-Sulfonyldiphenol, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 1,3-bis {2- (4-hydroxyphenyl) propyl} benzene, 1,4-bis {2- (4 -Hydroxyphenyl) propyl} benzene is preferred, especially 2,2-bis (4-
Hydroxyphenyl) propane (BPA), 1,1-bis (4-hydroxyphenyl) cyclohexane,
4'-Sulfonyldiphenol, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene is preferred. These may be used alone or in combination of two or more.
【0020】前記脂肪族−芳香族共重合ポリカーボネー
ト樹脂は、その構成単位すべてのモル分率の合計を10
0モル%とした時に、前記一般式[1]で表わされる構
成単位のモル分率が15〜90モル%であり、25〜7
5モル%が好ましい。90モル%を超えると耐熱性が低
下することがあり、15モル%未満ではポリマーの流動
性が低下し、光ディスク基板材料として好ましくない。The aliphatic-aromatic copolymerized polycarbonate resin has a total molar fraction of all constituent units of 10%.
When it is 0 mol%, the molar fraction of the structural unit represented by the general formula [1] is 15 to 90 mol%, and
5 mol% is preferred. If it exceeds 90 mol%, the heat resistance may be reduced, and if it is less than 15 mol%, the fluidity of the polymer may be reduced, which is not preferable as a material for an optical disk substrate.
【0021】本発明のポリカーボネート樹脂は光ディス
ク基板材料として、その樹脂の0.7gを100mlの
塩化メチレンに溶解し、20℃で測定した比粘度が0.
1〜0.7の範囲のものが好ましく、0.2〜0.6の
範囲のものがより好ましい。かかる範囲の比粘度を有す
るポリカーボネート樹脂は、溶融流動性が良好で成形性
に優れ、光学的に良好な強度も十分な光ディスク基板が
得られ好ましい。The polycarbonate resin of the present invention is used as an optical disk substrate material by dissolving 0.7 g of the resin in 100 ml of methylene chloride and having a specific viscosity of 0.2 at 20 ° C.
Those having a range of 1 to 0.7 are preferable, and those having a range of 0.2 to 0.6 are more preferable. A polycarbonate resin having a specific viscosity in such a range is preferable because an optical disk substrate having good melt fluidity, excellent moldability, and optically satisfactory strength can be obtained.
【0022】本発明のポリカーボネート樹脂は、その流
動性(Q値)は25×10-3cm3/s以上が好まし
く、より好ましくは30〜200×10-3cm3/s、
最も好ましくは35〜200×10-3cm3/sであ
る。The flowability (Q value) of the polycarbonate resin of the present invention is preferably 25 × 10 −3 cm 3 / s or more, more preferably 30 to 200 × 10 −3 cm 3 / s.
Most preferably, it is 35 to 200 × 10 −3 cm 3 / s.
【0023】本発明のポリカーボネート樹脂は、その吸
水率は0.20重量%以下が好ましく、より好ましくは
0.18重量%以下である。0.20重量%を超えると
光ディスク基板表面上に金属膜を形成させた光ディスク
が吸水によって反りを生じ易くなることがある。特に好
ましい吸水率は0.15重量%以下である。The water absorption of the polycarbonate resin of the present invention is preferably 0.20% by weight or less, more preferably 0.18% by weight or less. If the content exceeds 0.20% by weight, the optical disk having the metal film formed on the surface of the optical disk substrate may be liable to warp due to water absorption. Particularly preferred water absorption is 0.15% by weight or less.
【0024】本発明のポリカーボネート樹脂は、その光
弾性定数は80×10-8cm2/N以下が好ましく、よ
り好ましくは76×10-8cm2/N以下である。かか
る範囲内の光弾性定数の値を有すると、複屈折が小さく
なり、殊に高密度の光ディスクにおいて有利に利用され
る。The polycarbonate resin of the present invention has a photoelastic constant of preferably 80 × 10 −8 cm 2 / N or less, more preferably 76 × 10 −8 cm 2 / N or less. When the photoelastic constant has a value within this range, the birefringence becomes small, and it is advantageously used particularly in high-density optical disks.
【0025】本発明の脂肪族−芳香族ポリカーボネート
樹脂共重合体を製造するには、ピリジン等の酸結合剤の
存在下に、前記脂肪族ジオールおよび二価フェノールと
ホスゲンとの反応を行う方法(溶液法)、又はビスアリ
ールカーボネートを用い、溶融条件下エステル交換反応
を行う方法(溶融法)が好ましく採用される。In order to produce the aliphatic-aromatic polycarbonate resin copolymer of the present invention, the aliphatic diol and the dihydric phenol are reacted with phosgene in the presence of an acid binder such as pyridine ( (Solution method) or a method in which a transesterification reaction is carried out under melting conditions using bisaryl carbonate (melting method).
【0026】このうち溶液法では、酸結合剤としてピリ
ジン、キノリン、ジメチルアニリン等が好適なものとし
て挙げられ、殊にピリジンが好適なものとして用いられ
る。これらは単独でまたは有機溶媒を用い希釈して反応
が行われる。該有機溶媒としては、ベンゼン、トルエ
ン、キシレン等の炭化水素、塩化メチレン、クロロホル
ム、ジクロロエタン、クロロベンゼン、ジクロロベンゼ
ン等のハロゲン化炭化水素が用いられ、特に塩化メチレ
ン、クロロホルム、ジクロロエタン、クロロベンゼン、
ジクロロベンゼン等のハロゲン化炭化水素が好ましく、
殊に塩化メチレンがもっとも好ましい。該酸結合剤の使
用量は、通常ホスゲンに対して2〜100モル当量用い
られ、好ましくは2〜50モル当量用いられる。反応温
度は、好ましくは0〜40℃で行われる。反応時間は通
常数分〜数日間、好ましくは10分間〜5時間行われ
る。Among them, in the solution method, pyridine, quinoline, dimethylaniline and the like are preferred as the acid binder, and pyridine is particularly preferred. These may be used alone or diluted with an organic solvent. As the organic solvent, hydrocarbons such as benzene, toluene and xylene, methylene chloride, chloroform, dichloroethane, chlorobenzene and halogenated hydrocarbons such as dichlorobenzene are used, and in particular, methylene chloride, chloroform, dichloroethane, chlorobenzene,
Halogenated hydrocarbons such as dichlorobenzene are preferred,
In particular, methylene chloride is most preferred. The amount of the acid binder to be used is generally 2 to 100 molar equivalents, preferably 2 to 50 molar equivalents, relative to phosgene. The reaction temperature is preferably from 0 to 40 ° C. The reaction time is usually several minutes to several days, preferably 10 minutes to 5 hours.
