CN105665376A - Dry type fingerprint cleaning device - Google Patents
Dry type fingerprint cleaning device Download PDFInfo
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- CN105665376A CN105665376A CN201410654447.0A CN201410654447A CN105665376A CN 105665376 A CN105665376 A CN 105665376A CN 201410654447 A CN201410654447 A CN 201410654447A CN 105665376 A CN105665376 A CN 105665376A
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- cleaning
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- towel
- cleaned
- cleanout fluid
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Abstract
The invention relates to a dry type fingerprint cleaning device. According to the dry type fingerprint cleaning device, fingerprints and other pollutants formed on the surface of a cleaned substrate are removed through a dry type cleaning method by means of physical cleaning of ultrasonic waves and cleaning towels and plasma cleaning. The dry type fingerprint cleaning device comprises a substrate carrying part, an ultrasonic cleaning part, a cleaning liquid cleaning part and a plasma cleaning part, wherein the substrate carrying part is used for moving the cleaned substrate in the direction of one side; the ultrasonic cleaning part is arranged at the upper side of an inlet of the substrate cleaning part and used for cleaning the upper surface of the cleaned substrate carried by the substrate carrying part with ultrasonic waves; the cleaning liquid cleaning part is adjacent to the ultrasonic cleaning part and used for rubbing and cleaning the upper surface of the cleaned substrate with a cleaning towel dipped with cleaning liquid; the plasma cleaning part is adjacent to the cleaning liquid cleaning part and used for cleaning the upper surface of the cleaned substrate by spraying plasma to the upper surface of the cleaned substrate.
Description
Technical field
The present invention relates to a kind of dry type fingerprint rinser, more specifically, relate to a kind of following dry type fingerprint rinser: by utilizing ultrasound wave and cleaning the physical cleaning of towel and utilize isoionic cleaning, and use dry-type cleaning method to remove formation at pollutant such as the fingerprints being cleaned by substrate surface.
Background technology
The glass substrate used in display device and plastic base etc. have the characteristic not allowing any pollution to its surface. But, likely there are various pollutions at substrate surface in operation, it is therefore necessary to the cleaning operation thoroughly for described pollution.
In these substrate contamination sources, what be most difficult to clean is the fingerprint that produces in manual operation of operator. Form the fingerprint at substrate to be very difficult to remove, therefore utilize the chemical substances such as strong detergent to carry out wet clean operation in most cases.
But, if removing fingerprint with this wet-cleaned method, then exist and clean and dry wait operation to become complexity and the problem of required operating time length, be additionally, since the reasons such as cleanout fluid process, it is possible to the problem causing environmental pollution.
Therefore, simple and rapid process the dry clean technology of fingerprint on substrate can be formed in the urgent need to exploitation.
Summary of the invention
The problem that invention to solve
The technical problem to be solved in the present invention is to provide a kind of dry type fingerprint rinser, described dry type fingerprint rinser, by utilizing ultrasound wave and cleaning the physical cleaning of towel and utilize isoionic cleaning, and the pollutant such as the formation fingerprint on cleaning base plate surface are removed in use by dry-type cleaning method.
The method of solution problem
Formula fingerprint rinser for solving the present invention of above-mentioned technical task includes: substrate conveying unit, makes to be cleaned by substrate and moves towards direction, side; Ultrasonic waves for cleaning portion, is arranged on the upside of the entrance of described substrate conveying unit, for the upper surface being cleaned by substrate using ultrasonic waves for cleaning to be transported by described substrate conveying unit; Cleanout fluid cleaning part, adjacent with described ultrasonic waves for cleaning portion and arrange, for use speckle with cleanout fluid clean towel rub and clean described in be cleaned by the upper surface of substrate; Plasma cleaning portion, adjacent with described cleanout fluid cleaning part and arrange, for by the described upper surface injection plasma being cleaned by substrate is carried out.
Furthermore it is preferred that the described substrate conveying unit of the present invention includes: rotate cylinder, be arranged at the both side ends of described substrate conveying unit for a pair; Conveyer, has been formed uniformly multiple adsorption hole, is used for when being wound on the pair of rotation cylinder along with crawler belt rotates, is cleaned by substrate level simultaneously and moves described in making; Vac sorb module, the downside of the described cleanout fluid cleaning part being arranged in described substrate conveying unit, for by the lower surface of conveyer described in vac sorb, the lower surface of the cleaning substrate that absorption is arranged on the upper surface of described conveyer.
