JPH09209197A - Cathode jig for electroplating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify assembly work by inserting plural pieces of cathode pieces erected on the surface of a cathode base plate into an insulating layer in the state of exposing the front ends of these cathode pieces on the surface. SOLUTION: Plural cathode pieces 2 each of which is arranged longitudinally and transversely are erected on the surface of the cathode base plate 1 by this jig. The cathode pieces 2 are embedded into the insulating layer 3 in the state of exposing the front ends of the respective cathode pieces 2. As a result, the respective cathode pieces 2 are integrated via the base plane 1 and there is no more need for connecting lead wires by soldering and, therefore, the assembly work is simplified. If the front ends of the cathode pieces 2 are cured nearly parallel with the surface of the insulating layer 3, the exposing of the front ends of the cathode pieces 2 at the large area on the surface of the insulating layer 3 is made possible. As a result, the contact time of the material to be plated with the cathode pieces 2 is prolonged and the plating efficiency is enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cathode jig for electroplating used in a plating tank such as a continuous plating apparatus.

[0002]

2. Description of the Related Art As a plating apparatus, a member to be plated is housed in a basket-shaped barrel, the barrel is dipped in a plating tank containing a plating solution and electricity is applied to perform plating, and the barrel is plated after the plating is completed. The one that is taken out from the tank has been generally used. However, since this apparatus performs plating by batch processing, it has problems that it is not suitable for high-mix low-volume production, and that it is difficult to completely automate plating work.

Therefore, a continuous plating apparatus capable of continuously performing plating is provided by the applicant of the present invention in Japanese Patent Laid-Open No. 6-116795. As shown in FIG. 3, this continuous plating apparatus has a cylindrical plating tank 11 in which a plating solution is placed, a transport path 12 spirally provided along the inner peripheral surface of the plating tank 11, and a member to be plated. A shaker 20 that gives vertical and circumferential vibrations to the plating tank 11 so that 17 moves upward along the transport path 12, and a plating tank 1 that is immersed in the plating solution.
It is formed by including an anode plate 15 arranged in the central portion of No. 1 and a cathode A arranged along the upper surface of the transport path 12.

In this configuration, the vibrating device 20 vibrates the plating tank 11 in the vertical direction and the circumferential direction to move the member to be plated 17 in the ascending direction along the upper surface of the transport path 12, while the anode plate 15 is being moved. The member to be plated 17 can be plated by energizing the cathode A and the member A to be plated.
It is continuously sent out from the discharge port 16 at the upper end of 2. In this way, plating can be continuously performed.

In this continuous plating apparatus, the cathode is shown in FIG.
It is formed as shown in FIG. That is, a metal plate made of copper alloy, iron, nickel, or the like is pressed to produce a cathode plate 28 having comb-shaped cathode pieces 29, and a large number of cathode plates 28 are formed along the longitudinal direction of the transport path 12. The lead wires 30 are arrayed and lead wires 30 are passed through both end portions of each cathode plate 28.
A cathode is formed by electrically connecting each cathode plate 28 through 0. As shown in FIG. 4B, this cathode is fixed to the transport path 12 by the insulating layer 3 such as epoxy resin injected on the upper surface of the transport path 12, and the cathode piece 29 of each cathode plate 28 is fixed. The upper end portion of is exposed on the upper surface of the insulating layer 3 so that it can contact the member to be plated 17.

[0006]

However, in the cathode formed as described above, since the cathode plate 28 is assembled by connecting it by the lead wire 30, the soldering by hand is not necessary at the time of connection. There was a problem that it was necessary and complicated to assemble. The cathode plate 28 is a cathode piece 29.
Since the upper end surface of is only exposed on the upper surface of the insulating layer 3 in a small area, the contact area with the plated member 17 is small,
There was a problem of low plating efficiency. Further cathode piece 2
When the electrodeposit adheres to the portion exposed from the insulating layer 3 of 9,
There is also a problem that it is difficult to remove this electrodeposit. That is, since the electrodeposit adheres to the cathode piece 29 of the cathode plate 28 with high strength and is difficult to peel mechanically, the electrodeposit is dissolved and removed by an electrical method such as reverse electrolysis or a chemical method. However, the cathode plate 28 itself made of copper alloy, iron, nickel or the like may also be melted, and it is difficult to set or control the conditions.

The present invention has been made in view of the above points, and can simplify the assembly, enhance the plating efficiency, and easily remove the adhered electrodeposit. It is intended to provide a cathode jig for electroplating.

[0008]

In the cathode jig for electroplating according to the present invention, a plurality of the cathode pieces 2 are arranged vertically and horizontally on the surface of the cathode base plate 1, and the cathode pieces 2 are erected upright. It is characterized in that the cathode piece 2 is embedded in the insulating layer 3 with the part exposed on the surface, and each cathode piece 2 can be integrated through the cathode base plate 1. , Lead wire 30
It eliminates the need to connect with.

The invention of claim 2 is characterized in that the tip of the cathode piece 2 is bent substantially parallel to the surface of the insulating layer 3, and the tip of the cathode piece 2 is bent. It is possible to expose a large area on the surface of the insulating layer 3. Further, the invention of claim 3 is characterized in that at least a portion of the cathode piece 2 exposed on the upper surface of the insulating layer 3 is formed of a conductive material insoluble in the plating solution, and the cathode piece 2 is plated. It is possible to remove electrodeposits by reverse electrolysis without fear of being dissolved in a liquid.

Further, the invention of claim 4 is characterized in that titanium, lead or carbon is used as the conductive material insoluble in the plating solution, and titanium, lead or carbon having high chemical resistance is used. It can be formed into a cathode jig for electroplating which has excellent chemical resistance.

[0011]

Embodiments of the present invention will be described below. FIG. 1 shows an example of an electroplating cathode jig A according to the present invention. A large number of cathode pieces 2 are formed on the entire surface of a surface (upper surface) of a substantially rectangular cathode base plate 1.
There is standing. A plurality of cathode pieces 2 are arranged in one row and are arranged in a plurality of rows.
The cathode piece 2 can be erected integrally with the cathode base plate 1 by cutting and bending a part of the cathode base plate 1 and bending it at a right angle. However, the cathode piece 2 is a separate body from the cathode base plate 1. It may be formed. When it is formed separately, it is necessary to electrically connect the cathode piece 2 to the cathode base plate 1 sufficiently by welding or the like. Further, the upper end of the cathode piece 2 is in the horizontal direction (a member to be plated 17 described later).
Is bent in a direction parallel to the conveying direction).

The bent piece 5 at the upper end of the cathode piece 2 is formed of a conductive material insoluble in the plating solution. Of course, the whole cathode piece 2 may be made of a conductive material insoluble in the plating solution, or when the cathode piece 2 is integrally formed with the cathode base plate 1, the whole cathode piece 2 is made of a conductive material insoluble in the plating solution. It may be formed by. As the conductive material insoluble in the plating solution, it is preferable to use a metal such as titanium or lead, or an inorganic material such as carbon, and these have excellent chemical resistance and thus can prolong the service life. .

The cathode base plate 1 is fixed to the upper surface of the cathode holding plate 7. The cathode holding plate 7 is made of an electrically insulating material such as plastic or ceramic, and the fixing base 8 fixes the cathode base plate 1 to the cathode holding plate 7. A terminal plate 9 for connecting a cathode power source is connected to the side edge of the cathode base plate 1, and an electric insulating film 10 is coated on the surface of the terminal plate 9. The terminal plate 9 may be formed integrally with the cathode base plate 1 or may be formed separately. When formed separately, the cathode base plate 1 is formed by welding or brazing.
It is necessary to ensure that the terminal plate 9 is electrically well connected to the. Since each cathode piece 2 is formed integrally with the cathode base plate 1, it is possible to apply each cathode piece 2 only by connecting the cathode power supply to the terminal plate 9 provided at one place of the cathode base plate 1. Is something that
It is not necessary to connect the lead wire 30 as in the conventional case.

By filling the insulating layer 3 on the cathode base plate 1 so as to embed the above-mentioned cathode piece 2,
The assembly of the electroplating cathode jig A as shown in FIG. 1 can be completed. The insulating layer 3 is made of an electrically insulating material such as plastic such as epoxy resin or ceramics, and the bending piece 5 at the upper end of each cathode piece 2 is 0.05 to 0 on the surface of the insulating layer 3. .5m
It is exposed so as to project by about m. The cathode holding plate 7 may be formed of the insulating layer 3 and integrated as a part of the insulating layer 3. In this case, the fixing screw 8 is unnecessary.

FIG. 2 shows another example of the cathode jig A for electroplating according to the present invention, in which the electroplating is performed according to the curvature of the spirally formed conveying path 12 of the continuous plating apparatus described later. When the long side edges of the plating cathode jig A are formed in an arc shape and a plurality of electroplating cathode jigs A are arranged along the transport path 12, the electroplating cathode jig A is formed.
Cathode jig A for electroplating so that
Is formed as an inclined side. The terminal plate 9 is formed integrally with the cathode base plate 1. Other configurations are the same as those in FIG.

Next, a continuous plating apparatus incorporating the cathode jig A for electroplating manufactured as described above will be described. FIG. 3 shows an example of a continuous plating apparatus, in which a spiral transfer path 12 is integrally formed on the inner peripheral surface of a cylindrical plating tank 11 whose lower surface is closed and whose upper surface is open, from the lower end to the upper end. It is formed on. A plurality of anode plates 15 each having an upper end coupled to the periphery of the anode holding plate 14 are inserted in the center of the plating tank 11, and the anode plates 15 are the nickel plating solution or the copper plating solution placed in the plating tank 11. And so on. A discharge port 16 is provided above the peripheral wall of the plating tank 11 above the liquid level of the plating solution placed in the plating tank 11, and the upper end of the transfer path 12 is passed through the discharge port 16 to form the plating tank 11. It is projected to the outside.

On the lower surface of the plating tank 11, a vibrator 20 is attached.
The movable table 21 is connected. The vibrator 20 includes a fixed base 22 having a stationary seat 23 made of rubber for vibration isolation, and an electromagnetic solenoid 24 is arranged on the fixed base 22. The movable base 21 is a plurality of leaf springs 2.
5 is disposed above the fixed base 22 and is supported by
A magnetic pole plate 26 attracted to an electromagnetic solenoid 24 is vertically provided on the movable table 21, and each leaf spring 25 is connected to the electromagnetic solenoid 2
In a state where 4 is not excited, it is arranged so as to be inclined as shown in FIG. When the magnetic pole plate 26 receives an attractive force due to the excitation of the electromagnetic solenoid 24, the movable base 21
Rotates. At this time, since the distance between the movable base 21 and the fixed base 22 is regulated by the leaf spring 25,
The movable base 21 moves upward so as to be separated from the fixed base 22. That is, when the electromagnetic solenoid 24 is excited, the movable table 21 moves upward while rotating. If the excitation of the electromagnetic solenoid 24 is de-excited,
The movable base 21 returns to its original position by the restoring force of the leaf spring 25. That is, the movable table 21 moves downward while rotating in the opposite direction.

A plurality of electroplating cathode jigs A are arranged and attached on the transport path 12 of the continuous plating apparatus thus formed over substantially the entire length in the longitudinal direction thereof. It is preferable to fix the electroplating cathode jig A to the transport path 12 with a fixing screw. When the cathode jig A for electroplating is fixed by the screw type as described above, the workability of assembly is improved as compared with the case of fixing with the insulating layer 3 such as epoxy resin as in the conventional example of FIG. 4 (b). In addition, the electroplating cathode jig A can be easily removed and the maintainability is improved.

