JP2002076600A - Method of printing conductive paste - Google Patents
Method of printing conductive pasteInfo
- Publication number
- JP2002076600A JP2002076600A JP2000253565A JP2000253565A JP2002076600A JP 2002076600 A JP2002076600 A JP 2002076600A JP 2000253565 A JP2000253565 A JP 2000253565A JP 2000253565 A JP2000253565 A JP 2000253565A JP 2002076600 A JP2002076600 A JP 2002076600A
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- resist film
- substrate
- print mask
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、半田ペースト等
からなる導電ペーストの印刷方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for printing a conductive paste made of a solder paste or the like.
【0002】[0002]
【従来の技術】例えば、LGA(land grid array)やQ
FP(quad flat package)等の電子部品を基板上に表面
実装する場合、電子部品の接続端子を基板の接続端子
に、基板の接続端子上に予め印刷された半田ペーストを
介して接合することがある。2. Description of the Related Art For example, an LGA (land grid array) or Q
When electronic components such as FP (quad flat package) are surface-mounted on a substrate, the connection terminals of the electronic components can be joined to the connection terminals of the substrate via solder paste pre-printed on the connection terminals of the substrate. is there.
【0003】次に、従来のこのような場合の半田ペース
トの印刷方法の一例について、図2を参照して説明す
る。まず、図2(A)に示すように、ステージ1上に基
板2を載置する。基板2上の所定の箇所には接続端子3
が設けられ、接続端子3の周囲における基板2上にはレ
ジスト膜4が設けられている。ステージ1の上方には印
刷マスク5が配置されている。印刷マスク5の接続端子
3に対応する部分には開口部6が設けられている。この
場合、レジスト膜4の膜厚は接続端子3の膜厚とほぼ同
じで20〜40μm程度であり、印刷マスク5の膜厚は
50μm程度である。Next, an example of a conventional solder paste printing method in such a case will be described with reference to FIG. First, as shown in FIG. 2A, the substrate 2 is placed on the stage 1. A connection terminal 3 is provided at a predetermined location on the substrate 2.
And a resist film 4 is provided on the substrate 2 around the connection terminals 3. A print mask 5 is arranged above the stage 1. An opening 6 is provided in a portion of the print mask 5 corresponding to the connection terminal 3. In this case, the film thickness of the resist film 4 is approximately the same as the film thickness of the connection terminal 3 and is about 20 to 40 μm, and the film thickness of the print mask 5 is about 50 μm.
【0004】次に、図2(B)に示すように、ステージ
1を基板2と共に上昇させ、レジスト膜4の上面を印刷
マスク5の下面に密接させる。次に、図2(C)に示す
ように、印刷マスク5上においてスキージ7を移動させ
て半田ペースト8の印刷を行うことにより、印刷マスク
5の開口部6内における接続端子3上に半田ペースト8
aを印刷する。次に、図2(D)に示すように、ステー
ジ1を基板2と共に下降させ、版離れを行う。このと
き、ステージ1の下降速度を遅くすることにより、版離
れがスムーズに行われるようにする。かくして、基板1
の接続端子3上に半田ペースト8aが印刷される。[0004] Next, as shown in FIG. 2 (B), the stage 1 is raised together with the substrate 2, and the upper surface of the resist film 4 is brought into close contact with the lower surface of the print mask 5. Next, as shown in FIG. 2C, the squeegee 7 is moved on the print mask 5 to print the solder paste 8, so that the solder paste is printed on the connection terminals 3 in the openings 6 of the print mask 5. 8
Print a. Next, as shown in FIG. 2D, the stage 1 is lowered together with the substrate 2, and the plate is separated. At this time, the lowering speed of the stage 1 is reduced so that the plate separation is performed smoothly. Thus, substrate 1
The solder paste 8a is printed on the connection terminals 3 of FIG.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、従来の
このような半田ペーストの印刷方法では、ファインピッ
チ化が進むと、印刷マスク5の開口部6の面積が小さく
なり、この小さい開口面積と印刷マスク5の50μm程
度と比較的厚い膜厚との関係で、ステージ1の下降速度
を遅くしても、版離れが悪くなり、基板1の接続端子3
上に印刷された半田ペースト8aの印刷形状が悪化し、
当該半田ペースト8aを介する接合の信頼性が低下して
しまうことがある。この発明の課題は、ファインピッチ
化が進んでも、版離れをスムーズに行うことができるよ
うにすることである。However, in such a conventional solder paste printing method, as the fine pitch progresses, the area of the opening 6 of the print mask 5 becomes smaller, and this smaller opening area and the print mask become smaller. Due to the relatively large film thickness of about 50 μm, even if the stage 1 lowering speed is reduced, the separation of the plate becomes worse, and the connection terminals 3
The printed shape of the solder paste 8a printed thereon deteriorates,
The reliability of bonding via the solder paste 8a may be reduced. An object of the present invention is to make it possible to smoothly release a printing plate even when the fine pitch is advanced.
