JP2002134561A5 - - Google Patents
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- Publication number
- JP2002134561A5 JP2002134561A5 JP2000327884A JP2000327884A JP2002134561A5 JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5 JP 2000327884 A JP2000327884 A JP 2000327884A JP 2000327884 A JP2000327884 A JP 2000327884A JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000327884A JP4334128B2 (ja) | 2000-10-27 | 2000-10-27 | 半導体実装方法および半導体実装装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000327884A JP4334128B2 (ja) | 2000-10-27 | 2000-10-27 | 半導体実装方法および半導体実装装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002134561A JP2002134561A (ja) | 2002-05-10 |
| JP2002134561A5 true JP2002134561A5 (fr) | 2007-04-12 |
| JP4334128B2 JP4334128B2 (ja) | 2009-09-30 |
Family
ID=18804824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000327884A Expired - Fee Related JP4334128B2 (ja) | 2000-10-27 | 2000-10-27 | 半導体実装方法および半導体実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4334128B2 (fr) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005301056A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Displays Ltd | 表示装置とその製造方法 |
| CN100463130C (zh) * | 2004-05-20 | 2009-02-18 | 威盛电子股份有限公司 | 倒装芯片封装工艺 |
| TWI299555B (en) * | 2006-04-28 | 2008-08-01 | Taiwan Tft Lcd Ass | Semiconductor flip-chip package component and fabricating method |
| TW201018340A (en) * | 2008-10-30 | 2010-05-01 | Nan Ya Printed Circuit Board | Method for improving yield of solder bumps |
| JP5191927B2 (ja) * | 2009-02-26 | 2013-05-08 | アルプス電気株式会社 | Ｍｅｍｓセンサ及びその製造方法 |
| JP2012089563A (ja) * | 2010-10-15 | 2012-05-10 | Sanken Electric Co Ltd | 半導体モジュール |
| JP2019121704A (ja) * | 2018-01-09 | 2019-07-22 | トヨタ自動車株式会社 | 半導体装置 |
| JP7428916B2 (ja) * | 2021-12-27 | 2024-02-07 | 日亜化学工業株式会社 | 発光装置の製造方法および発光装置 |
| CN116110805B (zh) * | 2023-04-13 | 2023-07-11 | 深圳宏芯宇电子股份有限公司 | 芯片键合方法、结构及存储器 |
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2000
- 2000-10-27 JP JP2000327884A patent/JP4334128B2/ja not_active Expired - Fee Related