JP2002072473A - Photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring both a high film leaving property and high sensitivity in practical use independently of the amount of a quinonediazidodiazido-containing photosensitive agent used, excellent also in suitability to coating and uniformity in the line width of a resist pattern, having low process dependence and capable of forming a good pattern. SOLUTION: In the photosensitive resin composition containing an alkali- soluble resin and a quinonediazidodiazido-containing photosensitive agent, a mixture of a novolak resin having a weight average molecular weight (expressed in terms of polystyrene) of 3,000-15,000 and a styrene resin having a weight average molecular weight (expressed in terms of polystyrene) of 3,000-25,000 is used as the alkali-soluble resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition, and more particularly to a photosensitive resin composition suitable for producing semiconductor devices, flat panel displays (FPD), and the like.

[0002]

2. Description of the Related Art Semiconductor integrated circuits such as LSIs and FPDs
2. Description of the Related Art In a wide range of fields, such as the manufacture of display surfaces and the manufacture of circuit boards such as thermal heads, photolithography techniques have been conventionally used to form or process fine elements. In the photolithography technique, a positive or negative photosensitive resin composition is used to form a resist pattern.
Among these photosensitive resin compositions, a composition containing an alkali-soluble resin and a quinonediazidediazide compound as a photosensitive agent is widely used as the positive photosensitive resin composition. This composition is referred to as, for example, “Novolak resin / quinonediazide compound” in Japanese Patent Publication No. 54-23570.
Japanese Patent Publication (U.S. Pat. No. 3,666,473) and Japanese Patent Publication No. 56-30850 (US Pat. No. 4,115,12).
No. 8), JP-A-55-73045, JP-A-61-205933, and the like, various compositions having various compositions are described. Compositions containing these novolak resins and quinonediazide compounds have been studied and developed from both sides of novolak resins and photosensitive agents. From the viewpoint of the novolak resin, a new resin is of course developed, but a photosensitive resin composition having excellent properties has also been obtained by improving the physical properties of a conventionally known resin. For example, JP-A-60-140235 and JP-A-1-105243 disclose that a novolak resin has a specific molecular weight distribution, which is disclosed in JP-A-60-97347 and JP-A-60-1897.
No. 39 and Japanese Patent No. 2590342 disclose a technique for providing a photosensitive resin composition having excellent characteristics by using a novolak resin from which low molecular weight components have been separated and removed. Further, as a negative resist, a combination of a novolak resin, an alkoxymethylated melamine as a crosslinking agent and a halogenated triazine as an acid generator (Japanese Patent Application Laid-Open No. 5-303196) is known.

However, the degree of integration of an integrated circuit of a semiconductor device is increasing year by year, and a pattern processing with a line width of submicron or less is required in the manufacture of a semiconductor device and the like, and the conventional technology cannot sufficiently cope with it. Is coming. In the production of a display surface such as a liquid crystal display (LCD), a mother glass is required to have a large size and high definition. In order to achieve this high definition, the photosensitive resin composition is required to have good coatability, small dependency on process conditions, and excellent uniformity of resist pattern line width. As a method for improving the coating property, a method of adding a surfactant to the photosensitive resin composition is mentioned as one of the methods, and the type and amount of the surfactant conventionally added to the photosensitive resin composition are mentioned. Is being considered. In addition, a photosensitive resin composition containing a solvent having a limited boiling point, kinematic viscosity and evaporation rate (Japanese Patent Application Laid-Open No. 10-1866)
Studies have also been made on solvents such as a photosensitive resin composition containing a mixed solvent containing a solvent selected from propylene glycol and dipropylene glycol (JP-A-10-186638). On the other hand, one of the methods for reducing the process dependency such as the prebaking temperature and the developing time dependency is to increase the amount of the photosensitive agent. However, if the amount of the photosensitive agent is simply increased, the sensitivity of the photosensitive resin composition is reduced, and there is a problem in compatibility with a high residual film and high sensitivity. In applications that require such fine processing, not only resolution but also good pattern reproducibility are required. Furthermore, in terms of manufacturing costs, throughput during manufacturing (yield per unit time) is required.
There is also a demand for improvement. Under these circumstances, increasing the sensitivity of the photosensitive resin composition is also an important issue.

