JP2002043363A - Method and device for film sticking - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film sticking method and a film sticking device for minimizing a gap generated between an anisotropic conductive film(ACF) and a substrate in the case of sticking an IC chip to a substrate by using the ACF. SOLUTION: Air inside the ACF 5 and a recessed part 4 in a grid shape surrounded by a land (electrode) 2 and resist 3 formed on the substrate is gradually pressurized after bringing it into point contact or line contact at the time of starting pressurization, and is discharged to the outside of a grid edge, and the gap of a sticking part is eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking method and a film sticking apparatus, and more particularly to a CSP (Chip).
The present invention relates to a film sticking method and a film sticking apparatus for sticking a semiconductor integrated circuit (IC) chip to an interposer substrate or the like of a size package via a film.

[0002]

2. Description of the Related Art As an IC chip mounting method, a BGA (Ball Grid Array) in which terminals and electrodes are formed in a grid array (grid array) and the terminals themselves are formed of solder balls by increasing the number of input / output terminals and increasing the number of pins and thinning.
The y) type CSP is frequently used.

FIG. 13 is a side sectional view showing a case where an IC chip is attached to an interposer substrate by using an anisotropic conductive film (ACF) tape as a connection medium as a method for mounting an IC chip on a substrate of such a CSP. Shown in

In FIG. 13, reference numeral 1 denotes an interposer substrate on which a plurality of lands (electrodes) 2 are formed in a grid pattern, for example, as shown in FIG. A solder resist 3 is provided so as to cover the electrode 2. The depth of the pocket-shaped depressions 4 formed in a lattice shape is about 30 microns.

[0005] An ACF tape 5 larger than the lattice-shaped opening area of the solder resist 3 is covered on the solder resist 3,
An IC chip 6 having a plurality of lattice-like bumps 7 similar to the substrate 1 on the lower surface is aligned so as to face the lands 2 of the interposer substrate 1.

The ACF tape 5 has a predetermined thickness.
Predetermined conductive particles are dispersed and mixed therein. In this state, an ACF tape is applied between the IC chip 6 and the interposer substrate 1 by heating and pressing at 100 to 240 ° C. for 5 to 40 seconds at 5 to 100 g per bump in the direction of arrow A via a pressing head described later. IC chip 6 filled with 5
The plurality of bumps 7 can be easily joined to the plurality of lands 2.

A conventional structure of a film sticking apparatus for mounting the above-described film will be described with reference to a perspective view of FIG.

In FIG. 10, the above-mentioned ACF 5 is sandwiched between a release tape 5a and a separate tape 5b and supplied from a supply reel 8. Giving an ACF for example a feeding direction opposite to the tape 5, appropriate tension to the ACF tape 5 over the back tension T ₁ in the clockwise direction indicated by arrow CW in the supply reel 8.

The traveling direction of the ACF tape 5 fed from the supply reel 8 is changed downward by rollers 9a and 9b, and a master substrate 11 provided on an XY stage 10 provided between the rollers 9b and 9c. passed over so as to pass through the upper, separate tape 5b is wound at a winding torque of the wound in separate tape take-up reel (not shown) T _3.

[0010] The release tape 5a is disposed directly above the roller 9a.
ACF tape 5 and rollers 9d and 9e
Upward in the direction opposite to the direction of travel of the separate tape 5b
Release tape take-up reel (not shown) whose traveling direction can be changed
Wound around. This release tape take-up reel has a tension
T_TwoHas been granted. The release tape 5a was discharged.
Tension from release tape 5a to ACF tape 5
And minimum tension that can separate the separate tape 5b
And the back tension T of the supply reel 5 ₁Less than
Influence on the tension control of the whole ACF tape 5
It is made so as not to blow.

A vacuum block 12 is provided between the rollers 9a and 9b, and functions to suck the separate tape 5b whose traveling direction has been changed and buffer the dynamic fluctuation of the entire tape tension control system. ing.

The ACF tape 5 that has passed through the roller 9b is directly below the pressure head 13 because the ACF tape 5 is attached to one of the plurality of interposer substrates 1 provided on the parent substrate 11 immediately below the pressure head 13. On the left (downstream) from
The F tape 5 is attached to the interposer substrate 1, and only the separate tape 5b is discharged.

The fixed chucks 14a and 14b open and close up and down so that a separate tape 5b can be clamped. The movable chucks 15a and 15b are fixed to a servo motor or a ball screw (not shown) to discharge the ACF tape 5 and the separate tape 5b. It can be moved in the direction CD, and can be opened and closed in the vertical direction indicated by arrows E and F.

