JP2002038253A - Deposition shield and vacuum film-formation equipment therewith - Google Patents

Deposition shield and vacuum film-formation equipment therewith

Info

Publication number
JP2002038253A
JP2002038253A JP2000223990A JP2000223990A JP2002038253A JP 2002038253 A JP2002038253 A JP 2002038253A JP 2000223990 A JP2000223990 A JP 2000223990A JP 2000223990 A JP2000223990 A JP 2000223990A JP 2002038253 A JP2002038253 A JP 2002038253A
Authority
JP
Japan
Prior art keywords
deposition
plate
preventing
film
preventing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000223990A
Other languages
Japanese (ja)
Inventor
Hideyuki Shimizu
秀行 清水
Toshio Kaneshige
敏男 兼重
Norio Nishimura
則雄 西村
Teruo Watanabe
照男 渡辺
Shun Mikami
瞬 三上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Futaba Corp
Ulvac Inc
Original Assignee
Futaba Corp
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Futaba Corp, Ulvac Inc filed Critical Futaba Corp
Priority to JP2000223990A priority Critical patent/JP2002038253A/en
Publication of JP2002038253A publication Critical patent/JP2002038253A/en
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a more effective deposition shield which can be mounted easily without requiring much labor and time, and be stored without needing a wide space. SOLUTION: The deposition shield 21 for shielding a location other than a work-piece placed inside a body of an apparatus (such as a wall) from deposition of vaporized material, comprises being formed from a thin roll-shaped plate, having a concave or convexoconcave configuration on its surface 22 for preventing a film exfoliation, and consisting of an aluminum material of which the melting point is lower than that of the vaporized material.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電界放出形表示装
置(FED)、プラズマ表示装置(PDP)、有機エレ
クトロルミネッセンス(EL)表示装置等において、真
空蒸着装置やスパッタ装置等を用いて膜付けを行う際に
装置(チャンバー)内部壁面への膜付着を防止するため
の防着板及びこれを用いた真空成膜装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field emission display (FED), a plasma display (PDP), an organic electroluminescence (EL) display, and the like, which are used to form a film by using a vacuum evaporation apparatus or a sputtering apparatus. The present invention relates to a deposition-preventing plate for preventing a film from adhering to an inner wall surface of an apparatus (chamber) when performing the process, and a vacuum film forming apparatus using the same.

【0002】[0002]

【従来の技術】例えば電界放出形表示装置の製造工程に
おいて、ガラス基板上に金属薄膜による所定のパターン
を形成する場合、図1に示すような蒸着装置1が用いら
れている。
2. Description of the Related Art For example, in a manufacturing process of a field emission display device, when a predetermined pattern of a metal thin film is formed on a glass substrate, a vapor deposition device 1 as shown in FIG. 1 is used.

【0003】図1に示す蒸着装置1は、例えば装置内部
が真空に保たれた状態で、ハース2に設けられた蒸着材
料(ターゲット材料)3を抵抗加熱、電子ビーム加熱、
高周波誘導加熱により蒸発させ、上方に対向させたワー
クとしてのガラス基板4に付着させ、ガラス基板4の面
に所望のパターンを成膜する装置である。
In a vapor deposition apparatus 1 shown in FIG. 1, a vapor deposition material (target material) 3 provided on a hearth 2 is heated by resistance heating, electron beam heating, or the like, for example, while the inside of the apparatus is kept in a vacuum.
This is an apparatus that evaporates by high-frequency induction heating, adheres to a glass substrate 4 as a work facing upward, and forms a desired pattern on the surface of the glass substrate 4.

【0004】ところで、図1に示すような蒸着装置1を
用いて成膜を行う場合、蒸発した蒸着材料3が四方八方
に分散して広がり、蒸着材料3が100%ワークとして
のガラス基板4のみに到達する事ができず、装置内部の
壁面1aに付着してしまう。このため、多数のワークを
処理すると、装置内部の壁面1aに付着した材料が剥離
して装置内を汚し、さらに蒸着源等の電気系・メカ機構
への悪影響を及ぼす原因となる。
When a film is formed using the vapor deposition apparatus 1 as shown in FIG. 1, the vaporized vapor deposition material 3 is dispersed and spread in all directions, and the vapor deposition material 3 is 100% only on the glass substrate 4 as a work. And adheres to the wall surface 1a inside the device. For this reason, when a large number of workpieces are processed, the material adhering to the wall surface 1a inside the apparatus is peeled off and stains the inside of the apparatus, which further causes an adverse effect on electric and mechanical mechanisms such as a vapor deposition source.

