JP2002118150A - Electronic component bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component bonding apparatus which can provide a less misaligned parallelism between a backup part and a head, and thus can eliminate the need for adjusting the parallelism between the both, even when a change of the type of a substrate such as a display panel requires the backup part and head to be position adjusted in their horizontal direction. SOLUTION: A backup part 6 for supporting an edge of a substrate 40 carried on a movable table 30 from its underside as well as a head 10 above the backup part 6 for bonding an electronic component 41 to the edge of the substrate 40 by being driven by a cylinder 20 as a pressure application means to perform up and down operation are mounted to an identical frame 2, and the frame 2 is mounted to a support frame 1 to be position adjustable in a horizontal direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus for bonding an electronic component to an edge of a substrate.

[0002]

2. Description of the Related Art A TAB device (Tape Automated) is provided at an edge of a display panel such as a liquid crystal panel.
Driving electronic components such as a device in which a chip is bonded to a film carrier by a bonding method) and a flip chip are mounted by a bonding apparatus.

In a conventional bonding apparatus, a display panel is supported on a movable table, and an edge of the display panel is supported from below by a backup unit. And in that state,
When the head having a heat tool or the like is lowered, for example, when the electronic component is a TAB device, the lead is pressed against the electrode at the edge of the display panel for bonding, and when the bonding is completed, the head is raised. Release the pressed state.

[0004]

In the case where the type of display panel is changed and the mounting position of the electronic component is changed, the position of the backup portion or the head in the lateral direction (along the edge of the display panel) is also taken into account. They must be adjusted accordingly. When the position of the backup unit and the position of the head are adjusted in this manner, the parallelism between the two must be strictly maintained. This is because, if the parallelism between the two is not correct, the head cannot press the electronic component against the edge of the display panel with uniform strength, resulting in poor bonding.

However, in the conventional bonding apparatus, the backup portion and the head are fixed to separate frames by bolts or the like. Therefore, when the position of the display panel is adjusted in the horizontal direction as the display panel is changed as described above, Since the parallelism between the two was likely to be out of order, the parallelism had to be readjusted.

However, it is extremely difficult to strictly adjust the parallelism in a work site where many devices are densely packed, and this adjustment requires a great deal of labor and time. Such a problem also occurs when the head is replaced with the backup unit.

Therefore, the present invention provides a method of controlling the horizontal position of the backup unit and the head in the horizontal direction with the change of the type of the substrate such as the display panel.
Accordingly, it is an object of the present invention to provide an electronic component bonding apparatus capable of eliminating the need for adjusting the parallelism between the two.

[0008]

According to the present invention, there is provided an electronic component bonding apparatus comprising: a movable table for supporting a substrate; a backup section for supporting an edge of the substrate supported by the movable table from below; A head that is located above and is driven by a pressurizing means to perform up and down operations to bond the electronic component to the edge of the substrate; the backup unit and the head are mounted on the same frame; The position of the was adjusted freely.

Preferably, the pressurizing means is mounted on the support frame so as to be freely adjustable in a lateral direction.

Preferably, the frame has a vertical front surface, and a guide rail perpendicular to the front surface and a slider slidably mounted on the guide rail.
The head was mounted movably up and down.

In the above configuration, when the type of a substrate such as a display panel is changed, the position of the backup unit and the head is adjusted in the horizontal direction. The position adjustment is performed by moving the frame in the horizontal direction. . In this case, since the backup unit and the head are mounted on the same frame, when the frame is moved, the two move together, so that the parallelism of the two does not change. Can be eliminated. Also, when replacing the backup unit and the head, both can be replaced simultaneously for each frame, so if the adjustment of the parallelism between the backup unit and the head is performed before attaching it to the support frame, the parallelism at the time of replacement Adjustments can be made unnecessary.

[0012]

(Embodiment 1) FIG. 1 is a perspective view of an electronic component bonding apparatus according to Embodiment 1 of the present invention, and FIG. 2 is an electronic component bonding apparatus according to Embodiment 1 of the present invention. It is a side view.

In FIGS. 1 and 2, reference numeral 1 denotes a support frame having a U-shaped cross section, to which elements described below are assembled. Reference numeral 2 denotes a frame having an L-shaped cross section, which is mounted on the bottom surface of the support frame 1. The number of frames 2 to be mounted on the support frame 1 is arbitrarily determined, but in this embodiment, two frames 2 are mounted side by side as shown. The interval (pitch) between the frames 2 is adjusted according to the interval (pitch) between the electronic components mounted on the substrate 40.
The heads perform bonding at the same time.

An elongated hole 3 is formed in the bottom of the support frame 1 in the lateral direction, and a bolt 4 inserted into the elongated hole 3 is inserted in the bottom of the frame 2. Therefore, by loosening the nut 5 screwed to the bolt 4, the frame 2 slides in the horizontal direction along the long hole 3 to adjust its position, and by tightening the nut 5, the frame 2 becomes the support frame 1. Is fixed on the bottom surface of. In the present invention, the term “lateral” refers to the substrate 40 to which the electronic component is bonded.
Is the longitudinal direction (the X direction in FIG. 1) of the edge portion.

Reference numeral 10 denotes a head, on the lower end of which a tool 11 is integrally mounted. Tool 11 of this embodiment
Is a heat tool, which is heated to a predetermined temperature by a built-in heater 12. In FIG. 2, a vertical guide rail 13 is mounted on a vertical front surface of the frame 2.
A slider 14 slidably mounted on a guide rail 13 is provided on the back of the head 10. Therefore, the head 10 can move up and down along the guide rail 13. Note that a guide rail may be provided on the back of the head 10 and a slider may be provided on the front of the frame 2.

At the bottom of the frame 2, a rectangular backup portion 6 is provided. The head 10 is a backup unit 6
Located above. The head 1 is provided on the upper surface of the support frame 1.
Cylinder 20 as pressure means or vertical movement means of zero
Is provided. The cylinder 20 is located above each head 10 corresponding to each head 10, and has a bolt 22 and a nut 23 inserted into a long hole 21 (FIG. 1) formed in the support frame 1 in a lateral direction. ing. Therefore, the position of the cylinder 20 in the lateral direction is adjusted by the same operation as that of the frame 2.

The parallelism of the backup unit 6 and the head 10 can be adjusted while being mounted on the frame 2, and the parallelism between the upper surface of the backup unit 6 and the lower surface of the tool 11 is adjusted by a well-known mechanism (not shown). You.

In FIG. 2, the rod 24 of the cylinder 20
Extends downward, and the lower end thereof and the upper end of the head 10 are removably connected by connecting members 25, 26, 27. When the rod 24 of the cylinder 20 extends downward, the head 10 goes down, and when the rod 24 goes up, the head 10 goes up. Of course, in addition to the cylinder 20, a cam mechanism, a linear motor, or the like can be applied as a pressing unit for the head 10.

In this embodiment, the cylinder 20 and the head 10, which are the pressing means, are mounted on separate frames (support frame 1, frame 2). With such a configuration, even if the head 10 is pressed by the cylinder 20, most of the reaction force is received by the support frame 1, so that the frame 2 is not deformed. Therefore, the degree of parallelism between the head 10 and the backup unit 6 does not change due to pressure.

In FIG. 1, a standing wall 1a for positioning the frame 2 is formed below the supporting frame 1. By contacting the frame 2 with the side surface of the standing wall 1a, the backup portion 6 and the head 10 of each frame 2 can be aligned in a horizontal straight line. Therefore, the standing wall 1a is provided with the backup portions 6 of the plurality of frames 2.
And a frame aligning means for aligning the head 10 on a straight line. The upright wall 1a functions as a guide when the frame 2 is moved in the lateral direction.

In FIG. 1 and FIG.
A movable table 30 is provided in front of. The movable table 30 is configured by stacking an X table 31, a Y table 32, and a Zθ table 33. Zθ table 3
3, there is a suction portion 34, and a substrate 40 such as a display panel is provided.
Is adsorbed and supported / fixed by the adsorption section 34. MX,
MY is a motor for driving the X table 31 and the Y table 32, respectively.

When the movable table 30 is operated,
The substrate 40 is horizontally moved in the X, Y, Z, and θ directions for positioning. Although not shown, the substrate 40
A large number of electrodes are arranged side by side at a narrow pitch at the edge of FIG.
The electronic component 41 shown in FIG. 1 is bonded to the substrate 40 by aligning electrodes 42 such as leads and bumps with these electrodes.

This electronic component bonding apparatus has the above-described configuration. Next, the overall operation will be described. The substrate 40 is placed on the suction section 34, and as shown in FIG.
Is placed on the backup unit 6. In the present embodiment, the electrodes 42 of the electronic component 41 are temporarily attached to the electrodes at the edge of the substrate 40 in the previous step. Then, the head 10 is lowered by operating the cylinder 20, and the electrode 42 is pressed by the tool 11. Then, the electrode 42 is adhered to the electrode of the substrate 40 by the heat transfer from the tool 11, and then the head 10 is lifted to release the pressed state, thereby completing the bonding.