Generally, in order to increase the sensitivity of a photosensitive resin composition, a resin having a low molecular weight is used, or the amount of a photosensitive agent added is reduced. However, according to such a method, the heat resistance of the resist decreases, the etching resistance decreases in the manufacturing process of a semiconductor device or the like, the developability deteriorates, and scum (residual development) occurs,
Problems such as a decrease in the remaining film ratio occur. To cope with this, a technique using a mixed resin in which the molecular weight range of a novolak resin derived from a specific phenol compound has been specified (JP-A-7-271024), a novolak derived from a specific phenol compound A technique in which the molecular weight range and the degree of dispersion are specified by a resin, and a technique containing a poly-hydroxy compound having a phenolic hydroxyl group (Japanese Patent Application Laid-Open No. H8-184963), naphthoquinonediazidesulfonic acid ester of trihydroxybenzophenone and trihydroxybenzophenone A technique using photosensitive components mixed at a fixed ratio (Japanese Patent Laid-Open No. 8-82926) has been proposed. However, none of the above requirements has been sufficiently satisfied, and therefore these requirements, that is, high sensitivity, high residual film properties, good coating properties, excellent resist pattern line width uniformity, low process dependency, There is a demand for a photosensitive resin composition that can satisfy good pattern forming properties.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the present invention is intended to achieve both high residual film properties and high sensitivity even when the amount of the sensitizer is made smaller or larger than before. It is an object of the present invention to provide a photosensitive resin composition which is capable of forming an excellent pattern, has excellent coating properties and uniformity of the line width of a resist pattern, has low process dependency, and can form a good pattern.

[0006]

Means for Solving the Problems As a result of intensive studies and investigations, the present inventors have found that in a photosensitive resin composition containing an alkali-soluble resin and a sensitizer containing a quinonediazide group, a specific alkali-soluble resin is used. It has been found that the above object can be achieved by using a mixture of a novolak resin having a molecular weight and a styrene resin having a specific molecular weight, and the present invention has been accomplished.

That is, the present invention relates to a photosensitive resin composition containing an alkali-soluble resin and a sensitizer containing a quinonediazide group, wherein the alkali-soluble resin is 3,000
A photosensitive resin composition comprising a mixture of a novolak resin having a polystyrene equivalent weight average molecular weight of 0 to 15,000 and a styrene resin having a polystyrene equivalent weight average molecular weight of 3,000 to 25,000. About.

Hereinafter, the present invention will be described in more detail. The novolak resin used in the photosensitive resin composition of the present invention is a conventionally known novolak resin used in a photosensitive resin composition containing an alkali-soluble resin and a sensitizer containing a quinonediazide group, and has a polystyrene equivalent weight. Any material having an average molecular weight of 3,000 to 15,000 may be used, and is not particularly limited. The novolak resin which can be preferably used in the present invention can be obtained by polycondensing various phenols alone or a mixture of plural kinds thereof with aldehydes such as formalin.

The phenols constituting the novolak resin include, for example, phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 3,5-dimethylphenol, 2,
3,4-trimethylphenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol,
2,4,5-trimethylphenol, methylenebisphenol, methylenebisp-cresol, resorcin, catechol, 2-methylresorcin, 4-methylresordin, o-chlorophenol, m-chlorophenol, p
-Chlorophenol, 2,3-dichlorophenol, m
-Methoxyphenol, p-methoxyphenol, p-
Butoxyphenol, o-ethylphenol, m-ethylphenol, p-ethylphenol, 2,3-diethylphenol, 2,5-diethylphenol, p-isopropylphenol, α-naphthol, β-naphthol, and the like. Can be used alone or as a mixture of a plurality.

The aldehydes include, for example, formalin, paraformaldehyde, acetaldehyde, benzaldehyde, hydroxybenzaldehyde, chloroacetaldehyde and the like, and these can be used alone or as a mixture of a plurality of them. The weight average molecular weight of the novolak resin used in the photosensitive resin composition of the present invention is 3,000 in terms of polystyrene.
It is preferably from 0 to 15,000, more preferably from 5,000 to 12,000 in terms of polystyrene.

On the other hand, 3,000 to 25,000 used together with the novolak resin in the photosensitive resin composition of the present invention.
Examples of the styrene-based resin having a weight average molecular weight in terms of polystyrene include a homopolymer or copolymer of a styrene derivative (a polystyrene derivative), and at least one monomer selected from a styrene derivative and an acrylate ester or a methacrylate ester. And a copolymer having one or more monomers selected from organic acids and having a weight average molecular weight in terms of polystyrene of 3,000 to 25,000. Examples of the styrene derivative, acrylate, and methacrylate constituting these polymers include the following.

