JP2002110513A - Liquid film drying method and device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase uniformity in film thickness, and at the same time to control treatment time for improving throughput in a liquid film drying method for removing a solvent in a liquid film formed on a substrate to be treated. SOLUTION: This liquid film drying method includes a process for providing a through hole 204, and for allowing a rectifying plate 200 to come close to the substrate 101 to be treated at distance where the rectifying plate 200 does not come into contact with the liquid film; a process for rotating the rectifying plate 200 for generating the air current between the substrate 101 to be treated and the lower surface of the rectifying plate 200; and a process for bringing the liquid film containing a dissolved substance into contact with the air current, for removing the solvent in the liquid film, and for forming a solid-phase film made of the dissolved substance on the substrate 101 to be treated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid film drying method and a liquid film drying apparatus used in a method for producing a coating in a semiconductor and liquid crystal device production technology.

[0002]

2. Description of the Related Art Heretofore, in a process of forming a liquid film containing a solvent such as a resist film on a substrate to be processed and then drying the liquid film, a baking method in which the substrate to be processed is simply heated on a hot plate is used. A vacuum drying method in which a vacuum treatment is performed in a chamber connected to a vacuum pump has been used.

[0003] However, in the baking method, the volatilization of the solvent is very sensitive to the temperature, so that the film thickness varies, and there is a problem in the uniformity of the formed film thickness.

[0004] In the vacuum drying method using a vacuum pump, it takes time to remove the solvent near the saturated vapor pressure of the solvent, and there has been a problem that the throughput is reduced. Further, the throughput depends on the physical properties of the solvent and the amount of dripping, and the processing time cannot be controlled.

[0005]

As described above, in the drying process of a liquid film by a baking method using a hot plate, nonuniformity of the film thickness has been a problem. Further, the vacuum drying method has a problem that the processing time cannot be controlled and the throughput is reduced.

It is an object of the present invention to provide a liquid film drying method and a liquid film drying apparatus capable of improving the uniformity of the film thickness and controlling the processing time to improve the throughput in the liquid film drying step. Is to do.

[0007]

Means for Solving the Problems [Configuration] The present invention is configured as follows to achieve the above object. (1) The present invention (claim 1) provides a liquid film drying method for removing a solvent in a liquid film containing a solute formed on a substrate to be processed, wherein the rectifying plate having one or more through holes is provided. A step of bringing the liquid film close to the processing substrate at a distance that does not make contact with the liquid film; a step of rotating the rectifying plate to generate an airflow between the substrate to be processed and the lower surface of the rectifying plate; And removing a solvent in the liquid film to form a solid phase film made of the solute on the substrate to be processed.

Preferred embodiments of the present invention are described below. (a) The introduction of an airflow between the substrate to be processed and the lower surface of the rectifier plate is performed by utilizing the pressure difference generated between the substrate to be processed and the lower surface of the rectifier plate due to the rotation of the rectifier plate. Be done. (b) changing the direction of the air flow generated between the substrate to be processed and the lower surface of the rectifying plate with time; By changing the difference between the pressure between the substrate to be processed and the lower surface of the rectifier plate and the pressure at the upper surface of the rectifier plate, the direction of the airflow generated between the upper surface of the substrate to be processed and the lower surface of the rectifier plate is changed. Change over time.

(C) The center axis of the rectifying plate is different from the center of the substrate to be processed. The amount of change is varied with time. Rotating the substrate to be processed in a direction opposite to a rotation direction of the rectifying plate.

(2) The present invention (claim 8) provides a liquid film drying method for removing a solvent in a liquid film containing a solute formed on a substrate to be processed. A step of approaching at a distance that does not make contact with the liquid film; a step of maintaining a reduced pressure between and between the rectifying plate and the substrate to be processed; and Generating a gas flow therebetween, and removing the solvent in the liquid film by contacting the liquid film with the gas flow, and forming a solid-phase film made of the solute on the substrate to be processed. Features.

(3) A liquid film drying apparatus according to the present invention (claim 9) is disposed opposite to a substrate to be processed on which a liquid film containing a solvent is formed on the surface, and has a rectifying plate having at least one through hole. A rotation drive unit that rotates the rectifying plate, an airflow control plate disposed opposite to the opening side of the through hole of the rectifying plate on the opposite side of the substrate to be processed, and a rectifying plate and the substrate to be processed. A vertical drive unit for relatively changing a distance and a distance between the rectifying plate and the airflow control plate is provided.

