JP2002134561A5 - - Google Patents

Download PDF

Info

Publication number
JP2002134561A5
JP2002134561A5 JP2000327884A JP2000327884A JP2002134561A5 JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5 JP 2000327884 A JP2000327884 A JP 2000327884A JP 2000327884 A JP2000327884 A JP 2000327884A JP 2002134561 A5 JP2002134561 A5 JP 2002134561A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000327884A
Other languages
Japanese (ja)
Other versions
JP4334128B2 (ja
JP2002134561A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000327884A priority Critical patent/JP4334128B2/ja
Priority claimed from JP2000327884A external-priority patent/JP4334128B2/ja
Publication of JP2002134561A publication Critical patent/JP2002134561A/ja
Publication of JP2002134561A5 publication Critical patent/JP2002134561A5/ja
Application granted granted Critical
Publication of JP4334128B2 publication Critical patent/JP4334128B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000327884A 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置 Expired - Fee Related JP4334128B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000327884A JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Publications (3)

Publication Number Publication Date
JP2002134561A JP2002134561A (ja) 2002-05-10
JP2002134561A5 true JP2002134561A5 (cg-RX-API-DMAC7.html) 2007-04-12
JP4334128B2 JP4334128B2 (ja) 2009-09-30

Family

ID=18804824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000327884A Expired - Fee Related JP4334128B2 (ja) 2000-10-27 2000-10-27 半導体実装方法および半導体実装装置

Country Status (1)

Country Link
JP (1) JP4334128B2 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005301056A (ja) * 2004-04-14 2005-10-27 Hitachi Displays Ltd 表示装置とその製造方法
CN100463130C (zh) * 2004-05-20 2009-02-18 威盛电子股份有限公司 倒装芯片封装工艺
TWI299555B (en) * 2006-04-28 2008-08-01 Taiwan Tft Lcd Ass Semiconductor flip-chip package component and fabricating method
TW201018340A (en) * 2008-10-30 2010-05-01 Nan Ya Printed Circuit Board Method for improving yield of solder bumps
JP5191927B2 (ja) * 2009-02-26 2013-05-08 アルプス電気株式会社 Ｍｅｍｓセンサ及びその製造方法
JP2012089563A (ja) * 2010-10-15 2012-05-10 Sanken Electric Co Ltd 半導体モジュール
JP2019121704A (ja) * 2018-01-09 2019-07-22 トヨタ自動車株式会社 半導体装置
JP7655141B2 (ja) * 2021-08-05 2025-04-02 住友電気工業株式会社 半導体装置の製造方法
JP7428916B2 (ja) * 2021-12-27 2024-02-07 日亜化学工業株式会社 発光装置の製造方法および発光装置
CN116110805B (zh) * 2023-04-13 2023-07-11 深圳宏芯宇电子股份有限公司 芯片键合方法、结构及存储器

Similar Documents

Publication Publication Date Title
BE2015C062I2 (cg-RX-API-DMAC7.html)
BE2013C060I2 (cg-RX-API-DMAC7.html)
BE2010C008I2 (cg-RX-API-DMAC7.html)
BE2010C018I2 (cg-RX-API-DMAC7.html)
JP2003531004A5 (cg-RX-API-DMAC7.html)
JP2002538796A5 (cg-RX-API-DMAC7.html)
AR028236A3 (cg-RX-API-DMAC7.html)
JP2002063000A5 (cg-RX-API-DMAC7.html)
JP2002107520A5 (cg-RX-API-DMAC7.html)
JP2003527889A5 (cg-RX-API-DMAC7.html)
JP2001168931A5 (cg-RX-API-DMAC7.html)
JP2002537051A5 (cg-RX-API-DMAC7.html)
JP2002134561A5 (cg-RX-API-DMAC7.html)
JP2001329356A5 (cg-RX-API-DMAC7.html)
JP2002536733A5 (cg-RX-API-DMAC7.html)
JP2001142495A5 (cg-RX-API-DMAC7.html)
JP2002057931A5 (cg-RX-API-DMAC7.html)
JP2003530528A5 (cg-RX-API-DMAC7.html)
FR2790839A3 (cg-RX-API-DMAC7.html)
CN3142225S (cg-RX-API-DMAC7.html)
CN3139842S (cg-RX-API-DMAC7.html)
CN3143240S (cg-RX-API-DMAC7.html)
CN3142478S (cg-RX-API-DMAC7.html)
CN3142239S (cg-RX-API-DMAC7.html)
CN3144126S (cg-RX-API-DMAC7.html)