【0005】そこで、従来、上述した問題を解決するた
め、蒸着材料3の蒸着経路を邪魔しない様にしながら、
装置内部の膜付けしたくない部分(装置内部の壁面1
a)を隠すための防着板と称する板を設けていた。この
種の従来の防着板は、一般的にSUS板等を用いて作製
される重量のある構造体からなり、その表面は付着した
膜が剥がれる事を防ぐ処理としてアルミ溶着等が施され
ていた。
Therefore, conventionally, in order to solve the above-mentioned problem, while not obstructing the deposition path of the deposition material 3,
Do not want to apply a film inside the device (wall 1 inside the device)
A plate called a deposition-proof plate for hiding a) was provided. This kind of conventional anti-adhesion plate is generally composed of a heavy structure manufactured using a SUS plate or the like, and its surface is subjected to aluminum welding or the like as a treatment for preventing the adhered film from peeling off. Was.

【0006】このような従来の防着板を用いた構成で
は、通常、ある一定枚数のワークを処理する毎に防着板
を取り外して装置内部を清掃し、装置内部を綺麗に保っ
ている。そして、装置内部の清掃後、予め準備された洗
浄処理済の交換用防着板又は新品の防着板を所定の場所
に取り付け、清掃時間の短縮を図っている。
In such a configuration using a conventional deposition-preventing plate, the deposition-preventing plate is usually removed and the inside of the apparatus is cleaned every time a predetermined number of workpieces are processed, so that the inside of the apparatus is kept clean. Then, after cleaning the inside of the apparatus, a replacement anti-adhesion plate that has been prepared in advance and that has been cleaned is attached to a predetermined location, thereby shortening the cleaning time.

【0007】ところが、従来用いられている防着板は、
装置内部の形状に合致した専用としており、パズルを組
むような状態で取り付けが行われる。このため、取付け
場所の防着板を探すのに時間を要し、組立てに手間と時
間がかかり、更には熱・洗浄により防着板が変形するお
それがあった。
[0007] However, conventionally used anti-adhesion plates are:
It is dedicated to match the shape of the inside of the device, and is attached in a state where a puzzle is assembled. For this reason, it takes time to search for the anti-adhesion plate at the mounting location, it takes time and effort to assemble, and the anti-adhesion plate may be deformed by heat and washing.

【0008】また、構造上複雑な場所への対応は、加工
の難しさと取付けの難しさから目をつむる状況にあっ
た。
[0008] In addition, in order to deal with a structurally complicated place, there has been a situation where eyes are closed due to difficulties in processing and mounting.

【0009】[0009]

【発明が解決しようとする課題】すなわち、上述した従
来の防着板を用いた構成では、以下に示すような種々の
問題点があった。
That is, the configuration using the above-mentioned conventional protection plate has various problems as described below.

【0010】従来の防着板は、重量のある複雑な構造体
からなり、取付け位置によって多種あるため、制作自体
に時間とコストがかかり、管理が大変なうえ、広い保管
場所が必要であり、取り扱いが面倒で取付けにも手間と
時間がかかる。
[0010] The conventional attachment-preventing plate is made of a heavy and complicated structure, and there are various types depending on the mounting position. Therefore, the production itself takes time and cost, is very difficult to manage, and requires a large storage space. Handling is troublesome and installation takes time and effort.

【0011】従来の防着板は、熱や洗浄によって変形し
た場合、取付けネジ等が合わない場合が多々ある。
[0011] When the conventional attachment-preventing plate is deformed by heat or washing, the mounting screws and the like often do not fit.

【0012】従来の防着板は、付着した膜を剥がれにく
くするため、表面に別途アルミ溶着を施す必要があっ
た。
[0012] In order to prevent the adhered film from peeling off, it is necessary to separately apply aluminum welding to the surface of the conventional protection plate.