(4) According to the present invention (claim 10), a rectifying plate having at least one through-hole disposed opposite to a substrate to be processed having a liquid film containing a solvent formed on the surface thereof, It is characterized by comprising a rotation drive section for rotating, and an external airflow generator for supplying an airflow to the through hole.

Preferred embodiments of the above two inventions are described below. (a) The apparatus further comprises a decompression chamber in which the substrate to be processed and the rectifying plate are housed, and a vacuum pump connected to the decompression chamber and evacuating the chamber. (b) The current plate has a plurality of through-holes, and the through-holes are arranged so as to pass at substantially the same rate over an arbitrary portion on the substrate to be processed during rotation.

[Function] The present invention has the following functions and effects by the above configuration. By rotating the current plate at a high speed on the substrate to be processed, a uniform flow of air is generated on the substrate, so that a uniform coating film can be quickly formed.
In addition, by appropriately setting the number of rotations of the current plate and the distance between the substrate and the current plate, the processing time can be controlled without being affected by the physical properties of the solvent or the amount of dripping, and the throughput can be improved. Can be planned.

By introducing an airflow using the reduced pressure generated between the current plate and the substrate during rotation of the current plate as a driving force, the efficiency of the drying process can be improved.

By changing the direction of the air flow over time,
The inclination of the film thickness distribution along the flow of the air current can be suppressed, and a more uniform film can be formed.

By offsetting the center axis of the current plate and the center axis of the substrate to be processed, a singular point can be prevented and the uniformity of the film thickness can be improved. Further, the uniformity of the film thickness can be further improved by changing the amount of the offset with time. The drying efficiency can be improved by rotating the substrate to be processed.

Maintaining a reduced pressure between and between the rectifying plate and the substrate to be processed, and rotating the rectifying plate to generate an airflow between the substrate to be processed and the lower surface of the rectifying plate;
Turbulence due to rapid evaporation of the solvent at the saturated vapor pressure can be prevented, and a uniform coating film thickness distribution can be obtained.

By rotating a rectifying plate having at least one through hole on the substrate to be processed, the pressure between the substrate to be processed and the rectifying plate is reduced. The liquid film on the processing substrate can be dried.
By relatively changing the distance between the rectifier plate and the substrate to be processed and the distance between the rectifier plate and the airflow control plate, the pressure between the rectifier plate and the substrate to be processed, the airflow control plate, and the A difference can be created between the pressure and the processing substrate, and the direction of the airflow can be changed according to the pressure difference.

The liquid film on the substrate to be processed can be effectively dried by supplying an airflow to the through-hole provided in the rectifying plate by an external airflow generator.

By arranging a plurality of through-holes such that each through-hole passes through an arbitrary portion on the substrate to be processed at a substantially same rate during rotation, the airflow can be made uniform with respect to the substrate to be processed. As a result, a uniform film can be formed.

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment] Prior to description of the drying apparatus and method of the present invention, first, formation of a liquid film will be described with reference to FIG. FIG. 1 is a diagram for explaining a method of forming a liquid film (resist) according to the first embodiment of the present invention. As shown in FIG.
Is reciprocated on the substrate 101 in the y direction at a speed of 1 m / sec, and the substrate is sequentially moved in the x direction.
The liquid film 102 containing the resist A (solute) is dropped on the entire surface of the substrate 101 by dropping a chemical solution on the entire surface of the substrate to be processed.
Was formed.

Next, the solvent of the liquid film was dried by an air current generated by rotating a current plate having a rotating mechanism. FIG. 2 shows a schematic configuration of the liquid film drying apparatus.

As shown in FIG. 2, the current plate 200 includes a first disk 201 having a diameter of 250 mm opposed to a substrate to be processed, and a 250 mm diameter disk disposed via a rotation driving unit 203. The first disk 202 and the first disk 202.
An air flow inlet 204 having a diameter of 20 mm penetrates through a central portion of the circular plate 201, the rotation drive unit 203, and the second circular plate 202. Opposed to the second disk 202, an airflow conductance control plate 205 having the same diameter as the substrate 101 having a drive unit in the Z direction is spaced apart therefrom.

