JP2002184800A - Metal mold for resin molding for molding semiconductor chip out of resin and semiconductor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily remove burrs which are inevitably formed because of the absence of a lead terminal part when a sealing resin part which seals a semiconductor chip is molded out of resin. SOLUTION: The cavity shape of a resin molding metal mold for molding the sealing resin part 27 is improved and then a resin part 28 for deburring is formed of projecting resin along the lead terminal part 24. The resin part 28 for deburring is held by respective lead terminal parts 24 in contact with mutually opposite flanks 29 of adjacent lead terminal parts 24 while so divided that the lead terminal parts 24 are connected to each other and the resin part 28 has a projection 31 higher than the thickness of the lead terminal part 24; and the projection 31 has a gradient surface 32 extending to the lead terminal part 24. When the resin part 28 for deburring is removed, the moment peeling the resin part off the lead terminal part 24 operates through the operation of the gradient surface 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding die for resin-molding a semiconductor chip and a semiconductor component having a sealing resin portion formed by using the resin molding die. The present invention relates to an improvement for facilitating removal of burrs inevitably generated during resin molding.

[0002]

2. Description of the Related Art FIG. 5 shows a semiconductor component 1 having a conventional resin-sealed package structure which is of interest to the present invention. 5A is a front view showing a part of the semiconductor component 1 in a cross section, FIG. 5B is a plan view showing a part of the semiconductor component 1, and FIG. It is sectional drawing which follows the line CC.

A semiconductor component 1 includes a rail portion 2 and a rail portion 2.
And a lead frame 4 made of a thin metal plate having a plurality of lead terminal portions 3 connected to the lead frame. Further, the semiconductor component 1 includes a semiconductor chip mounted on the lead frame 4 so as to be connected to the plurality of lead terminal portions 3, and a sealing resin portion 5 for sealing the semiconductor chip with a resin. I have. The semiconductor chip is not shown because it is covered with the resin sealing portion 5.

When assembling such a semiconductor component 1,
The rail 2 is positioned or transported while holding the rail 2 in the lead frame 4. In order to ensure the positioning and transport, the rail 2 is used.
Are provided with a plurality of pilot holes 6.

Further, when the resin sealing portion 5 is formed, the space between the adjacent lead terminal portions 3 is set so that the resin for providing the resin sealing portion 5 does not enter between the adjacent lead terminal portions 3. A dam bar 7 is provided so as to be connected.
Further, a dam resin portion 8 is formed between the dam bar 7 and the resin sealing portion 5 for facilitating removal of burrs formed by protrusion of the resin for providing the resin sealing portion 5.

FIG. 6 is an enlarged sectional view showing a part of a resin molding die 9 used in a resin molding step for molding the resin sealing portion 5 and the dam resin portion 8. FIG. 6 illustrates the mold 9 in a state where the mold 9 is aligned with the lead terminal portion 3 in the resin molding process. The mold 9 includes an upper mold 10 and a lower mold 11.

Although FIG. 6 shows a sub-cavity portion 12 serving as a cavity for molding the dam resin portion 8, a main cavity portion serving as a cavity for molding the sealing resin portion 5 is not shown. Not shown. The shape of the main cavity portion will be obvious from the outer shape of the sealing resin portion 5. Further, as shown in FIG. 5, the dam resin portion 8 is provided with a convex portion 13, but the sub cavity portion 12 has
As shown in FIG. 6, a concave portion 14 corresponding to the convex portion 13 is provided.

As described above, the dam resin portion 8 is formed by the protrusion of the resin that provides the resin sealing portion 5.
Is shown in

That is, the mold 9 defines a guide passage portion 16 serving as a passage for guiding each of the plurality of lead terminal portions 3 out of the main cavity while communicating with the main cavity. have. The upper die 10 and the lower die 11 of the mold 9 can be brought into relatively close contact with the upper main surface and the lower main surface of the lead terminal portion 3 respectively. On the other hand, it is difficult to make contact, so that some gap 15 is inevitably formed along the guide passage portion 16.

The burrs are formed due to the protrusion of the resin from the gaps 15. However, if such burrs are intentionally formed and the removal is easily performed later, the burrs are formed. The dam resin portion 8 is formed because it is more advantageous to form the dam resin portion. The protrusions 13 formed on the dam resin portion 8 are for making the removal of the dam resin portion 8 easier. As burrs, flash burrs that adhere along the main surface of the lead terminal portion 3 are often formed in addition to the dam resin portion 8 described above.