【0006】[0006]
【課題を解決するための手段】請求項1に記載の発明
は、基板上に設けられた接続端子の周囲における前記基
板上に設けられたレジスト膜上に印刷マスクを密接させ
て前記接続端子上に導電ペーストを印刷するに際し、前
記レジスト膜の膜厚を前記接続端子の膜厚よりも厚く
し、且つ、前記印刷マスクの膜厚を前記レジスト膜の膜
厚よりも薄くしたものである。請求項2に記載の発明
は、請求項1に記載の発明において、前記レジスト膜の
膜厚を50〜100μm程度とし、前記印刷マスクの膜
厚を20〜40μm程度としたものである。請求項3に
記載の発明は、請求項1または2に記載の発明におい
て、前記導電ペーストとして半田ペーストを用いるよう
にしたものである。そして、請求項1に記載の発明によ
れば、レジスト膜の膜厚を接続端子の膜厚よりも厚く
し、且つ、印刷マスクの膜厚をレジスト膜の膜厚よりも
薄くしているので、すなわち、印刷マスクの膜厚をある
程度薄くしているので、ファインピッチ化が進んでも、
版離れをスムーズに行うことができる。According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device according to the first aspect of the present invention, comprising the steps of: When the conductive paste is printed on the substrate, the thickness of the resist film is larger than the thickness of the connection terminal, and the thickness of the print mask is smaller than the thickness of the resist film. According to a second aspect of the present invention, in the first aspect, the thickness of the resist film is about 50 to 100 μm, and the thickness of the print mask is about 20 to 40 μm. According to a third aspect of the present invention, in the first or second aspect, a solder paste is used as the conductive paste. According to the first aspect of the present invention, the thickness of the resist film is larger than the thickness of the connection terminal, and the thickness of the print mask is smaller than the thickness of the resist film. That is, since the thickness of the print mask is reduced to some extent, even if the fine pitch is advanced,
Plate separation can be performed smoothly.
【0007】[0007]
【発明の実施の形態】次に、この発明の一実施形態にお
ける半田ペースト(導電ペースト)の印刷方法につい
て、図1を参照して説明する。まず、図1(A)に示す
ように、ステージ11上に基板12を載置する。基板1
2上の所定の箇所には接続端子13が設けられ、接続端
子13の周囲における基板12上にはレジスト膜14が
設けられている。ステージ11の上方には印刷マスク1
5が配置されている。印刷マスク15の接続端子13に
対応する部分には開口部16が設けられている。この場
合、接続端子13の膜厚は30μm程度であり、レジス
ト膜14の膜厚は接続端子13の膜厚よりも厚くて50
〜100μm程度であり、印刷マスク15の膜厚はレジ
スト膜14の膜厚よりも薄くて20〜40μm程度であ
る。Next, a method of printing a solder paste (conductive paste) according to an embodiment of the present invention will be described with reference to FIG. First, as shown in FIG. 1A, a substrate 12 is placed on a stage 11. Substrate 1
A connection terminal 13 is provided at a predetermined position on the substrate 2, and a resist film 14 is provided on the substrate 12 around the connection terminal 13. A printing mask 1 is provided above the stage 11.
5 are arranged. An opening 16 is provided in a portion of the print mask 15 corresponding to the connection terminal 13. In this case, the thickness of the connection terminal 13 is about 30 μm, and the thickness of the resist film 14 is larger than the thickness of the connection terminal 13 by 50 μm.
The thickness of the print mask 15 is about 20 to 40 μm, which is smaller than the thickness of the resist film 14.
【0008】次に、図1(B)に示すように、ステージ
11を基板12と共に上昇させ、レジスト膜14の上面
を印刷マスク15の下面に密接させる。次に、図1
(C)に示すように、印刷マスク15上においてスキー
ジ17を移動させて半田ペースト18の印刷を行うこと
により、印刷マスク15の開口部16内における接続端
子13上に半田ペースト18aを印刷する。次に、図1
(D)に示すように、ステージ11を基板12と共にゆ
っくりと下降させ、版離れを行う。かくして、基板11
の接続端子13上に半田ペースト18aが印刷される。Next, as shown in FIG. 1B, the stage 11 is raised together with the substrate 12, and the upper surface of the resist film 14 is brought into close contact with the lower surface of the print mask 15. Next, FIG.