【0013】従来の防着板では、複雑形状の場所に取り
付ける場合、防着板の加工が難しく、隙間が多くなり、
防着効果が低下する。従って、装置の清掃頻度が多くな
り稼働率も低下する。
[0013] In the case of a conventional deposition-preventing plate, when it is installed in a place having a complicated shape, it is difficult to process the deposition-preventing plate, and there are many gaps.
The protective effect is reduced. Therefore, the cleaning frequency of the apparatus increases and the operation rate decreases.

【0014】なお、一般家庭で用いられているようなア
ルミ薄を用いる事も従来行われているが、耐久性、耐温
度等の面で量産装置に用いる事は難しいという問題があ
った。
Although the use of aluminum thin as used in ordinary households has been conventionally performed, there is a problem that it is difficult to use it for mass production equipment in terms of durability and temperature resistance.

【0015】そこで、本発明は、上記問題点に鑑みてな
されたものであり、手間と時間を要することなく取付け
が行え、広い保管場所を必要とせずに管理でき、耐久
性、耐温度等の面でも量産装置に適しており、より効率
的な防着を実現できる防着板及びこれを用いた真空成膜
装置を提供することを目的としている。
Therefore, the present invention has been made in view of the above-mentioned problems, and can be mounted without requiring time and labor, can be managed without requiring a large storage space, and has a durability, a temperature resistance and the like. Another object of the present invention is to provide a deposition plate which is suitable for a mass production apparatus and can realize more efficient deposition, and a vacuum film forming apparatus using the same.

【0016】[0016]

【課題を解決するための手段】上記目的を達成するた
め、請求項1の発明は、装置本体の内部のワーク以外の
場所へのターゲット材料の付着を防止する防着板におい
て、ロール状の薄板で形成されたことを特徴とする。
In order to achieve the above-mentioned object, a first aspect of the present invention is to provide a deposition-preventing plate for preventing a target material from adhering to a place other than a work inside an apparatus main body. It is characterized by being formed by.

【0017】請求項2の発明は、請求項1の防着板にお
いて、表面が凹部形状又は凹凸部形状による膜剥がれ防
止面とされていることを特徴とする。
According to a second aspect of the present invention, there is provided the protection plate according to the first aspect, wherein the surface is formed as a film peeling prevention surface having a concave shape or an uneven shape.

【0018】請求項3の発明は、請求項1又は2の防着
板において、融点が前記ターゲット材料の融点よりも低
い材料からなることを特徴とする。
According to a third aspect of the present invention, there is provided the protection plate of the first or second aspect, wherein the material is formed of a material having a melting point lower than that of the target material.

【0019】請求項4の発明は、請求項1又は2の防着
板において、アルミ薄膜材料からなることを特徴とす
る。
According to a fourth aspect of the present invention, there is provided the protection plate according to the first or second aspect, wherein the protection plate is made of an aluminum thin film material.

【0020】請求項5の発明に係る真空成膜装置は、請
求項1〜4の防着板を用いたことを特徴とする。
According to a fifth aspect of the present invention, there is provided a vacuum film forming apparatus, wherein the deposition plate according to the first to fourth aspects is used.

【0021】[0021]

【発明の実施の形態】図1は本発明による防着板が採用
される蒸着装置の概略構成を示す図、図2(a),
(b)は本発明による防着板の実施の形態を示す部分拡
大斜視図、図3(a),(b)は本発明による防着板の
部分拡大断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a schematic configuration of a vapor deposition apparatus employing a deposition-preventing plate according to the present invention.
FIG. 3B is a partially enlarged perspective view showing an embodiment of a deposition prevention plate according to the present invention, and FIGS. 3A and 3B are partially enlarged sectional views of the deposition prevention plate according to the present invention.

【0022】まず、本発明による防着板が適用される蒸
着装置の概略構成について図1を参照しながら説明す
る。
First, a schematic configuration of a vapor deposition apparatus to which the deposition-preventing plate according to the present invention is applied will be described with reference to FIG.

【0023】図1に示す蒸着装置1は、強度の点から装
置本体(チャンバー)が円筒形状に構成されている。装
置本体の内部の底部にはハース2が設けられている。ハ
ース2には、例えばCr、Mo、Nb等のターゲット材
料としての蒸着材料3が設けられている。
The vapor deposition apparatus 1 shown in FIG. 1 has an apparatus main body (chamber) having a cylindrical shape from the viewpoint of strength. A hearth 2 is provided at the bottom inside the apparatus main body. The hearth 2 is provided with a vapor deposition material 3 as a target material such as Cr, Mo, Nb, or the like.