That is, the movable chucks 15a and 15b are temporarily moved in the direction of arrow D while the fixed chucks 14a and 14b are opened and the movable chucks 15a and 15b are also opened in the directions of arrows E and F, and the movable chucks 15a and 15b are moved. Close and A
After sandwiching the CF tape 5 and the separate tape 15b, the CF tape 5 is moved by a predetermined amount in the direction of arrow C, and the ACF tape 5 is pulled out by a predetermined amount downstream.

Thereafter, the fixed chucks 14a and 14b sandwich the separate tape 5b, and the movable chucks 15a and
5b releases the separate tape 5b, and the fixed chuck 1
It returns to the nearest standby position of 4a, 14b.

During this time, the cutter fixing table 1 in the standby state
With respect to 6a, the cutter base 16b is moved upward via a driving means (not shown), and the cutter blade 16 cuts the ACF tape 5 adhered to the lower surface of the separate tape 5b so that the separate tape 5b is not cut. After cutting only the ACF tape 5, the cutter fixing table 16
a, the cutter unit including the cutter blade 16 on the cutter base 16b is returned to a predetermined standby position via moving means (not shown).

Next, the XY stage moves to a predetermined position,
The ACF tape 5 is adhered to the interposer substrate 1 by pressing and heating the ACF tape 5 on the interposer substrate 1 by the pressure head 13.

[0018]

The ACF tape 5 is attached to the lattice-shaped lands 2 of the plurality of interposer substrates 1 provided on the parent substrate 11 by the pressure head 13 via the above-mentioned film attaching device. Pressure head 13 for wearing
As shown in the side sectional view of FIG. 11, the end face of the pressing piston is generally formed as a flat surface. When the end face is flat as described above, the interposer substrate 1 having irregularities has A
When the CF tape 5 is adhered, the ACF tape 5 is difficult to adhere in the recess 4 of the interposer substrate 1, so that the elasticity of the silicon rubber sheet 17 having a thickness of about 1 mm or the like is applied to the tip of the piston of the pressure head 13. Intermediate cushioning material is provided.

With the interposition of the cushioning material 17, the ACF tape 5 indirectly pressurized by the cushioning material 17 of the pressure head 13 is adapted to easily fit into the recessed portion 4 and adhere well. I have.

However, with respect to the interposer substrate 1 having the recess 4, the AC of the cushioning material 17 adhered to the pressure head 13 is applied.
Since the contact surface of the F-tape 5 is a flat surface, the F-tape 5 is pressed against the interposer substrate 1 in parallel even during pressing.

For this reason, a gap is easily left between the upper surface of the interposer substrate 1 in the lattice-shaped recess 4 of the interposer substrate 1 and the attaching surface of the ACF tape 5.

At the start of pressurization, air is trapped in the space inside the closed recess 4 formed by the ACF tape 5-solder resist 3-interposer substrate 1. Block the air flow at the edge. When the pressure head 13 further moves in the arrow direction A, the pressure applied from the pressure head 13 to the silicon rubber sheet as the cushioning material 17 increases, and the cushioning material 17 becomes a pocket-shaped recess formed by the solder resist 3 of the interposer substrate 1. It deforms so as to follow the inside of the part 4 and invades it, and exerts the influence of this deformation on the ACF tape 5.

That is, the ACF tape 5 is deformed together with the cushioning material 17 so as to follow the recess 4 of the interposer substrate 1.
The behavior is such that it enters the recess 4 of the interposer substrate 1. At this time, at the same time, the air confined in the concave portion 4 flows out from a slight gap between the ACF tape 5 and the solder resist 3, and contributes to the close contact between the ACF tape 5 and the interposer substrate 5.

However, the pressure applied from the pressure head 13 is highest at the edge portion where the ACF tape 5 is in contact with the solder resist 3, and it is difficult to discharge all the air once confined. ACF tape 5 and interposer substrate 1 serve as air gaps
Will remain in between. Further, the pressure head 13 and the cushioning material 1
7 are both planar, the size and location of the remaining voids are not constant, adversely affecting the quality of the subsequent process.

Here, the size of the ACF tape 5 is larger than the lattice-shaped openings of the solder resist 3 on the interposer substrate 1, and the pressing surface of the piston of the pressing head 13 is an ACF tape cut to a predetermined size. 5, the cushioning material 17 such as a silicon rubber sheet is
3 is large enough to cover the piston pressing plane.