As shown in (C), the squeegee 17 is moved on the print mask 15 to print the solder paste 18, so that the solder paste 18 a is printed on the connection terminals 13 in the openings 16 of the print mask 15. Next, FIG.
As shown in (D), the stage 11 is slowly lowered together with the substrate 12 to release the plate. Thus, the substrate 11
The solder paste 18a is printed on the connection terminals 13 of FIG.
【0009】ところで、この実施形態では、レジスト膜
14の膜厚を50〜100μm程度と接続端子13の膜
厚よりも厚くし、印刷マスク15の膜厚を20〜40μ
m程度とレジスト膜14の膜厚よりも薄くしているの
で、すなわち、印刷マスク15の膜厚をある程度薄くし
ているので、ファインピッチ化が進んでも、版離れをス
ムーズに行うことができる。この結果、基板11の接続
端子13上に印刷された半田ペースト18aの印刷形状
が安定し、当該半田ペースト18aを介する接合の信頼
性を良くすることができる。In this embodiment, the thickness of the resist film 14 is about 50 to 100 μm, which is larger than the thickness of the connection terminal 13, and the thickness of the print mask 15 is 20 to 40 μm.
Since the thickness of the resist film 14 is smaller than that of the resist film 14, that is, the thickness of the print mask 15 is reduced to some extent, the plate separation can be performed smoothly even when the fine pitch is advanced. As a result, the printed shape of the solder paste 18a printed on the connection terminals 13 of the substrate 11 is stabilized, and the reliability of bonding via the solder paste 18a can be improved.
【0010】また、印刷マスク15の膜厚が20〜40
μm程度と比較的薄いので、レジスト膜14上に突出さ
れた半田ペースト18aの突出高さも20〜40μm程
度と比較的低くなる。この結果、半田ペースト18aが
周囲に流動しても、その流動範囲を比較的小さくするこ
とができ、ファインピッチ化が進んでも、隣接する半田
ペースト18a間でショートが発生しにくいようにする
ことができる。これに対し、図2に示す従来例の場合に
は、印刷マスク5の膜厚が50μm程度と比較的厚いの
で、半田ペースト8aの高さも50μm程度と比較的高
くなり、周囲に流動すると、流動範囲が比較的大きくな
るので、ファインピッチ化が進むと、隣接する半田ペー
スト8a間でショートが発生するおそれがある。The print mask 15 has a thickness of 20 to 40.
Since the solder paste 18a protrudes above the resist film 14, the protrusion height of the solder paste 18a is relatively low, such as about 20 to 40 μm. As a result, even when the solder paste 18a flows to the surroundings, the flow range thereof can be made relatively small, and even if the fine pitch is advanced, a short circuit between the adjacent solder pastes 18a is less likely to occur. it can. On the other hand, in the case of the conventional example shown in FIG. 2, since the thickness of the print mask 5 is relatively thick, about 50 μm, the height of the solder paste 8a is also relatively high, about 50 μm. Since the range is relatively large, when the fine pitch is advanced, a short circuit may occur between the adjacent solder pastes 8a.
【0011】なお、上記実施形態において、レジスト膜
14を各接続端子13の終縁部に重合するように形成
し、半田ペースト8aを接続端子13上にのみ設けるよ
うにしてもよい。In the above embodiment, the resist film 14 may be formed so as to be superimposed on the end edge of each connection terminal 13, and the solder paste 8 a may be provided only on the connection terminal 13.
【0012】[0012]
【発明の効果】以上説明したように、この発明によれ
ば、印刷マスクの膜厚をある程度薄くしているので、フ
ァインピッチ化が進んでも、版離れをスムーズに行うこ
とができ、ひいては基板の接続端子上に印刷された導電
ペーストの印刷形状が安定し、当該導電ペーストを介す
る接合の信頼性を良くすることができる。As described above, according to the present invention, the thickness of the print mask is reduced to some extent, so that even if the fine pitch is advanced, the separation of the plate can be performed smoothly, and the substrate can be removed. The printed shape of the conductive paste printed on the connection terminal is stabilized, and the reliability of bonding via the conductive paste can be improved.
【図1】(A)〜(D)はそれぞれこの発明の一実施形
態における半田ペーストの各印刷工程を示す断面図。FIGS. 1A to 1D are cross-sectional views showing respective printing steps of a solder paste according to an embodiment of the present invention.
【図2】(A)〜(D)はそれぞれ従来の半田ペースト
の各印刷工程を示す断面図。FIGS. 2A to 2D are cross-sectional views showing respective printing steps of a conventional solder paste.
