JP2002093833A - Method for insulation sealing of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize insulation sealing of an electronic component which has superior durability, reliability, and surface quality, using a simple and, easy and low-cost method. SOLUTION: A mold 1 and 2, which is formed of Teflon (R) or fluorine contained resin, or a mold formed with a fluorine-containing resin film is formed with an opening 6 for installing an electronic component. The method for insulation the sealing of the electronic component comprises a means of filling the inside of the mold with energy beam curing resin 8 through the opening; an energy beam irradiating means 9 for curing the resin; and a means for removing the electronic component out of the mold, after the resin has been cured by the irradiation of energy beam 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an IC module,
The present invention relates to a method for insulating and sealing electronic components such as a non-contact IC card.

[0002]

2. Description of the Related Art Insulation sealing of a conventional electronic component is generally performed by a transfer molding method in which a thermosetting epoxy resin is injected into a mold and heat-cured, or a heat-flow method in which a heat laminated sheet is heated and melted and flown. .

[0003]

However, the above prior art has the following problems.

[0004] First, in the conventional method, an insulating sealing material is cured by heating or heated and flowed. However, heating causes thermal strain in electrical contacts and electrical wiring portions of electronic parts, which may cause disconnection or internal stress. As a result, the reliability and durability of the electronic component may be impaired.

Second, in the transfer molding method,
Although the surface roughness and shape accuracy of the sealing molding surface are good, the device is expensive and the handling is not easy.

Thirdly, the method of heating and melting and flowing the laminate sheet is relatively inexpensive and easy to handle, but the surface roughness of the sealing molding surface and the shape accuracy are lower than those of the transfer molding method. Inferior.

SUMMARY OF THE INVENTION In view of the above prior art, it is an object of the present invention to provide an insulating and sealing method which improves the reliability and durability of electronic components, has good surface roughness and shape accuracy, and is easy to handle. .

[0008]

[Means for Solving the Problems]

According to the present invention, an opening for mounting an electronic component is provided in a mold made of Teflon or a fluorine-based resin having a low affinity for an insulating sealing material, or a mold treated with a fluorine-based resin coating. A means for filling the mold with an energy ray-curable resin from the opening, an energy beam irradiating means for curing the resin, and a means for removing the electronic component from the mold after curing the resin by the energy ray irradiation are provided. It is characterized by the following.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. A first embodiment according to the present invention will be described with reference to FIG. 1, and a second embodiment will be described with reference to FIG. Note that FIG.
FIG. 4 is an explanatory diagram of an IC module that is a target of the second embodiment shown in FIG.

A first embodiment will be described with reference to FIG.

In FIG. 1A, a Teflon frame 2 is provided on a Teflon plate 1 and a plurality of opening holes 6 for mounting a non-contact IC card 5 before insulation sealing. Is provided. Further, the card 5 is provided with the antenna coil substrate 4.
And an IC module 3.

In FIG. 1B, the squeegee 7 is
When it moves in the direction of arrow a while being in contact with the upper surface of the opening, the energy ray-curable resin 8 fills the inside of the opening 6.

In FIG. 1C, an energy ray 10 emitted from an energy ray irradiation lamp 9 such as an ultraviolet lamp or a heat ray lamp cures the energy ray-curable resin filled in the opening 6. It has become.

In FIG. 1D, the resin 8 is cured to form a cured resin 11. Since the frame 2 and the plate 1 are made of Teflon, the affinity with the resin 8 or 11 is low. small. Therefore, by raising the frame 2 in the direction of arrow b, the card integrated with the resin 11 can be separated from the plate 1 and the frame 2 and easily taken out.

The energy ray curable resin 8 includes:
The type of the energy ray-curable resin is not particularly limited, including a UV-curable resin, a resin whose curing reaction is initiated by irradiation with energy rays, and a curing reaction that proceeds by propagation of cations or cations and reaction heat.

A second embodiment will be described with reference to FIGS. FIG. 2 shows a contact type IC to which the second embodiment is applied.
FIG. 3 is a structural explanatory view of a card IC module.

FIG. 2A shows the structure of the contact type IC card IC module 12 before insulation sealing, and FIG. 2B shows the module 12 insulated and sealed with the cured resin 11.

