JP2002083837A - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JP2002083837A
JP2002083837A JP2000272099A JP2000272099A JP2002083837A JP 2002083837 A JP2002083837 A JP 2002083837A JP 2000272099 A JP2000272099 A JP 2000272099A JP 2000272099 A JP2000272099 A JP 2000272099A JP 2002083837 A JP2002083837 A JP 2002083837A
Authority
JP
Japan
Prior art keywords
nozzle
wire
air
air passage
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000272099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002083837A5 (enExample
Inventor
Hiroshi Ushiki
博 丑木
Toru Mochida
亨 持田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2000272099A priority Critical patent/JP2002083837A/ja
Priority to TW090117782A priority patent/TW556292B/zh
Priority to KR10-2001-0045946A priority patent/KR100412110B1/ko
Priority to US09/948,523 priority patent/US6619530B2/en
Publication of JP2002083837A publication Critical patent/JP2002083837A/ja
Publication of JP2002083837A5 publication Critical patent/JP2002083837A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Replacement Of Web Rolls (AREA)
JP2000272099A 2000-09-07 2000-09-07 ワイヤボンディング装置 Pending JP2002083837A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000272099A JP2002083837A (ja) 2000-09-07 2000-09-07 ワイヤボンディング装置
TW090117782A TW556292B (en) 2000-09-07 2001-07-20 Wire bonding apparatus
KR10-2001-0045946A KR100412110B1 (ko) 2000-09-07 2001-07-30 와이어 본딩 장치
US09/948,523 US6619530B2 (en) 2000-09-07 2001-09-07 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000272099A JP2002083837A (ja) 2000-09-07 2000-09-07 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JP2002083837A true JP2002083837A (ja) 2002-03-22
JP2002083837A5 JP2002083837A5 (enExample) 2006-11-09

Family

ID=18758279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000272099A Pending JP2002083837A (ja) 2000-09-07 2000-09-07 ワイヤボンディング装置

Country Status (4)

Country Link
US (1) US6619530B2 (enExample)
JP (1) JP2002083837A (enExample)
KR (1) KR100412110B1 (enExample)
TW (1) TW556292B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198886A (ja) * 2007-02-15 2008-08-28 Shinkawa Ltd ワイヤ洗浄ガイド
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置
US9865563B2 (en) 2014-02-24 2018-01-09 Shinkawa Ltd. Wire tensioner

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036873A1 (en) * 2004-09-27 2006-04-06 Kulicke And Soffa Industries, Inc. Wire feed system for a wire bonding apparatus
US20060091181A1 (en) * 2004-10-28 2006-05-04 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder
EP2039460A3 (de) * 2004-11-02 2014-07-02 HID Global GmbH Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit
US7677432B2 (en) * 2005-05-03 2010-03-16 Texas Instruments Incorporated Spot heat wirebonding
US8434487B2 (en) 2006-06-22 2013-05-07 Covidien Lp Endotracheal cuff and technique for using the same
US20080236593A1 (en) * 2006-06-22 2008-10-02 Nellcor Puritan Bennett Llc Endotracheal cuff and technique for using the same
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
CN101522356B (zh) * 2006-11-09 2012-01-04 库利克和索夫工业公司 适于向焊线施加可变张力的焊线机送线系统及其操作方法
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
SG146606A1 (en) * 2007-05-04 2008-10-30 Asm Tech Singapore Pte Ltd Temperature control of a bonding stage
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
DE602007010634D1 (de) * 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
US20120132695A1 (en) * 2010-11-30 2012-05-31 Yue Zhang Wire feeding apparatus for wire bonders
JP5296233B2 (ja) * 2012-02-07 2013-09-25 株式会社新川 ワイヤボンディング装置
CN102658344B (zh) * 2012-05-29 2015-04-22 深圳恒高自动技术有限公司 线材自动引导穿线装置及线材引导输送方法
CN105304223B (zh) * 2015-12-03 2017-07-28 浙江正导光电股份有限公司 一种微细铜线穿模引导装置
DE102020117641A1 (de) * 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit
US12191173B2 (en) * 2021-10-21 2025-01-07 Shinkawa Ltd. Wire tension adjustment method and wire tension adjuster
DE102022001054A1 (de) * 2022-03-25 2023-09-28 Hesse Gmbh Ultraschallbondvorrichtung und Drahtführungsmodul hierfür
CN220506046U (zh) * 2023-08-14 2024-02-20 上海凯虹科技电子有限公司 一种焊线机及其气管接头
CN117123984A (zh) * 2023-10-27 2023-11-28 宁波尚进自动化科技有限公司 双通道氮气保护装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172544A (en) * 1977-05-17 1979-10-30 Sola Basic Industries, Inc. Wire tensioning and feeding device
JPS571238A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Bonding of wire
JPS58218131A (ja) 1982-06-14 1983-12-19 Mitsubishi Electric Corp ネイルヘツドワイヤボンダのワイヤ供給装置
JPH075668B2 (ja) 1987-02-04 1995-01-25 チッソ株式会社 高結晶性ポリプロピレン
EP0330053B1 (de) * 1988-02-23 1994-08-03 F & K Delvotec Bondtechnik GmbH Vorrichtung und Verfahren zur gesteuerten Zuführung eines Bonddrahtes zum wedge oder zur Kapillare eines Bondkopfes
JP2617541B2 (ja) * 1988-11-01 1997-06-04 九州日本電気株式会社 ワイヤーボンディング装置
US5114066A (en) * 1990-11-20 1992-05-19 Texas Instruments Incorporated Voice coil programmable wire tensioner
JP3016880B2 (ja) 1991-02-01 2000-03-06 三菱化学株式会社 フィルム成形用高結晶性ポリプロピレン
JP3260531B2 (ja) 1994-02-01 2002-02-25 宮崎沖電気株式会社 エアによる極細線の張力発生装置
US5402927A (en) * 1994-06-09 1995-04-04 Kulicke And Soffa Investments, Inc. Adjustable wire tensioning apparatus
JP3576214B2 (ja) * 1994-07-12 2004-10-13 宮崎沖電気株式会社 ワイヤボンダにおけるバキュームテンショナの制御方法とその構造
JPH0945721A (ja) * 1995-08-03 1997-02-14 Kaijo Corp ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置
US5750645A (en) 1996-05-10 1998-05-12 Inteplast Corporation Process for the production of calendered film of polypropylene resin
US6258893B1 (en) 1997-05-15 2001-07-10 Chisso Corporation Unoriented polypropylene molding
US6376058B1 (en) 1999-12-21 2002-04-23 Avery Dennison Corporation Polypropylene based compositions and films and labels formed therefrom

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198886A (ja) * 2007-02-15 2008-08-28 Shinkawa Ltd ワイヤ洗浄ガイド
US8283593B2 (en) 2007-02-15 2012-10-09 Kabushiki Kaisha Shinkawa Wire cleaning guide
WO2011077681A1 (ja) * 2009-12-25 2011-06-30 アダマンド工業株式会社 エアーテンション装置
EP2518760A4 (en) * 2009-12-25 2014-09-17 Adamant Kogyo Co Air tension apparatus
US9865563B2 (en) 2014-02-24 2018-01-09 Shinkawa Ltd. Wire tensioner

Also Published As

Publication number Publication date
KR20020019876A (ko) 2002-03-13
KR100412110B1 (ko) 2003-12-24
US6619530B2 (en) 2003-09-16
TW556292B (en) 2003-10-01
US20020027152A1 (en) 2002-03-07

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