11 ステージ 12 基板 13 接続端子 14 レジスト膜 15 印刷マスク 16 開口部 17 スキージ 18、18a 半田ペースト DESCRIPTION OF SYMBOLS 11 Stage 12 Substrate 13 Connection terminal 14 Resist film 15 Printing mask 16 Opening 17 Squeegee 18, 18a Solder paste
Claims (3)
ける前記基板上に設けられたレジスト膜上に印刷マスク
を密接させて前記接続端子上に導電ペーストを印刷する
に際し、前記レジスト膜の膜厚を前記接続端子の膜厚よ
りも厚くし、且つ、前記印刷マスクの膜厚を前記レジス
ト膜の膜厚よりも薄くしたことを特徴とする導電ペース
トの印刷方法。When a conductive paste is printed on the connection terminals by closely contacting a print mask on the resist film provided on the substrate around the connection terminals provided on the substrate, the film of the resist film is formed. A method for printing a conductive paste, wherein the thickness is greater than the thickness of the connection terminal, and the thickness of the print mask is smaller than the thickness of the resist film.
ジスト膜の膜厚は50〜100μm程度であり、前記印
刷マスクの膜厚は20〜40μm程度であることを特徴
とする導電ペーストの印刷方法。2. The conductive paste printing method according to claim 1, wherein the resist film has a thickness of about 50 to 100 μm, and the print mask has a thickness of about 20 to 40 μm. Method.
て、前記導電ペーストは半田ペーストであることを特徴
とする導電ペーストの印刷方法。3. The method according to claim 1, wherein the conductive paste is a solder paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000253565A JP2002076600A (en) | 2000-08-24 | 2000-08-24 | Method of printing conductive paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000253565A JP2002076600A (en) | 2000-08-24 | 2000-08-24 | Method of printing conductive paste |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002076600A true JP2002076600A (en) | 2002-03-15 |
Family
ID=18742640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000253565A Abandoned JP2002076600A (en) | 2000-08-24 | 2000-08-24 | Method of printing conductive paste |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002076600A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6978714B2 (en) | 2002-10-18 | 2005-12-27 | Ngk Spark Plug Co., Ltd. | Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers |
-
2000
- 2000-08-24 JP JP2000253565A patent/JP2002076600A/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6978714B2 (en) | 2002-10-18 | 2005-12-27 | Ngk Spark Plug Co., Ltd. | Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005322915A (en) | Surface-mounting attachment of component | |
JPH08321671A (en) | Bump electrode structure and manufacture thereof | |
US6763585B2 (en) | Method for producing micro bump | |
JP2002307653A (en) | Printing method for conductive ink | |
JP2002076600A (en) | Method of printing conductive paste | |
JPH10335795A (en) | Printed board | |
JP2718146B2 (en) | Electronic component manufacturing method | |
JPS63283051A (en) | Substrate for hybrid integrated circuit device | |
JPH06204655A (en) | Printed circuit board and its manufacture | |
JPH02252248A (en) | Manufacture of semiconductor device | |
US6635407B1 (en) | Two pass process for producing a fine pitch lead frame by etching | |
JPH10154766A (en) | Manufacture of semiconductor package and semiconductor package | |
JP2001291729A (en) | Method for sealing semiconductor element with resin by stencil printing, and stencil printing plate and squeegee used therefor | |
JPH11307678A (en) | Interposer | |
JPH11321146A (en) | Mask for solder-printing, and its manufacture | |
JPH1116947A (en) | Semiconductor package and manufacture thereof | |
JP2006186051A (en) | Mask for arrangement of fine balls | |
JPH0344035A (en) | Semiconductor device having bump electrode and its manufacture | |
JPH04243187A (en) | Printed circuit board | |
JPH0739220B2 (en) | Cream Solder screen mask | |
JP2550219Y2 (en) | Circuit board device | |
JPS6369694A (en) | Screen | |
JPH06140752A (en) | Printed-wiring board | |
JPH03103851A (en) | Printing mask used for soldering printed circuit board | |
JP2001053189A (en) | Wiring board and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Effective date: 20060203 Free format text: JAPANESE INTERMEDIATE CODE: A7422 |
|
A621 | Written request for application examination |
Effective date: 20060303 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
RD04 | Notification of resignation of power of attorney |
Effective date: 20060413 Free format text: JAPANESE INTERMEDIATE CODE: A7424 |
|
RD04 | Notification of resignation of power of attorney |
Effective date: 20080519 Free format text: JAPANESE INTERMEDIATE CODE: A7424 |
|
A977 | Report on retrieval |
Effective date: 20080627 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
A131 | Notification of reasons for refusal |
Effective date: 20080708 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20080827 |