JP2002079522A5 - - Google Patents

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Publication number
JP2002079522A5
JP2002079522A5 JP2001189974A JP2001189974A JP2002079522A5 JP 2002079522 A5 JP2002079522 A5 JP 2002079522A5 JP 2001189974 A JP2001189974 A JP 2001189974A JP 2001189974 A JP2001189974 A JP 2001189974A JP 2002079522 A5 JP2002079522 A5 JP 2002079522A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001189974A
Other languages
Japanese (ja)
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JP2002079522A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001189974A priority Critical patent/JP2002079522A/ja
Priority claimed from JP2001189974A external-priority patent/JP2002079522A/ja
Publication of JP2002079522A publication Critical patent/JP2002079522A/ja
Publication of JP2002079522A5 publication Critical patent/JP2002079522A5/ja
Pending legal-status Critical Current

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JP2001189974A 2000-06-23 2001-06-22 ディスク基板成形金型及び樹脂成形金型 Pending JP2002079522A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001189974A JP2002079522A (ja) 2000-06-23 2001-06-22 ディスク基板成形金型及び樹脂成形金型

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000189860 2000-06-23
JP2000-189860 2000-06-23
JP2001189974A JP2002079522A (ja) 2000-06-23 2001-06-22 ディスク基板成形金型及び樹脂成形金型

Publications (2)

Publication Number Publication Date
JP2002079522A JP2002079522A (ja) 2002-03-19
JP2002079522A5 true JP2002079522A5 (xx) 2008-02-28

Family

ID=26594574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001189974A Pending JP2002079522A (ja) 2000-06-23 2001-06-22 ディスク基板成形金型及び樹脂成形金型

Country Status (1)

Country Link
JP (1) JP2002079522A (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014278A (ja) * 2003-06-24 2005-01-20 Tdk Corp スタンパを保持する面に断熱層とダイヤモンド様炭素膜を施した光ディスク成形金型とそれを使用する成型方法
EP1685606A1 (en) * 2003-11-13 2006-08-02 Philips Intellectual Property & Standards GmbH Electronic device comprising a protective barrier layer stack
JP2005190632A (ja) * 2003-12-26 2005-07-14 Technos:Kk ダイヤモンド様炭素膜を施した光ディスク成形金型とそれを使用する成形方法
DE102004040929A1 (de) * 2004-08-24 2006-03-02 Hachtel, Friedrich Spritzgießform
JP4690058B2 (ja) * 2005-01-20 2011-06-01 トーヨーエイテック株式会社 樹脂成形用金型
JP5319874B2 (ja) * 2006-04-07 2013-10-16 日立マクセル株式会社 射出成型用金型部材
JP4542167B2 (ja) * 2008-03-31 2010-09-08 株式会社日立ハイテクノロジーズ 微細構造転写装置
JP2010000637A (ja) * 2008-06-19 2010-01-07 Sony Corp 流路チップの製造方法および流路チップの製造装置
JP5945199B2 (ja) * 2012-09-18 2016-07-05 株式会社野村鍍金 金型、型ロールおよび剥離電鋳品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842472A (ja) * 1981-09-07 1983-03-11 Semiconductor Energy Lab Co Ltd サ−マルヘツド
JP2794289B2 (ja) * 1988-03-16 1998-09-03 ティーディーケイ株式会社 成形用金型とその製造方法
JP3336682B2 (ja) * 1992-07-02 2002-10-21 住友電気工業株式会社 硬質炭素膜
JP3540350B2 (ja) * 1993-12-28 2004-07-07 Tdk株式会社 スタンパおよび積層構造
CA2184206C (en) * 1995-08-29 2002-10-08 Yasuaki Sakamoto Molded glass plate produced by mold with modified surface
JPH09320497A (ja) * 1996-05-27 1997-12-12 Toyota Motor Corp 電界放出型表示装置
JP3057077B1 (ja) * 1999-03-08 2000-06-26 シチズン時計株式会社 樹脂成形用金型および樹脂成形用金型への硬質被膜形成方法

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