JP2002223075A - Method for manufacturing high-frequency laminated component, punching die and press machine used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-frequency laminated component used for high-frequency equipment which is capable of stabilizing high-frequency characteristics for mass production and a press machine used for manufacturing thereof. SOLUTION: In the component, a polyphenylene sulfide(PPS) is used as a bade material of a carrier film 4 for supporting inductive sheets 1a-1d forming a laminate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a high-frequency laminated component mainly used for high-frequency equipment, and a punching die and a press used for the method.

[0002]

2. Description of the Related Art Generally, a high-frequency laminated component forms a high-frequency circuit by combining a plurality of circuit electrodes in an inner layer portion of a dielectric laminate.

In a method of manufacturing a high-frequency laminated component, via holes and circuit electrodes are formed in a dielectric sheet having a carrier film on the back surface, and a plurality of dielectric sheets on which the circuit electrodes are printed are stacked in a predetermined order. Then, after pressing this laminated body at a time to a predetermined thickness, cut and fired to become an individual laminated body,
Conventionally, polyethylene terephthalate (hereinafter referred to as PET) has been used as a material for a carrier film.

[0004]

However, when PET is used as a carrier film material, it is effective in terms of heat resistance and cost. However, due to its elasticity, the positional accuracy of through holes in a punching step for forming via holes in particular varies. As a result, the high-frequency characteristics of the high-frequency laminated component are not stable in mass production.

Therefore, an object of the present invention is to solve such a problem and to stabilize high-frequency characteristics of high-frequency laminated components in mass production.

[0006]

Means for Solving the Problems In order to achieve this object, the invention according to claim 1 is characterized in that a material of a carrier film provided particularly on a dielectric sheet is formed of polyphenylene sulfide (hereinafter referred to as PPS). As a result, the positional accuracy of the through holes in the punching process is improved, and the high-frequency characteristics of the high-frequency laminated component can be stabilized.

According to the second aspect of the present invention, the high-frequency characteristics of the high-frequency laminated component can be further stabilized by forming a reference hole indicating a printing reference position in the printing step, particularly in the punching step.

According to the third aspect of the present invention, in particular, by forming the punching die used in the punching step to have a plurality of punching pins, the interval between the plurality of via holes can be defined by the die having high dimensional accuracy. In addition, the high frequency characteristics of the high frequency laminated component can be stabilized.

The invention according to claim 4 is to control the amount of pressing of the laminate by the press stroke of the press die, whereby the thickness of the dielectric sheet can be kept constant in the laminate, and the High frequency characteristics can be stabilized.

According to a fifth aspect of the present invention, the same effect as that of the fourth aspect can be obtained with a simple press machine structure by regulating the press stroke of the press die by the upper end surface of the frame die. Can be played.

According to a sixth aspect of the present invention, in particular, the base mold and the press mold each have a structure in which a molding surface that comes into contact with the laminated body projects from a support surface that comes into contact with the frame mold.
Press stroke accuracy can be improved, and maintenance during mass production can be facilitated.

The invention according to claim 7 is characterized in that a barrel step for polishing the surface of the laminate is provided particularly between the individual cutting step and the baking step, so that the laminate is protected from external impact on the laminate by barrel polishing. The generation of cracks can be prevented and the high frequency characteristics in mass production can be stabilized.

According to the present invention, in particular, by performing the deplasticizing step and the de-buying step separately, it is possible to set a temperature and a time corresponding to each of the steps so that sufficient removal can be performed and the efficiency of the barrel step can be improved. Can be improved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a laminated low-pass filter which is an example of a high-frequency laminated component used in a high-frequency device such as a mobile phone. A circuit for forming a high-frequency low-pass filter circuit inside a dielectric laminate 1 is shown. Electrodes 2a-2
and a chip component 3 forming a part of a high-frequency circuit is mounted on the upper surface of the laminate 1, and a high-frequency circuit formed by the circuit electrodes 2 a to 2 d and the chip component 3 is mounted on the lower surface of the laminate 1. A back surface electrode (not particularly shown) connected to the outside is formed.

Each of the dielectric sheets 1a to 1d forming the laminate 1 has circuit electrodes 2a to 2d formed on the upper surface, respectively.
The thickness varies depending on 2d.
For example, circuit electrodes 2b provided on a dielectric sheet 1b,
Reference numeral 2c denotes a ground electrode which is opposed to the circuit electrode 2a forming the ground provided on the dielectric sheet 1a, and the thickness of the dielectric sheet 1b therebetween is appropriately determined by the ground capacitance value and the facing area. Is what is done. On the other hand, the circuit electrode 2d provided on the dielectric sheet 1c is for forming an inductance connected between the above-mentioned two ground capacitors, and since this circuit electrode 2d requires a high impedance, it is grounded. Must be kept as far as possible from the circuit electrode 2a forming the same, and the thickness of the dielectric sheet 1c provided therebetween must be as large as possible.
The circuit electrodes 2a to 2d are appropriately connected by via holes 2e.