The semiconductor component 1 shown in FIG. 5 is to be a so-called intermediate product. A semiconductor chip is sealed by a resin sealing portion 5 and a plurality of semiconductor chips are led out from the semiconductor chip through the resin sealing portion 5. In order to obtain a semiconductor device as a final product having the lead terminals, the lead terminal portion 3 is cut in the vicinity of the rail portion 2 as shown by the one-dot chain line 17 and then obtained by cutting the lead terminal portion 3. Necessary processing such as bending is performed on the provided lead terminal.

Prior to the cutting of the lead terminal portion 3 along the dashed line 17, the dam resin portion 8 is removed. For removing the dam resin portion 8, for example, punching is applied. At this time, due to the load applied from the punching die, stress is concentrated on the convex portion 13 of the dam resin portion 8, so that the dam resin portion 8 is more easily removed.

In the above-mentioned punching step,
At the same time, the punching die cuts the position indicated by the dashed line 18 so as to remove the dam bar 7.

[0014]

However, the above-mentioned prior art has the following problems to be solved.

First, when the dam resin portion 8 is to be removed by punching, there is a problem that the dam resin portion 8 may remain without being removed in a portion other than the portion hit by the punching die. More specifically, the area where the punching die contacts the dam resin portion 8 is determined by taking into account the positional displacement that can inevitably occur between the sealing resin portion 5 and the lead terminal portion 3. Therefore, the dam resin portion 8 may remain near the sealing resin portion 5 and the lead terminal portion 3 in some cases.

Further, as described above, the remaining portion of the dam resin portion 8 is further removed by applying water jet, sand blast, or the like. However, when the lead frame 4 is made by etching, Since many fine irregularities are present on the side surface of the lead terminal portion 3, much time is required to reliably remove the dam resin portion 8 attached to such a side surface.

Further, in order to remove the dam bar 7, cutting is performed along the one-dot chain line 18, but as a result, a protruding portion 19 that protrudes laterally is left in the lead terminal portion 3. The overhang portion 19 makes the end of the lead terminal portion 3 on the resin sealing portion 5 side more easily deformed.
This is likely to occur in the step of separating the lead terminal portion 3 from the rail portion 2 along the dashed line 17. This lead terminal 3
If the deformation in is caused by the lead terminal after cutting, it will hinder the subsequent processing steps such as bending.

Further, after the dam bar 7 is cut as described above, the overhang 19 brought to the lead terminal 3 is
This hinders a narrow pitch of lead terminals in a semiconductor device.

Further, since the removal of the dam resin portion 8 and the cutting of the dam bar 7 are achieved by a common punching die, the punching die is consumed greatly, and the punching die must be replaced relatively frequently. No.

If the lead terminal is subjected to a bending process or the like while a part of the dam resin portion 8 is left, undesired bending occurs in the lead terminal or the lead terminal becomes flat. This causes a problem that the performance is impaired, and is a serious problem particularly for a surface mount type semiconductor device.

Accordingly, an object of the present invention is to provide a resin mold for resin-molding a semiconductor chip and a resin molded using the resin mold, which can solve the various problems described above. An object is to provide a semiconductor component having a sealing portion.

[0022]

SUMMARY OF THE INVENTION The present invention relates to a semiconductor chip mounted to be connected to a plurality of lead terminals in a lead frame having a rail and a plurality of leads connected to the rail. Forming a sealing resin portion for sealing with resin, used in a resin molding process, is directed first to a resin molding die, in order to solve the above-described technical problems,
It is characterized by having the following configuration.

That is, the resin molding die according to the present invention is located so as to surround the semiconductor chip, and has at least two main cavities, which are cavities for molding a resin sealing portion, and a lead terminal portion. A guide passage portion defined by a wall surface in contact with the surface and communicating with the main cavity portion, a guide passage portion serving as a passage for guiding each of the plurality of lead terminal portions to the outside from the main cavity portion, and a main cavity portion; It has walls that respectively define a sub-cavity portion that serves as a cavity for molding the deburring resin portion along the lead terminal portion with the resin protruding from the portion through the guide passage portion.

In such a resin mold,
The following characteristic shape is given to the above-mentioned sub-cavity portion. In other words, while the deburring resin portion is in contact with the opposing side surfaces of the adjacent lead terminal portions,
Each of the lead terminals has a protruding portion that is held by each of the lead terminals in a divided state so as not to connect between adjacent lead terminals, and protrudes higher than the thickness of the lead terminal. The shape of the sub-cavity is given so as to take such a form, in which a sloping surface extending into the sub-cavity is formed.

In the resin mold according to the present invention, the surface for forming the above-mentioned inclined surface in the sub cavity portion may be a surface extending in a plane or a surface extending in a curved surface. .

The present invention is also directed to a semiconductor component having a sealing resin portion formed using the above-described resin mold.

In order to solve the above-mentioned technical problem, this semiconductor component is connected to a lead frame including a rail and a plurality of lead terminals connected to the rail, and to the plurality of lead terminals. Semiconductor chip mounted on the lead frame, a sealing resin portion for sealing the semiconductor chip with resin, and a deburring resin portion formed along the lead terminal portion.

The deburring resin portion is held by each of the lead terminal portions in a divided state so as not to connect the adjacent lead terminal portions while being in contact with the side surfaces of the adjacent lead terminal portions facing each other. And a protruding portion protruding higher than the thickness of the lead terminal portion, and a slope surface extending to the lead terminal portion is formed on the protruding portion.

In the semiconductor component according to the present invention, the boundary between the sealing resin portion and the deburring resin portion is thinner than both the sealing resin portion and the deburring resin portion. Is preferably formed.

Further, as in the case of the resin mold described above, the slope surface of the deburring resin portion may be a surface extending in a plane or a surface extending in a curved surface.

[0031]

1A and 1B show a semiconductor component 21 according to an embodiment of the present invention. FIG. 1A is a front view showing the semiconductor component 21 in a partial cross section, and FIG. FIG. 2 is a plan view showing a part of a semiconductor component 21. FIG. 2 is an enlarged sectional view taken along line II-II in FIG. FIG. 3 is an enlarged cross-sectional view showing a part of a resin mold 22 used in manufacturing the semiconductor component 21 shown in FIGS. 1 and 2.

Referring to FIG. 1, semiconductor component 21 is formed as shown in FIG.
As in the case of the conventional semiconductor component 1 shown in FIG.

The semiconductor component 21 has a lead frame 25 having a rail 23 and a plurality of lead terminals 24 connected to the rail 23. In the rail part 23,
A plurality of pilot holes 26 for positioning and transporting the lead frame 25 are provided.

The semiconductor component 21 includes a semiconductor chip (not shown) mounted on the lead frame 25 so as to be connected to the plurality of lead terminal portions 24, and a sealing for sealing the semiconductor chip with resin. And a stopper resin portion 27.

The semiconductor component 21 is connected to the lead terminal 2.
4 is provided. The deburring resin portion 28 corresponds to the dam resin portion 8 in the conventional semiconductor component 1 shown in FIG. 5, but is formed in a different manner from the conventional dam resin portion 8.

That is, the deburring resin portion 28 is divided via the gap 30 so as to be in contact with the side surfaces 29 of the adjacent lead terminal portions 24 facing each other and not to connect the adjacent lead terminal portions 24. In this state, it is held by each of the lead terminal portions 24. The deburring resin portion 28 is preferably formed so as not to reach the rail portion 23.

As shown in FIG. 2, the deburring resin portion 28 has a projecting portion 31 projecting higher than the thickness of the lead terminal portion 24. A sloping surface 32 extending to the portion 24 is formed. In this embodiment, the slope surface 32 is provided by a plane extending in a plane.

Further, the lead frame 25 does not have an element corresponding to the dam bar 7 shown in FIG.

Since the deburring resin portion 28 is formed by extruding the resin that provides the sealing resin portion 27, the deburring resin portion 28 and the sealing resin portion 27 are connected to each other by the resin. However, as shown in FIG. 1A, at the boundary between the sealing resin portion 27 and the deburring resin portion 28, the sealing resin portion 27 and the deburring resin portion 28 In any case, a thinner portion 33 is formed.

The resin mold 22 partially shown in FIG. 3 is composed of an upper mold 34 and a lower mold 35, and a resin for molding the sealing resin portion 27 and the deburring resin portion 28. Used in the molding process.

The mold 22 is positioned so as to surround a semiconductor chip (not shown), and has a wall surface that defines a main cavity portion serving as a cavity for molding the resin sealing portion 27. Although the main cavity portion is not shown, its shape will be obvious from the outer shape of the sealing resin portion 27.

The mold 22 is defined by a wall surface which is in contact with at least both the main surfaces 36 and 37 of the lead terminal portion 24, and communicates with the main cavity portion so as to connect each of the plurality of lead terminal portions 24 to the main cavity portion. Guide passage portion 38 serving as a passage for guiding to protrude from the portion to the outside
Are defined. FIG. 3 shows the guide passage 3
The lead terminal portion 24 positioned so as to pass through 8 is shown.

As described above, it is relatively easy to obtain a state in which the wall surface defining the guide passage portion 38 is in contact with both the main surfaces 36 and 37 of the lead terminal portion 24. It is relatively difficult to obtain a state of contact with the side surface 29, so that a gap 39 is formed between the wall surface defining the guide passage 38 and the side surface 29 of the lead terminal portion 24.

Therefore, the resin for providing the sealing resin portion 27 formed by the main cavity portion protrudes through the gap 39 of the guide passage portion 38, and the protruding resin forms the deburring resin portion 28. The mold 22
As shown in FIG. 3, it has a wall surface that defines a sub-cavity portion 40 serving as a cavity for molding the deburring resin portion 28.

The shape of the sub-cavity 40 is shown in FIGS.
As can be seen from the comparison with the above, it is correlated with the outer shape of the resin part 28 for deburring. That is, the upper mold 34 of the mold 22
Is provided with a rib 41 for molding the gap 30 in the deburring resin portion 28, and
Is formed. The concave portion 42 is formed on one side of the protruding portion 31.
A part thereof is defined by a gradient forming surface 43 for forming the second member 2. The slope forming surface 43 is provided by a plane extending in a plane corresponding to the plane slope 32.

In the mold 22 shown in FIG.
Although 1 is provided on the upper mold 34 side, it may be provided on the lower mold 35 side. In this case, the taper formed in the rib is reversed. Further, the ribs may be provided in a state of being shared by both the upper mold 34 and the lower mold 35.

The mold 22 is provided with a wall portion 44 for forming a thin portion 33 at the boundary between the deburring resin portion 28 and the sealing resin portion 27 shown in FIG. Have been. The wall portion 44 has a cross section V corresponding to the shape of the V-shaped groove 45 formed above the thin portion 33 in FIG.
It has a character shape.

After the sealing resin portion 27 and the deburring resin portion 28 are formed by performing the resin molding process using the mold 22 having the structure described above, the deburring resin portion 28 is removed. Is done. For this removal, for example, punching is applied, or a water pressure such as a water jet is applied.

Regardless of the method used, the projecting portion 31 of the deburring resin portion 28 is perpendicular to the main surfaces 36 and 37 of the lead terminal portion 24 from above in the figure. Power is applied. As a result, since the slope surface 32 is formed on the protruding portion 31, a moment for separating the deburring resin portion 28 so as to separate it from the side surface 29 of the lead terminal portion 24 acts simultaneously with the shearing force. As a result, it is easy to remove all of the deburring resin portion 28 with a smaller force without applying a force by, for example, bringing the punching die into contact with the entire surface of the deburring resin portion 28. Become.

As described above, the deburring resin portion 2
In the process for removing flash burrs which will be carried out later, the resin portion 2 for removing burrs can be easily removed with a smaller force.
8 may be removed together with the flash burr to reduce the number of steps.

As shown in FIG. 1, in this embodiment, the deburring resin portion 28 is formed to be elongated along the lead terminal portion 24. Therefore, even if the lead frame 25 is not provided with a shape portion corresponding to the dam bar 7 shown in FIG. 5, the resin for providing the deburring resin portion 28 in the sub-cavity portion 40 of the mold 22 in the resin molding process. Can be kept. In this regard, FIG.
The end portion of the deburring resin portion 28 on the side of the rail portion 23 has a regular shape. However, depending on the conditions in the resin molding process and the shape and / or volume of the sub-cavity portion 40, etc. The resin portion 28 may be formed in a tapered shape, for example.

As described above, in this embodiment,
Since the lead frame 25 does not include an element corresponding to the dam bar 7 shown in FIG. 5, a step for cutting the same is unnecessary.

Next, the lead terminal part 24
Is cut at the end on the rail portion 23 side as shown by
As a result, a state is formed in which the lead terminals are independent from each other. Then, necessary processing such as bending is performed on the lead terminals, whereby a semiconductor device as a final product is completed.

FIG. 4 is a view corresponding to FIG. 3, showing a resin mold 22a according to another embodiment of the present invention. 4, elements corresponding to the elements shown in FIG. 3 are denoted by the same reference numerals, and redundant description will be omitted.

The mold 22a shown in FIG.
Is formed by a surface extending in a curved surface. Other configurations are substantially the same as those of the mold 22 shown in FIG.

According to the gradient molding surface 43a extending in a curved shape, the gradient surface 32 in the deburring resin portion 28 can be provided by a surface extending in a curved shape. As described above, the slope surface 32 is a plane extending in a plane, a plane extending in a curved plane, or a plane having a combination of two or more planes. It may be a combination.

Although the present invention has been described with reference to the illustrated embodiment, other than the above, within the scope of the present invention,
Various modifications are possible.

For example, as shown in FIG. 1, the illustrated semiconductor component 21 has a structure in which the lead terminal portions 34 are led out in two directions. The present invention can be applied to all semiconductor components for a semiconductor device having a resin-sealed package structure such as QFP.

In the above-described embodiment, the projecting portions 31 of the plurality of deburring resin portions 28 are illustrated so as to have the same height, but these projecting portions have different heights. You may.

[0060]

As described above, according to the present invention, the deburring resin portion formed along the lead terminal portion is in contact with the side surfaces of the adjacent lead terminal portions facing each other.
It has a protruding portion that is held by each of the lead terminal portions in a divided state so as not to connect between adjacent lead terminal portions, and that protrudes higher than the thickness of the lead terminal portion. Since a gradient surface extending to the lead terminal portion can be formed, when a force in a direction perpendicular to the main surface of the lead terminal portion is applied toward the deburring resin portion, the action of the gradient surface causes A peeling force due to a moment easily acts between the deburring resin portion and the lead terminal portion 24, so that the deburring resin portion can be easily and reliably removed.

Further, according to the present invention, since flash burrs are easily absorbed by the deburring resin portion, the flash burrs themselves can be extremely reduced. Therefore, the removal of the deburring resin portion and the removal of the flash burr can be completed in a common step, and the number of steps for deburring and the time required for the steps can be reduced.

When the lead frame is formed by etching, many fine irregularities are formed on the side surface of the lead terminal portion. To remove burrs adhering to such side surface, a water jet or sand blast is used. However, according to the present invention, the deburring resin portion adheres to the side surface of the lead terminal portion, and accordingly, the deburring resin portion as a relatively large lump is provided. It is enough to remove the
It can be done reliably, easily and in a short time.

Further, since a projecting portion is formed on the deburring resin portion and a slope is formed on the projecting portion, if punching is applied to the deburring resin portion, a punching die is used. In this case, it is not necessary to provide projections corresponding to the arrangement pitch and the number of the lead terminal portions, so that it is possible to avoid complicating the shape of the punching die, and to strictly control the punching die and the lead terminal portion in the punching step. Alignment is not required.

Further, according to the present invention, a dam bar for preventing the resin for providing the deburring resin portion from entering between the lead terminal portions is not required, so that a step for removing the dam bar is not required. Therefore, the problem of the consumption of the punching die for removing the dam bar is not bothered. Therefore, the service life of the punching die for removing the deburring resin portion can be extended as compared with the conventional case in which the removal of the dam bar and the removal of the dam resin portion are performed by a common punching die.

As described above, as a result of the reduction in the number of steps, the reduction in the time required for performing the steps, and the extension of the life of the mold, the cost for manufacturing a desired semiconductor device can be reduced. it can.

Further, as described above, since there is no need to provide a dam bar in the lead frame, it is possible to avoid the problem caused by the overhang remaining on the lead terminal after the dam bar is removed. That is, it is possible to avoid the problem that the lead terminal provided by the lead terminal portion is easily deformed due to the presence of the overhang portion, and the problem that the pitch of the lead terminals is prevented from being narrowed.

In the semiconductor component according to the present invention, when the thin portion is formed at the boundary between the sealing resin portion and the deburring resin portion, the deburring resin portion can be more easily removed. In addition, the surface of the sealing resin portion after the deburring resin portion is removed can be finished in a more clean state.