【0024】装置本体の内部の上方位置には、蒸着材料
3に対向してガラス基板(ワーク)4が基板ホルダー
(ワークホルダー)5に保持されている。なお、図1の
例では、一枚のガラス基板4が基板ホルダー5に保持さ
れた状態を示しているが、基板ホルダー5を複数設け、
各基板ホルダー5にガラス基板4を保持する構成として
もよい。
A glass substrate (work) 4 is held by a substrate holder (work holder) 5 at an upper position inside the apparatus main body so as to face the vapor deposition material 3. Although the example of FIG. 1 shows a state in which one glass substrate 4 is held by the substrate holder 5, a plurality of substrate holders 5 are provided.
It is good also as composition which holds glass substrate 4 in each substrate holder 5.

【0025】装置本体の内部で基板ホルダー5の上方に
は、ガラス基板4の温度を所望の温度に加熱するための
加熱ヒーター(加熱源)6が設けられている。
A heater (heating source) 6 for heating the glass substrate 4 to a desired temperature is provided above the substrate holder 5 inside the apparatus main body.

【0026】基板ホルダー5の下方には、ガラス基板4
に成膜される蒸着材料3を切り替えるためのシャッター
7が設けられている。なお、基板ホルダー5を複数備え
ている場合には、成膜を行うガラス基板4以外のガラス
基板4に蒸着材料3が行かないようにシャッター7の切
り替えを行うこともできる。
Below the substrate holder 5, a glass substrate 4
There is provided a shutter 7 for switching the deposition material 3 to be formed on the substrate. When a plurality of substrate holders 5 are provided, the shutter 7 can be switched so that the vapor deposition material 3 does not go to the glass substrate 4 other than the glass substrate 4 on which the film is formed.

【0027】装置本体の壁面1a(図1における左側壁
面)には、内部を所望のガス雰囲気にするためのガスを
導入するためのガス導入口8が設けられている。装置本
体の底面には、内部を真空状態に排気するため排気口9
が設けられている。
A gas inlet 8 for introducing a gas for bringing the inside into a desired gas atmosphere is provided on the wall surface 1a (the left wall surface in FIG. 1) of the apparatus main body. An exhaust port 9 is provided on the bottom of the apparatus main body to exhaust the inside to a vacuum state.
Is provided.

【0028】その他、装置本体の内部には、内部の真空
度を計測する真空計10やガラス基板4の面に成膜され
たパターンの膜厚を計測する膜厚計11が設けられてい
る。
In addition, a vacuum gauge 10 for measuring the degree of vacuum inside and a film thickness gauge 11 for measuring the film thickness of a pattern formed on the surface of the glass substrate 4 are provided inside the apparatus main body.

【0029】次に、上述した蒸着装置1に用いられる防
着板21の構成について図2および図3を参照しながら
説明する。図2(a),(b)本発明による防着板の実
施の形態を示す図であり、膜剥がれ防止面の形状の例を
示す部分拡大斜視図、図3(a),(b)は、本発明に
よる防着板の膜剥がれ防止面の断面形状の例を示す部分
拡大断面図(図2のA−A線断面図)である。
Next, the structure of the deposition-preventing plate 21 used in the vapor deposition apparatus 1 will be described with reference to FIGS. FIGS. 2 (a) and 2 (b) are views showing an embodiment of a deposition-preventing plate according to the present invention, and are partially enlarged perspective views showing examples of the shape of a film peeling prevention surface, and FIGS. 3 (a) and 3 (b) are FIG. 3 is a partially enlarged cross-sectional view (a cross-sectional view taken along the line AA in FIG. 2) showing an example of a cross-sectional shape of a film peeling prevention surface of the deposition-inhibiting plate according to the present invention.