The number of electronic components 41 bonded to the substrate 40 by one head 10 is arbitrarily determined. Generally, the electronic components 41 are bonded to a plurality of edges of the four sides of the substrate 40, and the Zθ table 33 is driven to move the substrate 40 by 90 ° or 180 °.
The desired electronic components are successively bonded to the edges of each side of the substrate 40 while being horizontally rotated.

If, for example, the mounting position (mounting pitch) of the electronic component to be bonded changes due to a change in the type of substrate, it is necessary to adjust the horizontal position of the head 10 and the backup unit 6. This position adjustment is performed as follows. That is, the nut 5 (FIG. 2) is loosened, and the frame 2 is moved laterally to a desired position, where the nut 5 is tightened to fix the frame 2. In this case, preferably, the nut 23 (FIG. 2) on the cylinder 20 side is also loosened, and the position of the cylinder 20 is adjusted by moving the cylinder 20 together with the frame 2 in the lateral direction. Of course, the connecting members 25, 26,
The connection with the head 10 by 27 may be removed, and the position may be adjusted separately from the frame 2.

As described above, since the head 10 and the backup unit 6 are mounted on the same frame 2, the head 10 is moved by moving the frame 2 in the horizontal direction.
The head 10 and the backup unit 6 are simultaneously and horizontally moved, and the head 10 and the backup unit 6 are integrally moved in the horizontal direction. Parallelism does not go out of order. Therefore, in the conventional apparatus, it is not necessary to adjust the parallelism between the head 10 and the backup unit 6 which is required every time the type of substrate is changed. Further, the horizontal position adjustment of the cylinder 20 can be easily performed in conjunction with the position adjustment of the frame 2.

When the backup unit 6 and the head 10 need to be replaced, the backup unit 6 and the head 10 mounted on the frame 2 with the parallelism adjusted are adjusted.
Is prepared, it is only necessary to remove the unnecessary frame 2 from the support frame 1 and attach a new frame 2, so that it is not necessary to adjust the parallelism at the time of replacement.

(Embodiment 2) FIG. 3 is a partial side view of an electronic component bonding apparatus according to Embodiment 2 of the present invention. In this embodiment, a tape-shaped sheet 51 is stretched between the tool 11 and the backup unit 6. 52 is a sheet feeding reel, and 53 is a sheet take-up reel. In order to secure a space for disposing the sheet take-up reel 53, the frame 50 supporting the head 10 has a U-shaped cross section. Other configurations are the same as the first embodiment. Therefore, the tool 11 bonds the electronic component to the substrate via the sheet 51. The horizontal position adjustment between the head 10 and the backup unit 6 is performed in the same manner as in the first embodiment. The sheet 51 is for preventing an auxiliary agent such as an anisotropic conductive agent for adhering the electronic component to the substrate from adhering to the tool 11, and is supplied from the sheet feeding reel 52 to the sheet take-up reel 53. Used while.

[0029]

As described above, according to the present invention, when the horizontal position adjustment of the head and the backup portion is performed by changing the type of the board, the frame to which both are attached may be moved in the horizontal direction. Therefore, the degree of parallelism between the head and the backup portion is unlikely to be out of order, so that it is not necessary to adjust the degree of parallelism, which is extremely advantageous in terms of handling management.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view of the electronic component bonding apparatus according to the first embodiment of the present invention.

FIG. 3 is a partial side view of an electronic component bonding apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support frame 2 Frame 6 Backup part 10 Head 30 Movable table 40 Substrate 41 Electronic component 50 Frame

Claims (3)

[Claims] 1. A movable table for supporting a substrate, a backup unit for supporting an edge of the substrate supported by the movable table from below, and a vertical movement above the backup unit and being driven by a pressurizing means. And a head for bonding the electronic component to the edge of the substrate. The backup unit and the head are mounted on the same frame, and the frame is mounted on the support frame so as to be freely adjustable in the lateral direction. Bonding equipment for electronic components. 2. An electronic component bonding apparatus according to claim 1, wherein said pressurizing means is mounted on said support frame so as to be freely adjustable in a lateral direction. 3. The apparatus according to claim 1, wherein the frame has a vertical front surface, and the head is vertically movably mounted on the front surface via a vertical guide rail and a slider slidably mounted on the guide rail. 3. A method according to claim 1, wherein
An electronic component bonding apparatus as described in the above.