JP2002129394A - Apparatus for vibration plating of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for vibration plating of electronic components, which can prevent a burnt electrode and eliminate a time-consuming work of bailing a plating solution. SOLUTION: The apparatus for vibration plating of electronic components, which accommodates ceramic elements 1 as articles to be plated and media 25 (for current passage) in a basket 11 provided with an electrode 23 for plating, and which forms plated film on the above ceramic elements 1, by electrifying the above electrode 23 for plating while vibrating the basket 11 immersed in a plating solution tank 27, comprises making up a drain hole of the plating solution at a base wall 11b of the basket 11, arranging the above electrode 23 therein, and making an area of the electrode 23 for plating as 8-94% of an area of the base wall 11b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibrating plating apparatus for an electronic component in which an electrode film is formed on an electronic component element constituting a chip thermistor, a chip capacitor or the like.

[0002]

2. Description of the Related Art For example, as a method of forming electrodes on a ceramic element such as a chip thermistor and a chip capacitor, there is a case where a vibration plating apparatus as shown in FIG. 7 is used (for example, see Japanese Patent No. 2745892). The vibration plating apparatus 50 has a structure in which a vibration source composed of an eccentric motor 51 and a spring 52 is attached to a support portion 54 of a basket 53, and a plating cathode 55 is disposed on a bottom wall 53 a of the basket 53. .

[0003] A large number of ceramic elements 60 and a metal ball medium 61 serving as a current carrying medium are accommodated in the basket 53, and the basket 53 is immersed in a plating solution tank 57. In this state, the bucket 5
In addition to applying vibration to 3, the cathode 55 is energized to supply current to the ceramic element 60 and the medium 61, thereby forming an electrode plating film on the ceramic element 60. In this case, the amount of electricity to the plating cathode 55 is controlled according to the thickness of the electrode plating film or the amount of the ceramic element charged. For example, when the thickness of the electrode plating film is increased or the amount of plating of the ceramic element is increased, the amount of electricity to the cathode 55 is increased.

[0004]

By the way, in the above-mentioned conventional vibration plating apparatus, if the amount of electricity to the cathode is too high,
Electrode burning may occur in which the cathode surface is oxidized and blackened, and in some cases, plating may not be possible.

[0005] In order to avoid such electrode burning, it is necessary to reduce the amount of electricity supplied to the cathode. As a result, there is a possibility that the plating time will be increased or the film thickness will vary.

In the above conventional vibration plating apparatus,
When discharging the plating solution that has flowed into the basket,
It takes time and effort to pump out the plating solution, and there is a problem that workability and productivity are low.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and an object of the present invention is to provide a vibration plating apparatus for an electronic component, which can prevent electrode burning and eliminate the need for a troublesome work of pumping out a plating solution. And

[0008]

According to the first aspect of the present invention, an electronic component element as an object to be plated and an energizing medium are accommodated in a container provided with a plating electrode, and the container is immersed in a plating solution tank. And applying vibration to the plating electrode to energize the plating electrode to form a plating film on the electronic component element. And the electrode for plating is arranged, and the electrode area of the electrode for plating is set to 8 to 94% of the area of the bottom wall of the container.

Here, the electrode area of the plating electrode is 8
The reason for setting it to 94% is that when the electrode area is 8% or less, the electrode is liable to burn, and when it is 94% or more, the area of the plating solution drain hole becomes small, and it takes time to drain the solution. It is.

According to a second aspect of the present invention, in the first aspect, the hole area of the plating solution drainage hole is 6 times the bottom wall area of the container.
~ 92%.

The reason why the area of the plating solution draining hole is set to 6 to 92% is that if the hole area is reduced to 6% or less, the time required for removing the plating solution becomes longer and the effect of improving workability cannot be obtained. If the content is more than 92%, it is not possible to secure a necessary electrode area for the plating electrode.

In forming the plating solution drain hole, the hole diameter is set to such a size that the electronic component element does not fall off, or a hole diameter larger than that of the electronic component element is formed. It will be covered with a net.