Furthermore it is preferred that the described cleanout fluid cleaning part of the present invention includes: clean towel supplies roller, be arranged at the upside of described vac sorb module, clean towel for the supply when winding cleans towel; Clean towel recycling roll, adjacent with described cleaning towel supplies roller and arrange, for winding and reclaim used cleaning towel; Pressing roller, is arranged at described cleaning towel supplies roller and cleans between towel recycling roll, for by described cleaning towel being pressurizeed to the upper surface direction of described cleaning substrate, making described cleaning towel contact with described cleaning upper surface of base plate; Cleanout fluid ejection section, is arranged at the front of described pressing roller, for described cleaning towel jet cleaning liquid; Reciprocal drive division, drives described cleanout fluid cleaning part for reciprocal in the longitudinal direction.
Furthermore it is preferred that the described cleanout fluid of the present invention is isopropanol (IPA:IsoPropylAlcohol).
Furthermore it is preferred that the described pressing roller of the present invention is made up of the foaming silicon material with retractility.
Furthermore it is preferred that the described plasma cleaning portion of the present invention is normal pressure argon plasma injection apparatus.
Invention effect
Dry type fingerprint rinser according to the present invention, it is possible to use dry-type cleaning method rapidly and simple removal is formed at the fingerprint being cleaned by substrate, therefore has environmental protection and the high advantage of process efficiency.
Accompanying drawing explanation
Fig. 1 is the figure of the composition illustrating the dry type fingerprint rinser according to one embodiment of the invention.
Fig. 2 illustrates conveyer according to one embodiment of the invention and is equipped on the figure of the state being cleaned by substrate of this conveyer.
Fig. 3 is the fragmentary cross-sectional view of the conveyer according to one embodiment of the invention.
Fig. 4 is the axonometric chart of the structure illustrating the vac sorb module according to one embodiment of the invention.
Fig. 5 is the figure of the cleaning operation state illustrating pressing roller and cleaning towel according to one embodiment of the invention.
Description of reference numerals
1: be cleaned by substrate
100: dry type fingerprint rinser according to an embodiment of the invention
110: substrate conveying unit
120: ultrasonic waves for cleaning portion
130: cleanout fluid cleaning part
140: plasma cleaning portion
Detailed description of the invention
Hereinafter, with reference to accompanying drawing, specific embodiments of the invention are described in detail.
As it is shown in figure 1, the dry type fingerprint rinser 100 according to the present embodiment includes substrate conveying unit 110, ultrasonic waves for cleaning portion 120, cleanout fluid cleaning part 130 and plasma cleaning portion 140.
First, described substrate conveying unit 110 is for making the substrate 1 that is cleaned by that will be carried out technique move to direction, side with the speed of regulation. Therefore, it is cleaned by substrate 1 and is moved with the speed of regulation by described substrate conveying unit 110, simultaneously through each cleaning area. For this, as it is shown in figure 1, specifically, the described substrate conveying unit 110 of the present embodiment can include rotating cylinder 111,112, conveyer 113, vac sorb module 115.At this, as it is shown in figure 1, the both side ends in described substrate conveying unit 110 arranges rotation cylinder 111,112 described in a pair respectively, and described rotation cylinder 111,112 has and autologous can rotate the structure driven. Further, the pair of rotation cylinder 111,112 separates at predetermined intervals in whole interval and configures, this whole interval refer to described in be cleaned by the interval that substrate 1 will move in technical process.
Secondly, as it is shown in figure 1, described conveyer 113 is wound under the state on the pair of rotation cylinder 111,112 along with crawler belt rotates, it is cleaned by substrate 1 simultaneously described in making and moves horizontally. Therefore, as in figure 2 it is shown, make to be cleaned by substrate 1 and be loaded on described conveyer 113 and move horizontally in the way of the matrix arrangement of regulation.
Now, as shown in Figure 2,3, the multiple adsorption holes 114 configured at predetermined intervals it are formed with at described conveyer 113. As it is shown in figure 5, this adsorption hole 114 adsorbs to be installed on together with vac sorb module 115 described later is cleaned by substrate 1 above these, so that it is not moved. Preferably, the diameter of described adsorption hole 114 is only small, and multiple adsorption hole 114 is formed uniformly at predetermined intervals on whole of conveyer 113.