Therefore, the AC cut to a predetermined size
Since the F tape 5 is larger than the opening of the grid-like solder resist 3 on the interposer substrate 1, the edge portion in contact with the solder resist 3 is initially pressed.

As described above, the problem in the case where the void remains is A
A gap filled with air remains after the CF tape 5 is adhered, and if an impact force is mechanically applied to the air after the ACF tape 5 is joined, it tends to become a crack generation source at the joint.

The space around the gap is apt to absorb moisture in the air, and this moisture is exploded by the rapid heating applied in the next reflow step, causing the air in the gap to explode and interposer substrate 1
There was a problem that progressed to the destruction of.

The present invention has been made to solve the above-mentioned problems, and the problem to be solved by the present invention is ACF.
Provided is a method and a device for attaching a film, in which a gap is not left between a tape and a concave portion of a substrate.
This is to improve the reliability of P.

[0030]

According to a first aspect of the present invention, there is provided a film sticking method for sticking an anisotropic conductive film on an upper surface of a substrate having electrodes arranged in a grid.
Pasting the anisotropic conductive film on the substrate while gradually expanding and evacuating the air generated in the recess formed between the substrate surface in the grid electrode and the application surface of the anisotropic conductive film in the direction of the grid electrode It is made to be worn.

The film sticking method according to the second aspect of the present invention is such that air is exhausted concentrically toward the periphery of the grid electrode from or near the center point in the recess of the grid electrode according to the first invention. It is something that has been done.

According to a third aspect of the present invention, air is exhausted from the center line position in the recess of the grid electrode or the vicinity thereof in two directions around the grid electrode in the first invention. It is something that has been done.

In a fourth aspect of the present invention, the air is exhausted from one side of the periphery of the concave portion of the grid electrode in the first aspect toward the opposite side.

A film sticking apparatus according to a fifth aspect of the present invention supplies a sheet-like film sequentially, cuts the sheet into a predetermined size, and sticks the film to a substrate placed on a stage via a pressure head. The shape of the cushioning material when the upper surface of the cut film disposed so as to cover the depressions in the electrodes formed in a grid on the substrate is pressed by the cushioning material provided at the tip of the pressure head and is adhered. Is such that the product of the pressure load of the pressure head and the deformation amount of the cushioning material is constant.

According to a sixth aspect of the present invention, there is provided a film sticking apparatus according to the fifth aspect, wherein the cushioning material according to the fifth invention has an apex at one point in the depression at the time of initial pressurization, and the cross-sectional area of the cushioning material is increased with the pressurization. It has a shape that is continuously deformed.

In the film sticking apparatus of the seventh invention, the cushioning material of the fifth invention abuts linearly in the depression at the time of initial pressurization, and the cross-sectional area of the cushioning material is continuously increased with the pressurization. The shape is transformed into a shape.

According to the above-described first to seventh embodiments of the film sticking method and the film sticking apparatus of the present invention, the film is added to the tip of the pressure head without generating a gap between the ACF tape and the interposer substrate. As for the cushioning material, it is only necessary to stick silicone rubber or the like formed in a predetermined shape.
P can be obtained.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described. A pressing head 13 of the present invention is an elastic cushioning material 17 such as a silicon rubber sheet fixed to a pressing surface of a piston as a pressing portion.
A flat silicon rubber sheet 1 whose shape is shown in FIG.
A hemispherical silicon rubber sheet 17a is used in place of 7 as shown in FIG.

The pressure head 13 shown in FIG. 1 is made of an elastic cushioning material 17a formed by processing silicon rubber into a hemispherical shape having a vertex near the center of the lattice-shaped recess 4 of the interposer substrate 1.

According to the cushioning member 17a having such a configuration, as shown in FIG.
Is moved, the top of the hemispherical cushioning material 17a at the beginning of the press contacts the center of the ACF tape 5, and the press starts from the center. Therefore, in this case, unlike the situation in which the air is once confined by applying pressure from the edge portion of the ACF tape 5 surrounded by the lattice-shaped solder resist 3 as described with reference to FIG. Since the pressurization is started, the air is not confined in the recess 4.

Thereafter, when the pressure head 13 is further depressed as shown by the arrow A, the hemispherical cushioning material 17a fixed to the pressure head 13 removes the center point 18 of the cut ACF tape 5.
The pressurization started from the concentric circles 19a,
19b, 19c}, the pressure range is expanded to the periphery.