[0013]

According to the vibration plating apparatus for electronic parts according to the present invention, a plating solution draining hole is formed in the bottom wall of the container, a plating electrode is arranged, and the electrode area of the plating electrode is reduced. Since the wall area is set to 8 to 94% of the wall area, electrode burning does not occur even if the amount of current is set according to the input amount of the electrode plating film and the ceramic element, and a stable plating process can be performed. As a result, the plating time can be reduced, the productivity can be improved, the variation of the plating film can be prevented, and the reliability for quality can be improved.

In addition, since the plating hole is formed in the bottom wall of the container, the plating solution can be easily discharged by pulling the container out of the plating solution tank, and the work can be performed in comparison with the conventional case of pumping the plating solution. The productivity can be improved, and the productivity can be improved from this point as well.

According to the second aspect of the present invention, since the hole area of the plating solution draining hole is 6 to 92% of the bottom wall area, the plating solution can be drained in a short time while securing the area of the plating electrode. And workability can be improved.

[0016]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1 to 4 are views for explaining a vibration plating apparatus for an electronic component according to an embodiment of the present invention. FIGS. 1, 2 and 3 are a sectional view and a plan view, respectively, of the vibration plating apparatus. FIG. 4, a perspective view, and FIG. 4 are block process diagrams showing a manufacturing process of the electronic component.

In the figure, reference numeral 10 denotes a vibration plating apparatus, which integrally connects a vertically extending support portion 12 to the center of the bottom wall 11b of a tub-like basket 11 having an input port 11a opening upward. The vibration generating source 13 is mounted on the upper end of the supporting portion 12.

The vibration source 13 includes a motor 15 and a plurality of coil springs 16, 16 housed in an outer case 14. In the outer case 14, the upper end of the support 12 is provided. Has been inserted. A vibration receiving plate 17 is fixed to the upper end surface of the support portion 12, and the support plate 1 is provided on the upper surface of the vibration receiving plate 17 by a plurality of columns 18 a.
8b is fixed.

The motor 15 is mounted on a support plate 18b of the support frame member 18, and an eccentric load 20 extending in a direction perpendicular to the axis is applied to a rotating shaft 15a of the motor 15. The coil spring 16 is provided between the lower surface of the vibration receiving plate 17 and the bottom plate of the outer case 14 by the support portion 12.
It is erected so as to surround. With the outer case 14 fixed and the basket 11 free, the motor 15
When is rotated, vibration energy is transmitted from the vibration receiving plate 17 to the basket 11 via the support portion 12. The vibration source 13 has a vibration frequency of the basket 11 of 20-8.
It is set to be within the range of 0 Hz.

At the upper edge of the side peripheral wall 11c of the basket 11, plating solution inflow holes 11d are formed at intervals in the circumferential direction. When the basket 11 is immersed in the plating solution, the plating solution gradually flows into the basket 11 from the plating solution inflow hole 11d. That is,
If the plating solution inflow hole 11d is not provided, the plating solution may flow at once from the inlet 11a, and the ceramic element 1 and the like housed therein may flow out of the basket 11, but in this embodiment, This problem can be avoided.

Insertion holes 11e are formed in the bottom wall 11b of the basket 11 at predetermined intervals in the circumferential direction.
In each insertion hole 11e, two plating solution draining mesh caps 22 and one plating cathode 23 are arranged alternately. The plating cathodes 23 are disposed every 90 degrees, are inserted and fixed in the respective insertion holes 11 e, and the remaining insertion holes 11 e are covered by the mesh cap 22. A power supply line 24 is connected to each of the plating cathodes 23, and the power supply line 24 is connected to the support 1.
2 and connected to an external power supply (not shown).

In the basket 11, a large number of chip-type ceramic elements 1 and a medium 25 as an energizing medium are accommodated. On both end surfaces of the ceramic element 1, electrode films formed by baking a paste such as Ag are formed. The medium 25 is made of conductive metal balls, and the size of the medium 25 is substantially the same or about twice as large as the maximum size of the ceramic element 1.

The electrode area of each of the plating cathodes 23 is set to be about 8% of the area of the bottom wall 11b of the basket 11, and the hole area of the insertion hole 11e in which each mesh cap 22 is provided is equal to the bottom area. It is set to about 16% of the area of the wall 11b.

Next, a method of manufacturing a ceramic electronic component using the vibration plating apparatus 10 will be described with reference to the block diagram of FIG.