【0027】また、末端停止剤として単官能フェノール
類を使用することができる。単官能フェノール類は末端
停止剤として分子量調節のために一般的に使用され、ま
た得られたポリカーボネート樹脂は、末端が単官能フェ
ノール類に基づく基によって封鎖されているので、そう
でないものと比べて熱安定性に優れている。かかる単官
能フェノール類の具体例としては、例えばフェノール、
p−tert−ブチルフェノール、p−クミルフェノー
ルおよびイソオクチルフェノールが挙げられる。また、
他の単官能フェノール類としては、長鎖のアルキル基あ
るいは脂肪族ポリエステル基を置換基として有するフェ
ノール類または安息香酸クロライド類、もしくは長鎖の
アルキルカルボン酸クロライド類を使用することができ
る。Further, monofunctional phenols can be used as a terminal stopper. Monofunctional phenols are commonly used as molecular terminators for molecular weight control, and the resulting polycarbonate resins are capped by groups based on monofunctional phenols, so that Excellent heat stability. Specific examples of such monofunctional phenols include, for example, phenol,
p-tert-butylphenol, p-cumylphenol and isooctylphenol. Also,
As other monofunctional phenols, phenols or benzoic acid chlorides having a long-chain alkyl group or aliphatic polyester group as a substituent, or long-chain alkyl carboxylic acid chlorides can be used.
【0028】これらの末端停止剤は、得られたポリカー
ボネート樹脂の全末端に対して少なくとも5モル%、好
ましくは少なくとも10モル%末端に導入されることが
望ましく、また、末端停止剤は単独でまたは2種以上混
合して使用してもよい。These terminal stoppers are desirably introduced at least 5 mol%, preferably at least 10 mol%, based on all terminals of the obtained polycarbonate resin, and the terminal stopper is used alone or You may mix and use 2 or more types.
【0029】溶融法は、不活性ガスの存在下に脂肪族お
よび芳香族ジオールとカーボネートエステルとを加熱し
ながら混合して、生成するアルコールまたはフェノール
を留出させる方法により行われる。反応温度は生成する
アルコールまたはフェノールの沸点等により異なるが、
通常120〜350℃の範囲である。反応後期には系を
1330〜13.3Pa程度に減圧して生成するアルコ
ールまたはフェノールの留出を容易にさせる。反応時間
は通常1〜4時間程度である。The melting method is carried out by mixing an aliphatic or aromatic diol with a carbonate ester while heating in the presence of an inert gas to distill off the alcohol or phenol formed. The reaction temperature depends on the boiling point of the alcohol or phenol to be produced, etc.
Usually, it is in the range of 120 to 350 ° C. In the latter stage of the reaction, the pressure of the system is reduced to about 1330 to 13.3 Pa to facilitate the distillation of alcohol or phenol produced. The reaction time is usually about 1 to 4 hours.
【0030】カーボネートエステルとしては、置換され
ていてもよい炭素数6〜12のアリール基、アラルキル
基あるいは炭素数1〜4のアルキル基などのエステルが
挙げられる。具体的にはジフェニルカーボネート、ビス
(クロロフェニル)カーボネート、m−クレジルカーボ
ネート、ジナフチルカーボネート、ビス(ジフェニル)
カーボネート、ジメチルカーボネート、ジエチルカーボ
ネート、ジブチルカーボネートなどが挙げられ、なかで
もジフェニルカーボネートが好ましい。Examples of the carbonate ester include an optionally substituted ester such as an aryl group having 6 to 12 carbon atoms, an aralkyl group or an alkyl group having 1 to 4 carbon atoms. Specifically, diphenyl carbonate, bis (chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis (diphenyl)
Examples thereof include carbonate, dimethyl carbonate, diethyl carbonate, and dibutyl carbonate. Among them, diphenyl carbonate is preferable.
【0031】また、重合速度を速めるために重合触媒を
用いることができ、かかる重合触媒としては、例えば水
酸化ナトリウム、水酸化カリウム、二価フェノールのナ
トリウム塩、カリウム塩等のアルカリ金属化合物、水酸
化カルシウム、水酸化バリウム、水酸化マグネシウム等
のアルカリ土類金属化合物、テトラメチルアンモニウム
ヒドロキシド、テトラエチルアンモニウムヒドロキシ
ド、トリメチルアミン、トリエチルアミン等の含窒素塩
基性化合物、アルカリ金属やアルカリ土類金属のアルコ
キシド類、アルカリ金属やアルカリ土類金属の有機酸塩
類、亜鉛化合物類、ホウ素化合物類、アルミニウム化合
物類、珪素化合物類、ゲルマニウム化合物類、有機スズ
化合物類、鉛化合物類、オスミウム化合物類、アンチモ
ン化合物類、マンガン化合物類、チタン化合物類、ジル
コニウム化合物類などの通常エステル化反応、エステル
交換反応に使用される触媒を用いることができる。触媒
は単独で使用してもよいし、2種以上組み合わせて使用
してもよい。これらの重合触媒の使用量は、原料の二価
フェノール1モルに対し、好ましくは1×10-9〜1×
10-3当量、より好ましくは1×10-8〜5×10-4当
量の範囲で選ばれる。また、必要に応じて分子量調節
剤、酸化防止剤等を加えてもよい。A polymerization catalyst can be used to increase the polymerization rate. Examples of the polymerization catalyst include sodium hydroxide, potassium hydroxide, alkali metal compounds such as sodium salts and potassium salts of dihydric phenol, and water. Alkaline earth metal compounds such as calcium oxide, barium hydroxide and magnesium hydroxide, nitrogen-containing basic compounds such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylamine and triethylamine, alkoxides of alkali metals and alkaline earth metals , Organic acid salts of alkali metals and alkaline earth metals, zinc compounds, boron compounds, aluminum compounds, silicon compounds, germanium compounds, organotin compounds, lead compounds, osmium compounds, antimony compounds, manga Compounds, titanium compounds, usually the esterification reaction, such as zirconium compounds, there can be used a catalyst used in the transesterification reaction. The catalyst may be used alone or in combination of two or more. The amount of these polymerization catalysts to be used is preferably 1 × 10 −9 to 1 ×, based on 1 mol of the starting dihydric phenol.