【0030】本例の防着板21は、厚さ2mm以下のロ
ール状の薄板で形成されている。この防着板21は、ハ
サミ等を用いて自由に切断し、手で折り曲て複雑な形状
にも対応できるように、好ましくは0.5mm程度の厚
みの薄板で形成される。防着板21は、ターゲット材料
としてのCr、Mo、Nb等の蒸着材料3の融点よりも
低い材料で形成される。具体的には、薄くて軽量のAl
が防着板21の材料として用いられる。
The deposition-preventing plate 21 of this embodiment is formed of a roll-shaped thin plate having a thickness of 2 mm or less. The attachment-preventing plate 21 is preferably formed of a thin plate having a thickness of about 0.5 mm so that it can be cut freely using scissors or the like and bent by hand to cope with a complicated shape. The deposition prevention plate 21 is formed of a material lower than the melting point of the vapor deposition material 3 such as Cr, Mo, or Nb as a target material. Specifically, thin and lightweight Al
Is used as a material of the deposition-preventing plate 21.

【0031】防着板21の表面には、付着した膜(蒸着
材料3による膜)の剥がれ防止対策として、図3(a)
に示すようなエンボス加工による凹凸部22Aの形状、
又は図3(b)に示すような凹部22Bの形状からなる
膜剥がれ防止面22が形成されている。具体的に、凹凸
部22Aや凹部22Bの高さは1〜2mm程度となって
いる。
As a measure for preventing the adhered film (the film made of the vapor deposition material 3) from peeling off on the surface of the deposition-preventing plate 21, FIG.
The shape of the uneven portion 22A by embossing as shown in
Alternatively, the film peeling prevention surface 22 having the shape of the concave portion 22B as shown in FIG. 3B is formed. Specifically, the height of the concave and convex portions 22A and the concave portions 22B is about 1 to 2 mm.

【0032】膜剥がれ防止面22の凹凸部22Aや凹部
22Bの形状としては、図2(a)に示すような四角形
や図2(b)に示すような円形の他、例えば台形形状、
帯形状、十字形状等のような他の形状でもよく、特に形
状は問わないものである。
The shape of the concave and convex portions 22A and the concave portions 22B of the film peeling prevention surface 22 is not limited to a square as shown in FIG. 2A or a circle as shown in FIG.
Other shapes such as a band shape and a cross shape may be used, and the shape is not particularly limited.

【0033】また、凹凸部22Aや凹部22Bの配置と
しては、図2(a)に示すように縦横に所定間隔を空け
て整列させる他、図2(b)に示すように千鳥状に所定
間隔を空けて整列させて強度を上げる配置とすることも
できる。
As for the arrangement of the concave and convex portions 22A and the concave portions 22B, they are arranged at predetermined intervals in the vertical and horizontal directions as shown in FIG. 2A, and are arranged in a staggered pattern as shown in FIG. Can be arranged so as to increase the strength by separating them.

【0034】以上のように構成される防着板21を図1
に示す蒸着装置に用いる場合には、ハサミ等を用い、ロ
ール状の防着板21を装置内部の取付場所(壁面1a)
の形状に合わせて所望の大きさ切断し、取付場所の形状
が複雑な場合には、手で折り曲げ、その形状に合わせて
取り付けを行う。その後、装置内部を所望の雰囲気(例
えば真空状態)にし、ハース2に設けられた蒸着材料3
を抵抗加熱、電子ビーム加熱、高周波誘導加熱により蒸
発させ、ワークとしてのガラス基板4に付着させ、ガラ
ス基板4の面に所望のパターンを成膜する。その後、成
膜されたガラス基板4を装置内部から取り出し、新たに
ガラス基板4を基板ホルダー5に保持させ、同様の蒸着
作業を行う。この蒸着作業を所定回数繰り返し行い、そ
の後、装置内部に取り付けられた防着板21を取り外
し、新たに防着板21を取り付ける。
FIG. 1 shows the protective plate 21 constructed as described above.
In the case of using in a vapor deposition apparatus shown in (1), scissors or the like are used, and a roll-shaped deposition-preventing plate 21 is attached to the mounting location (wall surface 1a) inside the apparatus.
When the shape of the mounting location is complicated, the product is cut by a desired size and bent by hand, and mounting is performed according to the shape. Thereafter, the inside of the apparatus is set to a desired atmosphere (for example, a vacuum state), and the vapor deposition material 3 provided on the hearth 2 is formed.
Is evaporated by resistance heating, electron beam heating, and high-frequency induction heating, and is adhered to a glass substrate 4 as a work, and a desired pattern is formed on the surface of the glass substrate 4. Thereafter, the glass substrate 4 on which the film is formed is taken out from the inside of the apparatus, the glass substrate 4 is newly held by the substrate holder 5, and the same vapor deposition operation is performed. This vapor deposition operation is repeated a predetermined number of times. Thereafter, the deposition-preventing plate 21 attached inside the apparatus is removed, and a new deposition-preventing plate 21 is attached.