In order to form such a laminated low-pass filter, the respective manufacturing steps shown in FIG. 2 are performed, and the steps will be described below in order.

First, as shown in FIG. 3, a dielectric sheet of a predetermined size having a carrier film 4 on the back surface (the dielectric sheet 1c in FIG. 1 will be described as an example) is prepared. On the other hand, a punching step of forming a through hole 6 for the via hole 2e shown in FIG. 1 by using a punching die 5 is appropriately performed, and the dielectric sheet 1c having the through hole 6 is formed as shown in FIG. Then, a via electrode printing step of filling the through holes 6 with the electrode paste 8 using a squeegee 7 is performed.

Next, as shown in FIG.
c, a circuit electrode printing step of printing a predetermined circuit electrode 2d is performed. As shown in FIG. 6, the carrier films 4 are peeled off from the dielectric sheets 1a to 1d that have passed through the circuit electrode printing step, and are stacked in a predetermined order. The laminate 1 is subjected to a laminating step, and the laminate 1 is integrated by using a press machine 9 as shown in FIG. 7 to perform a pressing step to a predetermined thickness. Is performed along the broken line shown in FIG. 1 to form an individual laminated body 1, and a firing step of firing the individual laminated body 1 and sintering the dielectric is performed.

Each of the dielectric sheets 1a to 1d is shown in FIG.
In the punching process, the via electrode printing process, and the circuit electrode printing process up to the laminating process shown in (1), the carrier is supported by the carrier film 4 in order to maintain the shape of the dielectric sheets 1a to 1d in an uncured state, particularly before firing. The carrier film 4
As described above, PET is conventionally used as the material. However, as the size and density of the high-frequency multilayer component increase, the circuit electrodes 2a to 2d provided in the multilayer body 1 as shown in FIG.
Has become complicated, and via holes 2e have been frequently used for connection between the circuit electrodes 2a to 2d. As described above, the influence of the carrier film, particularly the elasticity, on the high-frequency characteristics of the laminated low-pass filter has increased. . Therefore, in the present embodiment, PPS is used as the material of the carrier film.

That is, the PPS is a conventional PPS.
The elasticity is lower than that of ET, and the external force received from the punching die 5 at the time of forming the through hole 6 in the punching step shown in FIG. 3 and the movement of the squeegee 7 in the circuit electrode printing step shown in FIG. No deformation, via hole 2
e and the pattern accuracy of the circuit electrodes 2a to 2d can be improved, and in particular, the large-sized dielectric sheets 1a to
If the laminated body 1 is formed in 1d and cut into individual laminated bodies 1, the change in shape of the dielectric sheets 1a to 1d in the production stage has a large influence on the high-frequency characteristics and is suppressed. As a result, the high-frequency characteristics of the multilayer low-pass filter can be stabilized, and the production yield can be greatly improved.

From the viewpoint of stabilizing the high-frequency characteristics of the multilayer low-pass filter, it is also important to improve the printing accuracy of the circuit electrodes 2a to 2d formed in the multilayer body 1. In the laminated low-pass filter shown in FIG. 1, each of the circuit electrodes 2a to 2d provided on each of the dielectric sheets 1a to 1d forms a predetermined electric circuit element while being floating-coupled to each other. This is because the printing accuracy particularly affects the floating coupling state and a predetermined circuit constant cannot be formed. To improve the printing accuracy, in the present embodiment, in the punching step in FIG. In addition, a through hole 6 for a via hole is provided on each of the dielectric sheets 1a to 1d, and a reference hole (particularly not shown) indicating a printing reference position is formed in each of the dielectric sheets 1a to 1d.

That is, since the shape of the dielectric sheets 1a to 1d in the unsintered state before sintering changes depending on storage conditions such as temperature and humidity, each dielectric sheet 1a to 1d is subjected to a punching step immediately before the printing step. Reference holes indicating printing reference positions for body sheets 1a to 1d, respectively (not particularly shown)
Is formed together with the through-holes 6 for via holes, so that printing accuracy can be improved, and this reference hole (not particularly shown) can be used to form various dielectric sheets 1 a to
If a plurality of reference holes (particularly not shown) are provided in advance for each of the dielectric sheets 1a to 1d in consideration of use for positioning of the dielectric sheets 1d, X is obtained in the planar state of the dielectric sheets 1a to 1d. The axial direction, the Y-axis direction, and the rotation angle θ can be regulated, and the lamination accuracy in the lamination process can be improved.