It is selected in the range of 10 −3 equivalents, more preferably 1 × 10 −8 to 5 × 10 −4 equivalents. Further, a molecular weight regulator, an antioxidant and the like may be added as necessary.
【0032】本発明で得られた共重合ポリカーボネート
樹脂に触媒失活剤を添加する事もできる。本発明に使用
する触媒失活剤としては、公知の触媒失活剤が有効に使
用されるが、この中でもスルホン酸のアンモニウム塩、
ホスホニウム塩が好ましく、更にドデシルベンゼンスル
ホン酸テトラブチルホスホニウム塩等のドデシルベンゼ
ンスルホン酸の上記塩類やパラトルエンスルホン酸テト
ラブチルアンモニウム塩等のパラトルエンスルホン酸の
上記塩類が好ましい。またスルホン酸のエステルとして
ベンゼンスルホン酸メチル、ベンゼンスルホン酸エチ
ル、ベンゼンスルホン酸ブチル、ベンゼンスルホン酸オ
クチル、ベンゼンスルホン酸フェニル、パラトルエンス
ルホン酸メチル、パラトルエンスルホン酸エチル、パラ
トルエンスルホン酸ブチル、パラトルエンスルホン酸オ
クチル、パラトルエンスルホン酸フェニル等が好ましく
用いられ、その中でもドデシルベンゼンスルホン酸テト
ラブチルホスホニウム塩が最も好ましく使用される。A catalyst deactivator can be added to the copolymerized polycarbonate resin obtained in the present invention. As the catalyst deactivator used in the present invention, known catalyst deactivators are effectively used. Among them, ammonium salts of sulfonic acid,
Phosphonium salts are preferred, and the above salts of dodecylbenzenesulfonic acid such as tetrabutylphosphonium dodecylbenzenesulfonate and the above salts of paratoluenesulfonic acid such as tetrabutylammonium paratoluenesulfonate are more preferred. As sulfonic acid esters, methyl benzenesulfonate, ethyl benzenesulfonate, butylbenzenesulfonate, octylbenzenesulfonate, phenylbenzenesulfonate, methyl paratoluenesulfonate, ethyl paratoluenesulfonate, butylparatoluenesulfonate, para Octyl toluenesulfonate, phenyl paratoluenesulfonate and the like are preferably used, and among them, tetrabutylphosphonium dodecylbenzenesulfonate is most preferably used.
【0033】これらの触媒失活剤の使用量はアルカリ金
属化合物および/またはアルカリ土類金属化合物より選
ばれた前記重合触媒1モル当たり0.5〜50モルの割
合で、好ましくは0.5〜10モルの割合で、更に好ま
しくは0.8〜5モルの割合で使用する事ができる。The amount of the catalyst deactivator used is 0.5 to 50 mol, preferably 0.5 to 50 mol, per 1 mol of the polymerization catalyst selected from alkali metal compounds and / or alkaline earth metal compounds. It can be used at a ratio of 10 mol, more preferably at a ratio of 0.8 to 5 mol.
【0034】本発明の光ディスク基板は、前記共重合ポ
リカ−ボネ−ト樹脂を、例えば射出成形法、圧縮成形
法、押出成形法等任意の方法で成形することにより得る
ことができるが、本発明の光ディスク基板は、射出成形
法により得られたものが生産性に優れ好適である。The optical disk substrate of the present invention can be obtained by molding the copolymerized polycarbonate resin by any method such as injection molding, compression molding, extrusion molding, etc. The optical disk substrate obtained by the injection molding method is excellent in productivity and suitable.
【0035】本発明の光ディスク基板は、一般的には前
記ポリカーボネート樹脂を樹脂温度250〜380℃、
金型温度60〜130℃にて射出成形して得られ、また
はそれらを貼りあわせて得られる。The optical disc substrate of the present invention generally comprises a polycarbonate resin having a resin temperature of 250 to 380 ° C.
It is obtained by injection molding at a mold temperature of 60 to 130 ° C., or obtained by laminating them.
【0036】本発明の共重合ポリカーボネート樹脂に
は、必要に応じて燐系熱安定剤を加えることができる。
燐系熱安定剤としては、亜燐酸エステルおよび燐酸エス
テルが好ましく使用される。亜燐酸エステルとしては、
例えばトリフェニルホスファイト、トリスノニルフェニ
ルホスファイト、トリス(2,4−ジ−tert−ブチ
ルフェニル)ホスファイト、トリデシルホスファイト、
トリオクチルホスファイト、トリオクタデシルホスファ
イト、ジデシルモノフェニルホスファイト、ジオクチル
モノフェニルホスファイト、ジイソプロピルモノフェニ
ルホスファイト、モノブチルジフェニルホスファイト、
モノデシルジフェニルホスファイト、モノオクチルジフ
ェニルホスファイト、ビス(2,6−ジ−tert−ブ
チル−4−メチルフェニル)ペンタエリスリトールジホ
スファイト、2,2−メチレンビス(4,6−ジ−te
rt−ブチルフェニル)オクチルホスファイト、ビス
(ノニルフェニル)ペンタエリスリトールジホスファイ
ト、ビス(2,4−ジ−tert−ブチルフェニル)ペ
ンタエリスリトールジホスファイト、テトラキス(2,
4−ジ−tert−ブチルフェニル)−4,4−ジフェ
ニレンホスホナイト等の亜燐酸のトリエステル、ジエス
テル、モノエステルが挙げられる。これらのうち、トリ
スノニルフェニルホスファイト、ジステアリルペンタエ
リスリトールジホスファイト、トリス(2,4−ジ−t
ert−ブチルフェニル)ホスファイトが好ましい。A phosphorus heat stabilizer can be added to the copolymerized polycarbonate resin of the present invention, if necessary.