The deformation of the cushioning material 17a is performed by attaching the ACF tape 5 to the substrate surface (upper surface of the concave portion) in the concave portion 4 by deforming the ACF tape 5 so as to conform to the substrate unevenness in the concave portion 4 of the interposer substrate 1. Also starts from a position near the center point, so that a gap is rarely left.

In the above case, the deformation of the cushioning material 17a concentrically spreads, and the ACF tape 5 contacts the ridge line of the concave portion 4 surrounded by the grid solder resist 3 at the moment when the ACF tape 5 contacts the ridge line.
The air between the and the interposer board 1 loses a way out,
May be trapped. In this case, the gap is the depression 4
And the voids at the four corners are regions that do not harm the joining of the IC chip 6 and the interposer substrate 1 by the ACF tape 5 depending on the size, and a particular problem occurs. Absent.

In the above description, the shape of the buffer material 17a for pressing the ACF tape 5 is made hemispherical because the buffer material 17a
This is because the pressure distribution when the ACF tape 5 is pressed while being deformed is made uniform, so that the thickness of the ACF tape 5 after being closely attached to the interposer substrate 1 is made uniform. Therefore, as long as the pressure distribution is uniform and the thickness of the ACF tape 5 after application is uniform, the shape of the cushioning material 17a does not need to be hemispherical. Or a conical shape or a pyramid shape. In any case, the relationship between hardness and shape can be realized so that the load is constant regardless of the deformation amount of the cushioning member 17a. In other words, the shape of the cushioning material may be such that the product of the amount of deformation of the rubber and the load is always kept constant.

The top of the hemispherical cushioning material 17a is deformed by a small load, but the periphery is hardly deformed. If this description is replaced with a spring, assuming that the elastic cushioning member 17a is composed of a plurality of springs, the spring at the top of the head is long and the spring constant is relatively small, and the spring at the periphery is short. The constant will be relatively large.

The pressurization start point is set at the center near the center point by deforming the elasticity of the cushioning material 17a or the like.
The purpose is to ensure the uniformity of the pressure distribution and to release the air to the outside in the recess 4, and this is a result of emphasizing the uniformity of the pressure distribution. Therefore, as long as uniformity of the pressure distribution can be ensured, the pressing start point does not need to be at the center, and the pressing may be started from a certain point on the ACF tape 5 (for example, one vertex of a rectangle). . The pressurization in this case is 1
It is only necessary to spread from the top to the other three vertices. In short, it has a vertex at one point, and the cross-sectional area of the cushioning material in the spreading direction is continuously deformed when pressurized. May be made to be constant.

In the above description, the start of pressurization of the pressurizing head 13 is limited to a case starting from one point on the ACF tape 5. However, the start of pressurization is brought into line contact on the ACF tape 5. You may do it.

FIG. 3 shows a case where the shape of the cushioning member 17 is such that it does not make a point contact but a line contact at the time of initial pressurization, and the cushioning member 17b has a semi-circular cross-sectional shape of a semi-circular silicon rubber sheet. . In this case, the length L ₁ of the cushioning material 17b is slightly shorter than the length L ₂ of the recess 4 of the interposer substrate 1, the buffer at the position of the recess of the width W ₂ of 4 1 / 2W ₂ of the center line 20 It is formed such that the arched linear top of the material 17b abuts.

According to the cushioning member 17b, when the pressure head 13 is pressed in the direction A by the air cylinder 21 in FIG. The buffer material 17b abuts on the wire 20 and thereafter deforms and expands from the center line to both front and rear sides from the center line as the pressing force is applied, and finally joins at the position of the grid-like solder resist 3 while extruding air. Therefore, the ACF tape 5 can be stuck without leaving air.

Also in this case, the cushioning member 17b is not limited to the Kamaboko shape, but may be a triangular prism shape (cross section is triangular) in which a triangular prism is turned sideways. As shown in FIG. As the sheet 17c, the elastic deformation of the rubber can be used by pushing and expanding the sheet 17c from the side other than the center line 20 near one end face of the recess 4 toward the opposite side. In short, in these cases, the ACF tape 5 has a shape in which the pressurizing start portion linearly abuts the concave portion 4, the cross-sectional area changes continuously according to the pressurization, and the product of the amount of deformation and the load becomes constant. I just need.

The above-mentioned film sticking methods can be summarized into the following four. A method of pushing and spreading from one point near or at the center of the cut ACF tape 5d A method of pushing and spreading toward the periphery of the ACF tape cut from one point other than the center of the cut ACF tape 5d The center line of the cut ACF tape 5d From the four sides of the cut ACF tape 5d, the method can be divided into a method of expanding from the vicinity of any one side to the opposite side. All of these methods utilize the deformation of an elastic cushioning material such as rubber.

