JP2002049056A5 - - Google Patents

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Publication number
JP2002049056A5
JP2002049056A5 JP2000232528A JP2000232528A JP2002049056A5 JP 2002049056 A5 JP2002049056 A5 JP 2002049056A5 JP 2000232528 A JP2000232528 A JP 2000232528A JP 2000232528 A JP2000232528 A JP 2000232528A JP 2002049056 A5 JP2002049056 A5 JP 2002049056A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000232528A
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Japanese (ja)
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JP2002049056A (ja
JP4754677B2 (ja
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Publication date
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Priority to JP2000232528A priority Critical patent/JP4754677B2/ja
Priority claimed from JP2000232528A external-priority patent/JP4754677B2/ja
Publication of JP2002049056A publication Critical patent/JP2002049056A/ja
Publication of JP2002049056A5 publication Critical patent/JP2002049056A5/ja
Application granted granted Critical
Publication of JP4754677B2 publication Critical patent/JP4754677B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000232528A 2000-07-31 2000-07-31 半導体装置の作製方法 Expired - Fee Related JP4754677B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000232528A JP4754677B2 (ja) 2000-07-31 2000-07-31 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000232528A JP4754677B2 (ja) 2000-07-31 2000-07-31 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2002049056A JP2002049056A (ja) 2002-02-15
JP2002049056A5 true JP2002049056A5 (https=) 2007-09-20
JP4754677B2 JP4754677B2 (ja) 2011-08-24

Family

ID=18725202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000232528A Expired - Fee Related JP4754677B2 (ja) 2000-07-31 2000-07-31 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4754677B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4583568B2 (ja) * 2000-09-19 2010-11-17 株式会社半導体エネルギー研究所 発光装置の作製方法
US6956324B2 (en) 2000-08-04 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
JP3643025B2 (ja) * 2000-10-20 2005-04-27 シャープ株式会社 アクティブマトリクス型表示装置およびその製造方法
JP4389447B2 (ja) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 電気光学装置の製造方法
TW594210B (en) * 2003-08-28 2004-06-21 Ind Tech Res Inst A method for manufacturing a flexible panel for FPD
GB0323285D0 (en) * 2003-10-04 2003-11-05 Koninkl Philips Electronics Nv Device and method of making a device having a patterned layer on a flexible substrate
JP4529414B2 (ja) * 2003-10-29 2010-08-25 セイコーエプソン株式会社 電気光学装置用基板の製造方法
KR100698692B1 (ko) * 2005-07-20 2007-03-23 삼성에스디아이 주식회사 평판표시장치
US8581247B2 (en) * 2009-03-31 2013-11-12 Panasonic Corporation Flexible semiconductor device having gate electrode disposed within an opening of a resin film
CN106783682B (zh) * 2016-12-15 2019-11-22 武汉华星光电技术有限公司 柔性显示屏制作装置及制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249698B2 (ja) * 1994-12-15 2002-01-21 シャープ株式会社 表示装置
JP3831028B2 (ja) * 1996-12-03 2006-10-11 シチズン時計株式会社 液晶表示装置

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