JP2002043497A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device having a resin peeling prevention hole and provided with a lead frame difficult to concentrate deformation in the neighborhood thereof. SOLUTION: The resin peeling prevention hole 5 is provided on the intersection part 1 of a reinforcing frame 4 and an inside hanging lead 7 in the lead frame, and positioned on the intersection part of the area of the contrary side of a die pad rather than a line L connecting first and second inside hanging lead root boundary points 7a, 7b being a point in which the reinforcing frame continues to both the side parts of an inside hanging lead extending from the intersection part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a lead frame, and more particularly, to a semiconductor device having a resin separation preventing hole near a corner of a reinforcing frame.

[0002]

2. Description of the Related Art In a resin-sealed semiconductor device, there has been proposed a structure in which a frame-shaped frame is used for reinforcement in order to improve moldability and quality of resin sealing (Japanese Unexamined Patent Publication No. Hei 11-1999).
-284121). This structure includes, as shown in FIG. 9, suspension leads 107 and 108 extending between a corner 105 a of the dam bar 105 and the die pad 103,
A reinforcing frame 104 for reinforcing the suspension lead at an intermediate portion is arranged in a frame shape in parallel with the dam bar 105. The reinforcement frame 104 includes suspension leads 107 and 108.
The intersection 101 is formed in the middle part of the cross section. A semiconductor chip (not shown) mounted on the die pad is larger than the die pad 103 and large enough to reach the dam bar 105 beyond the reinforcing frame 104. With this reinforcing frame 104, a die bonding process,
Deformation can be reduced in the wire bonding step and the molding step.

In a lead frame provided with the frame-shaped reinforcing frame 104, FIGS.
As shown in (1), it is common to provide a resin peeling prevention hole 106 at the intersection 101 between the reinforcing frame and the inner suspension lead 107 in order to prevent the peeling of the sealing resin. The resin on the front side and the back side of the lead frame are integrated at the resin peeling prevention hole 106, and the resin strength is improved.

[0004] Further, since the semiconductor chip covers the reinforcing frame, when the gap between the semiconductor chip and the reinforcing frame is narrow, the resin peeling preventing hole is formed so as not to generate an uninjected portion. Has the effect of injecting resin. The gap between the semiconductor chip and the corner of the reinforcing frame 104 is about 20 μm, and from such a narrow gap, the resin enters only about 0.3 mm from the periphery. For this reason, at a position deep from the peripheral portion, the resin does not spread and becomes an uninjected region. When a portion where resin is not injected occurs, the resistance to moisture-absorbing cracks is reduced, and peeling and cracks occur starting from the non-injected region. Furthermore, when the uninjected area is large, the chip is supported by a local force, so that chip cracking occurs after the molding process. The above-mentioned resin peeling prevention hole has a function of preventing the occurrence of a resin non-injection region which causes the above-described trouble, because the resin is injected from the peripheral portion by the shape and arrangement shown in FIGS. 10 and 11. ing.

As a result, it is possible to provide a high-quality and high-reliability semiconductor device in which the deformation is reduced in the die bonding step, the wire bonding step, and the molding step, the sealing resin is hardly peeled off, and there is no uninjected region. it can.

[0006]

However, it has been found that the lead frame with the reinforcing frame provided with the resin separation preventing hole undergoes a bending deformation as a result of a die bonding, a wire bonding and a molding process. That is, as shown in FIGS. 12 and 13, bending occurs at the root of the inner suspension lead 107 near the resin peeling prevention hole 106. This deformation is bending along the line L shown in FIG. 13, and bending the die pad 103 and the semiconductor chip 101 out of the plane as shown in FIG. In the above-mentioned steps constituting the assembling step, the above-mentioned bending deformation occurs in any of the steps, although the degree varies. Among them, the shift in the molding process is the largest. Assuming that the shift amount in the die bonding step is 1, the ratio is 5 in the wire bonding step and about 20 in the molding step.