Styrene derivative: 4-fluorostyrene,
2,5-difluorostyrene, 2,4-difluorostyrene, p-isopropylstyrene, styrene, o-chlorostyrene, 4-acetylstyrene, 4-benzoylstyrene, 4-bromostyrene, 4-butoxycarbonylstyrene, 4-butoxy Methyl styrene, 4-butyl styrene, 4-ethyl styrene, 4-hexyl styrene,
4-methoxystyrene, 4-methylstyrene, 2,4-
Dimethylstyrene, 2,5-dimethylstyrene, 2,
4,5-trimethylstyrene, 4-phenylstyrene,
4-propoxystyrene, etc.

Acrylates: methyl acrylate, ethyl acrylate, n-propyl acrylate,
n-butyl acrylate, n-hexyl acrylate,
Isopropyl acrylate, isobutyl acrylate,
t-butyl acrylate, cyclohexyl acrylate, benzyl acrylate, 2-chloroethyl acrylate, methyl-α-chloroacrylate, phenyl-α
-Bromoacrylate, etc.

Methacrylates: methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, n-butyl methacrylate, n-hexyl methacrylate, isopropyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, phenyl methacrylate, 1- Phenylethyl methacrylate, 2-phenylethyl methacrylate, furfuryl methacrylate, diphenylmethyl methacrylate, pentachlorophenyl methacrylate, naphthyl methacrylate, etc.

Organic acid monomers: acrylic acid, methacrylic acid, itaconic acid, maleic anhydride, 2-acryloyl hydrogen phthalate, 2-acryloyloxypropyl hydrogen phthalate, etc.

When an organic acid monomer is used as the copolymer component, the styrene derivative, acrylic acid ester and methacrylic acid ester portion of the copolymer exhibit an alkali dissolution inhibiting effect on the photosensitive resin composition. On the other hand, the organic acid monomer part shows an alkali solubility improving effect. Therefore,
Depending on the amount of the organic acid monomer, it is possible to appropriately balance the effect of inhibiting the dissolution of the photosensitive resin composition by the styrene-based resin in the developing solution in the exposure region and the improvement in solubility when the styrene-based resin is added.

The weight average molecular weight of the polystyrene derivative and the copolymer of the monomer constituting the polystyrene derivative and one or more monomers selected from acrylates, methacrylates and organic acids is 3% in terms of polystyrene. It is preferably from 2,000 to 25,000, more preferably from 5,000 to 20,000. Further, a copolymer of a polystyrene derivative and a monomer constituting the polystyrene derivative and one or more monomers selected from acrylates, methacrylates, and organic acids may be used alone or in combination of two or more. The above may be used in combination. further,
The content of these polystyrene derivatives and copolymers is
The amount is preferably 0.5 to 5.0 parts by weight, more preferably 1.0 to 3.0 parts by weight, based on 100 parts by weight of the novolak resin. When the amount is less than 0.5 part by weight, the effect of improving sensitivity is usually not obtained. When the amount is more than 5.0 parts by weight, the effect of suppressing dissolution becomes too large and the sensitivity tends to be low, which is not practically used. This is because

As the sensitizer containing a quinonediazide group used in the photosensitive resin composition of the present invention, any of conventionally known sensitizers containing a quinonediaside group can be used, and naphthoquinonediazidesulfonic acid chloride and Those obtained by reacting a quinonediazidesulfonic acid halide such as benzoquinonediazidesulfonic acid chloride with a low molecular weight compound or a high molecular weight compound having a functional group capable of condensation reaction with the acid halide are preferable. Here, examples of the functional group capable of condensing with an acid halide include a hydroxyl group and an amino group, and a hydroxyl group is particularly preferable. Examples of the low molecular weight compound containing a hydroxyl group include hydroquinone, resorcin, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, and 2,4,4′-trihydroxy. Benzophenone,
2,3,4,4′-tetrahydroxybenzophenone,
2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 3,4,6'-pentahydroxybenzophenone, etc., and as the high molecular compound containing a hydroxyl group, novolak resin, polyhydroxystyrene, etc. Is raised. In the present invention, the content of the quinonediazide-containing photosensitive agent is preferably 10 to 30 parts by weight, more preferably 15 to 25 parts by weight, based on 100 parts by weight of the resin component in the photosensitive resin composition. . If the amount is less than 10 parts by weight, the residual film ratio tends to decrease.
If the amount exceeds the weight part, the sensitivity is too low, which causes a practical problem.

In the present invention, it is preferable that the photosensitive resin composition further contains a low molecular compound having a phenolic hydroxyl group represented by the following general formula (I).

[0020]

Embedded image Wherein R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ and R
₇ are each independently H, an alkyl group of C _{1 to} C ₄ ,
₁ -C ₄ alkoxyl group, a cyclohexyl group, or a group of the formula:

Embedded image Wherein R ₈ represents H, a C ₁ -C ₄ alkyl group, a C ₁ -C ₄ alkoxy group or a cyclohexyl group, and m and n are each 0, 1 or 2 ,
a, b, c, d, e, f, g and h are a + b ≦ 5,
It is an integer of 0 or 1 to 5 that satisfies c + d ≦ 5, e + f ≦ 5, and g + h ≦ 5, and i is 0, 1 or 2. )

The low molecular weight compound having a phenolic hydroxyl group represented by the above general formula (I) is usually used as a dissolution accelerator in the photosensitive resin composition of the present invention to adjust the dissolution rate, It can be suitably used for improving the sensitivity of the composition or adjusting the sensitivity.

Examples of the low molecular weight compound having a phenolic hydroxyl group represented by the general formula (I) include o-cresol, m-cresol, p-cresol, 2,4-xylenol, 2,5-xylenol, 6-xylenol, bisphenols A, B, C, E, F and G, 4,
4 ', 4 "-methylidine trisphenol, 2,6-bis [(2-hydroxy-5-methylphenyl) methyl]
-4-methylphenol, 4,4 '-[1- [4- [1
-(4-hydroxyphenyl) -1-methylethyl] phenyl] ethylidene] bisphenol, 4,4 ′, 4 ″
-Ethylidene trisphenol, 4- [bis (4-hydroxyphenyl) methyl] -2-ethoxyphenol,
4,4 ′-[(2-hydroxyphenyl) methylene] bis [2,3-dimethylphenol], 4,4 ′-[(3
-Hydroxyphenyl) methylene] bis [2,6-dimethylphenol], 4,4 ′-[(4-hydroxyphenyl) methylene] bis [2,6-dimethylphenol], 2,2 ′-[(2-hydroxy Phenyl) methylene] bis [3,5-dimethylphenol], 2,2′-
[(4-hydroxyphenyl) methylene] bis [3,5
-Dimethylphenol], 4,4 '-[(3,4-dihydroxyphenyl) methylene] bis [2,3,6-trimethylphenol], 4- [bis (3-cyclohexyl-4-hydroxy-6-methylphenyl) ) Methyl]-
1,2-benzenediol, 4,6-bis [(3,5-
Dimethyl-4-hydroxyphenyl) methyl] -1,
2,3-benzenetriol, 4,4 ′-[(2-hydroxyphenyl) methylene] bis [3-methylphenol], 4,4 ′, 4 ″-(3-methyl-1-propanyl-3-yridine) Trisphenol, 4,4 ', 4 ",
4 ′ ″-(1,4-phenylenedimethylidyne) tetrakisphenol, 2,4,6-tris “(3,5-dimethyl-4-hydroxyphenyl) methyl] -1,3-benzenediol, 2,4 , 6-Tris "(3,5-dimethyl-2-hydroxyphenyl) methyl] -1,3-benzenediol, 4,4 '-[1- [4- [1- [4-
Hydroxy-3,5-bis [(hydroxy-3-methylphenyl) methyl] phenyl] -1-methylethyl] phenyl] ethylidene] bis [2,6-bis (hydroxy-3-methylphenyl) methyl] phenol and the like Can be mentioned. These low molecular weight compounds having a phenolic hydroxyl group are generally used in an amount of 1 to 20 parts by weight, preferably 3 to 15 parts by weight, based on 100 parts by weight of the novolak resin.