Next, a drying method using the liquid film drying apparatus will be described. First, as shown in FIG. 3, the rectifying plate 20 is placed on the substrate 101 on which the liquid film 102 is formed.
0 was placed at a gap of 20 mm. Next, the distance between the airflow conductance control plate 205 and the rectifying plate 200 was set to 30 mm, which was larger than the distance (20 mm) between the substrate 101 to be processed and the rectifying plate 200. With the arrangement as it was, the current plate 200 was rotated at 3000 rpm for 5 seconds.

At this time, between the substrate to be processed and the rectifying plate and between the rectifying plate
When the depressurized state generated between the airflow conductance control plates is compared, the degree of depressurization between the substrate to be processed and the rectifying plate is larger. Therefore, this pressure reduction difference is used as a driving force and the airflow inlet 2
Air is sucked in from the opening on the second disk 202 side and exhausted from the opening on the first disk 201 side, and a downward airflow is formed in the airflow inlet 204 of the rectifier plate 200. Therefore, an airflow from the central portion to the outer peripheral portion is formed between the substrate to be processed and the first disk. The solvent of the liquid film 102 on the substrate 101 to be processed is dried from the central portion to the peripheral portion of the substrate along with the airflow flowing between the substrate to be processed and the second disk.

Next, as shown in FIG. 4, the distance between the airflow conductance control plate 205 and the rectifier plate 200 is set to 10 mm, which is smaller than the distance between the substrate to be processed and the rectifier plate, that is, 20 mm. Then, the current plate 200 was rotated.

At this time, comparing the reduced pressure state generated between the substrate to be processed and the rectifying plate and the rectifying plate and the airflow conductance control plate in the same manner as above, the degree of reduced pressure between the rectifying plate and the airflow conductance control plate is larger. Become. Therefore, the first disc 20 of the airflow inlet 204 is used as a driving force using the pressure difference.
Air is sucked in from the opening on the first side and exhausted from the opening on the second disk 202 side, and the airflow in the airflow inlet 204 of the current plate 200 flows upward. Between the substrate to be processed and the first disk,
An airflow is formed from the outer periphery toward the center. In the liquid film 102 on the substrate 101 to be processed, the solvent is dried from the outer peripheral portion to the central portion together with the airflow between the substrate to be processed and the first disk.

By repeating the above steps alternately six times, the solvent in the liquid film 102 was dried for a total of 60 seconds. Finally, the lower surface of the rectifying plate 200 is
Separated from the surface, finally, a coating film (solid phase film) of the resist A was formed uniformly on the entire surface of the substrate with a thickness of 300 nm without deviation in the airflow direction.

In the present embodiment, as shown in FIG. 5, by changing the distance between the rectifying plate 200 and the airflow conductance control plate 205 to alternately change the airflow on the liquid film 102 in the opposite direction. A uniform film thickness distribution without deviation in the airflow direction was obtained.

Also, by appropriately setting the number of rotations of the current plate and the distance between the substrate to be processed and the current plate, the processing time can be controlled without being affected by the physical properties of the solvent or the amount of the solvent dropped.
Throughput can be improved.

In the liquid film drying method according to the present embodiment, the relative relationship of the distance between the current plate and the substrate to be processed and the distance between the current plate and the airflow conductance control plate with respect to time is not limited to the present embodiment. Further, the rotation speed of the current plate is not limited to 3000 rpm. These may be appropriately set depending on the chemical used.

In this embodiment, the relationship between the distance between the rectifying plate and the substrate to be processed and the distance between the rectifying plate and the airflow conductance control plate is realized by moving the airflow conductance control plate. It may be realized by fixing the conductance control plate and relatively moving the current plate.

As the liquid film forming method, in addition to the scan coating method as in the present embodiment, a spiral coating method in which a chemical solution is dropped spirally from a central portion to a peripheral portion (or vice versa) may be used. Alternatively, another liquid film forming method may be used.

[Second Embodiment] First, as in the first embodiment, a liquid film of a resist A was formed on the entire surface of a substrate to be processed. Next, the solvent of the liquid film was dried using a current plate having a rotating mechanism as shown in FIG.

