JP2002110422A5 - - Google Patents

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Publication number
JP2002110422A5
JP2002110422A5 JP2000296558A JP2000296558A JP2002110422A5 JP 2002110422 A5 JP2002110422 A5 JP 2002110422A5 JP 2000296558 A JP2000296558 A JP 2000296558A JP 2000296558 A JP2000296558 A JP 2000296558A JP 2002110422 A5 JP2002110422 A5 JP 2002110422A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2000296558A
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Japanese (ja)
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JP2002110422A (ja
JP4626041B2 (ja
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Priority to JP2000296558A priority Critical patent/JP4626041B2/ja
Priority claimed from JP2000296558A external-priority patent/JP4626041B2/ja
Publication of JP2002110422A publication Critical patent/JP2002110422A/ja
Publication of JP2002110422A5 publication Critical patent/JP2002110422A5/ja
Application granted granted Critical
Publication of JP4626041B2 publication Critical patent/JP4626041B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000296558A 2000-09-28 2000-09-28 チップ型コイル部品 Expired - Lifetime JP4626041B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000296558A JP4626041B2 (ja) 2000-09-28 2000-09-28 チップ型コイル部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000296558A JP4626041B2 (ja) 2000-09-28 2000-09-28 チップ型コイル部品

Publications (3)

Publication Number Publication Date
JP2002110422A JP2002110422A (ja) 2002-04-12
JP2002110422A5 true JP2002110422A5 (enrdf_load_stackoverflow) 2007-09-27
JP4626041B2 JP4626041B2 (ja) 2011-02-02

Family

ID=18778817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000296558A Expired - Lifetime JP4626041B2 (ja) 2000-09-28 2000-09-28 チップ型コイル部品

Country Status (1)

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JP (1) JP4626041B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5083360B2 (ja) * 2010-04-02 2012-11-28 セイコーエプソン株式会社 電子基板、半導体装置および電子機器
WO2015156101A1 (ja) * 2014-04-08 2015-10-15 株式会社村田製作所 高周波モジュール
JP2017168472A (ja) * 2016-03-14 2017-09-21 株式会社村田製作所 多層基板
KR102863114B1 (ko) * 2019-06-12 2025-09-24 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 카메라 장치
WO2020246820A1 (ko) 2019-06-04 2020-12-10 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 카메라 장치
CN218297031U (zh) * 2020-03-12 2023-01-13 雅马哈株式会社 位移传感器及演奏操作装置
JP7235169B2 (ja) * 2020-05-22 2023-03-08 株式会社村田製作所 インダクタの実装構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787330B2 (ja) * 1985-06-20 1995-09-20 松下電器産業株式会社 バランコイル
JPH07135116A (ja) * 1993-11-11 1995-05-23 Matsushita Electric Ind Co Ltd 複合部品及びその製造方法
JPH0817656A (ja) * 1994-06-29 1996-01-19 T I F:Kk 半導体装置の磁気シールド方式および磁気シールド膜形成方法
JPH0917679A (ja) * 1995-06-29 1997-01-17 Mitsubishi Heavy Ind Ltd 積層型コイルの製作方法
JP3351738B2 (ja) * 1998-05-01 2002-12-03 太陽誘電株式会社 積層インダクタ及びその製造方法

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