JP2002134846A - Electronic component mounting board and apparatus for reversing and transferring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To arrange an electronic component mounting board 1 having alignment means, upset the board one turn and position it on a board mounting stage 8, thus transferring it. SOLUTION: A transfer stage 2 comprises positioning pins 4 to be inserted in holes of an electronic component mounting board 1 and clampers 3 for tightly holding the board 1 so as to upset and transfer the board positioned at a fixed point, thereby exactly transferring the board to the stage 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large and flexible electronic component mounting board on which electronic components such as ICs are mounted, and a method for inverting the electronic component mounting board to precisely position and transfer to a desired stage. It relates to a transfer mounting device.

[0002]

2. Description of the Related Art Generally, a flexible substrate of this type on which electronic components such as a driver IC are mounted is used for a driving circuit such as a plasma display or a liquid crystal panel. Further, since this substrate is a soft and large resin sheet or resin film, it has been difficult to automatically handle such as transferring or reversing the substrate itself in each manufacturing process. Usually, transfer and reversal in these steps are performed manually by an operator. However, there is a problem in that the manual work of reversing and transferring is time-consuming for mass production.

[0003] Such a large and flexible substrate such as a TCP (Tape Carri- er Pack) is used.
Japanese Patent Application Laid-Open No. 9-275 discloses a mechanism for inverting a display panel to which TCP has been temporarily pressed when pressing (age) onto a display panel.
No. 19 discloses this.

This reversing mechanism is a mechanism for gripping the display panel with a chuck that opens and closes up and down, rotates the display panel 180 degrees, and reverses the display panel.

[0005]

However, since the above-described reversing mechanism grips the display panel itself made of a rigid glass plate, the other portions than the gripped portion are also glass plates. Since there is no bending, there is no problem when transferring to the stage. However, when the substrate itself grasps a flexible TCP or resin sheet itself, there is a problem that both sides not grasped cannot be transferred to the hanging stage.

In the case of an inspection process for inspecting an electronic component mounting board or a TCP alone, it is necessary to align the electrode terminals in accordance with a predetermined tester probe position, position the stage, and transfer the stage. No. However, it is difficult to inspect the electronic component mounting substrate and the TCP itself with the above-described reversing mechanism having no positioning means for precisely aligning the electrode terminals.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting board having means for aligning, and a reversing transfer apparatus capable of reversing the electronic component mounting board to precisely position and transfer to a desired stage. Is to provide.

[0008]

SUMMARY OF THE INVENTION The present invention is characterized in that a resin sheet having an electronic device mounted thereon and electrode terminals for inputting / outputting data to / from the electronic device is attached to both ends, and the resin sheet is covered with the resin sheet. The electronic component mounting board is provided with a metal plate that is attached and has a pair of holes formed on both sides. Preferably, the metal plate is made of aluminum.

Another feature of the present invention is that a first mounting surface for mounting the electronic component mounting board is provided. The first mounting surface is inserted into a hole of the electronic component mounting board to position the electronic component mounting board.
And a clamper for fixing and holding the electronic component mounting board positioned.
And a reversing mechanism for reversing the delivery stage for fixing and holding the electronic component mounting substrate, and a second mounting surface for transferring the inverted electronic component mounting substrate. A reversing transfer device comprising: a substrate mounting stage having a second positioning pin for positioning the electronic component mounting substrate transferred by being inserted into a hole of the substrate.

It is desirable that the second mounting surface has a vacuum suction hole. Further, it is desirable that the clamp be sandwiched and fixed by pneumatic pressure. And, preferably,
A vertical movement mechanism for adjusting the height of the inverted delivery stage is provided. Further, it is desirable to have an XY moving mechanism for moving the substrate transfer stage in the X and Y directions. More preferably, the reversing mechanism includes an aero-rotary actuator that rotates about an end extending from the delivery stage.

[0011]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an electronic component mounting board according to an embodiment of the present invention. As shown in FIG. 1, the electronic component mounting board mounts electronic devices such as an IC 1b and a capacitor 1c, and has a resin sheet 1a at both ends on which electrode terminals 1d for inputting and outputting to the IC 1b are attached. And a metal plate 1e attached to the substrate body 1a and formed with a pair of holes 1f on both sides. This hole 1f is a reference hole at a position as described later.