Secondly, as shown in Figure 1,5, the downside of the described cleanout fluid cleaning part 130 that described vac sorb module 115 is arranged in described substrate conveying unit 110, below conveyer 113 described in vac sorb, thus absorption is arranged on below the above cleaning substrate 1 of described conveyer 113. That is, in the present embodiment, in the period that described conveyer 113 moves horizontally with fixing speed, described vac sorb module 115 still utilizes to be formed to adsorb at the adsorption hole 114 of described conveyer and fixing is cleaned by substrate 1.
It is therefore preferred that make described conveyer 113 easily slide in the way of being absent from frictional force on described vac sorb module 115 surface. Therefore, the back side of described conveyer 113 could be formed with the coat side reducing frictional force. It addition, the back side of described conveyer 113 needs the seamless surface unoccupied place with described vac sorb module 115 to be close to, sewing of vacuum so just can be made to be minimized.
On the other hand, in the present embodiment, as shown in Figure 4, specifically, described vac sorb module 115 is overall to be the barreled of cuboid and is formed, and forms multiple vacuum absorption holes 116 above. Now, preferably, described vacuum absorption holes 116 by along with described conveyer 113 move horizontally identical direction, direction narrow and long in the way of formed, so, the deformation of described conveyer 113 can not only be prevented, additionally it is possible to also keep the absorption affinity being cleaned by substrate 1 when described conveyer 113 moves horizontally.
It addition, as shown in Figure 4, it is preferable that described vacuum absorption holes 116 configures multiple row abreast, the vacuum absorption holes being arranged in adjacent column intermeshes configuration, in such manner, it is possible to continue to keep the vacuum adsorption force to being specifically cleaned by substrate 1.
Further, as shown in Figure 4, the side of described vac sorb module 115 is provided with discharge portion 117, is used for drawing and discharge its internal gas.
Secondly, as it is shown in figure 1, described ultrasonic waves for cleaning portion 120 is arranged on the upside of the entrance of described substrate conveying unit 110, it is cleaned by above substrate 1 by what described substrate conveying unit 110 transported by ultrasonic waves for cleaning. In the present embodiment, described ultrasonic waves for cleaning portion 120 has thoroughly removes the function being present in the granule (particle) etc. being cleaned by substrate 1 surface, when cleanout fluid cleaning part 130 then performs to utilize cleaning towel to rub action, it is prevented that be cleaned by the phenomenon that the surface of substrate 1 is scratched by granule etc.
Secondly, as it is shown in figure 1, described cleanout fluid cleaning part 130 is adjacent with described ultrasonic waves for cleaning portion 120 and arrange, for use the cleaning towel 136 speckling with cleanout fluid rub described in be cleaned by the above of substrate 1 and be carried out. For this, in the present embodiment, described cleanout fluid cleaning part 130 specifically can include cleaning towel supplies roller 131, cleaning towel recycling roll 132, pressing roller 133, cleanout fluid ejection section 134 and reciprocal drive division 135.
First, as it is shown in figure 1, described cleaning towel supplies roller 131 is arranged at the upside of described vac sorb module 115, do not have used clean supply when cleaning towel 136 to clean towel at winding. Further, described cleaning towel recycling roll 132 is adjacent with described cleaning towel supplies roller 131 and arranges, and is used for winding and reclaim used cleaning towel 136. The driving of described cleaning towel supplies roller 131 and cleaning towel recycling roll 132 controls to be performed by multiple method, such as, can adopt with the following method: when by described pressing roller 133 fully employed clean towel 136 a part of time, by rotate described cleaning towel recycling roll 133 will clean towel 136 new being partially wrapped on described pressing roller 133.
Secondly, as shown in Figure 1, described pressing roller 133 is arranged on described cleaning towel supplies roller 131 and cleans between towel recycling roll 132, for described cleaning towel 136 being pressurizeed towards the upper surface direction of described cleaning substrate 1, so that described cleaning towel 136 contacts with the upper surface of described cleaning substrate 1. That is, in order to be cleaned by the surface of substrate 1 described in physical cleaning, described cleaning towel 136 is pressurizeed by described pressing roller 133 to described substrate 1 direction that is cleaned by.