【0035】このように、本例における防着板21は、
薄膜でロール状に作製され、表面に台形、帯状、十字状
等のエンボス加工を施し、蒸着やスパッタ等の成膜目的
に設置されたガラス基板等のワーク(目標物)以外の場
所に付着する膜(蒸着材料3による膜)の剥離を抑制す
るとともに熱による変形を抑え、更には複雑形状への対
応を容易にし、簡単に取り扱え、リサイクルが可能なも
のである。
As described above, the protection plate 21 in this embodiment is
It is made of a thin film in the form of a roll. The surface is embossed in a trapezoid, band, cross, etc., and adheres to a place other than a work (target) such as a glass substrate installed for the purpose of film formation such as vapor deposition or sputtering. It suppresses peeling of the film (the film formed by the vapor deposition material 3), suppresses deformation due to heat, facilitates handling of complicated shapes, can be easily handled, and can be recycled.

【0036】したがって、本例の防着板21を用いた構
成によれば、以下に示すような効果を奏する。
Therefore, according to the structure using the deposition-preventing plate 21 of the present embodiment, the following effects can be obtained.

【0037】防着板21の交換作業の時間短縮等作業効
率が向上し、これにより防着板21を用いた真空成膜装
置のMTTR(平均修理時間)も短縮する。
The work efficiency is improved, for example, by shortening the time for replacing the deposition-preventing plate 21, and the MTTR (average repair time) of the vacuum film forming apparatus using the deposition-preventing plate 21 is also reduced.

【0038】従来のようなクリーニングによる産業廃棄
物発生(ブラスト材、薬品等)が無くなり、リサイクル
による防着板に付着した蒸着材料の再利用が可能とな
る。
The generation of industrial waste (blast material, chemicals, etc.) due to the conventional cleaning is eliminated, and the deposited material adhered to the deposition-preventing plate can be reused by recycling.

【0039】複雑な形状の機構部への装着が可能であ
り、保守性の向上を図ることができる。
It can be mounted on a mechanism having a complicated shape, and the maintainability can be improved.

【0040】防着板21の表面に凹凸部22Aや凹部2
2Bによる膜剥がれ防止面22が形成されているので、
表面に付着した膜が剥がれるのを防止でき、防着板21
を用いた真空成膜装置のMTBF(平均故障間隔時間)
の延長が図れる。
The surface of the attachment-preventing plate 21 is provided with uneven portions 22A and concave portions 2A.
Since the film peeling prevention surface 22 by 2B is formed,
It is possible to prevent the film attached to the surface from being peeled off,
MTBF (mean time between failures) of a vacuum film forming apparatus using
Can be extended.

【0041】リサイクル性も考慮して低融点材料である
アルミ薄膜板により防着板21を構成すれば、表面形状
を任意に凹凸や凹加工して膜剥がれ防止面22を形成で
き、取付場所に合わせてその場で切断し変形加工して取
り付けを比較的容易に行うことができる。しかも、主に
高融点材料を成膜する蒸着装置において、蒸着材料との
分離回収が容易に行え、地球環境影響への対応を考慮し
たリサイクルも可能である。
If the adhesion-preventing plate 21 is made of an aluminum thin plate which is a low-melting point material in consideration of recyclability, the surface peeling prevention surface 22 can be formed by arbitrarily making the surface shape uneven or concave, and the mounting position At the same time, it can be cut and deformed on the spot and mounted relatively easily. In addition, in a vapor deposition apparatus that mainly forms a high-melting-point material, separation and recovery from the vapor-deposited material can be easily performed, and recycling in consideration of the effect on the global environment is also possible.

【0042】なお、本例の防着板21は、型を用いての
成形、従来のSUS製防着板の様な板金加工も可能であ
り、加工性が良好である。
Incidentally, the deposition-preventing plate 21 of the present embodiment can be formed by using a mold and can be processed into a sheet metal like a conventional SUS deposition-preventing plate, and has good workability.

