JP2002062273A - 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム - Google Patents

鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム

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Publication number
JP2002062273A
JP2002062273A JP2001171044A JP2001171044A JP2002062273A JP 2002062273 A JP2002062273 A JP 2002062273A JP 2001171044 A JP2001171044 A JP 2001171044A JP 2001171044 A JP2001171044 A JP 2001171044A JP 2002062273 A JP2002062273 A JP 2002062273A
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JP
Japan
Prior art keywords
lead
solder material
free solder
sample
differential thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2001171044A
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English (en)
Japanese (ja)
Other versions
JP2002062273A5 (enExample
Inventor
Kenichiro Suetsugu
憲一郎 末次
Toshiharu Hibino
俊治 日比野
Yukio Maeda
幸男 前田
Yoshiyuki Kabashima
祥之 椛島
Mikiya Nakada
幹也 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001171044A priority Critical patent/JP2002062273A/ja
Publication of JP2002062273A publication Critical patent/JP2002062273A/ja
Publication of JP2002062273A5 publication Critical patent/JP2002062273A5/ja
Ceased legal-status Critical Current

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  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001171044A 2000-06-06 2001-06-06 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム Ceased JP2002062273A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001171044A JP2002062273A (ja) 2000-06-06 2001-06-06 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-168903 2000-06-06
JP2000168904 2000-06-06
JP2000-168904 2000-06-06
JP2000168903 2000-06-06
JP2001171044A JP2002062273A (ja) 2000-06-06 2001-06-06 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム

Publications (2)

Publication Number Publication Date
JP2002062273A true JP2002062273A (ja) 2002-02-28
JP2002062273A5 JP2002062273A5 (enExample) 2008-05-29

Family

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JP2001171044A Ceased JP2002062273A (ja) 2000-06-06 2001-06-06 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム

Country Status (1)

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JP (1) JP2002062273A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805282B2 (en) 2000-09-26 2004-10-19 Matsushita Electric Industrial Co., Ltd. Flow soldering process and apparatus
JP2007212396A (ja) * 2006-02-13 2007-08-23 Sii Nanotechnology Inc 示差走査熱量測定における凝固点温度測定方法及び温度較正方法
JP2009168569A (ja) * 2008-01-15 2009-07-30 Nihon Superior Co Ltd 溶融金属の監視システム
JP2015017983A (ja) * 2013-07-12 2015-01-29 ネッチ ゲレーテバウ ゲーエムベーハー 熱分析における測定結果の評価方法、該方法の使用、並びに該方法を行うためのコンピュータユニット、コンピュータプログラム製品及びシステム
WO2019208039A1 (ja) * 2018-04-27 2019-10-31 三菱電機株式会社 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置
CN119300261A (zh) * 2024-09-24 2025-01-10 常州市建宏电子技术有限公司 一种印刷电路板翻转焊接控制方法及系统
WO2025109927A1 (ja) * 2023-11-24 2025-05-30 株式会社日立ハイテク 情報処理装置、情報処理方法およびコンピュータプログラム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06273360A (ja) * 1993-03-18 1994-09-30 Res:Kk 半田組成分析装置
JPH07167809A (ja) * 1993-12-14 1995-07-04 Seiko Instr Inc 熱伝導率の測定方法
JPH0862165A (ja) * 1994-08-03 1996-03-08 Hispano Suiza 少なくとも２種の異なる成分からなる材料成分の百分率を決定する方法
JPH1054813A (ja) * 1996-08-08 1998-02-24 Shimadzu Corp 示差走査熱量測定装置
JPH10249579A (ja) * 1997-03-11 1998-09-22 Sony Corp はんだ材料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06273360A (ja) * 1993-03-18 1994-09-30 Res:Kk 半田組成分析装置
JPH07167809A (ja) * 1993-12-14 1995-07-04 Seiko Instr Inc 熱伝導率の測定方法
JPH0862165A (ja) * 1994-08-03 1996-03-08 Hispano Suiza 少なくとも２種の異なる成分からなる材料成分の百分率を決定する方法
JPH1054813A (ja) * 1996-08-08 1998-02-24 Shimadzu Corp 示差走査熱量測定装置
JPH10249579A (ja) * 1997-03-11 1998-09-22 Sony Corp はんだ材料

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805282B2 (en) 2000-09-26 2004-10-19 Matsushita Electric Industrial Co., Ltd. Flow soldering process and apparatus
JP2007212396A (ja) * 2006-02-13 2007-08-23 Sii Nanotechnology Inc 示差走査熱量測定における凝固点温度測定方法及び温度較正方法
JP2009168569A (ja) * 2008-01-15 2009-07-30 Nihon Superior Co Ltd 溶融金属の監視システム
JP2015017983A (ja) * 2013-07-12 2015-01-29 ネッチ ゲレーテバウ ゲーエムベーハー 熱分析における測定結果の評価方法、該方法の使用、並びに該方法を行うためのコンピュータユニット、コンピュータプログラム製品及びシステム
WO2019208039A1 (ja) * 2018-04-27 2019-10-31 三菱電機株式会社 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置
CN112004629A (zh) * 2018-04-27 2020-11-27 三菱电机株式会社 钎焊监视装置、钎焊监视方法以及钎焊装置
JPWO2019208039A1 (ja) * 2018-04-27 2020-12-10 三菱電機株式会社 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置
CN112004629B (zh) * 2018-04-27 2022-05-03 三菱电机株式会社 钎焊监视装置、钎焊监视方法以及钎焊装置
WO2025109927A1 (ja) * 2023-11-24 2025-05-30 株式会社日立ハイテク 情報処理装置、情報処理方法およびコンピュータプログラム
CN119300261A (zh) * 2024-09-24 2025-01-10 常州市建宏电子技术有限公司 一种印刷电路板翻转焊接控制方法及系统

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