However, as described above, when the vibrating device 20 vibrates the plating tank 11 in the circumferential direction and in the vertical direction, the member 17 to be plated is placed on the cathode jig A for electroplating provided on the transport path 12. Receives an upward force diagonally and rises and rolls forward. Then, by connecting a cathode power source to the electroplating cathode jig A and an anode power source to the anode plate 15 and energizing them, the member 17 to be plated can be electroplated. That is, when the member to be plated 17 on the cathode jig A for electroplating provided on the transport path 12 contacts the bent piece 5 at the upper end of the cathode piece 2, a direct current is applied to the member to be plated 17 through the cathode piece 2. At this time, the member to be plated 17 is electroplated.
Here, the longer the contact time of the member to be plated 17 with the cathode piece 2 is, the longer the time period in which the direct current is applied to the member to be plated 17 can be increased, so that the plating efficiency can be improved. Therefore, in the present invention, by bending the upper end of the cathode piece 2 to form the bent piece 5, the upper end of the cathode piece 2 is exposed in a large area on the surface of the insulating layer 3 and the cathode piece 2 is plated. The contact time of the member 17 is made long. In this way, the plated member 1
7 is plated while traveling on the cathode jig A for electroplating on the transport path 12, and the plated member 17 is discharged from the plating tank 11 through the discharge port 16. It is like this.

When the plating is performed for a long time as described above, the electrodeposit adheres to the portion of the cathode piece 2 exposed from the insulating tank 3. When the electrodeposit is deposited in this manner, reverse electrolysis is performed by connecting the anode power source to the electroplating cathode jig A and the cathode power source to the anode plate 15 to carry out reverse electrolysis to dissolve the electrodeposit in the plating solution. Can be removed. Since at least the exposed portion of the cathode piece 2 is formed of a conductive material insoluble in the plating solution, there is no risk of dissolution in the plating solution during reverse electrolysis, and the electrodeposit can be easily removed by reverse electrolysis. It will be possible.

[0021]

As described above, according to the present invention, a plurality of cathode strips are vertically and horizontally arranged on the surface of the cathode base plate to stand up the cathode strips, and the cathode strips are exposed with the tip of each cathode strip exposed on the surface. Since it is embedded in the insulating layer, each cathode piece is integrated via the cathode base plate, and it is not necessary to solder and connect the lead wires. Not only can it be simplified, but it is also easy to make many of the same things.

According to the second aspect of the invention, since the tip of the cathode piece is bent substantially parallel to the surface of the insulating layer, the tip of the cathode piece is exposed in a large area on the surface of the insulating layer by bending. It is possible to increase the plating efficiency by increasing the contact time of the member to be plated with the cathode piece. Further, according to the invention of claim 3, since at least a portion of the cathode piece exposed on the upper surface of the insulating layer is formed of a conductive material insoluble in the plating solution, the cathode piece can be reversely dissolved without fear of being dissolved in the plating solution. Electrolysis can be performed, and the electrodeposited material on the cathode piece can be removed by the reverse electrolysis treatment.

Further, the invention of claim 4 is characterized in that titanium, lead or carbon is used as the conductive material insoluble in the plating solution, and titanium, lead or carbon having high chemical resistance is used. It can be formed into a cathode jig for electroplating which has excellent chemical resistance.

[Brief description of drawings]

FIG. 1 shows an example of an embodiment of the present invention,
(A) is a plan view, (b) is an AA 'sectional view of the same figure, (c) is a BB' sectional view of the same figure (a).

FIG. 2 shows another example of the embodiment of the present invention,
(A) is a plan view, (b) is an AA 'sectional view of the same figure, (c) is a BB' sectional view of the same figure (a).

FIG. 3 shows a continuous plating apparatus, (a) is a plan view and (b) is a front sectional view.

FIG. 4 shows a conventional example, (a) is a perspective view,
(B) is a sectional view.

[Explanation of symbols]

 1 cathode base plate 2 cathode piece 3 insulating layer

Claims (4)

[Claims] 1. A plurality of cathode strips are arranged vertically and horizontally on a surface of a cathode base plate to stand upright, and the cathode strips are embedded in an insulating layer in a state where the tip of each cathode strip is exposed on the surface. A cathode jig for electroplating, which is characterized in that 2. The cathode jig for electroplating according to claim 1, wherein the tip of the cathode piece is bent substantially parallel to the surface of the insulating layer. 3. The cathode jig for electroplating according to claim 1, wherein at least a portion of the cathode piece exposed on the upper surface of the insulating layer is formed of a conductive material insoluble in the plating solution. . 4. The cathode jig for electroplating according to claim 3, wherein titanium, lead or carbon is used as the conductive material insoluble in the plating solution.