Now, the contact area in order to make described cleaning towel 136 be cleaned by substrate 1 maximizes, makes to be cleaned by whole uniform stressed of the 1 of substrate, as it is shown in figure 5, described pressing roller 133 is preferably made up of the material with retractility. So, if described pressing roller 133 is made up of the material with retractility, then while pressing roller 133 described in pressure process is pressed, one part launches with the described shape being cleaned by substrate 1, thus increases contact area.
Therefore, the described pressing roller 133 of the present embodiment is preferably made up of the foaming silicon material with retractility.
Secondly, as it is shown in figure 1, described cleanout fluid ejection section 134 is arranged at the front of described pressing roller 133, for described cleaning towel 136 jet cleaning liquid. In the present embodiment, directly cleanout fluid is not ejected into the surface being cleaned by substrate 1, and is sprayed against cleaning towel 136, stick in cleanout fluid and clean towel 136 and be in the cleaning towel 136 of the state of soaking and rub and be cleaned by substrate 1 surface and be carried out. Therefore, the amount sticking in the cleanout fluid being cleaned by substrate 1 is minimized, it is possible to maintains and can perform rapidly cleaning process under dry type state.
In the present embodiment, described cleanout fluid is preferably isopropanol (IPA:IsoPropylAlcohol), described cleanout fluid ejection section 134 can have the various structures towards described cleaning towel 136 direction jet cleaning liquid, for instance can be gap nozzle structure.
Secondly, as it is shown in figure 1, described reciprocal drive division 135 back and forth drives towards the direction that the described moving direction being cleaned by substrate 1 is identical for making to include described cleaning towel supplies roller 131, clean the whole cleanout fluid cleaning part 130 of towel recycling roll 132, pressing roller 133 and cleanout fluid ejection section 134.When clean towel 136 by described pressing roller 133 with when being cleaned by driving described reciprocal drive division 135 under the state that substrate 1 contacts, operate as it is shown in figure 5, clean smooth and easy being carried out while towel 136 contacts back and forth with the described surface being cleaned by substrate 1. Specifically, described cleaning towel supplies roller 131, cleaning towel recycling roll 132, pressing roller 133 and cleanout fluid ejection section 134 are arranged at a block 137, and described block 137 can have the structure making described reciprocal drive division 135 move horizontally.
Then, as it is shown in figure 1, described plasma cleaning portion 140 is adjacent with described cleanout fluid cleaning part 130 and arrange, the described above injection plasma being cleaned by substrate 1 is carried out. The vestige etc. cleaning towel being cleaned by substrate 1 described in remaining in thoroughly is removed by described plasma cleaning portion 140. Now, plasma cleaning portion described in the present embodiment 140 is preferably made up of normal pressure argon plasma injection apparatus, and cleaning performance so can be made to be maximized.
Claims (6)
1. a dry type fingerprint rinser, comprising:
Substrate conveying unit, makes to be cleaned by substrate and moves towards direction, side;
Ultrasonic waves for cleaning portion, is arranged on the upside of the entrance of described substrate conveying unit, for the upper surface being cleaned by substrate using ultrasonic waves for cleaning to be transported by described substrate conveying unit;
Cleanout fluid cleaning part, adjacent with described ultrasonic waves for cleaning portion and arrange, for use speckle with cleanout fluid clean towel rub and clean described in be cleaned by the upper surface of substrate;
Plasma cleaning portion, adjacent with described cleanout fluid cleaning part and arrange, for by the described upper surface injection plasma being cleaned by substrate is carried out.
2. dry type fingerprint rinser according to claim 1, wherein, described substrate conveying unit includes:
Rotate cylinder, be arranged at the both side ends of described substrate conveying unit for a pair;
Conveyer, has been formed uniformly multiple adsorption hole, is used for when being wound on the pair of rotation cylinder along with crawler belt rotates, is cleaned by substrate level simultaneously and moves described in making;
Vac sorb module, the downside of the described cleanout fluid cleaning part being arranged in described substrate conveying unit, for by the lower surface of conveyer described in vac sorb, the lower surface of the cleaning substrate that absorption is arranged on the upper surface of described conveyer.