The above-mentioned local deformation is caused by the reinforcing frame 10
In the lead frame reinforced by 4,
This is because the strength at the portion where the resin peeling prevention hole 106 is provided is locally reduced, and the deformation (strain) is concentrated at that portion. That is, portions other than the vicinity of the resin peeling prevention holes 106 are reinforced by the reinforcing frame 104, and rigidity and strength are improved, so that deformation (strain) is less likely to occur. On the other hand, since the rigidity and strength of the portion of the resin peeling prevention hole 106 are reduced, the stress applied to the whole is the same as before, but the other portions are not distorted and the strength is reduced. The strain is greatly concentrated on the portion where the bending occurs, and the bending deformation occurs.

The resin peeling prevention hole is indispensable for enhancing the durability of the sealing resin in the resin-sealed semiconductor device. For this reason, the resin peel prevention hole is provided to improve the durability of the sealing resin, and also to prevent the occurrence of a portion where the resin is not injected, and the deformation is not locally concentrated on the resin peel prevention hole portion. Development of a semiconductor device having a lead frame is desired.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device having a lead frame in which deformation hardly concentrates near a resin peeling prevention hole for preventing resin peeling and occurrence of uninjected portions.

[0010]

According to the present invention, there is provided a semiconductor device comprising:
This is a semiconductor device including a semiconductor chip and a lead frame on which the semiconductor chip is mounted. The lead frame includes a reinforcing frame, a die pad which is a mounting portion of the semiconductor chip surrounded by the reinforcing frame, and an inner suspension lead extending between the die pad and a corner of the reinforcing frame. In this lead frame, a resin peeling prevention hole is provided at the intersection of the reinforcing frame and the inner suspension lead, and the resin separation prevention hole is provided at a point where the reinforcement frame is continuous with both side portions of the inner suspension lead extending from the intersection. It is located at the intersection of the area on the opposite side of the die pad from the line connecting the first and second inner suspension lead root boundary points (claim 1).

By limiting the resin peeling prevention hole to the above range, the hole portion of the resin peeling prevention hole is not located at the inside suspension lead portion having a fixed width. That is, the load is not supported by the portion of the inner suspension lead having a small width which is removed by the hole. In other words, the resin peeling prevention hole is surrounded by the intersection portion, and there is no portion surrounded by the side portion of the inner suspension lead. As a result, the degree of concentration of the strain on the inner suspension lead at the intersection is reduced, or the concentration of the strain is eliminated, and the bending near the resin separation preventing hole is eliminated. As a result, it is possible to prevent a situation in which the lead frame is deformed and the die pad is shifted out of the plane, while preventing resin peeling and occurrence of uninjected portions. The above-mentioned boundary point refers to a point at which the inner suspension lead starts to spread in the width direction when viewed from the die pad side.

In the semiconductor device of the present invention, the reinforcing frame and the inner suspension lead are so formed as to fill a cavity which is a void of the lead frame dividing the reinforcing frame and the inner suspension lead in a wedge shape at the intersection. A corner reinforcing portion extending between the two is provided (claim 2).

According to the above configuration, the width of the portion of the inner suspension lead that is continuous with the intersection is substantially increased, and sufficient strength can be ensured even when the resin separation preventing hole is formed closer to the die pad side. Can be. As a result, even if a larger resin-peeling prevention hole is opened to prevent resin-peeling or to prevent generation of a resin-uninjected region, it has sufficient durability and does not bend.

In the semiconductor device of the present invention, the corner reinforcing portions are provided on both side portions of the inner suspension lead extending from the intersection, and the first and second inner suspension lead root boundary points are provided at the inner suspension leads with corner reinforcement. The part is a continuous boundary point (claim 3).