【0043】ところで、上記実施の形態の防着板及びこ
れを用いた真空成膜装置は、図1に示すような真空蒸着
装置に限らず、スパッタリング装置やCVD装置、ドラ
イエッチング装置に属する反応性イオンエッチング装置
等にも採用することが可能である。
Incidentally, the deposition-preventing plate of the above embodiment and the vacuum film forming apparatus using the same are not limited to the vacuum deposition apparatus as shown in FIG. The present invention can also be applied to an ion etching apparatus and the like.

【0044】[0044]

【発明の効果】以上の説明で明らかなように、本発明の
防着板によれば、ロール状の薄板で形成されるので、取
付け場所に合わせてその場で必要な大きさに切断して変
形加工でき、手間と時間を要することなく取付けを行う
ことができる。しかも、アルミ薄膜で形成すれば、簡単
に取り扱える上、広い保管場所を必要とせずに管理する
ことができる。これにより、耐久性、耐温度等の面でも
量産装置に適した防着板を提供することができる。
As is clear from the above description, according to the adhesion-preventing plate of the present invention, since it is formed of a roll-shaped thin plate, it is cut to the required size on the spot according to the mounting place. It can be deformed, and can be mounted without time and labor. In addition, when formed of an aluminum thin film, it can be easily handled and can be managed without requiring a large storage space. This makes it possible to provide a deposition-preventing plate that is suitable for mass production equipment in terms of durability, temperature resistance, and the like.

【0045】また、表面が凹部形状又は凹凸部形状によ
る膜剥がれ防止面とされているので、表面に付着した材
料が剥がれにくく、より効率的な防着が実現できる。従
って、本発明の防着板を用いた真空成膜装置のMTTR
やMTDFを大きく向上させることが可能となる。
Further, since the surface is formed as a surface for preventing film peeling due to the shape of the concave portion or the uneven portion, the material adhered to the surface is hardly peeled off, and more efficient deposition can be realized. Therefore, the MTTR of the vacuum film forming apparatus using the deposition-preventing plate of the present invention
And MTDF can be greatly improved.

【0046】更に、融点がターゲット材料の融点よりも
低い材料、例えばアルミ材料で形成すれば、主に高融点
材料を成膜する真空成膜装置において、成膜材料との分
離回収が容易に行え、地球環境影響への対応を考慮した
リサイクルが可能となる。
Further, if the target material is formed of a material having a lower melting point than that of the target material, for example, an aluminum material, it can be easily separated and recovered from the film forming material mainly in a vacuum film forming apparatus for forming a high melting point material. Therefore, recycling in consideration of the response to global environmental impact becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は本発明による防着板が採用される蒸着装
置の概略構成を示す図
FIG. 1 is a diagram showing a schematic configuration of a vapor deposition apparatus employing a deposition-preventing plate according to the present invention.

【図2】(a),(b)本発明による防着板の実施の形
態を示す図であり、膜剥がれ防止面の形状の例を示す部
分拡大斜視図
FIGS. 2 (a) and 2 (b) are views showing an embodiment of a deposition preventing plate according to the present invention, and are partially enlarged perspective views showing examples of a shape of a film peeling prevention surface.

【図3】(a),(b)本発明による防着板の膜剥がれ
防止面の断面形状の例を示す部分拡大断面図
FIGS. 3A and 3B are partially enlarged cross-sectional views showing an example of a cross-sectional shape of a film peeling prevention surface of a deposition-inhibiting plate according to the present invention.

【符号の説明】[Explanation of symbols]

1…蒸着装置、3…蒸着材料(ターゲット材料)、4…
ガラス基板(ワーク)、21…防着板、22…膜剥がれ
防止面、22A…凹凸部、22B…凹部。
DESCRIPTION OF SYMBOLS 1 ... Evaporation apparatus, 3 ... Evaporation material (target material), 4 ...
Glass substrate (work), 21: anti-adhesion plate, 22: film peel prevention surface, 22A: uneven portion, 22B: concave portion.