3. dry type fingerprint rinser according to claim 2, wherein, described cleanout fluid cleaning part includes:
Clean towel supplies roller, be arranged at the upside of described vac sorb module, clean towel for the supply when winding cleans towel;
Clean towel recycling roll, adjacent with described cleaning towel supplies roller and arrange, for winding and reclaim used cleaning towel;
Pressing roller, is arranged at described cleaning towel supplies roller and cleans between towel recycling roll, for by described cleaning towel being pressurizeed to the upper surface direction of described cleaning substrate, making described cleaning towel contact with described cleaning upper surface of base plate;
Cleanout fluid ejection section, is arranged at the front of described pressing roller, for described cleaning towel jet cleaning liquid;
Reciprocal drive division, drives described cleanout fluid cleaning part for reciprocal in the longitudinal direction.
4. dry type fingerprint rinser according to claim 3, it is characterised in that described cleanout fluid is isopropanol (IPA:IsoPropylAlcohol).
5. dry type fingerprint rinser according to claim 3, it is characterised in that described pressing roller is made up of the foaming silicon material with retractility.
6. dry type fingerprint rinser according to claim 1, it is characterised in that described plasma cleaning portion is normal pressure argon plasma injection apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410654447.0A CN105665376B (en) | 2014-11-17 | 2014-11-17 | Dry type fingerprint cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410654447.0A CN105665376B (en) | 2014-11-17 | 2014-11-17 | Dry type fingerprint cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105665376A true CN105665376A (en) | 2016-06-15 |
| CN105665376B CN105665376B (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410654447.0A Active CN105665376B (en) | 2014-11-17 | 2014-11-17 | Dry type fingerprint cleaning device |
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| Country | Link |
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| CN (1) | CN105665376B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109290287A (en) * | 2018-10-16 | 2019-02-01 | 深圳市华星光电半导体显示技术有限公司 | A kind of dry cleaning device and cleaning method |
| CN109759389A (en) * | 2019-03-18 | 2019-05-17 | 重庆两江联创电子有限公司 | A kind of cleaning glass method |
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| JP2002050655A (en) * | 2000-07-31 | 2002-02-15 | Toray Eng Co Ltd | Chip-packaging method and substrate-cleaning device used for the same |
| CN1601715A (en) * | 2003-09-26 | 2005-03-30 | 松下电器产业株式会社 | Assembling apparatus, assembling method and terminal cleaning apparatus |
| CN101367083A (en) * | 2007-08-15 | 2009-02-18 | 庄添财 | Liquid crystal screen cleaning device |
| JP2009136728A (en) * | 2007-12-04 | 2009-06-25 | Panasonic Corp | Substrate cleaning device, and substrate cleaning method |
| JP2010036999A (en) * | 2008-07-31 | 2010-02-18 | Nippon Electric Glass Co Ltd | Conveying unit for glass substrate, conveying device for glass substrate, and conveying method for glass substrate |
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2014
- 2014-11-17 CN CN201410654447.0A patent/CN105665376B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09252178A (en) * | 1996-03-15 | 1997-09-22 | Matsushita Electric Ind Co Ltd | Board cleaning method and electronic element bonding method |
| JP2002050655A (en) * | 2000-07-31 | 2002-02-15 | Toray Eng Co Ltd | Chip-packaging method and substrate-cleaning device used for the same |
| CN1601715A (en) * | 2003-09-26 | 2005-03-30 | 松下电器产业株式会社 | Assembling apparatus, assembling method and terminal cleaning apparatus |
| CN101367083A (en) * | 2007-08-15 | 2009-02-18 | 庄添财 | Liquid crystal screen cleaning device |
| JP2009136728A (en) * | 2007-12-04 | 2009-06-25 | Panasonic Corp | Substrate cleaning device, and substrate cleaning method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109290287A (en) * | 2018-10-16 | 2019-02-01 | 深圳市华星光电半导体显示技术有限公司 | A kind of dry cleaning device and cleaning method |
| CN109759389A (en) * | 2019-03-18 | 2019-05-17 | 重庆两江联创电子有限公司 | A kind of cleaning glass method |
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| Publication number | Publication date |
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| CN105665376B (en) | 2019-07-12 |
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