JP2002111194A - フローはんだ付け方法および装置 - Google Patents

フローはんだ付け方法および装置

Info

Publication number
JP2002111194A
JP2002111194A JP2000299423A JP2000299423A JP2002111194A JP 2002111194 A JP2002111194 A JP 2002111194A JP 2000299423 A JP2000299423 A JP 2000299423A JP 2000299423 A JP2000299423 A JP 2000299423A JP 2002111194 A JP2002111194 A JP 2002111194A
Authority
JP
Japan
Prior art keywords
substrate
solder material
temperature
jet
material supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000299423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002111194A5 (enExample
Inventor
Taiji Kawashima
泰司 川島
Kenichiro Suetsugu
憲一郎 末次
Toshiharu Hibino
俊治 日比野
Hiroaki Takano
宏明 高野
Tatsuo Okuchi
達夫 奥地
Yoshiyuki Kabashima
祥之 椛島
Yukio Maeda
幸男 前田
Mikiya Nakada
幹也 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000299423A priority Critical patent/JP2002111194A/ja
Priority to PCT/JP2001/008298 priority patent/WO2002028156A1/ja
Priority to EP03029562A priority patent/EP1405687B1/en
Priority to DE60140769T priority patent/DE60140769D1/de
Priority to EP01967824A priority patent/EP1259101A4/en
Priority to US10/148,014 priority patent/US6805282B2/en
Publication of JP2002111194A publication Critical patent/JP2002111194A/ja
Publication of JP2002111194A5 publication Critical patent/JP2002111194A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000299423A 2000-09-26 2000-09-29 フローはんだ付け方法および装置 Pending JP2002111194A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000299423A JP2002111194A (ja) 2000-09-29 2000-09-29 フローはんだ付け方法および装置
PCT/JP2001/008298 WO2002028156A1 (en) 2000-09-26 2001-09-25 Method and device for flow soldering
EP03029562A EP1405687B1 (en) 2000-09-26 2001-09-25 Method and device for flow soldering
DE60140769T DE60140769D1 (de) 2000-09-26 2001-09-25 Schwallötvorrichtung und -methode
EP01967824A EP1259101A4 (en) 2000-09-26 2001-09-25 FLOATING GAS DEVICE AND METHOD
US10/148,014 US6805282B2 (en) 2000-09-26 2001-09-25 Flow soldering process and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000299423A JP2002111194A (ja) 2000-09-29 2000-09-29 フローはんだ付け方法および装置

Publications (2)

Publication Number Publication Date
JP2002111194A true JP2002111194A (ja) 2002-04-12
JP2002111194A5 JP2002111194A5 (enExample) 2007-06-07

Family

ID=18781231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000299423A Pending JP2002111194A (ja) 2000-09-26 2000-09-29 フローはんだ付け方法および装置

Country Status (1)

Country Link
JP (1) JP2002111194A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013256A1 (ja) * 2005-07-27 2007-02-01 Matsushita Electric Industrial Co., Ltd. 金属試料作製装置と金属試料作製方法
KR100776262B1 (ko) * 2006-11-03 2007-11-15 삼성전자주식회사 자동납땜장치
KR102009692B1 (ko) 2019-02-08 2019-08-12 주식회사 위드텍 납땜공정 상에서 납땜처리된 단자의 커팅수단 및 세척수단을 갖는 인쇄회로기판의 자동납땜장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418572A (en) * 1987-07-13 1989-01-23 Matsushita Electric Industrial Co Ltd Soldering device
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH05318100A (ja) * 1992-05-25 1993-12-03 Matsushita Electric Ind Co Ltd 半田付け装置
JPH09237964A (ja) * 1996-02-28 1997-09-09 Sony Corp 窒素ガス封入式半田付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418572A (en) * 1987-07-13 1989-01-23 Matsushita Electric Industrial Co Ltd Soldering device
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH05318100A (ja) * 1992-05-25 1993-12-03 Matsushita Electric Ind Co Ltd 半田付け装置
JPH09237964A (ja) * 1996-02-28 1997-09-09 Sony Corp 窒素ガス封入式半田付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013256A1 (ja) * 2005-07-27 2007-02-01 Matsushita Electric Industrial Co., Ltd. 金属試料作製装置と金属試料作製方法
US7971627B2 (en) 2005-07-27 2011-07-05 Panasonic Corporation Device for producing metal sample and process for producing metal sample
JP4747174B2 (ja) * 2005-07-27 2011-08-17 パナソニック株式会社 金属試料作製装置と金属試料作製方法
KR100776262B1 (ko) * 2006-11-03 2007-11-15 삼성전자주식회사 자동납땜장치
KR102009692B1 (ko) 2019-02-08 2019-08-12 주식회사 위드텍 납땜공정 상에서 납땜처리된 단자의 커팅수단 및 세척수단을 갖는 인쇄회로기판의 자동납땜장치

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