JP2002050655A - Chip-packaging method and substrate-cleaning device used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently remove impurities in a substrate, for packaging a chip with high quality. SOLUTION: The substrate 8 is horizontally conveyed by a substrate conveyance means 7. Along the conveyance path of the substrate, air-blow-, wiping-, and plasma-cleaning means 13, 22, and 25 are arranged adjacent in this order. The substrate 8 is cleaned by the cleaning means 13, 22, and 25 for treatment while the substrate 8 is being conveyed. When a series of cleaning treatment is completed, an adhesive is applied onto the cleaned substrate 8, and the chip is jointed onto the substrate. The substrate is cleaned before the adhesive is applied, thus packaging the chip onto the substrate with high quality.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a chip on a substrate, and more particularly to a method for mounting a chip on a substrate after cleaning dirt and dirt attached to the substrate and a method for mounting the chip on the substrate. To a substrate cleaning apparatus.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing a substrate (eg, a glass substrate for LCD), there is a process of mounting a chip (eg, a semiconductor chip) on the substrate. As a method of mounting the chip on the board, after attaching an adhesive to the board,
A method of mounting a chip by bonding the chip to the substrate to which an adhesive is attached is well known.

That is, in a chip mounting apparatus for mounting a chip, (1) an adhesive (for example, ACF (Anisotropic Con
conductive film), ACP (Anisotropic Conductive Past)
e), NCF (Non Conductive Film), NCP (Non Condu
ctive Paste)). (2) The chip and the substrate are aligned using the recognition means, and the chip is mounted on the substrate with low heating and low pressure (hereinafter, referred to as “temporary pressure bonding”). (3) The chip is bonded to the substrate by the steps (1) to (3), such as curing the adhesive between the chip and the substrate with high heating and high pressure to fix the chip and the substrate (hereinafter referred to as “final pressure bonding”). Has been implemented.

[0004]

However, such a chip mounting method has the following problems. That is, dust or dirt such as glass powder, glass dust, an organic film, or an oxide film may adhere to the substrate during mounting.

When a chip is mounted using a substrate to which dirt or dirt is attached, dirt or dirt is interposed between the chip and the substrate.
Problems such as the failure of good electrical connection, the displacement of the chip and the substrate, and the scratching of the chip and the substrate occur.

The present invention has been made in view of such circumstances, and a chip mounting method capable of efficiently removing dirt from a substrate and mounting a chip with high quality, and a substrate cleaning method used therefor. It is an object to provide a device.

[0007]

The present invention has the following configuration to achieve the above object. According to a first aspect of the present invention, there is provided a chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive is attached. Before, a substrate cleaning step in which an air blow cleaning step of performing air blow cleaning on the substrate and a plasma cleaning step of performing plasma cleaning of the substrate are arranged in this order, and the air blow cleaning step and the plasma cleaning step are performed. By transporting and moving the substrate over the cleaning process, air blow cleaning and plasma cleaning are continuously performed on the substrate.

According to a second aspect of the present invention, there is provided a chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive is attached. Before the agent adhering step, there is provided a substrate cleaning step in which a wiping cleaning step for wiping and cleaning the substrate and a plasma cleaning step for performing plasma cleaning on the substrate are arranged in this order. The present invention is characterized in that wiping cleaning and plasma cleaning are continuously performed on the substrate by transporting and moving the substrate during the cleaning process.

According to a third aspect of the present invention, there is provided a chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive is attached. Before the agent adhering step, an air blow cleaning step of performing air blow cleaning on the substrate, a wiping cleaning step of performing wiping cleaning on the substrate, and a plasma cleaning step of performing plasma cleaning on the substrate are performed in this order. A substrate cleaning step is provided, and the substrate is transported and moved over an air blow cleaning step, a wiping cleaning step, and a plasma cleaning step, so that air blowing cleaning, wiping cleaning, and plasma cleaning are continuously performed on the substrate. It is characterized by performing.

According to a fourth aspect of the present invention, in the chip mounting method according to any one of the first to third aspects, in the substrate cleaning step, the respective cleaning steps are arranged adjacently along the transport path of the substrate. Then, the respective cleaning processes are sequentially performed on the substrate passing through the transport path at a constant speed.

According to a fifth aspect of the present invention, in the chip mounting method of the first or third aspect, in the air blow cleaning step, the vibrated air is blown toward the substrate and the blown air is blown. The substrate is cleaned by suction and discharge.

According to a sixth aspect of the present invention, in the chip mounting method according to the second or third aspect, in the wiping and washing step, the nonwoven fabric is impregnated with a cleaning liquid while winding the nonwoven fabric into a substrate. To clean the substrate.

According to a seventh aspect of the present invention, in the chip mounting method of the sixth aspect, in the wiping and cleaning step, the nonwoven fabric is applied to both front and back surfaces of the substrate to clean the substrate.

According to an eighth aspect of the present invention, in the chip mounting method of the seventh aspect, in the wiping and cleaning step, the nonwoven fabric is applied to both the front and back surfaces of the substrate to clean the substrate.

According to a ninth aspect of the present invention, in the chip mounting method according to any one of the sixth to eighth aspects, in the wiping and cleaning step, the nonwoven fabric is wound in a direction opposite to the direction of travel of the substrate. ing.

According to a tenth aspect of the present invention, in the chip mounting method according to any one of the first to ninth aspects,
In the plasma cleaning process, the substrate is cleaned by generating plasma under atmospheric pressure.

According to an eleventh aspect of the present invention, in the chip mounting method of the tenth aspect, in the plasma cleaning step, a plasma is generated by applying a voltage to the inside of the gas passage tube under atmospheric pressure, thereby forming the substrate. Wash.

According to a twelfth aspect of the present invention, in the chip mounting method according to any one of the first to eleventh aspects, the substrate is a glass substrate.

According to a thirteenth aspect of the present invention, in the chip mounting method of the fourth aspect, a passing speed of the substrate passing through the transport path is 10 to 100 mm / sec.

According to a fourteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the first aspect, wherein air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is attached. And plasma cleaning means for performing plasma cleaning on the substrate subjected to the air blow cleaning, and substrate transport means for transporting and moving the substrate across the air blow cleaning means and the plasma cleaning means.

According to a fifteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the second aspect, wherein a wiping cleaning means for wiping and cleaning the substrate before the adhesive is attached thereto; Plasma cleaning means for performing plasma cleaning on the wiped and cleaned substrate, and substrate transport means for transporting and moving the substrate across the wiping and cleaning means are provided.

According to a sixteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the third aspect, wherein air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is attached. And wiping and cleaning means for wiping and cleaning the air-blown substrate; plasma cleaning means for performing plasma cleaning on the wiping-cleaned substrate; and transporting the substrate between the air-blowing cleaning means, the wiping and cleaning means, and the plasma cleaning means. And a substrate transfer means for moving.

According to a seventeenth aspect of the present invention, in the substrate cleaning apparatus according to the fifteenth or sixteenth aspect, the wiping and cleaning means comprises two separate parts, one for wiping the front surface of the substrate and the other for wiping the rear surface of the substrate. Has been deployed.