Examples of the solvent for dissolving the alkali-soluble resin of the present invention, the photosensitizer and the dissolution inhibitor represented by the above formula (I) include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether. , Ethylene glycol monoalkyl ether acetates, ethylene glycol monoalkyl ether acetates such as ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol monoalkyl ethers such as propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, Propylene glycol monoalkyl ether acetates such as propylene glycol monoethyl ether acetate Methyl lactate esters such as ethyl lactate, toluene, aromatic hydrocarbons such as xylene,
Ketones such as methyl ethyl ketone, 2-heptanone, cyclohexanone, N, N-dimethylacetamide, N-
Examples thereof include amides such as methylpyrrolidone and lactones such as γ-butyrolactone. These solvents can be used alone or in combination of two or more.

The photosensitive resin composition of the present invention may optionally contain a dye, an adhesion aid, a surfactant and the like. Examples of the dye include methyl violet, crystal violet, and malachite green.Examples of the adhesion aid include alkyl imidazoline, butyric acid, alkyl acid, polyhydroxystyrene, polyvinyl methyl ether, t-butyl novolak, epoxy silane, and epoxy silane. Examples of the surfactants include polymers, silanes, and the like. Examples of the surfactants include nonionic surfactants such as polyglycols and derivatives thereof, ie, polypropylene glycol, or polyoxyethylene lauryl ether, and fluorine-containing surfactants such as Florad (products). Name, manufactured by Sumitomo 3M Co., Ltd., Megafac (trade name, manufactured by Dainippon Ink & Chemical Co., Ltd.), sulfuron (trade name, manufactured by Asahi Glass Co., Ltd.), or an organosiloxane surfactant such as KP341 (trade name, Shin-Etsu Chemical Co., Ltd. Made).

Hereinafter, the present invention will be described in more detail with reference to Examples, but embodiments of the present invention are not limited to these Examples.

Example 1 2,3,4,4'-Tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride were added to 100 parts by weight of a novolak resin having a weight average molecular weight of 7,000 in terms of polystyrene. Dissolving 20 parts by weight of an esterified product of the above and 3.0 parts by weight of polystyrene (PSt) having a weight average molecular weight of 14,000 in propylene glycol monomethyl ether acetate, and forming radial wrinkles on a resist film during spin coating; In order to prevent so-called striation, a fluorine-based surfactant, Florard-472 (manufactured by Sumitomo 3M) was further added to the solution in an amount of 300 p.
After adding pm and stirring, the mixture was filtered through a 0.2 μm filter to prepare a photosensitive resin composition of the present invention. This composition was spin-coated on a 4-inch silicon wafer,
After baking on a hot plate at 0 ° C for 90 seconds, 1.5μ
An m-thick resist film was obtained. The resist film was exposed to a test pattern having various line widths of 1: 1 line and space width by a Nikon g-line stepper (FX-604F), and 2.38% by weight of tetramethyl hydroxide. Development was carried out with an aqueous ammonium solution at 23 ° C. for 60 seconds. The residual film ratio was calculated from the film thickness measurement before and after the development, and the observation was performed using the exposure energy amount at which the line and space of 5 μm was resolved at a ratio of 1: 1 as a sensitivity, and the results in Table 1 were obtained.

Example 2 Polystyrene (PSt) having a weight average molecular weight of 7,000
Was carried out in the same manner as in Example 1 except for using, and the results in Table 1 were obtained.

Example 3 A copolymer of styrene and methyl methacrylate having a weight average molecular weight of 7,000 in terms of polystyrene (PSt / M
MA, monomer ratio 90/10), and the same procedure as in Example 1 was carried out, with the results shown in Table 1.

Example 4 5 parts by weight of o-cresol as a low molecular weight compound having a phenolic hydroxyl group, 100 parts by weight of a novolak resin having a weight average molecular weight of 7,000 in terms of polystyrene, and 2, 3, 4, 4 21.5 parts by weight of an esterified product of '-tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride, and 3.2 parts by weight of polystyrene (PSt) having a weight average molecular weight of 14,000. Is performed in the same manner as in Example 1,
The results in Table 1 were obtained.

Comparative Example 1 Polystyrene having a weight average molecular weight of 14,000 (PS
The procedure was performed in the same manner as in Example 1 except that t) was not used.
Was obtained.

Reference Example 1 The procedure of Example 1 was repeated except that polymethyl methacrylate (PMMA) having a weight average molecular weight of 10,000 in terms of polystyrene was used, and the results shown in Table 1 were obtained.

[0032]

[Table 1]

Example 5 Except that the esterified product of 2,3,4,4'-tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride was 25 parts by weight,
It carried out similarly to Example 1 and obtained the result of Table 2.