In FIG. 1A, a CPU chip 13 is connected to a pattern electrode 18 via a bump (electric contact) 14a, a pattern electrode 15 and a through electrode 17 on a substrate 16, and a bump 14b, a pattern It is connected to the memory chip 19 via the electrode 24 and the bump 20b.

The memory chip 19 has bumps 20a,
It is connected to the pattern electrode 23 via the pattern electrode 21 and the through electrode 22.

As shown in FIG. 2B, the module 1
Reference numeral 2 denotes a contact type IC card 25 which is insulated and sealed by the cured resin 11 and insulated and sealed. The pattern electrodes 18 and 23 are exposed and not insulated and sealed, and this pattern electrode portion serves as an external contact terminal of the contact IC card.

In FIG. 3A, the IC module 12 before insulation sealing is mounted on the Teflon plate 1 and in the opening 6 of the Teflon frame 2. Here, the surfaces of the pattern electrodes 18 and 23 are at the same height as the upper surface of the frame 2.

Next, as shown in FIG. 1B, a screen printing device 26 is mounted in contact with the upper surface of the frame 2.

The screen printing device 26 includes a frame 27, a mesh 28 bonded to the lower surface of the frame 27,
Cured film 29 formed of a photo-curable resin, and squeegee 7
It consists of. The cured film 29 is not formed on the opening 6, but is formed on the pattern electrodes 18 and 23.

When the squeegee 7 moves in the direction of arrow a,
The energy ray curable resin 8 is filled in the opening 6.

Next, after the screen printing device 26 is removed, as shown in FIG. 1C, the energy ray irradiation lamp 9 irradiates the energy ray 10 to the energy ray curing resin 8. ing.

As shown in FIG. 2D, when the energy ray-curable resin 8 is cured by the energy rays 10 to become a cured resin 11, the frame 2 is lifted in the direction of arrow b. .

Here, the material of the plate 1 and the frame 2 is Teflon, which has a low affinity with the energy ray-curable resin 8, so that it can be easily separated from the cured resin 11.

The energy ray-curable resin 8 includes:
The type of the energy ray-curable resin is not particularly limited, including a UV-curable resin, a resin whose curing reaction is initiated by irradiation with energy rays, and a curing reaction that proceeds by propagation of cations or cations and reaction heat.

[0030]

As described above in detail with the embodiments, in the present invention, the insulating sealing resin is cured by irradiation of energy rays such as ultraviolet rays and white light, so that the electronic parts and the electric contact parts of the electronic parts are hardened. Since the thermal strain applied to the electronic component can be reduced, the reliability of the electronic component is improved.

Conventionally, a thermosetting resin molding method such as a transfer molding method requires a large-scale and expensive apparatus. However, an apparatus for realizing the present invention is also a screen printing apparatus or a filling apparatus using a squeegee. Becomes simple.

By adopting the above method, the I
In the method of manufacturing a C card and an IC card, the following (1) to
The effect of (4) is achieved, which contributes to improvement in reliability, durability, and quality of the IC card and reduction in manufacturing cost.

Further, as in the first embodiment shown in FIG. 1, since the surface of the energy ray-curable resin can be smoothed by a squeegee, a surface quality comparable to that of the transfer molding method can be obtained by a simple method and apparatus. Therefore, even small companies such as small and medium-sized enterprises and job shops, which have a small capital investment capital, can easily introduce the system and contribute to the spread of the IT industry.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method for insulating and sealing a non-contact IC card as a first example according to an embodiment of the present invention.

FIG. 2 is a configuration explanatory view of a contact type IC card as a target of a second example according to the embodiment of the present invention.

FIG. 3 is a view showing a method of insulating and sealing a contact type IC card as a second example according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Teflon board 2 Teflon frame 5 Non-contact type IC card 6 Opening hole 7 Squeegee 8 Energy ray curing resin 9 Energy ray irradiation lamp 10 Energy ray 26 Screen printing device

Claims (1)

[Claims] An opening for mounting an electronic component is provided in a mold made of Teflon or a fluorine-based resin or a mold treated with a fluorine-based resin, and an energy ray-curable resin is supplied from the opening into the mold. And an energy beam irradiation means for curing the resin, and a means for removing the electronic component from the mold after the resin is cured by the energy beam irradiation.