By providing the corner reinforcing portion, the root portion of the inner suspension lead is reinforced, so that the range of the resin separation preventing hole can be expanded. The limit of this expanded range is the line connecting the two boundary points where the corner reinforcement is continuous with the inner suspension lead. For this reason, it is possible to increase the size of the resin separation preventing hole, prevent the resin separation, and prevent the occurrence of the resin non-injection region. In addition, the portion where the reinforcement frame and the inner suspension lead are integrated by the corner reinforcement portion increases, so that not only the concentration of strain on the inner suspension lead can be more reliably prevented, but also the strength and rigidity of the entire lead frame are improved. Can be.

In the semiconductor device of the present invention, the corner reinforcing portion is provided on one side of the inner suspension lead extending from the intersection, and the first inner suspension lead root boundary point is a boundary point where the reinforcing frame is continuous. The second inner suspension lead root boundary point is a boundary point where the corner reinforcing portions are continuous (claim 4).

The effect of reinforcing the strength of the corner reinforcing portion is great, and even if it is provided integrally with the reinforcing frame on one side of the base portion of the inner suspension lead, the purpose can be sufficiently achieved. There are four corner portions of the reinforcing frame, and at the four corner portions, corner reinforcing portions may be provided on the same side of the inner suspension frame, for example, on the right side, or may not be provided. Further, since the corner reinforcing portion is provided only on one side, the increase in weight is smaller than in the case where it is provided on both sides. With this configuration, it is possible to prevent the resin from peeling off while suppressing an increase in weight, and to eliminate bending at the root portion of the inner suspension lead.

In the semiconductor device according to the present invention, the corner reinforcing portion has a concave radius of curvature on the cavity side, which is a void portion of the lead frame.

By providing the radius of curvature, that is, the radius, as described above, both the portion where the corner reinforcement portion is continuous with the inner suspension lead and the vicinity of the base boundary point of the inner suspension lead where the corner reinforcement portion is continuous with the reinforcement frame are both smooth. Become part of the arc. For this reason, for example, even if a stress that spreads the space between the inner suspension lead and the reinforcing frame is applied, the degree of stress concentration is reduced, and it is unlikely that the above-described location will be a starting point and breakage will occur.

In the semiconductor device according to the present invention, the corner reinforcing portion is formed by a chamfered portion which is chamfered in a direction perpendicular to a direction in which the inner suspension lead extends.

With the above structure, a stamping die or the like can be easily manufactured.

In the above-described semiconductor device of the present invention, all of the intersections including the corner reinforcing portions extend from the respective peripheral portions of the reinforcing frame, the inner suspension leads, the corner reinforcing portions, and the resin peeling prevention holes to a position inside the predetermined width. (Claim 7).

The depth reaching position where the resin reaches during the resin injection is determined by the gap between the semiconductor chip and the reinforcing frame,
And the capacity of the resin injection device. For this reason, the above-mentioned predetermined width is also changed according to the fluctuation of the above-mentioned depth reaching position. Usually, the gap is about 20 μm, and the depth reaching position is about 0.3 mm.

According to the above configuration, even when the semiconductor chip covers the reinforcing frame and is large enough to cover the dam bar, no resin-injected region is generated in the entire region of the lead frame. For this reason, resin peeling,
It is possible to provide a high-quality and high-reliability semiconductor device by preventing deterioration of moisture absorption crack resistance and cracking of a semiconductor chip after molding.

It is desirable that the value of the predetermined width is about 0.3 mm with respect to a normal resin injection device.

If all the area near the corner portion is within 0.3 mm from the edge of the resin peeling prevention hole, the inner suspension lead, the reinforcing frame, and the corner reinforcing portion, the normal resin injection Using the device, it is possible to seal with resin without any uninjected area.

In the semiconductor device according to the present invention, the resin peeling prevention hole extends along the longitudinal direction in the direction in which the inner suspension lead extends.