A ceramic element is formed by firing the ceramic sheet at a high temperature (first step S1), a paste made of Ag and glass frit is applied to the ceramic element, and the paste is baked to form a first electrode film. (2nd process S2).

Ceramic element 1 on which first electrode film is formed
And the media 25 are put into the basket 11. Next, the basket 11 is immersed in the plating solution tank 27 filled with the nickel plating solution A. In this state, the basket 11 is vibrated at a vibration frequency of 20 to 80 Hz, and electricity is supplied between each cathode 23 of the basket 11 and the anode 26 inserted into the plating solution tank 27. Then, the basket 11 pivots in the horizontal direction and swings in the vertical direction. Accordingly, the ceramic element 1 and the medium 25 are stirred while flowing in the radial direction from the center of the basket 11 toward the peripheral wall. As a result, a second electrode film made of nickel plating is formed on the outer surface of the first electrode film by coating (third step S3). In this case, the ceramic element 1 and the medium 25 collide with each other due to vibration and agitation, and the unevenness of the first and second electrode films is leveled, and a smooth electrode film is formed.
Thereafter, the basket 11 is pulled up from the plating solution tank 27,
The nickel plating solution is discharged from the insertion holes 11e through the respective mesh caps 22. Next, the ceramic element 1 and the medium 25 are washed with water (fourth step S4). This washing may be performed a plurality of times.

Next, the basket 11 is immersed in a plating solution tank (not shown) filled with a tin plating solution, and is vibrated at a vibration frequency of 20 to 80 Hz as in the third step S3. An electric current is applied between the cathodes to cover and form a third electrode film made of tin plating on the outer surface of the second electrode film (fifth step S5). In this case, the ceramic element 1
And the medium 25 collide with each other due to the vibration and agitation of the medium 25, and the unevenness of the second and third electrode films is leveled to form a smooth electrode film. Thereafter, washing with water is performed (sixth step S6).

The basket 11 is immersed in water together with the ceramic element 1 and the medium 25, and a vibration having a vibration frequency of 20 Hz or more is applied to the basket 11 in this state, whereby the ceramic element 1 is vibrated and stirred (seventh step S7). ). As a result, the ceramic element 1 and the medium 25 collide with each other, and the unevenness of the electrode surface is further leveled, so that a smooth and glossy third electrode film is formed. Thus, an electronic component is formed.

The electronic component thus formed is taken out of the basket 11 together with the medium 25 and dried in a drying oven (eighth step S8). Next, the electronic component and the medium 25 are separated by a separator, and are separately collected (ninth step S9). Thereafter, the electronic component is packaged by taping or the like to obtain a product (tenth process S
10).

According to this embodiment, a predetermined number of insertion holes 11e are formed in the bottom wall 11b of the basket 11, and the plating cathode 23 is disposed in four of the insertion holes 11e, and the remaining insertion holes 11e are provided. Since a mesh cap 23 for discharging the plating solution is provided in each of the electrodes and the electrode area of each of the plating cathodes 23 is set to about 8% of the area of the bottom wall 11e, the thickness of the electrode plating film and the input amount of the ceramic element are reduced. Even if an appropriate amount of current is set, electrode burning does not occur, and a stable plating process can be performed. This makes it possible to shorten the plating time, improve productivity, prevent variations in plating film, and improve reliability with respect to quality.

A mesh cap 23 is provided in each of the through holes 11e as plating solution drain holes in the bottom wall 11b of the basket 11, and the hole area of the through holes 11e is about 16% of the area of the bottom wall 11e. Therefore, by pulling up the basket 11 from the plating solution tank 27, the plating solution can be discharged in a short time through each of the mesh caps 23, and the discharging operation of the plating solution can be easily performed, thereby improving workability and productivity. Can be improved.

In the above embodiment, the plating cathode 2
3 has been described as about 8% of the area of the bottom wall 11b and the area of the through hole 11e for draining the plating solution has been described as about 16% of the area of the bottom wall 11b. However, the present invention is not limited to this. In short, the electrode area and the plating solution draining hole area may be appropriately allocated according to the amount of electricity, the plating solution discharge time, and the like.

For example, as shown in FIG.
1 is formed by the plating cathode 30, and four plating solution drain holes 30 a are formed in the plating cathode 30;
This makes it possible to reduce the area of the cathode to about 92% and the area of the plating solution drain hole to about 8%. In this case, since the current can flow more easily as the cathode area can be increased, the amount of current can be increased, and a large amount of plating can be performed without causing electrode burning.

Further, as shown in FIG.
The plating solution draining hole 31 is entirely covered with a mesh cap 32, and four plating cathodes 33 are arranged and fixed in the mesh cap 32. Can be set to about 8%, and the plating solution drain hole area can be set to 92%. In such a case, the plating solution can be discharged almost instantaneously while preventing burning of the electrode, and the discharge time can be greatly reduced.

[0036]

【Example】

[0037]

[Table 1]

In this embodiment, a basket (Example 1) having a plating cathode area of 8% and a drain hole area of 6% with respect to a bottom wall area, and a plating cathode area with a bottom wall area of 6% was used. A basket (Example 2) having 10% and a liquid drain hole area of 10% was prepared, and a ceramic element and a medium were charged into the basket and nickel plating was performed. The current value at this time was 5A, 8A, and 10A. And the presence or absence of electrode burning due to this was examined.

After the plating treatment, the basket was pulled up from the plating solution tank, and the time until the plating solution completely came out of the basket was measured.

Note that a chip-type thermistor having an outer diameter of 1.0 mm × 0.5 mm × 0.5 mm was used for the ceramic element, and an iron ball having a diameter of 1.0 mm was used for the medium. I put them. For further comparison, a similar test was performed on a basket (comparative example) having a cathode area of 2% and a drain hole area of 2%.

As is clear from Table 1, the cathode area 2
%, And in the case of the comparative example in which the drainage hole area was 2%, the electrode was burned by applying a current of 5 A, and plating could not be performed. Also, the time required for draining the liquid is as long as 10 minutes.

On the other hand, in Example 1 in which the cathode area was 8% and the drain hole area was 6%, electrode burning did not occur at 5A and 8A, and electrode burning occurred at 10A. In this case, the plating process is performed with a current of 8 A during normal mass production, and there is no particular problem. The drainage time was 2 minutes, which is 8 minutes shorter than that of the comparative example.
Can be used for mass production. In the case of Example 2 in which the cathode area was 10% and the drain hole area was 10%, electrode burning did not occur even with a current of 10 A, and the plating solution draining time was greatly reduced to 1 minute. Performance can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic component vibration plating apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a basket of the vibration plating apparatus.

FIG. 3 is a perspective view of the vibration plating apparatus.

FIG. 4 is a block process diagram showing a manufacturing process of the electronic component.

FIG. 5 is a plan view of a basket bottom surface according to a first modification of the embodiment.

FIG. 6 is a plan view of a basket bottom surface according to a second modification of the embodiment.

FIG. 7 is a sectional view of a conventional general vibration plating apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ceramic element (electronic component element) 10 Vibration plating apparatus 11 Basket (container) 11b Bottom wall 11e, 30a, 31 Insertion hole (plating solution draining hole) 23, 30, 33 Cathode for plating 25 Media (electrically conductive medium) 27 Plating Liquid tank

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) C25D 21/00 C25D 21/00 A H01G 4/252 H01G 1/14 V (72) Inventor Yutaka Ikeda Kyoto Prefecture 2-26-10 Tenjin, Nagaokakyo-shi Murata Manufacturing Co., Ltd. F term (reference) 4K024 AA03 AA07 AB02 BA15 BB09 CA12 CB02 CB06 CB08 CB19 DA10 GA02 GA16

Claims (2)

[Claims] 1. An electronic component element as an object to be plated and an energizing medium are accommodated in a container provided with an electrode for plating, and the container is immersed in a plating solution tank to apply vibration, and By energizing the electrodes, in a vibration plating apparatus for an electronic component in which a plating film is formed on the electronic component element, a plating solution drain hole is formed in the bottom wall of the container, and the plating electrode is disposed. The electrode area of the plating electrode is 8 to 94% of the bottom wall area of the container.
A vibration plating apparatus for electronic parts, characterized in that: 2. The vibration plating apparatus for electronic parts according to claim 1, wherein the area of the plating solution drain hole is 6 to 92% of the bottom wall area of the container.