As the phosphorus-based heat stabilizer, phosphites and phosphates are preferably used. As the phosphite,
For example, triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, tridecyl phosphite,
Trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite,
Monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, 2,2-methylene bis (4,6-di-te
rt-butylphenyl) octyl phosphite, bis (nonylphenyl) pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, tetrakis (2
Examples thereof include triesters, diesters and monoesters of phosphorous acid such as 4-di-tert-butylphenyl) -4,4-diphenylenephosphonite. Of these, trisnonylphenyl phosphite, distearylpentaerythritol diphosphite, tris (2,4-di-t
(tert-butylphenyl) phosphite is preferred.
【0037】一方、熱安定剤として使用される燐酸エス
テルとしては、例えばトリブチルホスフェート、トリメ
チルホスフェート、トリクレジルホスフェート、トリフ
ェニルホスフェート、トリクロルフェニルホスフェー
ト、トリエチルホスフェート、ジフェニルクレジルホス
フェート、ジフェニルモノオルソキセニルホスフェー
ト、トリブトキシエチルホスフェート、ジブチルホスフ
ェート、ジオクチルホスフェート、ジイソプロピルホス
フェート等が挙げられ、なかでもトリフェニルホスフェ
ート、トリメチルホスフェートが好ましい。On the other hand, examples of the phosphoric acid ester used as a heat stabilizer include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenylcresyl phosphate, and diphenylmonoorthoxenyl. Phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate and the like can be mentioned, and among them, triphenyl phosphate and trimethyl phosphate are preferable.
【0038】前記燐系熱安定剤は、単独で使用してもよ
く、また二種以上を組合せて使用してもよい。燐系熱安
定剤は、共重合ポリカーボネート樹脂に基づいて0.0
001〜0.05重量%の範囲で使用するのが適当であ
る。The phosphorus heat stabilizers may be used alone or in combination of two or more. The phosphorus-based heat stabilizer is 0.0% based on the copolymerized polycarbonate resin.
It is suitable to use in the range of 001 to 0.05% by weight.
【0039】本発明で得られる共重合ポリカーボネート
樹脂には、酸化防止の目的で通常知られた酸化防止剤を
添加することができる。その例としてはフェノール系酸
化防止剤を示すことができ、具体的には例えばトリエチ
レングリコール−ビス(3−(3−tert−ブチル−
5−メチル−4−ヒドロキシフェニル)プロピオネー
ト)、1,6−ヘキサンジオール−ビス(3−(3,5
−ジ−tert−ブチル−4−ヒドロキシフェニル)プ
ロピオネート、ペンタエリスリトール−テトラキス(3
−(3,5−ジ−tert−ブチル−4−ヒドロキシフ
ェニル)プロピオネート)、オクタデシル−3−(3,
5−ジ−tert−ブチル−4−ヒドロキシフェニル)
プロピオネート、1,3,5−トリメチル−2,4,6
−トリス(3,5−ジ−tert−4−ヒドロキシベン
ジル)ベンゼン、N,N−ヘキサメチレンビス(3,5
−ジ−tert−ブチル−4−ヒドロキシヒドロシンナ
マイド)、3,5−ジ−tert−ブチル−4−ヒドロ
キシベンジルホスホネートジエチルエステル、トリス
(3,5−ジ−tert−ブチル−4−ヒドロキシベン
ジル)イソシアヌレート、3,9−ビス{1,1−ジメ
チル−2−[β−(3−tert−ブチル−4−ヒドロ
キシ−5−メチルフェニル)プロピオニルオキシ]エチ
ル}−2,4,8,10−テトラオキサスピロ(5,
5)ウンデカン等が挙げられる。これら酸化防止剤の好
ましい添加量の範囲は共重合ポリカーボネート樹脂に対
して、0.0001〜0.05重量%である。To the copolymerized polycarbonate resin obtained in the present invention, an antioxidant generally known for the purpose of preventing oxidation can be added. Examples thereof include phenolic antioxidants, and specifically, for example, triethylene glycol-bis (3- (3-tert-butyl-
5-methyl-4-hydroxyphenyl) propionate), 1,6-hexanediol-bis (3- (3,5
-Di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythritol-tetrakis (3
-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate), octadecyl-3- (3,
5-di-tert-butyl-4-hydroxyphenyl)
Propionate, 1,3,5-trimethyl-2,4,6
-Tris (3,5-di-tert-4-hydroxybenzyl) benzene, N, N-hexamethylenebis (3,5
-Di-tert-butyl-4-hydroxyhydrocinnamide), 3,5-di-tert-butyl-4-hydroxybenzylphosphonate diethyl ester, tris (3,5-di-tert-butyl-4-hydroxybenzyl) Isocyanurate, 3,9-bis {1,1-dimethyl-2- [β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] ethyl} -2,4,8,10- Tetraoxaspiro (5
5) Undecane and the like. The preferable range of the addition amount of these antioxidants is 0.0001 to 0.05% by weight based on the copolymerized polycarbonate resin.
【0040】さらに本発明で得られる共重合ポリカーボ
ネート樹脂には、必要に応じて多価アルコールの高級脂
肪酸エステルを加えることもできる。この高級脂肪酸エ
ステルを加えることによって、共重合ポリカーボネート
樹脂の熱安定性が向上し、成形時の樹脂の流動性が良く
なり、さらに成形後の金型からの基板の離型性が改良さ
れて離型不良によるディスク基板の変形が防止できる。
かかる高級脂肪酸エステルとしては、炭素数2〜5の多
価アルコールと炭素数10〜30の飽和脂肪酸との部分
エステル、または全エステルであるのが好ましい。この
多価アルコールとしては、グリコール類、グリセロール
またはペンタエリスリトールが挙げられる。Further, a higher fatty acid ester of a polyhydric alcohol can be added to the copolymerized polycarbonate resin obtained in the present invention, if necessary. By adding this higher fatty acid ester, the thermal stability of the copolymerized polycarbonate resin is improved, the fluidity of the resin at the time of molding is improved, and the releasability of the substrate from the mold after molding is improved, thereby improving the release. Deformation of the disk substrate due to defective mold can be prevented.