According to an eighteenth aspect of the present invention, in the substrate cleaning apparatus according to any one of the fifteenth to seventeenth aspects, the wiping and cleaning means winds the nonwoven fabric in a direction opposite to a direction in which the substrate advances. While washing the substrate, the nonwoven fabric acts on the substrate.

According to a nineteenth aspect of the present invention, in the substrate cleaning apparatus according to any one of the fourteenth to eighteenth aspects, the substrate transporting means transports the substrate at a constant speed, and the cleaning means comprises: Are arranged adjacent to each other along the substrate transfer path.

According to a twentieth aspect of the present invention, in the substrate cleaning apparatus according to the nineteenth aspect, the substrate transporting means comprises:
The substrate is transported at a speed of 0 to 100 mm / sec.

[0027]

The operation of the present invention is as follows. That is, according to the first aspect of the present invention, before the adhesive is attached to the substrate, the substrate is subjected to air blow cleaning, thereby removing dirt such as dust and dust attached to the substrate. You. Thereafter, by performing a plasma cleaning process, dirt such as an organic material film and an oxide film that cannot be removed in the air blow cleaning step is decomposed and removed. Therefore, dust and dirt attached to the substrate at the time of mounting are removed, and the chip is mounted on the substrate with high quality.

According to the second aspect of the present invention, dirt such as dust and dirt adhering to the substrate is removed by wiping and cleaning the substrate before adhering the adhesive to the substrate. You. Thereafter, by performing a plasma cleaning process, dirt such as an organic film and an oxide film that cannot be removed in the wiping cleaning process is decomposed and removed. Therefore, dust and dirt attached to the substrate at the time of mounting are removed, and the chip is mounted on the substrate with high quality.

According to the third aspect of the present invention, the air blow cleaning is performed on the substrate before the adhesive is applied to the substrate,
Next, by performing wiping cleaning, dirt such as dust and dust attached to the substrate is removed. Thereafter, by performing a plasma cleaning process, dirt such as an organic film and an oxide film that cannot be removed in the air blow cleaning process and the wiping cleaning process is decomposed and removed. Therefore,
The dust and dirt attached to the substrate at the time of mounting are effectively removed, and the chip is mounted on the substrate with higher quality.

According to the fourth aspect of the present invention, in the substrate cleaning step, the cleaning steps are arranged adjacent to each other along the transport path of the substrate, and the substrates passing through the transport path at a constant speed are cleaned. Since the processing is performed sequentially, the substrate is efficiently cleaned.

According to the fifth aspect of the present invention, dust or dirt attached to the substrate is peeled off by blowing out the vibrated air, and the dust or dirt removed by sucking out the blown-up air. Etc. are sucked and discharged together with air.

According to the sixth aspect of the present invention, since the nonwoven fabric is applied to the substrate while winding the belt-like nonwoven fabric impregnated with the cleaning liquid, the dust and the dust attached to the substrate are removed. Wiping and removal are performed efficiently. Further, dust and the like captured by the nonwoven fabric do not adhere to the substrate.

According to the seventh aspect of the present invention, since the nonwoven fabric acts on both the front and back surfaces of the substrate, the front and back surfaces of the substrate are efficiently cleaned.

According to the eighth aspect of the present invention, since the individual nonwoven fabrics act on the front and back surfaces of the substrate, dust and dirt on the back surface of the substrate adhere to the surface of the substrate, and the opposite phenomenon occurs. Does not occur.

According to the ninth aspect of the present invention, the non-woven fabric is applied to the substrate and washed while winding the non-woven fabric in a direction opposite to the traveling direction of the substrate. The substrate is cleaned.

According to the tenth aspect of the present invention, since plasma is generated under the atmospheric pressure, it is easier to perform plasma cleaning while transporting the substrate than in the case where plasma is generated in a vacuum.

According to the eleventh aspect of the present invention, since a plasma is generated by applying a voltage to the gas passage tube under atmospheric pressure, only the plasma is applied to the substrate without applying a charge voltage to the substrate. The substrate is cleaned.

According to the twelfth aspect of the present invention, the glass substrate is effectively cleaned before the adhesive is applied, and the chip is mounted on the glass substrate with high quality.

According to the thirteenth aspect of the present invention, since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate is effectively and efficiently cleaned.

According to the fourteenth aspect of the present invention, the substrate cleaning apparatus provided with the air blow cleaning means and the plasma cleaning means performs the air blow cleaning and the plasma cleaning on the substrate before the adhesive is applied in this order. Done.

According to the fifteenth aspect of the present invention, the substrate cleaning apparatus provided with the wiping cleaning means and the plasma cleaning means performs the wiping cleaning and the plasma cleaning on the substrate before the adhesive is applied in that order. .

According to the sixteenth aspect of the present invention, the substrate cleaning apparatus provided with the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means performs air blow cleaning and wiping cleaning on the substrate before the adhesive is applied. And plasma cleaning are performed in that order.

According to the seventeenth aspect, the front and rear surfaces of the substrate are individually cleaned using two wiping cleaning means for wiping the surface of the substrate and wiping and cleaning the rear surface of the substrate.

According to the eighteenth aspect of the present invention, the non-woven fabric is applied to the substrate while the non-woven fabric is wound in the direction opposite to the traveling direction of the substrate, and the substrate is cleaned.

According to the nineteenth aspect of the present invention, each of the cleaning means disposed adjacently along the transport path sequentially performs each of the cleaning processes on the substrate being transported at a constant speed by the substrate transport means. .

According to the twentieth aspect, since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate is effectively and efficiently cleaned.

[0047]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a process chart showing one embodiment of a chip mounting method according to the present invention. The chip mounting method according to the present embodiment is roughly divided into a substrate cleaning step S1 for cleaning a substrate, an adhesive application step S2 for applying an adhesive to the cleaned substrate, and a method for attaching a chip to the substrate to which the adhesive is applied. And a chip joining step S3 for joining.

The substrate cleaning step S1 includes an air blow cleaning step S11 for performing air blow cleaning on the substrate, a wiping cleaning step S12 for performing wiping cleaning on the air blow cleaned substrate, and And a plasma cleaning step S13 for performing plasma cleaning on the substrate. The substrate is transported and moved between the air blow cleaning step S11, the wiping cleaning step S12, and the plasma cleaning step 13, thereby performing air blow cleaning and wiping cleaning on the substrate. And plasma cleaning are performed continuously.

In the air blow cleaning step S11, it is preferable that air be blown from the air blowing portion to the substrate to blow off dust and the suction portion suck air and dust. This can prevent the blown dust from re-adhering to the substrate. In addition, if the air blowing unit is provided with a means for vibrating the air (for example, an ultrasonic wave generating unit), dust can be removed more efficiently by blowing the air vibrated from the air blowing unit onto the substrate.

In the wiping and cleaning step S12, dust adhering to the substrate is wiped off with, for example, a cloth or a cloth impregnated with a cleaning liquid. At this time, it is preferable to wipe off the dust while winding up the band-shaped cloth, since the dust captured by the cloth does not adhere to the substrate again. Further, it is preferable that the front and back surfaces of the substrate are wiped and cleaned using individual cloths, since dust and dirt on the back surface of the substrate do not adhere to the surface of the substrate, and vice versa.