[Brief description of the drawings]

1A and 1B show a semiconductor component 21 according to an embodiment of the present invention, in which FIG. 1A is a front view showing the semiconductor component 21 in a partial cross section, and FIG. FIG.

FIG. 2 is an enlarged sectional view taken along a line II-II in FIG. 1 (b).

FIG. 3 shows a part of a resin molding die 22 used in a resin molding step for molding the sealing resin part 27 and the deburring resin part 28 shown in FIGS. It is sectional drawing which expands and shows in the state aligned with (3).

FIG. 4 is a view corresponding to FIG. 3, showing a resin mold 22a according to another embodiment of the present invention.

FIG. 5 shows a conventional semiconductor component 1 of interest to the present invention.
(A) is a front view showing the semiconductor component 1 in a partial cross section, (b) is a plan view showing a part of the semiconductor component 1, and (c) is (b) It is sectional drawing which follows the line CC of FIG.

FIG. 6 shows a resin sealing portion 5 and a dam resin portion 8 shown in FIG.
FIG. 5 is an enlarged cross-sectional view showing a part of a resin molding die 9 used in a resin molding step for molding a resin terminal in a state where it is aligned with a lead terminal portion 3.

[Explanation of symbols]

 REFERENCE SIGNS LIST 21 semiconductor component 22, 22 a resin mold 23 rail portion 24 lead terminal portion 25 lead frame 27 resin sealing portion 28 deburring resin portion 29 side surface of lead terminal portion 30 gap 31 projecting portion 32 inclined surface 33 thin portion 36 , 37 Main surface of lead terminal portion 38 Guide passage portion 39 Gap 40 Subcavity portion 41 Rib 42 Recess 43, 43a Gradient forming surface

Claims (7)

[Claims] 1. A semiconductor chip mounted to be connected to a plurality of said lead terminals in a lead frame having a rail and a plurality of leads connected to said rail is sealed with a resin. Used in a resin molding process to mold a sealing resin portion for
A resin molding die, which is positioned so as to surround the semiconductor chip and is a main cavity portion serving as a cavity for molding the sealing resin portion, and a wall surface in contact with at least both main surfaces of the lead terminal portion. And a guide passage portion serving as a passage for guiding each of the plurality of lead terminal portions to the outside from the main cavity portion while communicating with the main cavity portion, and the main cavity Having a wall which respectively defines a sub-cavity portion which serves as a cavity for molding a deburring resin portion along the lead terminal portion, with the resin protruding from the portion through the guide passage portion, and the deburring resin portion. Are divided so as not to connect the adjacent lead terminal portions while contacting the side surfaces of the adjacent lead terminal portions facing each other. A protruding portion that is held by each of the lead terminal portions in a state where the lead terminal portion is protruded and that is higher than the thickness of the lead terminal portion, and a slope surface extending to the lead terminal portion is formed in the protruding portion. A resin molding die for resin-molding a semiconductor chip, wherein the shape of the sub-cavity is provided so as to take such a form. 2. The resin mold according to claim 1, wherein the surface for forming the inclined surface in the sub cavity portion is a surface extending in a planar shape. 3. The resin mold according to claim 1, wherein the surface for forming the inclined surface in the sub cavity portion is a surface extending in a curved shape. 4. A lead frame including a rail and a plurality of lead terminals connected to the rail, and a semiconductor chip mounted on the lead frame so as to be connected to the plurality of lead terminals. A sealing resin portion for sealing the semiconductor chip with a resin; and a deburring resin portion formed along the lead terminal portion, wherein the deburring resin portion is adjacent to the lead terminal. A projection that is held by each of the lead terminal portions in a divided state so as not to connect between adjacent ones of the lead terminal portions, and that protrudes higher than the thickness of the lead terminal portion while being in contact with the side surfaces facing each other of the portion. A semiconductor component having a portion, wherein a slope surface extending to the lead terminal portion is formed on the protruding portion. 5. A thinner portion is formed at a boundary between the sealing resin portion and the deburring resin portion, which is thinner than any of the sealing resin portion and the deburring resin portion. The semiconductor component according to claim 4, wherein: 6. The slope surface of the deburring resin portion,
The semiconductor component according to claim 4, wherein the semiconductor component is a plane extending in a plane. 7. The slope surface of the deburring resin portion,
The semiconductor component according to claim 4, wherein the semiconductor component is a surface extending in a curved shape.