The higher fatty acid ester is preferably a partial ester or a whole ester of a polyhydric alcohol having 2 to 5 carbon atoms and a saturated fatty acid having 10 to 30 carbon atoms. Examples of the polyhydric alcohol include glycols, glycerol and pentaerythritol.
【0041】前記高級脂肪族酸エステルは、共重合ポリ
カーボネート樹脂に対して、0.005〜2重量%の範
囲、好ましくは0.02〜0.1重量%の範囲で添加さ
れるのが適当である。かかる範囲の添加量であると、上
記効果が得られ、また金型表面の汚れの原因となり難く
好ましい。The higher aliphatic acid ester is added in an amount of 0.005 to 2% by weight, preferably 0.02 to 0.1% by weight, based on the weight of the copolymerized polycarbonate resin. is there. The addition amount in such a range is preferable because the effects described above are obtained and the surface of the mold is hardly stained.
【0042】本発明で得られる共重合ポリカーボネート
樹脂には、さらに光安定剤、着色剤、帯電防止剤、滑剤
等の添加剤を、透明性を損なわない範囲で加えることが
できる。また、他のポリカーボネート樹脂、熱可塑性樹
脂を本発明の目的を損なわない範囲で少割合添加するこ
ともできる。Additives such as a light stabilizer, a colorant, an antistatic agent and a lubricant can be further added to the copolymerized polycarbonate resin obtained in the present invention as long as the transparency is not impaired. Further, other polycarbonate resins and thermoplastic resins can be added in small proportions within a range not to impair the object of the present invention.
【0043】本発明の光ディスクとしては、オーディオ
用コンパクトディスク(直径12cmのディスク当り約
650MBの記録密度)から、高密度のディスクまでを
対象とする。例えば、最近再生専用では容量4.7GB
のDVD−ROM、記録再生可能なDVD−R、DVD
−RW、DVD−RAMにおいても容量4.7GBが実
現されつつある。また、MOディスクでは5.25”サ
イズでは両面で5.2GB、3.5”では片面で1.3G
Bの光学情報記録媒体が上市されているが、デジタル高
画質放送などに対応する直径12cmのディスクに換算
して片面約6.5GB以上、殊に10GB以上の高密度
光学記録媒体が要望され、本発明の光ディスク基板はこ
れらのものにも十分に適応できる特性を有する。The optical disk of the present invention covers a range from a compact disk for audio (recording density of about 650 MB per disk having a diameter of 12 cm) to a high-density disk. For example, 4.7 GB capacity recently
DVD-ROM, recordable / reproducible DVD-R, DVD
-A capacity of 4.7 GB is being realized also in RW and DVD-RAM. For a MO disk, 5.2 GB on both sides at 5.25 "size, and 1.3 GB on one side at 3.5"
Although the optical information recording medium of type B is on the market, a high-density optical recording medium having a diameter of about 6.5 GB or more, particularly 10 GB or more on one side in terms of a disk having a diameter of 12 cm corresponding to digital high-definition broadcasting is demanded. The optical disk substrate of the present invention has characteristics that can be sufficiently applied to these substrates.
【0044】本発明の光ディスク基板は、その少なくと
も片面に金属薄膜を形成させることにより光ディスクが
得られる。この金属としては、アルミニウム、Tb、F
e、Co、Gd、SiN、ZnS−SiO2、GeSb
Te、ZnSおよびアルミニウム合金等があり、アルミ
ニウムが適している。また薄膜は、スパッタリング、蒸
着等の手段で形成させることができる。これらの金属薄
膜の形成手段は、それ自体知られた方法で行うことがで
きる。The optical disk substrate of the present invention can be obtained by forming a metal thin film on at least one surface thereof. This metal includes aluminum, Tb, F
e, Co, Gd, SiN, ZnS-SiO 2, GeSb
There are Te, ZnS, and aluminum alloys, and aluminum is suitable. The thin film can be formed by means such as sputtering and vapor deposition. Means for forming these metal thin films can be performed by a method known per se.
【0045】[0045]
【実施例】以下に実施例を挙げて本発明を更に説明す
る。なお、実施例中の部及び%は重量部及び重量%であ
る。なお、各項目の測定は下記の方法で行なった。 (1)比粘度 塩化メチレンを溶媒として、ポリカーボネート樹脂0.
7g/100mlの濃度で測定した。なお、測定温度を
20℃とした。 (2)Q値 島津製作所(株)製フローテスターCFT−500Cに
より直径10mm、長さ20mmのシリンダーを用いて
温度240℃、荷重100kgで直径1.0mmのノズ
ルから1秒間に流出する体積を測定した。 (3)光弾性定数 理研機器(株)製の光弾性測定装置PA−150により
厚さ100μmのキャストフィルムを用いて測定した。 (4)吸水率 ASTM D−0570に従い23℃、24時間水浸漬
後の吸水率を測定した。The present invention will be further described with reference to the following examples. Parts and% in the examples are parts by weight and% by weight. In addition, the measurement of each item was performed by the following method. (1) Specific viscosity Using methylene chloride as a solvent, polycarbonate resin 0.1.
It was measured at a concentration of 7 g / 100 ml. The measurement temperature was set to 20 ° C. (2) Q value Using a flow tester CFT-500C manufactured by Shimadzu Corporation, the volume flowing out of a 1.0 mm diameter nozzle from a 1.0 mm diameter nozzle at a temperature of 240 ° C. under a load of 100 kg was measured using a cylinder having a diameter of 10 mm and a length of 20 mm. did. (3) Photoelastic constant The photoelastic constant was measured using a 100 μm thick cast film with a photoelasticity measuring device PA-150 manufactured by Riken Kiki Co., Ltd. (4) Water absorption The water absorption after immersion in water at 23 ° C. for 24 hours was measured according to ASTM D-0570.