In the plasma cleaning step S13, plasma cleaning performed at atmospheric pressure is preferable in order to perform plasma processing while transporting the substrate. As a plasma cleaning process performed under atmospheric pressure, for example, there is a method of generating plasma by applying a voltage in a gas passage tube under atmospheric pressure. According to this method, only plasma is supplied to the substrate without applying a charging voltage to the substrate by passing air or gas through the passage tube to remove dirt (for example, organic film, oxide film, etc.) attached to the substrate. can do.

In the above-described air blow cleaning step S11, relatively large dust (for example, dust) is removed.
In the wiping and cleaning step S12, an air blow cleaning step S1 is performed.
Dust smaller than the dust removed in step 1 (for example, fine dust such as glass dust) is removed. If the cleaning process is performed in the order of the wiping cleaning process S12 and the air blow cleaning process S11, at the stage of the wiping cleaning process S12, since relatively large dust such as dust is not removed yet,
During wiping and cleaning, large dust may scratch the substrate. Therefore, the cleaning process is performed in the order of the air blow cleaning process S11 and the wiping cleaning process S12.

In the plasma cleaning step S13, since the dirt such as the organic film and the oxide film is removed by the decomposition of carbon and oxygen by the plasma, the air blow cleaning step S13 is performed.
11 and after removing dust in the wiping and cleaning step S12,
A plasma cleaning step S13 is provided.

In the adhesive applying step S2, an adhesive (for example, ACF (Anisotropic Conductive Film), A
CP (Anisotropic Conductive Paste), NCF (Non Con
Inductive Film), NCP (Non Conductive Paste) or the like is transferred or applied.

The chip bonding step S3 includes aligning the chip and the substrate using a recognition means, and mounting the chip on the substrate with low heating and low pressure, and temporarily bonding the chip and the substrate with high heating and high pressure. The main pressure bonding step S32 of curing the adhesive between the chips and fixing the chip and the substrate.

The term "chip" in the present invention means, for example, a film chip, a film tape carrier package, an IC chip, a semiconductor chip, an optical element, a surface mount component, a chip, a wafer, etc. All forms on the side to be joined are shown.

The term "substrate" in the present invention means, for example, all forms on the side to be bonded to a chip, irrespective of the type and size, such as a resin substrate, a glass substrate, a film substrate, a chip, and a wafer.

Further, the term “joining” in the present invention means a broad concept such as mounting for mounting a chip on a substrate, bonding having a heating / pressing process, and the like.

Hereinafter, a substrate cleaning apparatus used in the substrate cleaning step which is a main part of the present invention will be described. FIG. 2 is an overall perspective view showing a schematic configuration of a substrate cleaning apparatus according to an embodiment in which each cleaning unit is integrated.

As shown in FIG. 2, the substrate carrying means 7
Arm 2 that can be controlled in parallel in the direction, lifting table 3 that can be controlled in elevation, rotation table 4 that can be controlled in rotation, and translation table 5 that can be controlled in parallel in the Y direction “Movable table 6”) and the substrate holder 1.

The substrate holding section 1 is fixed to the tip of the arm 2 and has a suction hole on the substrate holding surface side. The suction holes are connected to a vacuum pump via pressure-resistant hoses (both are not shown), and are arranged in such a manner that the substrate 8 can be sucked and removed by vacuum suction.

In the substrate supply units 9a and 9b, a plurality of substrates 8 are set inside each of the substrate supply units 9a and 9b.
After the movable table 6 is moved such that the arm comes to the front position of the substrate supply unit 9a, the arm 2 is moved to the substrate supply unit 9a.
It is configured to extend in the direction a.

The substrate holding unit 1 includes a substrate supply unit 9a,
After reaching the lower surface of the substrate 8 set inside 9b, the arm 2 stops, the substrate 8 is sucked and held by the substrate holding unit 1 having the suction hole, and the arm 2 moves in the contracting direction in that state. Then, the substrate 8 is taken out from the substrate supply unit 9a.

An air blow cleaning means 13, a wiping cleaning means 22, and a plasma cleaning means 25 are arranged adjacent to each other along the transport path of the substrate 8 in that order. The substrate 8 taken out of the substrate supply unit 9a is held by the substrate transport unit 7 in the direction of the air blow cleaning unit 13 while being suction-held so that each cleaning process is performed in the order of the cleaning units 13, 22, and 25. Be moved. In the case of the parallel movement, the chip mounting position portion of the substrate 8 (reference numeral 28a in FIG. 6)
(See Reference)), so that each cleaning process is appropriately performed.

The ultrasonic air blowing surface of the ultrasonic air blowing unit 10 in the air blowing cleaning means 13, the space between the pressing guides 18 and 19 in the wiping cleaning means 22, and the plasma blowing surface of the plasma cleaning unit 23 in the plasma cleaning means 25. Are provided at the same height position, so that when the substrate 8 held by the substrate transfer means 7 passes through the cleaning means 13, 22, 25 while moving in parallel, the substrate is kept at the same height position. It can be passed in a state. Therefore, when the size of the substrate 8 is so large as to extend over the adjacent cleaning means, the cleaning by the cleaning means 13, 22, 25 can be performed simultaneously.

FIG. 3 shows the structure of the air blow cleaning means 13. The air blow cleaning means 13 is provided in a form in which the ultrasonic air blow unit 10 is fixed by the support member 12. The inside of the ultrasonic air blow unit 10 is divided into an ultrasonic air outlet 33 and a dust suction port 34, and the tip of the pressure-resistant hose 11a is connected to the ultrasonic air outlet 3
3. The other end of the hose 11a is connected to a blowing air pump. The end of the pressure-resistant hose 11b is connected to a dust suction port 34, and the other end of the hose 11b is connected to a suction air pump.

When the substrate 8 held by the substrate transfer means 7 moves in parallel and reaches the ultrasonic air blow section 10, air blowing by the pressure-resistant hose 11a and air vibration
The air is vibrated by 9 (for example, an ultrasonic wave generating unit or the like), and the vibration wave air (for example, ultrasonic air or the like) is blown out from the vibrated air outlet 33 and the air is sucked by the pressure-resistant hose 11b.

The substrate 8 passes through the lower surface of the ultrasonic air blow unit 10 while continuing to move in parallel at a constant speed, and thus adheres to the chip mounting position of the substrate 8 by blowing ultrasonic air 31 from the outlet 33. The dust powder 30 is peeled off, and the peeled dust powder 30 is sucked by the suction port 34 together with the air 32. Therefore, the dust powder 30 is removed without scattering to the surroundings, and the substrate 8 continues to move parallel to the wiping / cleaning means 22.

FIG. 4 shows the structure of the wiping / cleaning means 22. For example, a wiping tape 21 such as a nonwoven fabric tape of a strip
Is held by the supply roller 14. This tape 21
Pressing guide 18 capable of raising and lowering control, roller 17 capable of controlling parallel movement, pressing guide 19 capable of controlling lifting and lowering, tape 21
Is set in the order of the controllable driving roller 16 for feeding the tape and the winding roller 15 for winding the tape 21.

