JP2002118294A5 - - Google Patents
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- Publication number
- JP2002118294A5 JP2002118294A5 JP2001106049A JP2001106049A JP2002118294A5 JP 2002118294 A5 JP2002118294 A5 JP 2002118294A5 JP 2001106049 A JP2001106049 A JP 2001106049A JP 2001106049 A JP2001106049 A JP 2001106049A JP 2002118294 A5 JP2002118294 A5 JP 2002118294A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001106049A JP2002118294A (ja) | 2000-04-24 | 2001-04-04 | フリップチップ型発光ダイオード及び製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-122288 | 2000-04-24 | ||
| JP2000122288 | 2000-04-24 | ||
| JP2001106049A JP2002118294A (ja) | 2000-04-24 | 2001-04-04 | フリップチップ型発光ダイオード及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002118294A JP2002118294A (ja) | 2002-04-19 |
| JP2002118294A5 true JP2002118294A5 (cs) | 2008-03-06 |
Family
ID=26590642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001106049A Pending JP2002118294A (ja) | 2000-04-24 | 2001-04-04 | フリップチップ型発光ダイオード及び製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002118294A (cs) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10221857A1 (de) | 2002-05-16 | 2003-11-27 | Osram Opto Semiconductors Gmbh | Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
| JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP4889193B2 (ja) * | 2003-07-23 | 2012-03-07 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| US6876008B2 (en) * | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
| US7482638B2 (en) * | 2003-08-29 | 2009-01-27 | Philips Lumileds Lighting Company, Llc | Package for a semiconductor light emitting device |
| JP4530739B2 (ja) * | 2004-01-29 | 2010-08-25 | 京セラ株式会社 | 発光素子搭載用基板および発光装置 |
| JP2005243795A (ja) * | 2004-02-25 | 2005-09-08 | Matsushita Electric Ind Co Ltd | 光半導体装置 |
| US9502624B2 (en) | 2006-05-18 | 2016-11-22 | Nichia Corporation | Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same |
| CN108389946B (zh) * | 2013-10-11 | 2022-04-08 | 世迈克琉明有限公司 | 半导体发光元件 |
| KR102197082B1 (ko) * | 2014-06-16 | 2020-12-31 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광소자 패키지 |
| KR102232265B1 (ko) * | 2014-07-14 | 2021-03-25 | 주식회사 헥사솔루션 | 기판 구조, 그 형성방법, 및 이를 이용한 질화물 반도체 제조방법 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548462A (en) * | 1977-06-21 | 1979-01-22 | Nec Home Electronics Ltd | Manufacture for semiconductor |
| JPS5413774A (en) * | 1977-07-01 | 1979-02-01 | Nec Home Electronics Ltd | Production of semiconductor devices |
| JPS5421261A (en) * | 1977-07-19 | 1979-02-17 | Nec Home Electronics Ltd | Manufacture for semiconductor device |
| JPS63130258A (ja) * | 1986-11-19 | 1988-06-02 | Hitachi Ltd | 接合構造 |
| JPH0816730B2 (ja) * | 1988-07-11 | 1996-02-21 | 富士通株式会社 | 光半導体アセンブリ製造用治具 |
| JPH07142491A (ja) * | 1993-11-19 | 1995-06-02 | Hitachi Ltd | 半田バンプ形成方法及びそれによって形成されたバンプを有する半導体装置 |
| JPH07321412A (ja) * | 1994-05-27 | 1995-12-08 | Fujitsu Ltd | 半導体装置 |
| JPH07326856A (ja) * | 1994-05-31 | 1995-12-12 | Toshiba Corp | 電子部品のはんだ付け方法 |
| JP2793528B2 (ja) * | 1995-09-22 | 1998-09-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハンダ付け方法、ハンダ付け装置 |
| JP3656316B2 (ja) * | 1996-04-09 | 2005-06-08 | 日亜化学工業株式会社 | チップタイプｌｅｄ及びその製造方法 |
| JP3028791B2 (ja) * | 1997-08-06 | 2000-04-04 | 日本電気株式会社 | チップ部品の実装方法 |
| JP3797763B2 (ja) * | 1997-09-08 | 2006-07-19 | 富士通テン株式会社 | フラックス組成物 |
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2001
- 2001-04-04 JP JP2001106049A patent/JP2002118294A/ja active Pending