When the resin suspending hole has a large inner suspension lead and crosses the inner suspension lead, the inner suspension lead is cut off. For this reason, the resin peel prevention holes are
It is desirable that the ratio of the width of the inner suspension lead to the inner suspension lead be small. on the other hand,
In order to fulfill the purpose of the resin separation preventing hole, the resin separation preventing hole needs to have a predetermined area. One compromise that satisfies both of the above objectives is a resin exfoliation prevention hole having a shape that is long in the direction in which the inner suspension lead root extends. As a result, it is possible to satisfy the purpose of preventing resin peeling while suppressing a decrease in strength at the root portion of the inner suspension lead.

In the semiconductor device of the present invention, when the resin separation preventing hole defines each range from the edge of the corner reinforcing portion and the edge of the reinforcing frame to a position inside the predetermined width, the hole is not included in any range. It has a hole periphery projecting toward the area (claim 10).

The resin injected from the peripheral edge of the hole easily reaches a region where the resin injected from the edge such as the corner reinforcing portion or the reinforcing frame does not reach. Therefore, it is not necessary to generate a resin non-injected region due to the provision of the corner reinforcing portion. As a result, it is possible to improve the strength of the entire lead frame, including the prevention of bending of the inner suspension lead base, and to prevent the resin from peeling and prevent the resin non-injection region from being generated.

In the above-described semiconductor device of the present invention, the resin peeling prevention hole has a hole peripheral portion protruding so as to include a midpoint of a line connecting the inner suspension lead root boundary point and the outer suspension lead upper boundary point. (Claim 11).

The above-mentioned middle point is a middle point of a line connecting the same side of the inner and outer suspension leads to each other. (The middle point of the line connecting the different sides of the suspension lead
It is naturally included in the resin-peeling prevention hole having a normal shape. When viewed from the center of the corner of the reinforcing frame, the direction toward the above-mentioned midpoint is included in any of the ranges when the respective ranges are defined from the corner reinforcing portion and the edge of the reinforcing frame to a position inside the predetermined width. There is almost coincidence in the direction of no place. Therefore, if a resin peeling prevention hole having a hole peripheral portion protruding toward the midpoint direction is provided so as to include the midpoint, the resin is likely to be uninjected from the hole peripheral portion protruding as described above. Easy to go around. For this reason, it is possible to prevent the resin non-injection region from being generated by the shape of the resin peeling prevention hole satisfying the above requirements. The shape of the resin peeling prevention hole that satisfies the above requirements may be a triangular shape, a quadrangular shape, or another polygonal shape with the corner protruding in the direction of the midpoint when viewed from the center of the corner of the reinforcing frame. Such a resin prevention peeling hole usually includes the midpoint within the range of the hole.

[0033]

Next, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 is a diagram illustrating a semiconductor device according to a first embodiment. The semiconductor chip 20 is mounted on the die pad 3 of the lead frame via the die bonding agent 3a. An inner suspension lead 7 and an outer suspension lead extend outward from the die pad 3, and a reinforcing frame 4 is disposed between the two. An inner lead 18, a dam bar 5, and an outer lead 17 are arranged continuously from the outer suspension lead, and a gold wire 19 is connected to the inner lead. These components are entirely covered and protected by the mold resin 16. FIG. 2 is a perspective view showing a lead frame 10 used in the semiconductor device of FIG. Inner suspension leads 7 extend from four corners of the die pad 3 and are continuous with the outer suspension leads 8 and the dam bar 5. The reinforcing frame 4 is arranged between the inner suspension lead 4 and the outer suspension lead in parallel with the dam bar 5 and forms the intersection 1 with the inner suspension lead and the outer suspension lead.