The holes provided in the holding guides 18 and 19 are connected to cleaning solution supply hoses 20, respectively.
The supply of the cleaning liquid is controlled by a predetermined amount by a cleaning liquid device (not shown) connected to each of the other ends. At this time, the supply of the cleaning liquid is not always supplied. For example, supply / supply stop control of the cleaning liquid is performed based on, for example, one substrate or the passage time of the substrate. The cleaning liquid supplied by the hose 20 penetrates the tape 21 through the holes of the holding guides 18 and 19.

After the cleaning by the air blow cleaning means 13 is completed, when the substrate 8 reaches the wiping and cleaning means 22, the pressing guides 18 and 19 allow the thickness of the substrate 8 to pass therethrough.
The guide 18 which was in the state where the gap was open (the state where the guide 18 was raised and the guide 19 was lowered) was lowered, and the guide 19 was raised to mount the chip of the substrate 8 (reference numeral 28a in FIG. 6). Etc.), etc.). At this time, the roller 17 is adjusted and fixed at a position where the edge of the substrate 8 does not contact.

The substrate 8 held by the substrate transfer means 7 continues to be translated at a constant speed while being lightly sandwiched by the guides 18 and 19. That is, the wiping tape 21 is sandwiched between the front surface of the guide 18 and the back surface of the substrate 8 and between the back surface of the guide 19 and the back surface of the substrate 8. The peripheral portion of the sandwiched tape 21 is supplied with the cleaning liquid. Since the supply of the cleaning liquid is controlled by the hose 20 for each predetermined amount, the substrate 8 continues to move in a parallel state while a certain amount of the cleaning liquid permeates. Therefore, the dust 21 (for example, fine dust such as glass dust) which cannot be completely cleaned by the air blow cleaning means 13 is wiped off by the tape 21 impregnated with the cleaning liquid.

When the substrate 8 has passed between the guides 18 and 19, the dust wiping operation is completed. As a preparation for wiping the next substrate, the guide 18 rises so that the thickness of the next substrate can pass, and at the same time the guide 19 descends,
By controlling the drive of the drive roller 16, the tape 21 is
The dirty part is taken up by the take-up roller 15 side by the wiping operation described in (1). At this time, the feeding amount of the tape 21 is such that the dirty portion of the tape 21 does not contact the next substrate. The substrate 8 having been subjected to the cleaning operation by the wiping and cleaning means 22 is removed by the substrate transporting means 7 to the plasma cleaning means 25.
Continue translation in the direction.

FIG. 5 shows the structure of the plasma cleaning means 25. The plasma cleaning means 25 is
The plasma cleaning unit 23, which is a gas passage tube, is provided in a fixed form. Further, the nozzle 47 is provided on the lower surface of the plasma cleaning unit 23, and is provided with the plasma outlet 38.
Are the parts of the substrate 8 on which the chips are mounted (reference numeral 28 in FIG. 6).
The position is adjusted and fixed at a position where plasma is emitted to a portion where contamination such as an organic film is to be cleaned, such as a.

When the substrate 8 held by the substrate transfer means 7 moves in parallel and approaches the plasma cleaning section 23, gas or air is supplied from the gas supply hose 48 to the plasma cleaning section 23.
Supplied to The high frequency power supply 49 and the ground 50 provided in the plasma cleaning unit 23
A plasma is generated in the inside. The generated plasma is emitted from the plasma outlet 38 of the nozzle 47 toward the substrate. Since the substrate 8 is moving in parallel at a constant speed, dirt 36 such as an organic film and an oxide film is sequentially removed. At this time, since the high frequency power supply 49 and the ground 50 are provided in the plasma cleaning unit 23, only the plasma is discharged to the substrate, and the charge voltage is not applied to the substrate.

If the dirt adhering to the substrate is an organic film, the dirt is removed (carbon is decomposed) by supplying a gas such as nitrogen, helium, argon or oxygen from the gas supply hose 48, and the dirt is removed. Is an oxide film, dirt is removed (oxygen is decomposed) by supplying a gas such as nitrogen, helium, argon, or hydrogen from the gas supply hose 48. The gas to be supplied at this time may be arbitrarily selected depending on the conditions of the substrate, may be selected from both, or may be a gas other than those described above for removing dirt attached to the substrate.

When the substrate 8 has passed through the plasma cleaning section, the plasma cleaning operation is completed, and the emission of the plasma 37 stops. The substrate 8 after the cleaning operation by the plasma cleaning unit 25 has been completed is continuously moved in the direction of the movable table 26 by the substrate transfer unit 7.

When the substrate 8 held by the substrate transfer means 7 completes the parallel movement to the end of the parallel moving table 5 (before the movable table 26), the rotary table 4 controls the movable table 26 to rotate 90 degrees, and then moves up and down. By controlling the table 3, the substrate 8 held by the substrate holding unit 1 is moved to the movable table 2.
6

At this time, as shown in FIG. 6, if only a single side of the chip mounting position 28a on the substrate 8 is a single side, the cleaning process in the substrate cleaning device 27 is completed. Unit 9a
(After returning), the arm 2 extends toward the substrate supply unit 9a to take out the next substrate, and the same cleaning operation is repeated. The cleaning-completed substrate remaining on the movable table 26 is attached to the substrate by an adhesive (for example, ACF (Anisotropic Conductive) by a transfer arm (not shown).
Film), ACP (Anisotropic Conductive Paste), NC
F (Non Conductive Film), NCP (Non Conductive Pa)
ste) etc. are transferred to a work line after the adhesive adhering step of transferring or applying.

When the chip mounting position on the substrate 8 has a plurality of sides as shown in FIG. 7, the chip must be mounted on all sides of the substrate such as 28b, 28c and 28d, for example, in addition to the chip mounting position 28a. At this time, since the same cleaning process must be performed on a portion where the cleaning process has not been performed, the movable table 26 on which the substrate 8 is mounted rotates. For example, as shown in FIG. 7, when cleaning processing is required on all sides of the substrate, the substrate is rotated 90 degrees to change the direction of the substrate.
Thereafter, the substrate is held by the substrate holding unit 1 of the substrate transfer means 7 again.

After the substrate 8 held by the substrate transfer means 7 is moved by the movable table 6 to the air blow cleaning means 13 (after returning), the air blow cleaning means 13, the wiping cleaning means 22, Then, a cleaning process is performed by the plasma cleaning unit 25 and the movable table 26
The substrate on which the cleaning process has been completed is mounted. Then, after changing the direction of the substrate by the rotation control of the movable table 26, again
The substrate is held by the substrate transfer means 7 and moved to the air blow cleaning means 13 to perform the same cleaning processing.

That is, after the cleaning process is repeated for a plurality of sides of the substrate 8 that require the cleaning process, the cleaning process is completed. The cleaning-completed substrate mounted on the movable table 26 is attached to the substrate by a transfer arm (not shown) with an adhesive (for example, ACF (Anisotropic Conductive)).
Film), ACP (Anisotropic Conductive Paste), NC
F (Non Conductive Film), NCP (Non Conductive Pa)
ste) etc. are transferred to a work line after the adhesive adhering step of transferring or applying.