As shown in FIGS. 6A and 6B, the rectifying plate 601 is a circular plate having a diameter of 250 mm which is arranged to face the substrate 101 to be processed. The straightening plate 601 has a diameter of 5 mm.
The holes 603 are formed in a spiral shape in such a manner that the intervals are increased in proportion to the radius. On the surface of the rectifying plate 601 on the side opposite to the substrate to be processed 101 side, the atmospheric pressure
For example, an air flow supply device 603 that can control a constant pressure at 1.5 kg / cm ² is connected.

The straightening plate 601 is interposed in proportion to the radius.
Spiral holes are helically arranged at a pitch that widens
The reason is that when the current plate 601 is rotated, the holes 603 of the disc are processed.
At which radius position per unit time on the substrate 101 surface
Is to pass through the same number. This embodiment
In the case of the state, for example, the outermost periphery of the substrate (r = 100 mm)
If the pitch of the hole having a diameter of 5 mm is 30 mm, the radius r
Hole pitch P at _rIs P_r= 30 × (r / 100).

Next, a drying process using the drying apparatus shown in FIG. 6 will be described. As shown in FIG.
Are placed on the liquid film 102 at a distance of 10 mm, and
The liquid film was dried by rotating at 60 rpm in the direction shown in the drawing (reverse to the winding direction of the spiral) for 60 seconds. Next, the current plate 601 is separated from the surface of the substrate 101 to be processed,
Finally, a coating film of the resist B was formed with a thickness of 300 nm.

In this embodiment, the liquid film 102 on the substrate 101 to be processed is always in uniform contact with the airflow vertically discharged from the spiral hole 603 of the current plate 601, and the airflow is generated in the spiral direction in the outer periphery of the substrate. The liquid film was dried by being smoothly discharged in the direction. Through the above steps, a very uniform and flat film thickness distribution was obtained.

In the present embodiment, an airflow supply device is provided above the flow straightening plate and is set to a pressure higher than the atmospheric pressure to increase the discharge speed of the airflow and improve the drying efficiency. The airflow may be generated by a driving force of only the degree of pressure reduction between the substrate surface and the lower surface of the rectifier plate, which is generated by the rotation of the rectifier plate, without providing a heater. Further, the number of through holes, the hole diameter / pitch, the number of rotations, and the gap of the current plate to be set may be appropriately adjusted depending on the chemical used.

As a liquid film forming method, in addition to the scan coating method as in this embodiment, a spiral coating method of spirally dropping a chemical solution from a center portion to a peripheral portion (or vice versa) may be used. Alternatively, another liquid film forming method may be used.

[Third Embodiment] An extremely fine nozzle is reciprocated at a speed of 1 m / sec in the y-direction on the substrate to be processed, and the substrate is sequentially moved in the x-direction. And a chemical solution was dropped on the entire surface of the substrate (φ200 mm) to form a liquid film of the resist A on the entire surface of the substrate to be processed.

Next, the liquid film is dried using the drying apparatus shown in FIG. FIG. 8 is a diagram illustrating a schematic configuration of a drying device according to the third embodiment of the present invention. As shown in FIG. 8, the substrate to be processed 101 is installed so as to face a rotary rectifying plate (disk) 801 installed in the chamber 802.
The chamber 802 is connected to a vacuum pump 803 so that the pressure in the chamber can be reduced.

Next, a drying process using the drying apparatus shown in FIG. 8 will be described. First, the distance between the substrate 101 to be processed and the rectifying plate 801 is set to 5 mm, and the pressure in the chamber 802 is set at a constant rate (−15 Torr /
sec.). Next, when the pressure in the chamber 802 reaches about 2 Torr, which is the saturated vapor pressure of the solvent, the straightening plate is rotated at 2000 rpm for 30 seconds.
The solvent was dried while maintaining for c.

Next, the current plate 801 is connected to the substrate 101 to be processed.
After being separated from the surface and taken out of the chamber 802, a 300 nm-thick resist C coating film was finally formed on the substrate 101 to be processed.

In the conventional vacuum drying method, as shown in FIG. 9, when the solvent is in a saturated vapor pressure state, the volatilized solvent becomes turbulent, and there is a problem in the surface of the liquid film 102 and the uniformity of the formed film thickness. May occur.

In the present embodiment, as shown in FIG. 10, the solvent atmosphere is discharged to the periphery of the substrate in a laminar flow state, thereby preventing the solvent from volatilizing in a turbulent state at a saturated vapor pressure. Was reduced, and a uniform film thickness distribution was obtained.

