JP2002110882A5 - - Google Patents
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- Publication number
- JP2002110882A5 JP2002110882A5 JP2000301987A JP2000301987A JP2002110882A5 JP 2002110882 A5 JP2002110882 A5 JP 2002110882A5 JP 2000301987 A JP2000301987 A JP 2000301987A JP 2000301987 A JP2000301987 A JP 2000301987A JP 2002110882 A5 JP2002110882 A5 JP 2002110882A5
- Authority
- JP
- Japan
- Prior art keywords
- headers
- semiconductor
- pellet
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 17
- 239000008188 pellet Substances 0.000 claims 13
- 238000007789 sealing Methods 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000301987A JP2002110882A (ja) | 2000-10-02 | 2000-10-02 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000301987A JP2002110882A (ja) | 2000-10-02 | 2000-10-02 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002110882A JP2002110882A (ja) | 2002-04-12 |
| JP2002110882A5 true JP2002110882A5 (https=) | 2005-06-30 |
Family
ID=18783430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000301987A Pending JP2002110882A (ja) | 2000-10-02 | 2000-10-02 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002110882A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012857A (ja) | 2005-06-30 | 2007-01-18 | Renesas Technology Corp | 半導体装置 |
| JP5301497B2 (ja) * | 2010-05-20 | 2013-09-25 | 三菱電機株式会社 | 半導体装置 |
| WO2016006650A1 (ja) * | 2014-07-10 | 2016-01-14 | 大日本印刷株式会社 | リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、半導体装置の多面付け体、樹脂付きリードフレームの多面付け体の製造方法、それに使用される射出成形用金型、成形装置 |
-
2000
- 2000-10-02 JP JP2000301987A patent/JP2002110882A/ja active Pending
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