JP2002118294A5 - - Google Patents

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Publication number
JP2002118294A5
JP2002118294A5 JP2001106049A JP2001106049A JP2002118294A5 JP 2002118294 A5 JP2002118294 A5 JP 2002118294A5 JP 2001106049 A JP2001106049 A JP 2001106049A JP 2001106049 A JP2001106049 A JP 2001106049A JP 2002118294 A5 JP2002118294 A5 JP 2002118294A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001106049A
Other languages
Japanese (ja)
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JP2002118294A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001106049A priority Critical patent/JP2002118294A/ja
Priority claimed from JP2001106049A external-priority patent/JP2002118294A/ja
Publication of JP2002118294A publication Critical patent/JP2002118294A/ja
Publication of JP2002118294A5 publication Critical patent/JP2002118294A5/ja
Pending legal-status Critical Current

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JP2001106049A 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法 Pending JP2002118294A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106049A JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000122288 2000-04-24
JP2000-122288 2000-04-24
JP2001106049A JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Publications (2)

Publication Number Publication Date
JP2002118294A JP2002118294A (ja) 2002-04-19
JP2002118294A5 true JP2002118294A5 (es) 2008-03-06

Family

ID=26590642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106049A Pending JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Country Status (1)

Country Link
JP (1) JP2002118294A (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10221857A1 (de) 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP4889193B2 (ja) * 2003-07-23 2012-03-07 日亜化学工業株式会社 窒化物半導体発光素子
US6876008B2 (en) * 2003-07-31 2005-04-05 Lumileds Lighting U.S., Llc Mount for semiconductor light emitting device
US7482638B2 (en) * 2003-08-29 2009-01-27 Philips Lumileds Lighting Company, Llc Package for a semiconductor light emitting device
JP4530739B2 (ja) * 2004-01-29 2010-08-25 京セラ株式会社 発光素子搭載用基板および発光装置
JP2005243795A (ja) * 2004-02-25 2005-09-08 Matsushita Electric Ind Co Ltd 光半導体装置
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US9748446B2 (en) 2013-10-11 2017-08-29 Semicon Light Co., Ltd. Semiconductor light emitting device
KR102197082B1 (ko) 2014-06-16 2020-12-31 엘지이노텍 주식회사 발광 소자 및 이를 포함하는 발광소자 패키지
KR102232265B1 (ko) * 2014-07-14 2021-03-25 주식회사 헥사솔루션 기판 구조, 그 형성방법, 및 이를 이용한 질화물 반도체 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5413774A (en) * 1977-07-01 1979-02-01 Nec Home Electronics Ltd Production of semiconductor devices
JPS5421261A (en) * 1977-07-19 1979-02-17 Nec Home Electronics Ltd Manufacture for semiconductor device
JPS63130258A (ja) * 1986-11-19 1988-06-02 Hitachi Ltd 接合構造
JPH0816730B2 (ja) * 1988-07-11 1996-02-21 富士通株式会社 光半導体アセンブリ製造用治具
JPH07142491A (ja) * 1993-11-19 1995-06-02 Hitachi Ltd 半田バンプ形成方法及びそれによって形成されたバンプを有する半導体装置
JPH07321412A (ja) * 1994-05-27 1995-12-08 Fujitsu Ltd 半導体装置
JPH07326856A (ja) * 1994-05-31 1995-12-12 Toshiba Corp 電子部品のはんだ付け方法
JP2793528B2 (ja) * 1995-09-22 1998-09-03 インターナショナル・ビジネス・マシーンズ・コーポレイション ハンダ付け方法、ハンダ付け装置
JP3656316B2 (ja) * 1996-04-09 2005-06-08 日亜化学工業株式会社 チップタイプled及びその製造方法
JP3028791B2 (ja) * 1997-08-06 2000-04-04 日本電気株式会社 チップ部品の実装方法
JP3797763B2 (ja) * 1997-09-08 2006-07-19 富士通テン株式会社 フラックス組成物

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