JP2002124576A5 - - Google Patents

Download PDF

Info

Publication number
JP2002124576A5
JP2002124576A5 JP2001262668A JP2001262668A JP2002124576A5 JP 2002124576 A5 JP2002124576 A5 JP 2002124576A5 JP 2001262668 A JP2001262668 A JP 2001262668A JP 2001262668 A JP2001262668 A JP 2001262668A JP 2002124576 A5 JP2002124576 A5 JP 2002124576A5
Authority
JP
Japan
Prior art keywords
layer
conductive
insulating layer
landing
tapered landing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2001262668A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002124576A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2002124576A publication Critical patent/JP2002124576A/ja
Publication of JP2002124576A5 publication Critical patent/JP2002124576A5/ja
Abandoned legal-status Critical Current

Links

JP2001262668A 2000-08-31 2001-08-31 テーパランディングを有する構造及び製造方法 Abandoned JP2002124576A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65349200A 2000-08-31 2000-08-31
US09/653492 2000-08-31

Publications (2)

Publication Number Publication Date
JP2002124576A JP2002124576A (ja) 2002-04-26
JP2002124576A5 true JP2002124576A5 (cg-RX-API-DMAC7.html) 2004-09-09

Family

ID=24621097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001262668A Abandoned JP2002124576A (ja) 2000-08-31 2001-08-31 テーパランディングを有する構造及び製造方法

Country Status (4)

Country Link
JP (1) JP2002124576A (cg-RX-API-DMAC7.html)
KR (1) KR20020018606A (cg-RX-API-DMAC7.html)
GB (1) GB2371408B (cg-RX-API-DMAC7.html)
TW (1) TW582090B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949656B2 (ja) * 2005-08-12 2012-06-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US11869725B2 (en) 2021-11-30 2024-01-09 Texas Instruments Incorporated Multi-stacked capacitor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838605A (en) * 1996-03-20 1998-11-17 Ramtron International Corporation Iridium oxide local interconnect
US6114766A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Integrated circuit with metal features presenting a larger landing area for vias

Similar Documents

Publication Publication Date Title
JPH10154801A5 (cg-RX-API-DMAC7.html)
TW560234B (en) Wiring substrate for small electronic component and manufacturing method
JP2001203316A5 (cg-RX-API-DMAC7.html)
JP2004072122A5 (cg-RX-API-DMAC7.html)
EP0887849A3 (en) Method for fabricating capacitor for semiconductor device
WO2004095459A3 (en) Magnetoresistive ram device and methods for fabricating
EP2408035A3 (en) Two terminal resistive switching device structure and method of fabricating
JP2005525000A5 (cg-RX-API-DMAC7.html)
JP2002016157A5 (cg-RX-API-DMAC7.html)
WO2012034383A1 (zh) 多层导通孔叠层结构
US7525140B2 (en) Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength
JP2002124576A5 (cg-RX-API-DMAC7.html)
TW479310B (en) Capacitor structure and method of making same
JP2005268494A5 (cg-RX-API-DMAC7.html)
JP2003258107A5 (cg-RX-API-DMAC7.html)
KR940001358A (ko) 반도체장치 제조방법
KR970072106A (ko) 최상단 전도 구조체의 오버에칭을 감소시키는 다층 구조체에서의 컨택트 개구들의 형성 방법
JP6940219B2 (ja) 抵抗体を含む電子部品
JPH11330236A5 (cg-RX-API-DMAC7.html)
JP2003158196A5 (cg-RX-API-DMAC7.html)
KR970059050A (ko) 반도체 장치의 축전기 제조방법
JP2001291838A5 (ja) 半導体チップ及びその製造方法、半導体装置、回路基板並びに電子機器
JP2002164430A5 (cg-RX-API-DMAC7.html)
JP2008060446A5 (cg-RX-API-DMAC7.html)
JPH0351315B2 (cg-RX-API-DMAC7.html)