As described above, after the adhesive such as ACF or ACP is attached or applied to the substrate, the chip and the substrate are aligned, and then the temporary compression and the final compression are performed.

The substrate transfer means 7 holding the substrate 8
Passes through the air blow cleaning means 13, the wiping cleaning means 22, and the plasma cleaning means 25 at a constant speed, and the moving speed at this time is arbitrarily selected depending on the substrate conditions and the like. A preferred mode is one in which the substrate is moved at a speed of / sec.

The present invention is not limited to the above embodiment, but can be modified as follows. (1) The substrate cleaning step in the chip mounting method according to the present invention includes the air blow cleaning step S as in the above-described embodiment.
11, wiping cleaning step S12, plasma cleaning step S1
3 is not limited to the order, and the following substrate cleaning process may be used.

For example, as a substrate cleaning process before the adhesive application process, an air blow cleaning process S11 for performing air blow cleaning on a substrate and a plasma cleaning process S13 for performing plasma cleaning on the substrate are arranged in this order. Then, the substrate may be conveyed and moved between the air blow cleaning step S11 and the plasma cleaning step S13, so that the air blow cleaning and the plasma cleaning may be continuously performed on the substrate.

Alternatively, as a substrate cleaning step before the adhesive adhering step, a wiping cleaning step S12 for wiping and cleaning the substrate and a plasma cleaning step S13 for performing plasma cleaning on the substrate are arranged in this order. By carrying and moving the substrate over the wiping cleaning step S12 and the plasma cleaning step S13, the wiping cleaning and the plasma cleaning may be continuously performed on the substrate.

(2) Similarly, the substrate cleaning apparatus according to the present invention comprises an air blow cleaning unit 13, a wiping cleaning unit 22, and a plasma cleaning unit 25, as in the above-described embodiment.
The present invention is not limited to the one provided with the above, and may be the following substrate cleaning apparatus.

For example, the air blow cleaning means 13 for performing air blow cleaning on the substrate before the adhesive is attached, the plasma cleaning means 25 for performing plasma cleaning on the air blow cleaned substrate, and the air blow cleaning means 13 The substrate cleaning apparatus may include a substrate cleaning unit 7 that transports and moves the substrate over the plasma cleaning unit 25.

Alternatively, wiping and cleaning means 22 for wiping and cleaning the substrate before the adhesive is applied, plasma cleaning means 25 for performing plasma cleaning on the wiped and cleaned substrate, wiping and cleaning means 22 and plasma cleaning means 25
And a substrate transporting means 7 for transporting and moving the substrate.

(3) The substrate holding portion 1 of the substrate transfer means 7 is not limited to the suction holding means by the suction hole, but also the electrostatic holding means by static electricity, the magnetic holding means by magnet or magnetism,
Any type of holding means such as mechanical means for gripping or holding the chip by a plurality of or a single movable claw may be provided.

(4) In the case of a substrate on which a chip is mounted at a position such as the center of the substrate, the shape of the substrate holding portion 1 is modified into, for example, a U-shaped substrate holding portion 39 as shown in FIGS. For example, the central part of the substrate may be cleaned, or another form may be used. As shown in FIGS. 8 to 14, the substrate holding means also includes suction holding means (see FIG. 8) using suction holes 40 and the like, electrostatic holding means using static electricity and the like, and magnetic holding means using a magnet (magnetism) 41 and the like (see FIG. 9). ), Mechanical means for sandwiching the substrate 8 between the plurality of movable claws 42 (FIG. 1)
0), mechanical means for pressing the substrate 8 with a single movable claw 42 (see FIG. 11), mechanical means for using a claw or a clip 43 (see FIG. 12), adhesion using a peelable adhesive tape or an adhesive 44 or the like. The holding means (see FIG. 13) and mechanical means (see FIG. 14) sandwiched by a plurality of U-shaped substrate holding portions 39 may be provided in any form.

(5) Air blow cleaning means 13
As shown in FIG. 15, the ultrasonic air blow unit 1 for the front surface and the back surface so that both the front and back surfaces of the substrate 8 can be cleaned.
0 may be provided.

(6) As shown in FIG. 16, the plasma cleaning means 25 may have a form in which each of the front and back plasma cleaning sections 23 is provided so that both the front and back surfaces of the substrate 8 can be cleaned. .

(7) The wiping and cleaning means 22 includes the guide 1
In addition to the configuration provided in a single body for wiping the front and back surfaces of the substrate by 8 and 19, as shown in FIG.
You may comprise in forms other than one-piece type. This configuration is preferable because dust and dirt adhering to the back surface of the substrate do not adhere to the surface of the substrate, and the opposite phenomenon does not occur.
Further, during the wiping, the tape 21 may be passed through the substrate in a fixed state. However, it is preferable that the tape 21 is driven in a direction opposite to the direction in which the substrate advances, and the tape 21 is always wiped with a clean portion of the tape.

(8) The wiping tape 21 used for the wiping / cleaning means 22 is preferably in a form in which a strip-shaped nonwoven fabric is impregnated with a cleaning liquid, but may be in a form in which the cleaning liquid is not impregnated. A tape other than a nonwoven fabric may be used as long as the tape is possible.

(9) The unit of the wiping and cleaning means 22 is fixed to the substrate cleaning device 27, but the whole unit is arranged in any operation form such as parallel movement control, rotation control, and elevation control. Is also good. The substrate holding unit 1 is not limited to a form fixed to the arm 2, but may be provided in a form in which rotation can be controlled by a rotary table 46 or the like as shown in FIG. It may be provided. The form of the air blow cleaning means 13 is not limited to the form in which the ultrasonic air blow section 10 is fixed to the support member 12, but may be any of such as parallel movement control, rotation control, and elevation control of the entire air blow cleaning means 13. It may be arranged in such an operation mode. The form of the plasma cleaning means 25 is the same as that of the ultrasonic cleaning means 13.

(10) An ultrasonic air blowout port 33 is provided at the center of the ultrasonic air blow section 10 and a dust suction port 34 is provided on both sides. On the contrary, ultrasonic air is blown from both sides. Any form, such as a form in which dust is sucked from the central portion, may be used as long as the dust powder 30 can be cleaned without scattering around.

(11) The adhesive for mounting the chip on the substrate is an anisotropic conductive film such as ACF or ACP.
Not only a conductive film having conductivity in the thickness direction of the film and an insulating property in the plane direction), but also a normal conductive film (isotropic conductive film), an insulating adhesive, etc. Not limited.
In the case of an insulating adhesive, there is a case where a process of mechanically connecting the chip and the substrate is required when the chip is mounted on the substrate. In addition to transferring or applying the adhesive to the substrate, there is no particular limitation on the method of attaching the adhesive to the substrate, such as by dropping the adhesive on the substrate.