The cushioning members 17a to 17 made of, for example, a silicon rubber sheet in the shape of a burr fixed to the above-described pressure head 13
The operation of the ACF tape sticking apparatus and the ACF tape sticking method using c will be described with reference to FIGS.

In FIGS. 5 to 9, the entire structure of the film sticking apparatus is the same as that of FIG. 10 except for the shape of the cushioning material described above. Are denoted by the same reference numerals, and description of the device configuration is omitted.

In FIG. 5, the pressure head 13 is
The X, Y stage 10 is disposed at a fixed position between
The parent substrate 11 is placed on the upper side as described with reference to FIGS. For example, about 100 interposer substrates provided in the CSP are juxtaposed on the parent substrate 11,
These are finally cut to form an interposer substrate for CSP.

The XY stage 10 is slidable in the Y-axis and X-axis directions.
The predetermined interposer substrate 1 to which the F tape 5 is to be attached is brought.

In FIG. 5, the fixed chucks 14a and 14b are opened and the movable tapes 15a and 15b
b, ACF tape 5 and separate tape 5b
Is moved in the direction C by a predetermined amount, and the ACF tape 5 disposed below the separate tape 5b is brought to a position directly below the pressure head 13.

Next, when the fixed chucks 14a and 14b are closed and the separate tape 5b is clamped, the movable chucks 15a and 15b are opened and the separated tape 5b is released to a standby position near the positions of the fixed chucks 14a and 14b. It moves in the C direction and stops (see FIG. 6).

Next, as shown in FIG. 6, the cutter units such as the cutter fixing stand 16a, the cutter stand 16b, and the cutter blade 16 at the above-mentioned standby position during the operation move upward from below as shown by the arrow E. Then, the ACF tape 5 is brought to a position where it can be cut by the cutting blade 16.

The cutter blade 16 is moved in the direction of arrow E by driving means (not shown), and the tip of the cutter blade 16 is
Only the cutter unit is cut, and the separate tape 5b stops at the position where it is not cut, and the cutter unit that has finished cutting the ACF tape 5 moves in the F and E directions and moves to a predetermined standby position.

FIG. 7 shows that the cutter unit moves to the standby position and the X-position is applied to the pressing position of the pressing head 13 in order to apply the cut ACF tape 5d onto the predetermined interposer substrate 1 on the XY stage 10. The figure shows a state where the Y stage 10 has been moved in the X-axis direction (D direction) and the Y-axis direction (G direction).

The XY stage 10 has a function of positioning the parent substrate 11 by a vacuum or the like (not shown), and has a control means for sequentially feeding the interposer substrate 1 directly below the pressure head 13.

Next, as shown in FIG. 8, the air cylinder 21 of the pressure head 13 is driven to
If the hemispherical apex of the cushioning material 17a fixed to 3 makes point contact with the substantially center position of the cut lattice-shaped ACF tape 5d, and the pressing head is further lowered in the A direction, as shown in FIG. The bonding is performed while gradually extruding air concentrically from the vicinity of the center position of the concave portion 4 of the interposer substrate 1 in the outer peripheral direction, and finally extruding air from the upper edge of the solder resist 3, ACF5 cut inside
d can be stuck without gaps.

The pressure head 13 has a heater and a thermocouple (not shown), and is controlled so as to always maintain a constant temperature.
The ACF tape 5d cut via the separate tape 5b is heated to the softening point at 0 to 240 ° C.

The ACF tape 5 at the softening point has the highest fluidity and is adhered to the surface of the interposer substrate 1 while flowing into the recess 4 on the interposer substrate 1. The ACF tape 5 adhered to the interposer substrate 1 is cut by the cutter blade 16 when pulled out by a predetermined amount as described above, and only the cut ACF tape 5d remains on the interposer substrate 1 and is not cut. When the separate tape 5b separates from the interposer substrate 1 with the elevation of the pressure head 13, the portion is moved from the interposer substrate 1 together with the separate tape 5b as shown in FIG.
Leave like.

In each of the above embodiments, the case where the IC chip 6 is adhered to the interposer substrate 1 has been described. Therefore, the grid electrodes provided on the BGA main substrate shown in FIG. It is apparent that the present invention can be applied to a case where a lattice-shaped solder ball terminal (not shown) provided at the lower end is attached via an ACF tape, and various changes can be made without departing from the gist of the present invention.