The metal plate 1e is desirably made of aluminum which is light and has good heat conductivity. With this IC
The heat radiation of 1c can be improved, and the positions of the pair of holes 1f can be precisely machined. The input / output lines to the IC 1c are buried in a resin sheet and are insulated from other components. Further, the electrode terminal 1d connected to the input / output line is exposed from the resin film so as to be in contact with the probe of the tester for measurement.

FIG. 2 is a perspective view showing a reversing transfer device according to an embodiment of the present invention. As shown in FIG. 2, the reversing transfer device has mounting surfaces 2a and 2b on which the electronic component mounting board 1 is mounted, and is inserted into the hole 1f of the electronic component mounting board 1 in FIG. 2 includes a pair of positioning pins 4 for positioning the electronic component mounting board 1 and a clamper 3 for fixing and holding the electronic component mounting board 1 positioned thereon.
A reversing mechanism 5 for reversing a transfer stage 2 for fixing and holding the electronic component mounting board 1, and a mounting surface 15 for transferring the inverted electronic component mounting board 1 to the electronic component mounting board 1. And a board mounting stage 7 having positioning pins 10 for positioning the electronic component mounting board 1 inserted and transferred into the hole 1f.

The transfer stage 2 has a mounting surface 2a for receiving the soft substrate body 1a of the electronic component mounting substrate 1.
And 2b are provided, and there is a positioning pin 4 inserted into the hole 1f of the metal plate 1e. Thus, the electronic component mounting board 1 is precisely positioned and mounted on the delivery stage 2 without slackening.

The clamper 3 includes a clamp jaw and a pneumatic rotor actuator 3 for rotating the clamp jaw.
The electronic component mounting substrate 1 is fixed and held so as not to be displaced when the electronic component mounting board 1 positioned is turned over.

Further, the reversing mechanism 5 includes a delivery stay.
A butterfly type mechanism that rotates around an axis at an end extending from the zigzag 2, and the rotation mechanism includes a belt 5a.
This is a butterfly-type mechanism that rotates the pre-wheel.
This pre-rotation source is not a motor but an inexpensive aero
The tally actuator 5b is used. Further, the reversing mechanism 5 is provided with a vertical movement mechanism 6 so that the inverted electronic component mounting board 1 is raised from the board mounting stage 7 to a position at a predetermined height.

On the other hand, a positioning pin 10 inserted into the hole 1f of the electronic component mounting substrate 1 is provided on the substrate mounting stage 7.
And the suction hole 1 of the mounting surface 15 for vacuum-sucking the flat back surface (the surface on which no electronic component is mounted) of the electronic component mounting board 1
6 and a suction nozzle 14. Further, a stopper 11 having a shock absorber function is provided so as not to give an impact to the electronic component mounting board 1 of the inverted delivery stage 2.

The elevating mechanism 9 attached to the lower part of the substrate mounting stage 7 is composed of a plurality of air cylinders and has a function of transferring the electronic component mounting substrate 1 from the transfer stage 2. The XY moving mechanism 8 below the elevating mechanism 9 is a general-purpose XY stage, and has a pulse motor for moving the substrate mounting stage 7 in the X and Y directions. . It is provided to align the inverted electrode terminals 1d of the electronic component mounting board 1 with the probe of the tester.

FIGS. 3A and 3B are side views of the reversing transfer device for explaining the operation of the reversing transfer device of FIG. Next, the operation of the reversing transfer device will be described with reference to FIGS. First, the electronic component mounting board 1 conveyed with the electronic components facing upward is picked up by a transfer machine (not shown) having a plurality of suction pads, and the transfer machine rotates and a transfer stage 2 of the reversing transfer device. The electronic component mounting substrate 1 is transported on the substrate.

Next, the transfer machine descends, and the delivery stage
The electronic component mounting substrate 1 is inserted into the holes of the electronic component mounting substrate 1 into the positioning pins 4 of the die 2, and the substrate body of the electronic component mounting substrate 1 is mounted on the holding portion 12 as shown in FIG. Then, the suction pad of the transfer machine releases the electronic component mounting board 1 and rises. next,
The clamper 3 operates to fix and hold the electronic component mounting board 1.

Next, the aero-tary actuator 5b
Operates, and the delivery stage 2 holding and holding the electronic component mounting board 1 turns to invert the electronic component mounting board 1. This reversal is performed, and the electronic component mounting board 1 reversed by the vertical movement mechanism 6 remains at the position of the preset height. That is, the vertical movement mechanism is adjusted in advance so that the inverted end of the delivery stage 2 comes into contact with the stopper 11 of the substrate mounting stage 7.