(12) Although the chip was bonded to the substrate by the temporary compression and the final compression, the chip may be bonded to the substrate only by the final compression without performing the temporary compression, and if the chip can be bonded to the substrate. It is not limited to crimping.

[0101]

As described above in detail, according to the chip mounting method according to the first aspect of the present invention, the air blow cleaning and the plasma cleaning are sequentially performed on the substrate before the adhesive is attached to the substrate. And removes dirt such as dust, dust, organic film and oxide film attached to the substrate.
The chip can be mounted on the substrate with high quality. In other words, it is possible to eliminate problems such as poor adhesion and poor electrical connection between the chip and the substrate due to dirt attached to the substrate, misalignment between the chip and the substrate, and scratches on the chip and the substrate. it can. In addition, since the substrate is conveyed and moved between the air blow cleaning step and the plasma cleaning step, the air blow cleaning and the plasma cleaning are continuously performed on the substrate, so that the substrate can be efficiently cleaned. it can.

According to the chip mounting method according to the second aspect of the present invention, the dirt on the substrate is removed by performing wiping cleaning and plasma cleaning on the substrate in this order before the adhesive is attached to the substrate. As in the first aspect, the chip can be mounted on the substrate with high quality. In addition, dirt on the substrate can be efficiently removed.

According to the chip mounting method according to the third aspect of the present invention, before the adhesive is attached to the substrate, the substrate is subjected to air blow cleaning, wiping cleaning, and plasma cleaning in that order to remove dirt from the substrate. Claims 1 and 2
The chip can be mounted on the substrate with higher quality than in the case of (1). In addition, dirt on the substrate can be efficiently removed.

According to the chip mounting method of the present invention, the cleaning steps are arranged adjacent to each other along the transport path of the substrate, and the cleaning process is performed on the substrate passing through the transport path at a constant speed. Since the steps are sequentially performed, the substrate can be efficiently cleaned.

According to the chip mounting method according to the fifth aspect of the present invention, dust or dirt attached to the substrate is removed by blowing out vibrated air, and the dust or dirt is removed by sucking air. Since dirt and the like are sucked and discharged together with the air, dust and dirt can be removed without scattering to other parts.

According to the chip mounting method of the sixth aspect of the present invention, the non-woven fabric is applied to the substrate while winding the band-shaped non-woven fabric impregnated with the cleaning liquid, so that the dust adhering to the substrate is removed. Dust and dirt can be efficiently wiped and removed. Further, dust and the like captured by the nonwoven fabric do not adhere to the substrate again.

According to the chip mounting method of the present invention, since the nonwoven fabric acts on both the front and back surfaces of the substrate, the front and back surfaces of the substrate can be efficiently cleaned.

According to the eighth aspect of the present invention, since the individual nonwoven fabrics act on the front and back surfaces of the substrate, dust and dirt on the back surface of the substrate adhere to the surface of the substrate and vice versa. The substrate can be satisfactorily cleaned by suppressing the above.

According to the ninth aspect of the present invention, since the nonwoven fabric is applied to the substrate and washed while the nonwoven fabric is being wound in the direction opposite to the direction of travel of the substrate, the substrate can be cleaned well. it can.

According to the chip mounting method according to the tenth aspect of the present invention, since plasma is generated under the atmospheric pressure, cleaning is performed by generating plasma in a vacuum.
Plasma cleaning can be easily performed.

According to the chip mounting method of the eleventh aspect, since a plasma is generated by applying a voltage to the gas passage tube under the atmospheric pressure, it is not necessary to apply a charge voltage to the substrate. As a result, destruction of the substrate due to the charge voltage (for example, peeling or destruction of a circuit pattern or the like on the substrate) can be prevented.

According to the chip mounting method of the twelfth aspect, a chip can be mounted on a glass substrate with high quality.

According to the chip mounting method of the thirteenth aspect, since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate can be effectively and efficiently cleaned. .

According to the substrate cleaning apparatus of the fourteenth aspect, the substrate is transported and cleaned between the air blow cleaning means and the plasma cleaning means, so that the substrate cleaning process can be efficiently performed without manual operation. It can be carried out.

According to the apparatus for cleaning a substrate according to the fifteenth aspect of the present invention, the substrate is transported and cleaned between the wiping cleaning means and the plasma cleaning means, so that the substrate cleaning process can be efficiently performed without manual operation. be able to.

According to the substrate cleaning apparatus of the sixteenth aspect of the present invention, the substrate is transported and cleaned across the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means. Processing can be performed efficiently.

According to the seventeenth aspect of the present invention, the front and back surfaces of the substrate are individually cleaned using two wiping and cleaning means for wiping the surface of the substrate and for wiping the rear surface of the substrate. Dust powder and dirt on the back surface of the substrate are prevented from adhering to the substrate surface, and the opposite phenomenon is suppressed, and the substrate can be cleaned well.

According to the eighteenth aspect of the present invention, the nonwoven fabric is applied to the substrate while the nonwoven fabric is being wound in the direction opposite to the traveling direction of the substrate. be able to.

According to the nineteenth aspect of the present invention, since the respective cleaning means are arranged adjacent to each other along the transport path, the substrate can be efficiently cleaned by a compact apparatus.

According to the twentieth aspect of the present invention, since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate can be effectively and efficiently cleaned.

[Brief description of the drawings]

FIG. 1 is a process chart of a chip mounting method according to an embodiment.

FIG. 2 is an overall perspective view showing a schematic configuration of a substrate cleaning apparatus according to an embodiment.

FIG. 3 is a perspective view illustrating a configuration of an air blow cleaning unit according to the present embodiment.

FIG. 4 is a perspective view illustrating a configuration of a wiping and cleaning unit according to the present embodiment.

FIG. 5 is a perspective view illustrating a configuration of a plasma cleaning unit according to the present embodiment.

FIG. 6 is a diagram illustrating a holding state of a substrate when a chip mounting position is a single side;

FIG. 7 is a diagram illustrating a holding state of a substrate when a chip mounting position is on a plurality of sides.

FIG. 8 is a diagram illustrating a configuration of a substrate holding unit according to a modification.

FIG. 9 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 10 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 11 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 12 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 13 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 14 is a diagram illustrating a configuration of a substrate holding unit according to another modification.

FIG. 15 is a diagram showing a configuration of an air blow cleaning unit according to a modification.

FIG. 16 is a diagram showing a configuration of a plasma cleaning unit according to a modification.

FIG. 17 is a diagram showing a configuration of a wiping / cleaning unit according to a modification.

FIG. 18 is a diagram illustrating a configuration of a substrate holding unit when configured to be capable of rotation control.