Further, by forming a plurality of punching pins 5a so that a plurality of through holes 6 for via holes can be formed by a single punching of the punching die 5 used in the punching step shown in FIG. 1a
1d can be reduced, the deformation of the dielectric sheets 1a to 1d caused by the punching can be suppressed, and the relative positions of the plurality of through holes 6 in the dielectric sheets 1a to 1d are determined by the highly accurate punching die 5. Therefore, the high frequency characteristics can be further stabilized.

In the pressing step shown in FIG. 2, the base die 9 constituting the pressing machine 9 as shown in FIG.
The laminated body 1 is placed on the laminate a, a frame mold 9b is arranged so as to surround the outer periphery of the laminated body 1, and the laminate 1 is pressed by sliding a press mold 9c from above the laminated body 1. At this time, the press die 9c has a structure in which a part of the press die 9c abuts on the upper end of the frame die 9b in the pressing process, that is, in the descending stage of the press die 9c, so that the press stroke is regulated.

That is, when this press machine 9 is used,
The press amount of the laminate 1 is not regulated by the press pressure but regulated by the press stroke. This is to prevent the thickness of the dielectric sheets 1a to 1d forming the laminate 1 from being changed after pressing due to the difference in sheet density. In the laminated low-pass filter shown in FIG. When a constant pressure press is applied, for example, regarding a capacitor formed by the circuit electrode 2b and the circuit electrode 2a, if the density of the dielectric sheet 1b is low, the thickness of the dielectric sheet 1b after pressing becomes smaller than the expected one. The capacity of the capacitor formed here becomes large. Alternatively, if the density of the dielectric sheet 1b is high, the thickness of the dielectric sheet 1b after pressing becomes thicker than expected and the capacitor capacity formed here becomes smaller. The effect on the circuit is significant.

On the other hand, when the press amount is regulated by the press stroke, that is, by the press finished dimension of the laminated body 1, even if the sheet density of the dielectric sheets 1a to 1d varies, the post-pressing is performed. Since the thickness of the laminated body 1 is kept constant, the high-frequency circuit can be set to a desired value.

Further, in the base mold 9a and the press mold 9c used in the press machine 9, the molding surfaces in contact with the upper and lower surfaces of the laminate 1 respectively protrude more than the contact surfaces with the frame mold 9b. It has a shape. This is the base mold 9
a and the molding surface of the press die 9c are required to have extremely flatness, and this is for improving the polishing accuracy at the time of forming the die. Is provided at the outer peripheral end of the lens, so that the surface is easily formed with high surface accuracy.

The laminating step shown in FIG. 2 is to stack the dielectric sheets 1a to 1d on which the circuit electrodes 2a to 2d and the via holes 2e are printed as described above in a predetermined order. The dielectric sheet 1b on which the circuit electrodes 2b and 2c are printed is stacked on the dielectric sheet 1a on which the circuit electrode 2a is printed. And this dielectric sheet 1
The laminated body composed of the dielectric sheet 1a and the dielectric sheet 1b is subjected to hot pressing to bind a binder component contained in the dielectric sheet and prevent lateral displacement between the dielectric sheets. Then, the procedure of stacking the dielectric sheet 1c on the dielectric matrix 1b, fixing the dielectric sheet 1c on the dielectric matrix 1b, and performing hot pressing again and fixing the dielectric sheet 1b as the laminated matrix is repeated.

That is, the hot pressing in the laminating step is to stack and fix the dielectric sheets 1a to 1d one by one with respect to the laminated base material.
The main purpose is to apply heat for binding the binder component contained in 1d, and the pressing load in the hot press may be a very small one that presses the dielectric sheets 1a to 1d so as not to move on the laminated matrix. The lamination accuracy in the press is very high.

Even if a large pressing load is applied in the pressing step of processing the laminated body 1 having undergone the laminating step to a predetermined thickness, each of the dielectric sheets 1a
1 to 1d are securely fixed by the binding of the binder component, so that even if a large press load is applied to each of the dielectric sheets 1a to 1d, a laminate having a predetermined thickness without lateral displacement can be formed. .

That is, the high-frequency circuit formed in the multilayer body 1 is greatly affected by the lamination accuracy of the multilayer body 1. By adopting the above-described process in the manufacturing process of this high-frequency multilayer component, the handling frequency will be increased in the future. This is a very effective means for a high-frequency laminated component that becomes even higher.

In forming such a laminated body 1, barrel polishing is performed on the surface of the laminated body 1 in order to remove burrs of the laminated body 1 generated after cutting individual pieces. As shown in FIG. 2, providing between the individual cutting step and the firing step, which is a stage before sintering the laminate 1, is an effective means in the high-frequency laminated component.

This is because, when the barrel process is performed on the sintered laminate 1, microcracks are easily generated by an external impact, and the microcracks are caused by the microcracks.
There is a possibility that the dielectric loss of the high-frequency circuit formed therein is increased, and that the conduction of the high-frequency circuit is poor. However, by applying the barrel step of forming the microcracks to the uncured laminate 1 before firing, the external impact on the laminate due to barrel polishing can be reduced, so that the influence on the circuit electrodes 2a to 2d is reduced. In addition, even if a microcrack occurs in the laminate 1 at this time, the microcrack disappears due to the glass component contained in the laminate at the time of firing, so that the characteristics of the high frequency laminated component are not affected as a result. It is.

Further, in the deplasticizing step and the de-buying step for removing the plasticizer and the binder component contained in the dielectric sheets 1a to 1d, both the plasticizer and the binder component are simultaneously burned off by the firing heat in the firing step. However, in the present embodiment, as shown in FIG. 2, the deplasticizing step and the de-buying step are performed separately.

This is because if the de-buying step and the de-plasticizing step during firing are performed simultaneously, a temperature difference occurs between the outer part and the inner part of the laminate 1 and the plasticizer and the binder component in the inner part are sufficiently removed. These components remain in the laminate 1 and affect the high-frequency characteristics.
However, by performing these steps separately, it is possible to set a temperature setting, a time, and the like corresponding to each of the steps, so that sufficient removal can be performed.

If a barrel step is provided after the deplasticization step, the laminate 1 in which the plasticizer has been removed and the laminate 1 is in a rough state is barrel-polished, thereby improving the polishing efficiency. It can be done.

[0038]

As described above, according to the present invention, since the material of the carrier film provided on the dielectric sheet is formed of polyphenylene sulfide (hereinafter, referred to as PPS), the positional accuracy of the through holes in the punching process can be improved. It is possible to improve and stabilize the high frequency characteristics of the high frequency laminated component.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a laminated low-pass filter according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a manufacturing process of the laminated low-pass filter.

FIG. 3 is a sectional view showing a punching step.

FIG. 4 is a sectional view showing a via electrode printing step.

FIG. 5 is a perspective view showing a circuit electrode printing process.

FIG. 6 is a perspective view showing a state of a laminated structure.

FIG. 7 is a cross-sectional view of a press machine used in a press process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laminated body 1a-1d Dielectric sheet 2a-2d Circuit electrode 2e Via hole 4 Carrier film 6 Through-hole

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 Y H01P 11/00 H01P 11/00 K

Claims (8)

[Claims] 1. A method for manufacturing a high-frequency laminated component comprising: a laminated body in which a plurality of dielectric sheets are laminated; a circuit electrode and a via hole for forming a high-frequency circuit in the laminated body; A punching step of forming a through hole for forming the via hole in the dielectric sheet; a via electrode printing step of filling a via electrode in the through hole of the punched dielectric sheet; A circuit electrode printing step of forming the circuit electrodes, a stacking step of stacking a plurality of dielectric sheets on which the circuit electrodes are printed in a predetermined order, and integrating the stacked body to a predetermined thickness. A pressing step; a cutting step of cutting the integrated laminate into individual pieces; and a firing step of sintering the laminated body of the individual pieces. A method for manufacturing a high-frequency laminated component, wherein a material of a rear film is formed of polyphenylene sulfide (PPS). 2. The punching step, wherein a through hole for forming a via hole is formed in the dielectric sheet, and a reference hole indicating a printing reference position in the printing step is also formed. Of manufacturing high frequency laminated parts. 3. The high-frequency laminated component according to claim 1, wherein the punching die used in the punching step according to claim 2 includes a plurality of punching pins that simultaneously form a plurality of through holes. Punching mold. 4. The pressing step, wherein the amount of compression of the laminated body is controlled by a stroke of a mold.
3. The method for manufacturing a high-frequency laminated component according to claim 1. 5. The press die according to claim 4, wherein the press die is disposed on a base die on which the laminate is placed, and is fixed to the base die and surrounds a side of the laminate. Frame die, and a press die that slides in the frame die and presses the upper surface of the laminated body, and the press stroke of the press die is regulated by the upper end surface of the frame die. A press machine characterized by the following configuration. 6. The press according to claim 5, wherein each of the base die and the press die has a molding surface that comes into contact with the laminated body protruding from a support surface that comes into contact with the frame die. 7. The method for manufacturing a high-frequency laminated component according to claim 1, further comprising a barrel step of polishing the surface of the laminate between the individual cutting step and the firing step. 8. A deplasticizing step for removing a plasticizer contained in the laminate between the individual cutting step and the barrel step, wherein a binder component contained in the laminate is removed between the green barrel step and the firing step. The method for manufacturing a high-frequency laminated component according to claim 2, further comprising a de-buying step for removing.