JP2002192369A5 - - Google Patents

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Publication number
JP2002192369A5
JP2002192369A5 JP2001278752A JP2001278752A JP2002192369A5 JP 2002192369 A5 JP2002192369 A5 JP 2002192369A5 JP 2001278752 A JP2001278752 A JP 2001278752A JP 2001278752 A JP2001278752 A JP 2001278752A JP 2002192369 A5 JP2002192369 A5 JP 2002192369A5
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JP
Japan
Prior art keywords
workpiece
along
laser beam
elliptically polarized
laser
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Application number
JP2001278752A
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English (en)
Japanese (ja)
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JP3722731B2 (ja
JP2002192369A (ja
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Priority to JP2001278752A priority Critical patent/JP3722731B2/ja
Priority claimed from JP2001278752A external-priority patent/JP3722731B2/ja
Publication of JP2002192369A publication Critical patent/JP2002192369A/ja
Publication of JP2002192369A5 publication Critical patent/JP2002192369A5/ja
Application granted granted Critical
Publication of JP3722731B2 publication Critical patent/JP3722731B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001278752A 2000-09-13 2001-09-13 レーザ加工方法 Expired - Lifetime JP3722731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-278306 2000-09-13
JP2000278306 2000-09-13
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2002097725A Division JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法
JP2005207559A Division JP4837320B2 (ja) 2000-09-13 2005-07-15 加工対象物切断方法

Publications (3)

Publication Number Publication Date
JP2002192369A JP2002192369A (ja) 2002-07-10
JP2002192369A5 true JP2002192369A5 (OSRAM) 2005-09-02
JP3722731B2 JP3722731B2 (ja) 2005-11-30

Family

ID=26599877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001278752A Expired - Lifetime JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Country Status (1)

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JP (1) JP3722731B2 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US7592238B2 (en) 2000-09-13 2009-09-22 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8361883B2 (en) 2002-03-12 2013-01-29 Hamamatsu Photonics K.K. Laser processing method

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7015118B2 (en) 2001-10-31 2006-03-21 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
EP1609559B1 (en) 2003-03-12 2007-08-08 Hamamatsu Photonics K. K. Laser beam machining method
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
DE112004000768B4 (de) * 2003-05-12 2015-07-23 Tokyo Seimitsu Co., Ltd. Verfahren zum Trennen eines plattenartigen Elements
DE112004000769B4 (de) * 2003-05-22 2015-06-25 Tokyo Seimitsu Co., Ltd. Laser-Chipschneidvorrichtung
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2007235069A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
JP5573832B2 (ja) 2009-02-25 2014-08-20 日亜化学工業株式会社 半導体素子の製造方法
JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
KR20120073249A (ko) 2009-08-28 2012-07-04 코닝 인코포레이티드 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20140138134A (ko) 2012-02-28 2014-12-03 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품
WO2013130581A1 (en) * 2012-02-28 2013-09-06 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US9227868B2 (en) 2012-02-29 2016-01-05 Electro Scientific Industries, Inc. Method and apparatus for machining strengthened glass and articles produced thereby
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
JP6783374B2 (ja) * 2016-07-15 2020-11-11 テラダイオード， インコーポレーテッド 可変ビーム形状を有するレーザを利用する材料処理
CN114227957B (zh) * 2021-12-20 2024-03-26 常州时创能源股份有限公司 硅棒切割方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7592238B2 (en) 2000-09-13 2009-09-22 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7825350B2 (en) 2000-09-13 2010-11-02 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8227724B2 (en) 2000-09-13 2012-07-24 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8283595B2 (en) 2000-09-13 2012-10-09 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US8268704B2 (en) 2002-03-12 2012-09-18 Hamamatsu Photonics K.K. Method for dicing substrate
US8361883B2 (en) 2002-03-12 2013-01-29 Hamamatsu Photonics K.K. Laser processing method

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