[Explanation of symbols]

 7 substrate transfer means 8 substrate 13 air blow cleaning means 21 wiping tape 22 wiping cleaning means 25 plasma cleaning means 26 movable table 27 substrate cleaning device

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] October 31, 2001 (2001.10.
31)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Deleted

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0018

[Correction method] Change

[Correction contents]

[0018] The invention according to claim 11 is the invention according to claim 1
11. The chip mounting method according to claim 10 , wherein the substrate is a glass substrate.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

According to a twelfth aspect of the present invention, in the chip mounting method of the fourth aspect, a passing speed of the substrate passing through the transport path is 10 to 100 mm / sec.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction contents]

According to a thirteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the first aspect, wherein air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is attached. And plasma cleaning means for performing plasma cleaning on the substrate subjected to the air blow cleaning, and substrate transport means for transporting and moving the substrate across the air blow cleaning means and the plasma cleaning means.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction contents]

According to a fourteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the second aspect, wherein a wiping and cleaning means for wiping and cleaning the substrate before the adhesive is attached thereto; Plasma cleaning means for performing plasma cleaning on the wiped and cleaned substrate, and substrate transport means for transporting and moving the substrate across the wiping and cleaning means are provided.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0022

[Correction method] Change

[Correction contents]

According to a fifteenth aspect of the present invention, there is provided a substrate cleaning apparatus used in the chip mounting method according to the third aspect, wherein air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is attached. And wiping and cleaning means for wiping and cleaning the air-blown substrate; plasma cleaning means for performing plasma cleaning on the wiping-cleaned substrate; and transporting the substrate between the air-blowing cleaning means, the wiping and cleaning means, and the plasma cleaning means. And a substrate transfer means for moving.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0023

[Correction method] Change

[Correction contents]

The invention described in claim 16 is the same as in claim 14
Alternatively, in the substrate cleaning apparatus according to the fifteenth aspect , the wiping and cleaning means is provided separately for wiping and cleaning the substrate surface and for wiping and cleaning the rear surface of the substrate.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0024

[Correction method] Change

[Correction contents]

[0024] The invention according to claim 17 or claim 14
17. The substrate cleaning apparatus according to claim 16 , wherein the wiping and cleaning means cleans the substrate by applying the nonwoven fabric to the substrate while winding the nonwoven fabric in a direction opposite to a traveling direction of the substrate.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0025

[Correction method] Change

[Correction contents]

The invention according to claim 18 is the invention according to claim 13.
18. The substrate cleaning apparatus according to claim 17 , wherein the substrate transport means transports the substrate at a constant speed, and each of the cleaning means is arranged adjacently along a transport path of the substrate.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction contents]

According to a nineteenth aspect of the present invention, in the substrate cleaning apparatus according to the eighteenth aspect , the substrate transporting means may include:
The substrate is transported at a speed of 0 to 100 mm / sec.

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction contents]

According to the tenth aspect of the present invention, since plasma is generated under the atmospheric pressure, it is easier to perform plasma cleaning while transporting the substrate than in the case where plasma is generated in a vacuum. Further, preferably, plasma washing
During the cleaning process, a voltage is applied to the gas
The substrate is configured to be cleaned by generating
You. With this configuration, the gas passage pipe can be
Since voltage is applied inside to generate plasma, the substrate
Only plasma to substrate without applying charge voltage
The cleaning of the substrate is effected.

[Procedure amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0037

[Correction method] Deleted

[Procedure amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0038

[Correction method] Change

[Correction contents]

According to the eleventh aspect of the present invention, the glass substrate is effectively cleaned before the adhesive is applied, and the chip is mounted on the glass substrate with high quality.

[Procedure amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction contents]

According to the twelfth aspect of the present invention, the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec. Therefore, the substrate is effectively and efficiently cleaned.

[Procedure amendment 16]

[Document name to be amended] Statement

[Correction target item name] 0040

[Correction method] Change

[Correction contents]

According to the thirteenth aspect of the present invention, the substrate cleaning apparatus provided with the air blow cleaning means and the plasma cleaning means performs the air blow cleaning and the plasma cleaning on the substrate before the adhesive is applied in this order. Done.

[Procedure amendment 17]

[Document name to be amended] Statement

[Correction target item name] 0041

[Correction method] Change

[Correction contents]

According to the fourteenth aspect of the present invention, the substrate cleaning apparatus provided with the wiping cleaning means and the plasma cleaning means performs the wiping cleaning and the plasma cleaning on the substrate before the adhesive is applied in that order. .

[Procedure amendment 18]

[Document name to be amended] Statement

[Correction target item name] 0042

[Correction method] Change

[Correction contents]

According to the fifteenth aspect of the present invention, the substrate cleaning apparatus provided with the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means performs air blow cleaning and wiping cleaning on the substrate before the adhesive is applied. And plasma cleaning are performed in that order.

[Procedure amendment 19]

[Document name to be amended] Statement

[Correction target item name] 0043

[Correction method] Change

[Correction contents]

According to the sixteenth aspect of the present invention, the front and rear surfaces of the substrate are individually cleaned using two wiping and cleaning means for wiping and cleaning the surface of the substrate and for wiping and cleaning the rear surface of the substrate.

[Procedure amendment 20]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction contents]

According to the seventeenth aspect of the present invention, the non-woven fabric is applied to the substrate while the non-woven fabric is being wound in the direction opposite to the traveling direction of the substrate, and the substrate is washed.

[Procedure amendment 21]

[Document name to be amended] Statement

[Correction target item name] 0045

[Correction method] Change

[Correction contents]

According to the eighteenth aspect of the present invention, each of the cleaning means arranged adjacently along the transport path sequentially performs each of the cleaning processes on the substrate being transported at a constant speed by the substrate transport means. .

[Procedure amendment 22]

[Document name to be amended] Statement

[Correction target item name] 0046

[Correction method] Change

[Correction contents]

According to the nineteenth aspect , since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate is effectively and efficiently cleaned.

[Procedure amendment 23]

[Document name to be amended] Statement

[Correction target item name] 0110

[Correction method] Change

[Correction contents]

According to the chip mounting method according to the tenth aspect of the present invention, since plasma is generated under the atmospheric pressure, cleaning is performed by generating plasma in a vacuum.
Plasma cleaning can be easily performed. In addition, preferred
Or, in the plasma cleaning process, at atmospheric pressure
Cleans the substrate by applying voltage to it and generating plasma
It is constituted so that. With this configuration, the atmosphere
A plasma is generated by applying a voltage to the gas passage tube under pressure.
Need to apply charge voltage to the substrate
And as a result, the substrate is destroyed by the charge voltage (eg
For example, peeling or destruction of circuit patterns on the substrate)
can do.

[Procedure amendment 24]

[Document name to be amended] Statement

[Correction target item name] 0111

[Correction method] Deleted

[Procedure amendment 25]

[Document name to be amended] Statement

[Correction target item name] 0112

[Correction method] Change

[Correction contents]

According to the chip mounting method of the eleventh aspect , a chip can be mounted on a glass substrate with high quality.

[Procedure amendment 26]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

According to the chip mounting method of the twelfth aspect of the present invention, since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate can be cleaned effectively and efficiently. .

[Procedure amendment 27]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

According to the substrate cleaning apparatus of the thirteenth aspect, since the substrate is transported and cleaned between the air blow cleaning means and the plasma cleaning means, the cleaning processing of the substrate can be efficiently performed without manual operation. It can be carried out.