[0066]

According to the film sticking method and the film sticking apparatus of the present invention, by starting the pressing of the ACF tape from one point or one straight line on the ACF tape, the AC bonding is started.
The gap between the F tape and the substrate does not remain at all, or at all, is very small. The position of the gap can be fixed at four corners, near one side, or the like. Such a place is ACF
This is a position that is unlikely to cause any harm to the joining of the substrate and the IC chip by the tape. In other words, there is no void in the portion contributing to the actual joining of the ACF tape. This can be said to contribute to stabilization of quality and improvement of reliability for joining of the ACF tape. Further, the present invention utilizes deformation of an elastic cushioning material such as rubber, and can be provided to existing devices at very low cost. When adapting to an existing device, instead of a conventional cushioning material such as a flat rubber sheet, it is only necessary to fix an elastic cushioning material such as silicone rubber molded into a predetermined shape at the tip of the pressure head. . As described above, the present invention has many features that can contribute to both aspects of improving the quality and reliability of mounted products such as IC chips and CSPs and providing an inexpensive film sticking device.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing one embodiment of a pressure head used in the present invention.

FIG. 2 is an explanatory diagram of a pressed state of a pressure head used in the present invention.

FIG. 3 is a perspective view showing another embodiment of the pressure head used in the present invention.

FIG. 4 is a side sectional view showing still another embodiment of the pressure head used in the present invention.

FIG. 5 is an explanatory view (I) of the operation of the film sticking method of the present invention.

FIG. 6 is an explanatory view (II) of the operation of the film sticking method of the present invention.

FIG. 7 is an explanatory view of the operation of the film sticking method of the present invention (III).
It is.

FIG. 8 is an explanatory view (IV) of the operation of the film sticking method of the present invention.

FIG. 9 is an explanatory view (V) of the operation of the film sticking method of the present invention.

FIG. 10 is a perspective view of a main part of a conventional film sticking apparatus.

FIG. 11 is a side sectional view of a conventional pressure head.

FIG. 12 is a perspective view of a conventional substrate.

FIG. 13 is an explanatory view of a conventional ACF attaching method.

[Explanation of symbols]

1 ‥‥ interposer substrate, 2 ‥‥ land (electrode),
3 solder resist, 4 hollow, 5 anisotropic conductive film (ACF), 17 rubber sheet (buffer), 1
7a {semispherical rubber sheet (cushioning material), 17b} Kamaboko-shaped rubber sheet (cushioning material), 17c {triangular prism-shaped rubber sheet (cushioning material)

Claims (7)

[Claims] 1. A film sticking method for sticking an anisotropic conductive film on an upper surface of a substrate in which electrodes are formed in a grid pattern, the method comprising the steps of: The method is characterized in that the anisotropic conductive film is adhered to the substrate while air generated in the recess formed between the adhering surfaces of the film is gradually pushed and expanded in the direction of the grid electrode and exhausted. Film sticking method. 2. The method according to claim 1, wherein the air is exhausted concentrically from the center point in the concave portion of the grid electrode or the vicinity thereof toward the periphery of the grid electrode.
The method for attaching a film according to the above. 3. The air exhaust system according to claim 1, wherein the air is exhausted from the center line position in the concave portion of the grid electrode or in the vicinity thereof in two directions around the grid electrode. Film sticking method. 4. The film sticking method according to claim 1, wherein the air is exhausted from one side around the inside of the concave portion of the grid electrode toward the opposite side. 5. A film adhering device for sequentially feeding a sheet-like film, cutting the film into a predetermined size, and adhering the film to a substrate placed on a stage via a pressure head, comprising: When the upper surface of the cut film arranged so as to cover the concave portion in the electrode formed in the shape of a pressure is pressed by a buffer material provided at the tip of the pressure head, and adhered, the shape of the buffer material is added. A film sticking apparatus characterized in that the product of the pressure load of the pressure head and the deformation amount of the cushioning material is constant. 6. The cushioning material has an apex at one point in the recess at the time of initial pressurization, and has a shape in which a cross-sectional area of the cushioning material is continuously deformed with pressurization. The film sticking device according to claim 5, characterized in that: 7. The structure according to claim 7, wherein the cushioning material abuts linearly in the recess at the time of initial pressurization, and the cross-sectional area of the cushioning material is continuously deformed with the pressurization. The film sticking apparatus according to claim 5, characterized in that: