CN108385154B - A kind of cathode assembly of batch plating metal heat sink component - Google Patents
A kind of cathode assembly of batch plating metal heat sink component Download PDFInfo
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- CN108385154B CN108385154B CN201810120521.9A CN201810120521A CN108385154B CN 108385154 B CN108385154 B CN 108385154B CN 201810120521 A CN201810120521 A CN 201810120521A CN 108385154 B CN108385154 B CN 108385154B
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- housing
- heat sink
- loading
- metal heat
- hole
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention discloses a kind of cathode assembly of batch plating metal heat sink component, including loads housing and loading pallet, and loading housing is in circular cone shape, loads housing top surface equipped with conductive sheet, bottom edge and is equipped with conducting ring；It loads housing shell wall and is equipped with electroplate liquid through-hole array, load housing shell wall and be also embedded with one group of metal lead wire, metal lead wire top is connected with conductive sheet, bottom end is connected with conducting ring；Loading pallet is threadedly engaged with loading casing base and connect, and forms the loading chamaer for accommodating metal heat sink element, and loading pallet is equipped with one group of electroplate liquid percolation hole；Conductive sheet center is equipped with screw hole, loads and is equipped with the mounting hole concentric with screw hole at the top of housing, conductive column is equipped in mounting hole, conductive column with electroplating device cathode interface thread for connecting；The present apparatus is not necessarily to clamp metal heat sink element, and electroplate liquid flows into and out loading chamaer and realizes plating；Structure is simple, easy for installation, stability is good, and electroplating evenness is high, meets the plating requirement of metal heat sink element.
Description
Technical field
The present invention relates to ic component preparation technical field, specifically a kind of batch plating metal heat sink component
Cathode assembly.
Background technique
In IC manufacturing field, electroplating technology is since it is simple with operating condition, preparation metal species multiplicity
The features such as, it is frequently utilized for metallic film preparation.Currently, it is selectively raw to be chiefly used in wafer scale linear growth, wafer scale for electroplating device
It is long, the wafer scales Surface-micromachining process such as TSV preparation.Electroplating cathode device used in electroplating device also uses multipoint clamping accordingly
Mode realizes that wafer clamps.
It is worth noting that, the power device in integrated circuit fields is at work, amount of heat is discharged, is needed in time from work
It dredges as environment to external environment, most common leading method is exactly the installation metal heat sink element on power device.Due to function
The universal size of rate device is smaller, and shape is varied, results in the size of metal heat sink element equally compared with small, contour structures are more
Sample, usually only several millimeters, many structures belong to non-standard type formula structure.
The plating difficulty of metal heat sink element certainly will be greatly improved in this way.Reason is: one, metal heat sink component profile
Size is very thin, and existing electroplating cathode device can not clamp；Two, different from the plane formula technology of crystal column surface plating, metal heat sink
Element is mostly the plating of body formula, i.e., uniformly-coating need to be carried out to body surface face, and existing electroplating cathode device can not provide higher uniform
Property, do not have use value.
Summary of the invention
The purpose of the present invention is to provide a kind of cathode assemblies of batch plating metal heat sink component, which can
The electroplating surface of metal heat sink element is realized in bulk, and structure is simple, easy for installation, at low cost, and stability is good, and is electroplated uniform
Property it is high, meet the plating requirement of metal heat sink element.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of cathode assembly of batch plating metal heat sink component, including housing and loading pallet are loaded, the loading cover
Shell is in circular cone shape, loads housing top surface and is equipped with conductive sheet, and the bottom edge for loading housing is equipped with conducting ring；The shell wall for loading housing is set
Have electroplate liquid through-hole array, load the shell wall of housing also in be embedded with one group of metal lead wire, metal lead wire top and conductive sheet phase
Connection, bottom end are connected with conducting ring；The loading pallet is threadedly engaged with loading casing base and connect, and is formed to metal heat sink
The loading chamaer of element, loading pallet disk are equipped with one group of electroplate liquid percolation hole；
The conductive sheet center is equipped with screw hole, loads and is equipped with the mounting hole concentric with screw hole at the top of housing, wears in mounting hole
Equipped with the conductive column being threadedly engaged, conductive column with electroplating device cathode interface thread for connecting.
Further, the conductive column is from top to bottom divided into electrode portion, intermediate protection portion, interconnecting piece and bottom end protection portion,
Electrode portion is connect with electroplating device cathode interface thread, and intermediate protection portion periphery is arranged with the protective case being threadedly engaged, interconnecting piece
It is connected with the cooperation of housing screw top is loaded, bottom end protection portion is connected with protection plug.
Further, the top surface Yu bottom surface of the protective case are respectively equipped with seal groove, are equipped with sealing ring in seal groove.
Further, sealing ring is equipped in the loading pallet, sealing ring and conducting ring bottom surface form sealing cooperation.
Further, the mounting hole loaded at the top of housing is the step screw hole comprising upper screw hole Yu lower screw hole, upper spiral shell
Hole is threadedly engaged with conductive column, and lower screw hole is threadedly engaged with protection plug.
Further, the metal lead wire includes four, is evenly spaced in the shell wall for loading housing.
The beneficial effects of the present invention are:
One, the present apparatus makes metal fever by loading housing and loading pallet without clamping to metal heat sink element
Heavy element is contained in loading chamaer in bulk, and electroplate liquid enters loading by electroplate liquid through-hole array and electroplate liquid percolation hole
Chamber realizes the plating to metal heat sink element；Structure is simple, easy for installation, at low cost, and stability is good, and electroplating evenness is high,
Meet the plating requirement of metal heat sink element；
Two, loading housing is in horn-like design, is capable of increasing metal heat sink element in plating electric field vertical direction
The area that paves, obtain better electroplating effect；
Three, by sealing ring, protective case and protection plug, connect all parts of conductive column directly with electroplate liquid
Touching avoids additionally being electroplated, the helicitic texture of damage conductive column, wastes precious metal；And by the way of being threadedly coupled, a side
Face is easy to load and unload, and on the other hand in threaded engagement, by the friction between internal and external screw thread, can completely remove junction gold
The natural oxidizing layer of category improves Ohmic contact quality, reduces contact resistance, provides stable electroplating technology electric current；
Four, sealing ring carries out insulation blocking to conducting ring bottom surface, and conducting ring is made there was only inner wall and plating solution contacts, improves electricity
Plate effect.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples:
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the perspective view of the explosion of Fig. 1；
Fig. 3 is the enlarged diagram that housing is loaded in the present invention；
Fig. 4 is the face upwarding stereogram that housing is loaded in the present invention；
Fig. 5 is the cross-sectional view that housing is loaded in the present invention；
Fig. 6 is the enlarged diagram of conductive column in the present invention；
Fig. 7 is the enlarged diagram of protective case in the present invention；
Fig. 8 is the face upwarding stereogram of protective case in the present invention；
Fig. 9 is the enlarged diagram that plug is protected in the present invention；
Figure 10 is conductive column and protective case and the cooperation schematic diagram for protecting plug；
Figure 11 is the enlarged diagram of loading pallet in the present invention.
Specific embodiment
In conjunction with shown in Fig. 1 and Fig. 2, the present invention provides a kind of cathode assembly of batch plating metal heat sink component, including dress
Carry housing 1 and loading pallet 2；In conjunction with shown in Fig. 3~5, loading housing 1 is in circular cone shape, loads 1 top surface of housing and is equipped with conductive sheet
3, it loads and is equipped with conducting ring 4 on the inside of the bottom edge of housing 1；The shell wall for loading housing 1 is equipped with electroplate liquid through-hole array 5, loads housing 1
Shell wall also in be embedded with one group of metal lead wire 6,6 top of metal lead wire is connected with conductive sheet 3, bottom end is connected with conducting ring 4
It connects；Preferably, the metal lead wire 6 includes four, it is evenly spaced in the shell wall for loading housing 1.
3 center of conductive sheet is equipped with screw hole 3a, loads and is equipped with the mounting hole 7 concentric with screw hole 3a, mounting hole 7 at the top of housing 1
It is inside equipped with the conductive column 8 being threadedly engaged, conductive column 8 is also threadedly engaged with screw hole 3a.Conductive column 8 is used for and electroplating device cathode
Interface thread connection.Mounting hole 7 is the step screw hole comprising upper screw hole 7a Yu lower screw hole 7b.
As shown in connection with fig. 6, conductive column 8 is from top to bottom divided into electrode portion 8a, intermediate protection portion 8b, interconnecting piece 8c and bottom end and protects
Shield portion 8d.
In conjunction with shown in Fig. 7~10, electrode portion 8a with electroplating device cathode interface thread for connecting, outside intermediate protection portion 8b
It is arranged with the protective case 9 being threadedly engaged week, interconnecting piece 8c is connected with the cooperation of 1 screw top of housing is loaded, and bottom end protection portion 8d connects
It is connected to protection plug 10.The top surface of protective case 9 and bottom surface are respectively equipped with seal groove 9a and lower seal groove cavity 9b, in two seal grooves
It is respectively equipped with upper sealing ring 11a and lower sealing ring 11b.Upper sealing ring 11a makes close between protective case 9 and electroplating device cathode interface
Envelope, lower sealing ring 11b make to seal between protective case 9 and conductive sheet 3.
The interconnecting piece 8c of the upper screw hole 7a and conductive column is threadedly engaged, and lower screw hole 7b is threadedly engaged with protection plug 10.
It protects the inner wall of plug 10 to be equipped with internal screw thread, outer wall equipped with external screw thread, protects the inner wall and bottom end protection portion 8d screw thread of plug 10
Cooperation, outer wall are threadedly engaged with lower screw hole 7b.
In conjunction with shown in Figure 11, loading pallet 2 and loading 1 bottom thread of housing are cooperatively connected, and are formed and accommodate metal heat sink member
The loading chamaer of part, 2 disk of loading pallet are equipped with one group of electroplate liquid percolation hole 12.Sealing ring 13, sealing ring are equipped in loading pallet
13 form sealing cooperation with 4 bottom surface of conducting ring.
Housing 1 is loaded in use, being first put into a batch metal heat sink element to be electroplated, loading pallet 2 is then screwed on, makes
Metal heat sink element, which is housed inside, to be loaded in the loading chamaer that housing 1 and loading pallet 2 are formed；By conductive column 8 by the present apparatus and
The connection of electroplating device cathode interface thread, when plating, the present apparatus obliquely immerses in electroplate liquid, and conductive column 8 is while being powered
It is rotated, electric current is transferred to conducting ring 4 through conductive column 8, conductive sheet 3, metal lead wire 6；It loads housing 1, loading pallet 2, protect
Sheath 9, protection plug 10 are insulating materials, and when plating, the only inner wall and plating solution contacts of conducting ring 4, electroplate liquid is by electricity
Plating solution through-hole array 5 and electroplate liquid percolation hole 12 enter loading chamaer, realize the plating to metal heat sink element.When plating, dress
Carrying housing 1 follows conductive column 8 to rotate, so that its internal metal heat sink element constantly rolls and shifts one's position, to guarantee each
A metal heat sink element can be equably electroplated, and electroplating effect is improved.
The above described is only a preferred embodiment of the present invention, being not intended to limit the present invention in any form；Appoint
What those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the side of the disclosure above
Method and technology contents make many possible changes and modifications to technical solution of the present invention, or are revised as the equivalent reality of equivalent variations
Apply example.Therefore, anything that does not depart from the technical scheme of the invention according to the technical essence of the invention do above embodiments
Any simple modification, equivalent replacement, equivalence changes and modification, all of which are still within the scope of protection of the technical scheme of the invention.