[Procedure amendment 28]

[Document name to be amended] Statement

[Correction target item name] 0115

[Correction method] Change

[Correction contents]

According to the substrate cleaning apparatus of the fourteenth aspect, the substrate is transported and cleaned between the wiping cleaning means and the plasma cleaning means, so that the substrate cleaning process can be performed efficiently without manual intervention. be able to.

[Procedure amendment 29]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

According to the apparatus for cleaning a substrate according to the fifteenth aspect of the present invention, the substrate is transported and cleaned between the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means. Processing can be performed efficiently.

[Procedure amendment 30]

[Document name to be amended] Statement

[Correction target item name] 0117

[Correction method] Change

[Correction contents]

According to the substrate cleaning apparatus of the sixteenth aspect, the front and rear surfaces of the substrate are individually cleaned using two wiping cleaning means for wiping the substrate surface and wiping the substrate back surface. Dust powder and dirt on the back surface of the substrate are prevented from adhering to the substrate surface, and the opposite phenomenon is suppressed, and the substrate can be cleaned well.

[Procedure amendment 31]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

According to the seventeenth aspect of the present invention, the non-woven fabric is applied to the substrate while winding the non-woven fabric in the direction opposite to the direction in which the substrate moves, so that the substrate can be cleaned well. be able to.

[Procedure amendment 32]

[Document name to be amended] Statement

[Correction target item name] 0119

[Correction method] Change

[Correction contents]

According to the apparatus for cleaning a substrate according to the eighteenth aspect of the present invention, since the respective cleaning means are arranged adjacent to each other along the transport path, the substrate can be efficiently cleaned by a compact apparatus.

[Procedure amendment 33]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

According to the nineteenth aspect , since the cleaning process is performed while transporting the substrate at a speed of 10 to 100 mm / sec, the substrate can be effectively and efficiently cleaned.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/52 H01L 21/52 FF Term (Reference) 2H088 FA17 FA18 FA21 FA30 HA01 HA05 MA20 2H090 HC18 JB02 JC19 3B116 AA02 AB14 BA08 BB24 BB32 BB83 BC01 5F044 LL07 LL09 PP15 5F047 BA21 FA31 FA66

Claims (20)

[Claims] 1. A chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive has been attached. A substrate cleaning step is provided in which an air blow cleaning step of performing air blow cleaning on the substrate and a plasma cleaning step of performing plasma cleaning on the substrate are arranged in this order. A chip mounting method, wherein air blow cleaning and plasma cleaning are continuously performed on a substrate by transporting the substrate. 2. A chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive has been attached. A substrate cleaning process is provided in which a wiping cleaning process for wiping and cleaning the substrate and a plasma cleaning process for performing plasma cleaning on the substrate are arranged in this order, and the substrate is transported between the wiping cleaning process and the plasma cleaning process. A chip mounting method, wherein wiping cleaning and plasma cleaning are continuously performed on a substrate by moving the substrate. 3. A chip mounting method comprising: an adhesive attaching step of attaching an adhesive to a substrate; and a chip joining step of joining a chip to the substrate to which the adhesive is attached. A substrate cleaning process in which an air blow cleaning process of performing air blow cleaning on a substrate, a wiping cleaning process of performing wiping cleaning on a substrate, and a plasma cleaning process of performing plasma cleaning on a substrate are arranged in this order. By transporting and moving the substrate over the air blow cleaning process, the wiping cleaning process, and the plasma cleaning process,
A chip mounting method comprising continuously performing air blow cleaning, wiping cleaning, and plasma cleaning on a substrate. 4. The chip mounting method according to claim 1, wherein in the substrate cleaning step, each cleaning step is arranged adjacently along a substrate transport path, and the transport path is fixed. A chip mounting method for sequentially performing each cleaning process on a substrate passing at a high speed. 5. The chip mounting method according to claim 1, wherein in the air blow cleaning step, the vibrated air is blown toward the substrate, and the blown air is suctioned and discharged to remove the substrate. Chip mounting method to be cleaned. 6. The chip mounting method according to claim 2, wherein in the wiping and cleaning step, the substrate is washed by winding the band-shaped nonwoven fabric impregnated with a cleaning liquid while allowing the nonwoven fabric to act on the substrate. Chip mounting method. 7. The chip mounting method according to claim 6, wherein in the wiping and cleaning step, the nonwoven fabric is applied to both front and back surfaces of the substrate to clean the substrate. 8. The chip mounting method according to claim 7, wherein in the wiping and cleaning step, a nonwoven fabric is applied to each of the front and back surfaces of the substrate to clean the substrate. 9. The chip mounting method according to claim 6, wherein in the wiping and cleaning step, the nonwoven fabric is wound in a direction opposite to a direction in which the substrate advances. 10. The chip mounting method according to claim 1, wherein in the plasma cleaning step, plasma is generated under atmospheric pressure to clean the substrate. 11. The chip mounting method according to claim 10, wherein in the plasma cleaning step, a substrate is cleaned by applying a voltage to a gas passage tube under atmospheric pressure to generate plasma. 12. The chip mounting method according to claim 1, wherein the substrate is a glass substrate. 13. The chip mounting method according to claim 4, wherein a passing speed of the substrate passing through the transport path is 10 to 10.
A chip mounting method of 0 mm / sec. 14. A substrate cleaning apparatus used in the chip mounting method according to claim 1, wherein air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is applied, and wherein the air blow cleaning is performed. A substrate cleaning apparatus comprising: a plasma cleaning unit that performs plasma cleaning on a substrate; and a substrate transport unit that transports and moves the substrate across the air blow cleaning unit and the plasma cleaning unit. 15. A substrate cleaning apparatus used in the chip mounting method according to claim 2, wherein a wiping cleaning means for wiping and cleaning the substrate before the adhesive is applied, and a plasma cleaning method for the wiping and cleaning substrate. A substrate cleaning apparatus comprising: plasma cleaning means for performing cleaning; and substrate transport means for transporting and moving a substrate across the wiping cleaning means and the plasma cleaning means. 16. A substrate cleaning apparatus used in the chip mounting method according to claim 3, wherein: an air blow cleaning means for performing air blow cleaning on the substrate before the adhesive is attached; A wiping cleaning means for wiping and cleaning the substrate; a plasma cleaning means for performing plasma cleaning on the wiping-cleaned substrate; and a substrate transport means for transporting the substrate across the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means. A substrate cleaning apparatus, comprising: 17. The substrate cleaning apparatus according to claim 15, wherein the wiping and cleaning unit is provided with two units, one for wiping and cleaning the surface of the substrate and the other for wiping and cleaning the rear surface of the substrate. apparatus. 18. The substrate cleaning apparatus according to claim 15, wherein the wiping and cleaning unit applies the nonwoven fabric to the substrate while winding the nonwoven fabric in a direction opposite to a direction in which the substrate travels. A substrate cleaning device that cleans a substrate. 19. The substrate cleaning apparatus according to claim 14, wherein said substrate transport means transports the substrate at a constant speed, and said cleaning means travels along a substrate transport path. And a substrate cleaning device disposed adjacent to the substrate cleaning device. 20. The substrate cleaning apparatus according to claim 19, wherein the substrate transport unit transports the substrate at a speed of 10 to 100 mm / sec.