【0046】[実施例1]1,4−シクロヘキサンジメ
タノール(以下「CHDM」と称す)43.2重量部、
ビスフェノール−A(以下「BPA」と称す)68.4
重量部、ジフェニルカーボネート(以下「DPC」と称
す)を134.96重量部及びテトラメチルアンモニウ
ムヒドロキシド(以下「TMAH」と称す)を0.18
重量部、水酸化ナトリウム8×10-4重量部を攪拌装
置、蒸留器及び減圧装置を備えた反応槽に仕込み、窒素
置換した後、140℃で溶解した。30分攪拌後、内温
を180℃に昇温しつつ徐々に減圧し1.3×104P
aで30分間反応させ、生成するフェノールを留去し
た。次に同圧に維持しながら昇温し続け、190℃で3
0分間、200℃で40分間、220℃で30分間、さ
らに240℃で30分間フェノールを留去せしめ反応さ
せた。その後、ゆっくりと減圧し1.3×102Pa以
下とした。減圧状態で240℃、4時間攪拌下で反応せ
しめ共重合ポリカーボネート樹脂を得た。この樹脂に、
該樹脂100部に対して、トリス(2,4−ジ−ter
t−ブチルフェニル)ホスファイトを0.003部、ト
リメチルホスフェートを0.005部、およびステアリ
ン酸モノグリセリドを0.0045部加えた。次に、か
かる樹脂をベント式二軸押出機[神戸製鋼(株)製KT
X−46]によりシリンダー温度240℃で脱気しなが
ら溶融混錬し、ペレット化した。そして、このペレット
を(株)名機製作所製M35B―D―DMを用いて樹脂
温度240℃、金型温度70℃、冷却時間15秒、射出
速度150mm/秒(充填時間0.43sec)で12
0mmφ、1.2mmt厚みのディスク基板を射出成形
した。さらに、このディスク基板にアルミニウムを蒸着
しディスクを得た。このディスクの吸水による反りは、
比較例1で得られたディスクに比べて、格段に小さかっ
た。なお、評価結果を表1に示した。Example 1 43.2 parts by weight of 1,4-cyclohexanedimethanol (hereinafter referred to as "CHDM")
Bisphenol-A (hereinafter referred to as "BPA") 68.4
Parts by weight, 134.96 parts by weight of diphenyl carbonate (hereinafter, referred to as "DPC") and 0.18 parts by weight of tetramethylammonium hydroxide (hereinafter, referred to as "TMAH").
8 parts by weight of sodium hydroxide and 8 × 10 -4 parts by weight of sodium hydroxide were charged into a reaction vessel equipped with a stirrer, a still and a depressurizing apparatus, and after displacing with nitrogen, dissolved at 140 ° C. After stirring for 30 minutes, the internal temperature was gradually raised to 180 ° C. and the pressure was gradually reduced to 1.3 × 10 4 P
The reaction was carried out at a for 30 minutes, and the formed phenol was distilled off. Then, the temperature was kept rising while maintaining the same pressure.
Phenol was distilled off for 0 minute, at 200 ° C. for 40 minutes, at 220 ° C. for 30 minutes, and further at 240 ° C. for 30 minutes to react. Thereafter, the pressure was slowly reduced to 1.3 × 10 2 Pa or less. The mixture was reacted under reduced pressure at 240 ° C. for 4 hours under stirring to obtain a copolymerized polycarbonate resin. In this resin,
To 100 parts of the resin, tris (2,4-di-ter
0.003 parts of t-butylphenyl) phosphite, 0.005 parts of trimethyl phosphate and 0.0045 parts of stearic acid monoglyceride were added. Next, a vent-type twin screw extruder [KT made by Kobe Steel Ltd.]
X-46], melt-kneaded while degassing at a cylinder temperature of 240 ° C, and pelletized. The pellets were prepared using M35BD-DM manufactured by Meiki Seisakusho Co., Ltd. at a resin temperature of 240 ° C., a mold temperature of 70 ° C., a cooling time of 15 seconds, and an injection speed of 150 mm / sec (filling time of 0.43 sec).
A disk substrate having a thickness of 0 mmφ and a thickness of 1.2 mmt was injection molded. Further, aluminum was evaporated on the disk substrate to obtain a disk. The warpage of this disk due to water absorption
It was much smaller than the disk obtained in Comparative Example 1. The evaluation results are shown in Table 1.
【0047】[実施例2]CHDM25.9重量部、B
PA95.8重量部、DPCを134.96重量部及び
TMAHを0.18重量部、水酸化ナトリウム8×10
-4重量部を用いた以外は、実施例1と同様な操作を行
い、ディスクを得た。このディスクの吸水による反り
は、比較例1で得られたディスクに比べて、格段に小さ
かった。なお、評価結果を表1に示した。Example 2 25.9 parts by weight of CHDM, B
95.8 parts by weight of PA, 134.96 parts by weight of DPC and 0.18 part by weight of TMAH, sodium hydroxide 8 × 10
A disc was obtained in the same manner as in Example 1, except that -4 parts by weight was used. The warpage of this disk due to water absorption was much smaller than that of the disk obtained in Comparative Example 1. In addition, the evaluation result was shown in Table 1.
【0048】[実施例3]CHDM60.48重量部、
9,9−ビス(4−ヒドロキシ−3−メチルフェニル)
フルオレン(以下「BCF」と称す)68.04重量
部、DPCを134.96重量部及びTMAHを0.1
8重量部、水酸化ナトリウム8×10-4重量部を用いた
以外は、実施例1と同様な操作を行い、ディスクを得
た。このディスクの吸水による反りは、比較例1で得ら
れたディスクに比べて、格段に小さかった。なお、評価
結果を表1に示した。Example 3 60.48 parts by weight of CHDM
9,9-bis (4-hydroxy-3-methylphenyl)
68.04 parts by weight of fluorene (hereinafter referred to as “BCF”), 134.96 parts by weight of DPC and 0.1% of TMAH
A disk was obtained in the same manner as in Example 1, except that 8 parts by weight and 8 × 10 −4 parts by weight of sodium hydroxide were used. The warpage of this disk due to water absorption was much smaller than that of the disk obtained in Comparative Example 1. In addition, the evaluation result was shown in Table 1.
【0049】[実施例4]CHDM25.3重量部、B
PA17.2重量部、p−tert−ブチルフェノール
0.89重量部を温度計、撹拌機付き反応器にし込み、
窒素置換した後、あらかじめよく乾燥したピリジン20
3重量部、塩化メチレン563重量部を加え溶解した。
撹拌下25℃でホスゲン28.6重量部を100分要し
て吹込んだ。ホスゲン吹込み終了後、約10分間そのま
ま撹拌して反応を終了した。反応終了後生成物を塩化メ
チレンで希釈し、ピリジンを塩酸で中和除去後、導電率
がイオン交換水と殆ど同じになるまで繰り返し水洗し、
その後塩化メチレンを蒸発して無色のパウダーを得た。
このパウダーを実施例1と同様な操作を行いペレット化
し、次いでディスク基板を射出成形し、さらに、このデ
ィスク基板にアルミニウムを蒸着しディスクを得た。こ
のディスクの吸水による反りは、比較例1で得られたデ
ィスクに比べて、格段に小さかった。なお、評価結果を
表1に示した。Example 4 25.3 parts by weight of CHDM, B
17.2 parts by weight of PA and 0.89 parts by weight of p-tert-butylphenol were charged into a reactor equipped with a thermometer and a stirrer,
After purging with nitrogen, the pyridine 20 is dried well in advance.
3 parts by weight and 563 parts by weight of methylene chloride were added and dissolved.
At 25 ° C., 28.6 parts by weight of phosgene was blown in with stirring over 100 minutes. After the injection of phosgene, the reaction was completed by stirring for about 10 minutes. After the reaction is completed, the product is diluted with methylene chloride, pyridine is neutralized and removed with hydrochloric acid, and then repeatedly washed with water until the conductivity becomes almost the same as ion-exchanged water.
Thereafter, the methylene chloride was evaporated to obtain a colorless powder.
This powder was pelletized by the same operation as in Example 1, and then a disk substrate was injection-molded. Further, aluminum was deposited on the disk substrate to obtain a disk. The warpage of this disk due to water absorption was much smaller than that of the disk obtained in Comparative Example 1. In addition, the evaluation result was shown in Table 1.
【0050】[実施例5]CHDM25.3重量部、
1,1−ビス(4−ヒドロキシフェニル)シクロヘキサ
ン(以下「BPZ」と略す)20.2重量部、p−te
rt−ブチルフェノール0.89重量部、ホスゲン2
8.6重量部、ピリジン203重量部、塩化メチレン5
64重量部を用いた以外は、実施例3と同様な操作を行
いポリカーボネートパウダーを得た。このパウダーを実
施例1と同様な操作を行いペレット化し、次いでディス
ク基板を射出成形し、さらに、このディスク基板にアル
ミニウムを蒸着しディスクを得た。このディスクの吸水
による反りは、比較例1で得られたディスクに比べて、
格段に小さかった。なお、評価結果を表1に示した。Example 5 25.3 parts by weight of CHDM
20.2 parts by weight of 1,1-bis (4-hydroxyphenyl) cyclohexane (hereinafter abbreviated as “BPZ”), p-te
0.89 parts by weight of rt-butylphenol, phosgene 2
8.6 parts by weight, pyridine 203 parts by weight, methylene chloride 5
Except that 64 parts by weight were used, the same operation as in Example 3 was performed to obtain a polycarbonate powder. This powder was pelletized by the same operation as in Example 1, and then a disk substrate was injection-molded. Further, aluminum was deposited on the disk substrate to obtain a disk. The warpage of the disk due to water absorption was smaller than that of the disk obtained in Comparative Example 1.
It was much smaller. In addition, the evaluation result was shown in Table 1.
【0051】[実施例6]CHDM8.4重量部、BP
A8.0重量部、4,4’−スルホニルジフェノール
(以下「BPS」と略す)5.9重量部、p−tert
−ブチルフェノール0.087重量部、ホスゲン13.
9重量部、ピリジン95重量部、塩化メチレン263重
量部を用いた以外は、実施例3と同様な操作を行いポリ
カーボネートパウダーを得た。このパウダーを実施例1
と同様な操作を行いペレット化し、次いでディスク基板
を射出成形し、さらに、このディスク基板にアルミニウ
ムを蒸着しディスクを得た。このディスクの吸水による
反りは、比較例1で得られたディスクに比べて、格段に
小さかった。なお、評価結果を表1に示した。Example 6 8.4 parts by weight of CHDM, BP
A8.0 parts by weight, 5.9 parts by weight of 4,4′-sulfonyldiphenol (hereinafter abbreviated as “BPS”), p-tert
-0.087 parts by weight of butylphenol, phosgene 13.
A polycarbonate powder was obtained in the same manner as in Example 3, except that 9 parts by weight, 95 parts by weight of pyridine, and 263 parts by weight of methylene chloride were used. This powder was used in Example 1
A pellet was formed by performing the same operation as described above, and then a disk substrate was injection-molded. Further, aluminum was deposited on the disk substrate to obtain a disk. The warpage of this disk due to water absorption was much smaller than that of the disk obtained in Comparative Example 1. In addition, the evaluation result was shown in Table 1.
【0052】[比較例1]界面重合法により得られたビ
スフェノール−A(BPA)タイプのポリカーボネート
樹脂パウダーを実施例1と同様な操作を行いペレット化
し、次いでディスク基板を射出成形し、さらに、このデ
ィスク基板にアルミニウムを蒸着しディスクを得た。な
お、評価結果を表1に示した。Comparative Example 1 A bisphenol-A (BPA) type polycarbonate resin powder obtained by an interfacial polymerization method was pelletized by the same operation as in Example 1, and then a disk substrate was injection-molded. Aluminum was deposited on the disk substrate to obtain a disk. In addition, the evaluation result was shown in Table 1.