Next, the substrate mounting stage is moved by the elevating mechanism 9.
Then, the positioning pin 10 is inserted into the hole of the electronic component mounting board 1, and the electronic component is mounted on the electronic component mounting board 1 so as to cover the block and the suction nozzle 14 which are arranged at positions avoiding the electronic component mounted on the electronic component mounting board 1. The board body of the mounting board is placed. Next, the rotary actuator 3a of the clamper 3
Operates, and the electronic component mounting substrate 1 is transferred to the transfer stage 2.
Release from

Next, the valve of the vacuum pump is opened, and the electronic component mounting board 1 is sucked and held by the suction holes and the suction nozzles 14 on the mounting surface of the block. Next, the delivery stage 2 is reversed by the reversing mechanism 5 and stays on the table where the stopper 13 and the positioning pin 4 are located. Then, the delivery stage 2 is lowered by the vertical movement mechanism 6 and is placed on the table. Then, it waits until the next electronic component mounting board is transported.

On the other hand, the electronic component mounting substrate 1 sucked and held by the substrate mounting stage 7 is precisely sent in the X or Y direction by the XY moving mechanism 8, and the electronic device is placed under the probe of the tester. The electrode terminals of the component mounting board 1 are positioned. Then, the characteristic of the electronic component is inspected by a tester.

The heat-dissipating metal plate of the electronic component is attached to the substrate body of the soft resin sheet as described above, a reference hole is formed in the metal plate, and a positioning pin and a substrate holder are held in the hole. Even if a clamper is provided and the electronic component mounting substrate is inverted, the displacement can be eliminated, and the operation can be performed automatically without any manual work.

[0027]

As described above, according to the present invention, handling is facilitated and automation can be achieved by attaching a metal plate for radiating electronic components to an electronic component mounting board formed of a soft resin sheet. In addition, a pair of holes serving as a position reference is provided in this metal plate, and a positioning pin inserted into this hole and a means for fixing and holding the electronic component mounting board are provided in the handler, and the position is fixed and the plate is inverted or transferred. In addition, there is an effect that reversal transfer can be performed in a very short time without causing a position shift, and the number of steps can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting board according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a reversing transfer device according to the embodiment of the present invention.

FIG. 3 is a side view of the reversing transfer device for explaining the operation of the reversing transfer device of FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting board 1a Board main body 1b IC 1c Capacitor 1d Electrode terminal 1e Metal plate 1f Hole 2 Delivery stage 3 Clamper 4,10 Positioning pin 5 Inversion mechanism 6 Vertical movement mechanism 7 Board mounting stage 8XY Moving mechanism 9 Elevating mechanism

Claims (8)

[Claims] 1. A resin sheet on which electronic terminals are mounted and electrode terminals for inputting and outputting data to and from the electronic device are attached to both ends. A pair of holes are attached to the resin sheet and formed on both sides. An electronic component mounting substrate, comprising: a metal plate to be formed. 2. The electronic component mounting board according to claim 1, wherein said metal plate is made of aluminum. 3. The electronic device according to claim 1, further comprising: a first mounting surface on which the electronic component mounting board is mounted, wherein the first positioning pin is inserted into a hole of the electronic component mounting substrate and positioned with a first positioning pin for positioning the electronic component mounting substrate. A delivery stage having a clamper for fixedly holding the electronic component mounting board, a reversing mechanism for reversing the delivery stage for fixing and holding the electronic component mounting board, and the inverted electronic component mounting board Board mounting stage having a second mounting surface for mounting the electronic component mounting board and having a second positioning pin inserted into a hole of the electronic component mounting board and positioning the transferred electronic component mounting board. And a reversal transfer device, comprising: 4. The reversing transfer device according to claim 3, wherein a vacuum suction hole is provided on the second mounting surface. 5. The reversing transfer device according to claim 3, wherein the clamp is sandwiched and fixed by pneumatic pressure. 6. The reversing transfer device according to claim 3, further comprising a vertical movement mechanism for adjusting a height of the inverted delivery stage. 7. The reversing transfer device according to claim 3, further comprising an XY moving mechanism for moving the substrate transfer stage in X and Y directions. 8. The delivery mechanism according to claim 1, wherein
4. An aero-rotary actuator for rotating about an end extending from the jig.
The reversing transfer device according to 4, 5, 6, or 7.