Comparative Example 2 Polystyrene having a weight average molecular weight of 14,000 (PS
Table 2 was obtained in the same manner as in Example 5 except that t) was not used.
Was obtained.

[0035]

[Table 2]

Example 6 2,3,4,4'-Tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride were added to 100 parts by weight of a novolak resin having a weight average molecular weight of 5,000 in terms of polystyrene. The same procedures as in Example 1 were carried out except that the amount of the esterified product was changed to 30 parts by weight, and the results shown in Table 3 were obtained.

Comparative Example 3 Polystyrene having a weight average molecular weight of 14,000 (PS
The procedure was performed in the same manner as in Example 6 except that t) was not used.
Was obtained.

[0038]

[Table 3]

Example 7 A 2,3,4,4′-weight-average molecular weight was calculated based on 100 parts by weight of a novolak resin having a polystyrene equivalent of 10,000.
Example 1 was repeated except that the esterified product of tetrahydroxybenzophenone and 1,2-naphthoquinonediazido-5-sulfonyl chloride was changed to 10 parts by weight and polystyrene (PSt) having a weight average molecular weight of 14,000 to 4.0 parts by weight. And the results in Table 4 were obtained.

Comparative Example 4 Polystyrene having a weight average molecular weight of 14,000 (PS
The procedure was performed in the same manner as in Example 7 except that t) was not used.
Was obtained.

[0041]

[Table 4]

No scum was observed in any of the resist patterns obtained in the examples, and the line width of the resist pattern was uniform and the shape of the resist pattern was good. From the above tables, it can be seen that the photosensitive resin composition of the present invention is excellent in both the residual film ratio and the sensitivity. Also, when PMMA is selected as the resin used in combination with the novolak resin, the residual film ratio and the sensitivity are improved. However, when PSt is used, the photosensitive sensitivity is higher than when PMMA is used. It can be seen from Table 1 that a resin composition is obtained. This is PMMA
Also, PSt used in the present invention has a difference in refractive index between the novolak resin and the novolak resin, which is considered to improve the sensitivity of the photosensitive resin composition. Is smaller than the refractive index difference between the novolak resin and PMMA, and the refractive index difference of PSt becomes an appropriate refractive index difference from the viewpoint of improving the sensitivity of the photosensitive resin composition compared to the refractive index difference between PMMA and the novolak resin, It is considered that the use efficiency of the photosensitive agent was improved by this. Table 3 shows that the photosensitive resin composition of the present invention can maintain high sensitivity and a high residual film even when a large amount of the photosensitive agent is added.

[0043]

As described above, according to the present invention, it is practically possible to achieve both high residual film properties and high sensitivity, and furthermore, it is excellent in coatability and line width uniformity of a resist pattern, and is process-dependent. It is possible to obtain a photosensitive resin composition having a low property and capable of forming a good pattern.

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Claims (4)

[Claims] 1. A photosensitive resin composition comprising an alkali-soluble resin and a sensitizer containing a quinonediazide group,
The alkali-soluble resin comprises a mixture of a novolak resin having a polystyrene equivalent weight average molecular weight of 3,000 to 15,000 and a styrene resin having a polystyrene equivalent weight average molecular weight of 3,000 to 25,000. A photosensitive resin composition. 2. The photosensitive resin composition according to claim 1, wherein the content of the styrene resin is 0.5 to 5.0 parts by weight based on 100 parts by weight of the novolak resin. 3. The content of a photosensitive agent is novolak resin 100
The photosensitive resin composition according to claim 1 or 2, wherein the amount is 10 to 30 parts by weight based on part by weight. 4. The photosensitive resin composition according to claim 1, comprising a low molecular compound having a phenolic hydroxyl group represented by the following general formula (I). Embedded image Wherein R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , R ₆ and R
₇ are each independently H, an alkyl group of C _{1 to} C ₄ ,
_{1 to} C ₄ alkoxyl, cyclohexyl, or a compound of the formula: Wherein R ₈ represents H, a C ₁ -C ₄ alkyl group, a C ₁ -C ₄ alkoxy group or a cyclohexyl group, and m and n are each 0, 1 or 2 ,
a, b, c, d, e, f, g and h are a + b ≦ 5,
It is an integer of 0 or 1 to 5 that satisfies c + d ≦ 5, e + f ≦ 5, and g + h ≦ 5, and i is 0, 1 or 2. )