【0053】[0053]
【表1】 [Table 1]
【0054】[0054]
【発明の効果】本発明の脂肪族−芳香族共重合ポリカー
ボネート樹脂は、低吸水性で、流動性に優れ、光弾性定
数が小さいことから、光学的特性、反り等に優れた光デ
ィスク基板、殊に高密度光ディスク基板用の材料として
好適に用いられ、その奏する工業的効果は格別である。The aliphatic-aromatic copolymerized polycarbonate resin of the present invention has low water absorption, excellent fluidity, and a small photoelastic constant. It is suitably used as a material for a high-density optical disk substrate, and the industrial effects achieved are outstanding.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 今中 嘉彦 東京都千代田区内幸町1丁目2番2号 帝 人化成株式会社内 Fターム(参考) 4J029 AA09 AE05 BB10A BB12A BB12C BB13A BB13B BB16A BB18 BD06A BD07A BD09A BD09B BD09C BF14A BF14B BG08X BH02 DB07 DB11 DB13 HC01 HC04A HC05A HC05B 5D029 KA07 KA08 KC01 MA18 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yoshihiko Imanaka 1-2-2 Uchisaiwai-cho, Chiyoda-ku, Tokyo Teijin Chemicals Limited F-term (reference) 4J029 AA09 AE05 BB10A BB12A BB12C BB13A BB13B BB16A BB18 BD06A BD07A BD09A BD09B BD09C BF14A BF14B BG08X BH02 DB07 DB11 DB13 HC01 HC04A HC05A HC05B 5D029 KA07 KA08 KC01 MA18
Claims (4)
て水素原子、ハロゲン原子、炭素数1〜10のアルキル
基、炭素数1〜10のアルコキシ基、炭素数6〜20の
シクロアルキル基、炭素数6〜20のシクロアルコキシ
基、炭素数6〜10のアリール基、炭素数7〜20のア
ラルキル基、炭素数6〜10のアリールオキシ基、炭素
数7〜20のアラルキルオキシ基、であって、m及びn
は夫々0〜4の整数であり、Wは炭素数5〜12の脂環
式炭化水素基もしくは 【化3】 であり、ここにR3、R4は同一又は異なり、水素原子ま
たは炭素数1〜10の炭化水素基を表わし、R5及びR6
はそれぞれ独立して水素原子又は炭素数1〜3のアルキ
ル基、pは4〜7の整数、R7及びR8はそれぞれ独立し
て水素原子、ハロゲン原子又は炭素数1〜3のアルキル
基である。]で表わされる構成単位からなり、且つ一般
式[1]で表される構成単位のモル分率が15〜90モ
ル%である共重合ポリカーボネート樹脂から形成される
光ディスク基板。[Claim 1] The following general formula [1] And a structural unit represented by the following general formula [2]: [In the above formula [2], R 1 and R 2 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and a cycloalkyl having 6 to 20 carbon atoms. Group, a cycloalkoxy group having 6 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an aralkyloxy group having 7 to 20 carbon atoms, Where m and n
Is an integer of 0 to 4, respectively, and W is an alicyclic hydrocarbon group having 5 to 12 carbon atoms or Wherein R 3 and R 4 are the same or different and represent a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and R 5 and R 6
Are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, p is an integer of 4 to 7, and R 7 and R 8 are each independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 3 carbon atoms. is there. An optical disk substrate formed of a copolymerized polycarbonate resin comprising the structural unit represented by the general formula [1] and having a molar fraction of 15 to 90 mol% of the structural unit represented by the general formula [1].
サンジメタノールから誘導された構成単位である請求項
1記載の光ディスク基板。2. The optical disc substrate according to claim 1, wherein the general formula [1] is a structural unit derived from 1,4-cyclohexanedimethanol.
ヒドロキシフェニル)プロパン、1,1−ビス(4−ヒ
ドロキシフェニル)シクロヘキサン、4,4’−スルホ
ニルジフェノール及び9,9−ビス(4−ヒドロキシ−
3−メチルフェニル)フルオレンからなる群より選ばれ
た少なくとも一種の二価フェノールから誘導された構成
単位である請求項1記載の光ディスク基板。3. The compound of the general formula [2] is 2,2-bis (4-
Hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4′-sulfonyldiphenol and 9,9-bis (4-hydroxy-
2. The optical disc substrate according to claim 1, wherein the optical disc substrate is a structural unit derived from at least one dihydric phenol selected from the group consisting of (3-methylphenyl) fluorene.
とも片面に金属薄膜を形成させた光ディスク。4. An optical disk having a metal thin film formed on at least one surface of the optical disk substrate according to claim 1.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001027855A JP2002230829A (en) | 2001-02-05 | 2001-02-05 | Optical disk substrate |
US10/070,273 US6780965B2 (en) | 2000-07-11 | 2001-07-09 | Plastic lens |
CN01802727.XA CN1277127C (en) | 2000-07-11 | 2001-07-09 | Plastic lens |
PCT/JP2001/005945 WO2002004992A1 (en) | 2000-07-11 | 2001-07-09 | Plastic lens |
ES01947932T ES2311018T3 (en) | 2000-07-11 | 2001-07-09 | PLASTIC LENS. |
EP01947932A EP1302785B1 (en) | 2000-07-11 | 2001-07-09 | Plastic lens |
DE60135554T DE60135554D1 (en) | 2000-07-11 | 2001-07-09 | PLASTIC LENS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001027855A JP2002230829A (en) | 2001-02-05 | 2001-02-05 | Optical disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002230829A true JP2002230829A (en) | 2002-08-16 |
Family
ID=18892448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001027855A Pending JP2002230829A (en) | 2000-07-11 | 2001-02-05 | Optical disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002230829A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011148942A (en) * | 2010-01-25 | 2011-08-04 | Teijin Chem Ltd | Polycarbonate resin and film having low photoelastic constant |
-
2001
- 2001-02-05 JP JP2001027855A patent/JP2002230829A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011148942A (en) * | 2010-01-25 | 2011-08-04 | Teijin Chem Ltd | Polycarbonate resin and film having low photoelastic constant |
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