Claims (6)
1. a kind of cathode assembly of batch plating metal heat sink component, which is characterized in that including loading housing and loading pallet, institute
It states and loads housing in circular cone shape, load housing top surface and be equipped with conductive sheet, the bottom edge for loading housing is equipped with conducting ring；Load housing
Shell wall be equipped with electroplate liquid through-hole array, load the shell wall of housing also in be embedded with one group of metal lead wire, metal lead wire top with
Conductive sheet is connected, bottom end is connected with conducting ring；The loading pallet is threadedly engaged with loading casing base and connect, and is formed and is held
Receive the loading chamaer of metal heat sink element, loading pallet disk is equipped with one group of electroplate liquid and flows hole；
The conductive sheet center is equipped with screw hole, loads and is equipped with the mounting hole concentric with screw hole at the top of housing, is equipped in mounting hole
The conductive column being threadedly engaged, conductive column with electroplating device cathode interface thread for connecting.
2. a kind of cathode assembly of batch plating metal heat sink component according to claim 1, which is characterized in that described to lead
Electric column is from top to bottom divided into electrode portion, intermediate protection portion, interconnecting piece and bottom end protection portion, electrode portion and electroplating device cathode interface
It is threadedly coupled, intermediate protection portion periphery is arranged with the protective case being threadedly engaged, and interconnecting piece cooperates phase with housing screw top is loaded
Even, bottom end protection portion is connected with protection plug.
3. a kind of cathode assembly of batch plating metal heat sink component according to claim 2, which is characterized in that the guarantor
The top surface and bottom surface of sheath are respectively equipped with seal groove, are equipped with sealing ring in seal groove.
4. a kind of cathode assembly of batch plating metal heat sink component according to claim 1,2 or 3, which is characterized in that
Sealing ring is equipped in the loading pallet, sealing ring and conducting ring bottom surface form sealing cooperation.
5. a kind of cathode assembly of batch plating metal heat sink component according to claim 2, which is characterized in that the dress
The mounting hole carried at the top of housing is the step screw hole comprising upper screw hole Yu lower screw hole, and upper screw hole is threadedly engaged with conductive column, lower spiral shell
Hole is threadedly engaged with protection plug.
6. a kind of cathode assembly of batch plating metal heat sink component according to claim 1, which is characterized in that the gold
Belonging to lead includes four, is evenly spaced in the shell wall for loading housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810120521.9A CN108385154B (en) | 2018-02-07 | 2018-02-07 | A kind of cathode assembly of batch plating metal heat sink component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810120521.9A CN108385154B (en) | 2018-02-07 | 2018-02-07 | A kind of cathode assembly of batch plating metal heat sink component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108385154A CN108385154A (en) | 2018-08-10 |
| CN108385154B true CN108385154B (en) | 2019-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810120521.9A Active CN108385154B (en) | 2018-02-07 | 2018-02-07 | A kind of cathode assembly of batch plating metal heat sink component |
Country Status (1)
| Country | Link |
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| CN (1) | CN108385154B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002129394A (en) * | 2000-10-30 | 2002-05-09 | Murata Mfg Co Ltd | Apparatus for vibration plating of electronic component |
| JP2007039719A (en) * | 2005-08-01 | 2007-02-15 | Tdk Corp | Barrel plating method |
| JP2011052241A (en) * | 2009-08-31 | 2011-03-17 | Murata Mfg Co Ltd | Plating apparatus and plating method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101156786B1 (en) * | 2009-11-13 | 2012-06-18 | 삼성전기주식회사 | Barrel plating apparatus |
-
2018
- 2018-02-07 CN CN201810120521.9A patent/CN108385154B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002129394A (en) * | 2000-10-30 | 2002-05-09 | Murata Mfg Co Ltd | Apparatus for vibration plating of electronic component |
| JP2007039719A (en) * | 2005-08-01 | 2007-02-15 | Tdk Corp | Barrel plating method |
| JP2011052241A (en) * | 2009-08-31 | 2011-03-17 | Murata Mfg Co Ltd | Plating apparatus and plating method |
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| Publication number | Publication date |
|---|---|
| CN108385154A (en) | 2018-08-10 |
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Address after: No. 2016, Tanghe Road, economic development zone, Bengbu City, Anhui Province 233030 Patentee after: Anhui North Microelectronics Research Institute Group Co.,Ltd. Address before: No. 2016, Tanghe Road, economic development zone, Bengbu City, Anhui Province 233030 Patentee before: NORTH ELECTRON RESEARCH INSTITUTE ANHUI Co.,Ltd. |