In this embodiment, a current plate having no opening is used. However, the present invention is not limited to this, and a current plate having a plurality of holes used in the second embodiment may be used. Also,
In the present embodiment, the chamber has a closed structure except for the portion connected to the vacuum pump, but when an opening is provided in the current plate,
An airflow supply device as shown in FIG. 11 may be provided in the upper part of the chamber, and the processing may be performed while supplying an airflow into the chamber. Further, the distance, the number of rotations, and the degree of vacuum between the current plate and the substrate may be appropriately changed depending on the chemical used. Finally, as a liquid film forming method, in addition to the scan coating method as in the present embodiment, a spiral coating method in which a chemical solution is dropped in a spiral form from a central portion to a peripheral portion (or vice versa) may be used. May be used.

[Fourth Embodiment] FIG. 12 is a diagram showing a schematic configuration of a drying apparatus according to a fourth embodiment of the present invention. 12, the same parts as those in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted. First, the rectifying plate is brought close to the rectifying plate at a distance of 20 mm so that the central axis of the substrate to be processed on which the resist liquid film is formed is aligned with the central axis of the rectifying plate.
Started rotation at m. At this time, the substrate to be processed also started to rotate at 30 rpm in the direction opposite to the direction of rotation of the current plate. Next, at the same time, the central axis of the current plate was moved at a speed of 10 mm / s toward the outer peripheral portion of the substrate to be processed. At the same time when the central axis of the current plate reached the outer peripheral portion of the substrate, the center of the current plate was moved at a speed of 10 mm / s toward the stop axis side of the substrate. By repeating such a reciprocating scan motion three times, the solvent was dried for a total of 60 seconds to form a resist film having a thickness of 300 nm.

In this embodiment, unlike the first embodiment,
Although the flow of the airflow always turned downward, the solvent was dried uniformly over the entire surface of the substrate by relatively moving the current plate and the substrate to be processed.

By offsetting the central axis of the current plate and the central axis of the substrate to be processed, a singular point can be prevented and the uniformity of the film thickness can be improved. Further, the uniformity of the film thickness can be further improved by changing the amount of the offset with time. The drying efficiency can be improved by rotating the substrate to be processed.

In the liquid film drying method of the present embodiment, the current plate side is moved, but the substrate to be processed may be moved, or both the current plate and the substrate may be moved. . In addition, the rotation speed and distance of the current plate are also 300 rpm.
It is not limited to m and 20 mm, but may be set as appropriate depending on the chemical used. In some cases, the offset amount may be constant without changing the offset amount.
As the liquid film forming method, in addition to the scan coating method as in the present embodiment, a spiral coating method in which a chemical solution is dropped in a spiral form from a central portion to a peripheral portion (or vice versa) may be used. A creation method may be used.

The present invention is not limited to the above embodiment. For example, the rotation speed of the current plate is in the range of 500 to 4000 rpm, and the distance between the substrate and the current plate is in the range of 5 to 30 mm as long as the liquid film itself is not sprinkled out of the substrate unless it is contrary to the gist of the present invention. Can be used. In addition, the present invention does not depart from the gist thereof,
Various modifications can be made.

[0055]

As described above, according to the present invention, the rectifying plate is rotated at a high speed on the substrate to be processed to generate a uniform flow of air on the substrate, thereby enabling uniform drying. Thus, a uniform coating film can be quickly formed.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a method for forming a liquid film according to a first embodiment.

FIG. 2 is a diagram showing a schematic configuration of a liquid film drying device according to the first embodiment.

FIG. 3 is a view for explaining a drying method using the liquid film drying apparatus shown in FIG. 2;

FIG. 4 is a view for explaining a drying method using the liquid film drying apparatus shown in FIG. 2;

FIG. 5 is a view for explaining a drying method using the liquid film drying apparatus shown in FIG. 2;

FIG. 6 is a diagram showing a schematic configuration of a liquid film drying apparatus according to a second embodiment.

FIG. 7 is a view for explaining a drying method using the liquid film drying apparatus shown in FIG. 6;

FIG. 8 is a diagram showing a schematic configuration of a liquid film drying apparatus according to a third embodiment.