FIG. 3 is an enlarged view of the intersection. In FIG. 3, the inner suspension lead 7 extends from the intersection to the die pad side, and the outer suspension lead 8 extends in the opposite direction. The resin peeling prevention hole 6 is provided at the intersection, and a straight line L connecting the inner suspension lead root boundary points 7a and 7b.
Outside, that is, in a range opposite to the die pad. Therefore, as shown in FIG. 13, the periphery of the resin peeling prevention hole is not partially surrounded by the side portion of the inner suspension lead. If there is a portion surrounding the resin peeling prevention hole by the side of the inner suspension lead, a load is applied to the narrow portion of the inner suspension lead. The narrow portion has lower rigidity, lower bending resistance, lower tensile and compressive strength, and the like than the other portions, so that deformation is concentrated when a load is applied. For this reason, if a load is applied to push the die pad out of the plane, the strain is concentrated on this portion and the portion is bent. The resin peeling prevention holes shown in FIG. 3 are different from those shown in FIG. For this reason, a narrow portion does not appear.
Therefore, the periphery of the resin peeling prevention hole is high in strength and deformation is not concentrated, so that bending deformation does not occur in the die bonding, wire bonding and molding steps. As a result, it is possible to prevent bending of the root portion of the inner suspension lead after providing the resin separation preventing hole 6 for preventing resin separation and non-injection.

(Embodiment 2) FIG. 4 is a diagram illustrating an intersection of a semiconductor device according to a second embodiment. The lead frame includes a corner reinforcing portion 9 to reinforce the intersection between the inner suspension lead base and the reinforcing frame 4. This corner reinforcement 9 is provided with a cavity 11
A concave radius of curvature is provided toward.

In the case where the corner reinforcing portion 9 is provided, the inner suspension lead root boundary point is the boundary point 7a, 7b where the corner reinforcing portion 9 is continuous with the inner suspension lead. As can be seen by comparing FIG. 4 with FIG. 3, when the corner reinforcing portion 9 is provided, the boundary between the roots of the inner suspension leads is largely shifted to the die pad side. That is, even if the resin peeling prevention hole is moved and provided inside the inner suspension lead (on the die pad side), there is no place where the strength is greatly reduced due to the presence of the corner reinforcing portion 9, and the above-described bending occurs. do not do.

Further, since the corner reinforcing portion 9 has a radius of curvature, the boundary points 7a and 7b which are continuous from the corner reinforcing portion to the inner suspension lead and the boundary points which are continuous with the reinforcing frame 4 (no sign). And smooth, so that stress concentration hardly occurs. This becomes clearer by comparing with the same part in FIG. For this reason, even if stress is applied in the direction in which the inner suspension lead 7 and the reinforcing frame 4 are spread, they do not tear. Further, the corner reinforcing portion 9 not only prevents the bending, but also
The reinforcing frame is reinforced, and the entire lead frame is reinforced.

FIG. 5 shows an example in which a corner reinforcing portion 9 is provided similarly to the lead frame of FIG. This corner reinforcing portion 9 does not have a radius as in the example shown in FIG.
Beveling. For this reason, at a portion that is continuous from the corner reinforcing portion 9 to the inner suspension lead, the portion is not so smooth and is orthogonal. Therefore, stress concentration cannot be avoided to some extent, but the degree thereof is smaller than that in the case of FIG. 3, and all excellent effects other than the above-mentioned stress concentration can be obtained. Further, in the case of chamfering, machining is simpler than in the case of providing a radius of curvature, and the machining cost can be reduced accordingly.

(Embodiment 3) In this embodiment, FIG.
As shown in (1), the corner reinforcement 9 is provided only on one side of the root of the inner suspension lead, and the corner reinforcement is not provided on the other side. Also in this case, no resin peeling prevention hole is formed on the die pad (not shown) side from the line L connecting the inner suspension lead root boundary points 7a and 7b. For this reason, the portion of the resin peeling prevention hole 6 is sufficiently reinforced, and the inner suspension lead does not bend near the resin peeling prevention hole. As a result, it is possible to provide a semiconductor device having a lead frame that has high durability and does not increase weight significantly.

(Embodiment 4) FIG. 7 is a diagram illustrating a semiconductor device according to Embodiment 4. As mentioned above,
In the semiconductor device of the present invention, the semiconductor chip has a size that covers the reinforcing frame and covers the dam bar. Therefore, the gap between the semiconductor chip and the reinforcing frame is 20
It is as small as about μm, and the penetration depth (depth) of the mold resin can be expected to be only about 0.3 mm. For this reason, when the corner reinforcing portion 9 is provided, the above-described shape and arrangement of the resin peeling prevention holes can fill only a limited area of the resin from entering from the edge portion of each portion, so that an unfilled region occurs. Resulting in. In the present embodiment, in order to prevent the occurrence of the unfilled or uninjected region, the resin peeling prevention hole is formed in a special shape for preventing the occurrence of the uninjected region.

In FIG. 7, a region having a width of 0.3 mm is taken from the edge of the inner suspension lead, the reinforcing frame, and the corner reinforcing portion, and the uncovered region is defined as Cw. At this time, if the shape and position of the resin peeling prevention hole 6 are as shown in FIG.
If an area is taken with a width of m, Cw is also included in the area. This resin peeling prevention hole is located at the middle point
5A and the middle point 15b of the boundary points 7b and 8b, and has a hole peripheral portion, that is, a side, protruding in the direction of the middle point when viewed from near the center of the corner of the reinforcing frame. The direction from the vicinity of the center of the corner to the midpoint substantially coincides with the direction from the center to Cw. By providing such a shape resin prevention hole,
The entire area can be covered without generating an unimplanted area. As a result, even when the corner reinforcing portion is provided, the resin sealing can be completely performed.

On the other hand, when such a shape and arrangement are not taken for the resin peeling prevention holes, as shown in FIG. 8, a non-injected region occurs. In FIG. 8, even when a region having a width of 0.3 mm is taken from the edge of the inner suspension lead, the reinforcing frame, the corner reinforcing portion, and the resin peeling prevention hole, an uninjected region such as Co is generated.

Although the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. Not limited. The scope of the present invention is defined by the appended claims, and includes all modifications within the meaning and scope equivalent to the description of the claims.

[0045]

By using the semiconductor device of the present invention, it is possible to prevent bending of the root portion of the inner suspension lead while preventing resin peeling. Further, by providing the corner reinforcing portion at the root of the inner suspension lead, the lead frame used in the present semiconductor device is further strengthened, and the resin peeling prevention hole can be provided with a margin. When the corner reinforcing portion is provided, there is a concern that a resin non-injected region may occur. However, by using the shape and arrangement of the resin peeling prevention hole of the present invention, resin peeling and bending of the inner suspension lead root portion are prevented. After that, it is possible to eliminate the generation of the non-injection region of the resin.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a lead frame used in the semiconductor device of FIG.

FIG. 3 is a view for explaining the vicinity of a root portion of an inner suspension lead of the lead frame of FIG. 2;

FIG. 4 illustrates a semiconductor device according to a second embodiment;
It is a figure explaining the vicinity of the root part of the inside suspension lead which provided the corner reinforcement on both sides.

FIG. 5 is a diagram illustrating another semiconductor device in Embodiment 2.

FIG. 6 illustrates a semiconductor device according to Embodiment 3;
It is a figure explaining the vicinity of the root part of the inside suspension lead which provided the corner reinforcement on one side.

FIG. 7 is a diagram illustrating a mechanism for preventing occurrence of a resin non-injection region in a lead frame of a semiconductor device according to a fourth embodiment;

FIG. 8 is a diagram illustrating a mechanism in which a resin non-injection region occurs in the lead frame of the semiconductor device of the present invention.

FIG. 9 is a diagram illustrating a lead frame of a conventional semiconductor device.

FIG. 10 is a view for explaining a conventional lead frame provided with a frame-shaped reinforcing frame.

FIG. 11 is a diagram in which a resin peeling prevention hole is provided at a root portion of a conventional inner suspension lead.

FIG. 12 is a diagram illustrating a bent state at the base of the inner suspension lead of the conventional lead frame.

FIG. 13 is an enlarged view of a bent portion A in FIG.

[Explanation of symbols]

1 intersection, 3 die pad, 3a die bonding agent, 4
Reinforcement frame, 6 resin peel prevention hole, 7 inner suspension lead, 7a, 7b inner suspension lead root boundary point, 8 outer suspension lead, 8a, 8b outer suspension lead upper boundary point,
9 corner reinforcement, 11 cavities, 15a, 15
b Midpoint of boundary between inner and outer suspension leads, L resin peeling prevention hole limit line, Cw Area that does not fall within a certain area from the edge of inner suspension lead, reinforcement frame and corner reinforcement, Co Inner suspension lead and reinforcement An area that does not enter an area within a certain range from the edges of the frame, the corner reinforcing section, and the resin peeling prevention hole.

Claims (11)

[Claims] 1. A semiconductor device comprising a semiconductor chip and a lead frame on which the semiconductor chip is mounted, wherein the lead frame includes a reinforcing frame and a mounting portion of the semiconductor chip surrounded by the reinforcing frame. A die pad, and an inner suspension lead extending between the die pad and a corner of the reinforcing frame; a resin separation preventing hole is provided at an intersection of the reinforcing frame and the inner suspension lead; The peel prevention hole is located on the opposite side of the die pad from the line connecting the first and second inner suspension lead root boundary points, which are points where the reinforcing frame is continuous on both sides of the inner suspension lead extending from the intersection. A semiconductor device located at the intersection of regions. 2. In the intersection, between the reinforcing frame and the inner suspension lead, so as to fill a cavity which is a gap of the lead frame dividing the reinforcing frame and the inner suspension lead into a wedge shape. The semiconductor device according to claim 1, further comprising a corner reinforcing portion extending to the corner. 3. The corner reinforcement portion is provided on both sides of an inner suspension lead extending from the intersection, and the first and second inner suspension lead root boundary points are connected to the inner suspension lead by the corner reinforcement portion. Is a continuous boundary point,
The semiconductor device according to claim 2. 4. The corner reinforcing portion is provided on one side of an inner suspension lead extending from the intersection, the first inner suspension lead root boundary point is a boundary point where the reinforcing frame is continuous, and 3. The semiconductor device according to claim 2, wherein the inner suspension lead root boundary point is a boundary point where the corner reinforcing portions are continuous. 4. 5. The semiconductor device according to claim 2, wherein said corner reinforcing portion has a concave radius of curvature on a cavity side which is a void portion of said lead frame. 6. The semiconductor device according to claim 2, wherein said corner reinforcing portion is formed by a chamfered portion chamfering in a direction orthogonal to a direction in which said inner suspension lead extends. 7. All the portions of the intersection including the corner reinforcing portion from the peripheral edge of the reinforcing frame, the inner suspension lead, the corner reinforcing portion, and the resin peeling prevention hole to a position inside a predetermined width. The semiconductor device according to any one of claims 2 to 6, wherein the semiconductor device is provided so as to be located within the range of (2). 8. The value of the predetermined width is 0.3 mm.
The semiconductor device according to claim 7. 9. The semiconductor device according to claim 1, wherein the resin peeling prevention hole extends along the longitudinal direction in a direction in which the inner suspension lead extends. 10. The resin separation preventing hole, when defining respective ranges from the edges of the corner reinforcing portion and the reinforcing frame to a position inside a predetermined width, is directed to a region of a range not included in any of the ranges. 9. The semiconductor device according to claim 7, wherein the semiconductor device has a peripheral edge of the hole. 11. The resin peeling prevention hole has a hole peripheral portion protruding so as to include a middle point of a line connecting the inner suspension lead root boundary point and the upper suspension point of the outer suspension lead. 11. The semiconductor device according to any one of claims 8, 8, and 10.