FIG. 9 is a diagram illustrating a problem in a conventional reduced-pressure drying method.

FIG. 10 is a view for explaining a drying method using the liquid film drying apparatus shown in FIG.

FIG. 11 is a diagram showing a schematic configuration of a modification of the liquid film drying device according to the third embodiment.

FIG. 12 is a view for explaining a drying method according to a fourth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 ... Substrate to be processed 102 ... Liquid film 110 ... Chemical liquid discharge nozzle 200 ... Rectifier plate 201 ... First circular plate 202 ... Second circular plate 203 ... Rotation drive unit 204 ... Air flow inlet 205 ... Air flow conductance control plate

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Katsuya Okumura 1-Front Term, Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa F-term (reference) 2H096 AA00 AA25 AA27 CA12 DA10 JA02 3L113 AA01 AB01 AC34 BA34 CB15 CB28 CB34 DA04 5F046 JA01 JA07 JA08 KA10

Claims (12)

[Claims] 1. A liquid film drying method for removing a solvent in a liquid film containing a solute formed on a substrate to be processed, wherein a rectifying plate having one or more through holes is provided on the substrate to be processed. A step of bringing the liquid film into contact with the air flow, a step of rotating the rectifier plate to generate an airflow between the substrate to be processed and the lower surface of the rectifier plate, and a step of bringing a liquid film into contact with the airflow. Removing the solvent therein to form a solid phase film made of the solute on the substrate to be processed. 2. The method according to claim 1, wherein the introduction of the airflow between the substrate to be processed and the lower surface of the rectifier plate utilizes a pressure difference generated between the substrate to be processed and the lower surface of the rectifier plate due to the rotation of the rectifier plate. 2. The method for drying a liquid film according to claim 1, wherein the drying is performed. 3. The liquid film drying method according to claim 1, wherein a direction of an air flow generated between the substrate to be processed and the lower surface of the current plate is changed with time. 4. The method according to claim 1, wherein a difference between a pressure between the substrate to be processed and the lower surface of the rectifier plate and a pressure on the upper surface of the rectifier plate is changed to provide a space between the substrate to be processed and the lower surface of the rectifier plate. The direction of the generated airflow is changed with time.
3. The method for drying a liquid film according to item 1. 5. The method according to claim 1, wherein a center axis of the rectifying plate and a center of the substrate to be processed are made different. 6. The method for drying a liquid film according to claim 5, wherein the different amount is changed over time. 7. The liquid film drying method according to claim 5, wherein the substrate to be processed is rotated in a direction opposite to a rotation direction of the current plate. 8. A liquid film drying method for removing a solvent in a liquid film containing a solute formed on a substrate to be processed, wherein a rectifying plate is brought directly above the substrate to be processed at a distance that does not make contact with the liquid film. A step of maintaining a reduced pressure between and around the rectifying plate and the substrate to be processed, a step of rotating the rectifying plate to generate an airflow between the substrate to be processed and the lower surface of the rectifying plate, Contacting the liquid film with an air stream to remove a solvent in the liquid film, and forming a solid-phase film made of the solute on the substrate to be processed. 9. A rectifying plate having at least one through-hole disposed opposite to a substrate to be processed having a liquid film containing a solvent formed on a surface thereof; a rotation drive unit for rotating the rectifying plate; An airflow control plate facing the opening side of the through hole of the rectifier plate on the opposite side of the substrate; a distance between the rectifier plate and the substrate to be processed; and a distance between the rectifier plate and the airflow control plate. A liquid film drying apparatus, comprising: a vertical driving unit that changes the pressure in the liquid film. 10. A rectifier plate having at least one through-hole disposed opposite to a substrate on which a liquid film containing a solvent is formed on a surface thereof, a rotation drive unit for rotating the rectifier plate, and the through-hole. And an external airflow generator for supplying an airflow to the liquid film drying apparatus. 11. The apparatus according to claim 1, further comprising a decompression chamber in which the substrate to be processed and the rectifying plate are housed, and a vacuum pump connected to the decompression chamber and evacuating the chamber. Item 11. The liquid film drying device according to item 9 or 10. 12. The rectifying plate has a plurality of through-holes, and the through-holes are arranged so as to pass at substantially the same time rate at an arbitrary portion on the substrate to be processed during rotation. The liquid film drying device according to claim 9 or 12, wherein