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成12年8月3日(2000.8.3)[Submission date] August 3, 2000 (2008.3.3)

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0045[Correction target item name] 0045

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0045】また、表面が凹部形状又は凹凸部形状によ
る膜剥がれ防止面とされているので、表面に付着した材
料が剥がれにくく、より効率的な防着が実現できる。従
って、本発明の防着板を用いた真空成膜装置のMTTR
やMTBFを大きく向上させることが可能となる。
Further, since the surface is formed as a surface for preventing film peeling due to the shape of the concave portion or the uneven portion, the material adhered to the surface is hardly peeled off, and more efficient deposition can be realized. Therefore, the MTTR of the vacuum film forming apparatus using the deposition-preventing plate of the present invention
And MTBF can be greatly improved.

フロントページの続き (72)発明者 兼重 敏男 千葉県茂原市大芝629 双葉電子工業株式 会社内 (72)発明者 西村 則雄 千葉県茂原市大芝629 双葉電子工業株式 会社内 (72)発明者 渡辺 照男 千葉県茂原市大芝629 双葉電子工業株式 会社内 (72)発明者 三上 瞬 神奈川県茅ヶ崎市萩園2500番地 日本真空 技術株式会社内 Fターム(参考) 4K029 CA01 CA05 DA10 4K030 KA12 KA46 5F103 AA01 BB60 DD28 LL01 RR01Continued on the front page (72) Inventor Toshio Kaneshige 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Co., Ltd. (72) Inventor Norio Nishimura 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Co., Ltd. (72) Inventor Watanabe Teruo 629 Oshiba, Mobara-shi, Chiba Futaba Electronics Industry Co., Ltd. DD28 LL01 RR01

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 装置本体の内部のワーク以外の場所への
ターゲット材料の付着を防止する防着板において、 ロール状の薄板で形成されたことを特徴とする防着板。
An anti-adhesion plate for preventing a target material from adhering to a place other than a work inside an apparatus body, wherein the anti-adhesion plate is formed of a roll-shaped thin plate.
【請求項2】 表面が凹部形状又は凹凸部形状による膜
剥がれ防止面とされていることを特徴とする請求項1記
載の防着板。
2. The anti-adhesion plate according to claim 1, wherein the surface has a surface for preventing film peeling due to a concave shape or an uneven shape.
【請求項3】 融点が前記ターゲット材料の融点よりも
低い材料からなることを特徴とする請求項1又は2記載
の防着板。
3. The deposition-preventing plate according to claim 1, wherein the melting point is made of a material having a melting point lower than that of the target material.
【請求項4】 アルミ薄膜材料からなることを特徴とす
る請求項1又は2記載の防着板。
4. The adhesion-preventing plate according to claim 1, wherein the plate is made of an aluminum thin film material.
【請求項5】 請求項1〜4の防着板を用いたことを特
徴とする真空成膜装置。
5. A vacuum film forming apparatus using the deposition-preventing plate according to claim 1.
JP2000223990A 2000-07-25 2000-07-25 Deposition shield and vacuum film-formation equipment therewith Pending JP2002038253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000223990A JP2002038253A (en) 2000-07-25 2000-07-25 Deposition shield and vacuum film-formation equipment therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000223990A JP2002038253A (en) 2000-07-25 2000-07-25 Deposition shield and vacuum film-formation equipment therewith

Publications (1)

Publication Number Publication Date
JP2002038253A true JP2002038253A (en) 2002-02-06

Family

ID=18718019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000223990A Pending JP2002038253A (en) 2000-07-25 2000-07-25 Deposition shield and vacuum film-formation equipment therewith

Country Status (1)

Country Link
JP (1) JP2002038253A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009091628A (en) * 2007-10-09 2009-04-30 Fujinon Corp Particle sticking preventive cover, vapor deposition system provided with the particle sticking preventive cover, and vapor deposition method
CN102069359A (en) * 2011-01-04 2011-05-25 宁波江丰电子材料有限公司 Method for processing defensive move plate structure
JP2012153942A (en) * 2011-01-26 2012-08-16 Ulvac Techno Ltd Sheet for film forming apparatus and method of manufacturing the same
WO2014065125A1 (en) * 2012-10-26 2014-05-01 富士フイルム株式会社 Anti-adhesive plate for vacuum film deposition apparatus, method of manufacturing anti-adhesive plate for vacuum film deposition apparatus, vacuum film deposition apparatus, and vacuum film deposition method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239951A (en) * 1984-05-15 1985-11-28 Matsushita Electric Ind Co Ltd Vacuum deposition device
JPH02141575A (en) * 1988-11-21 1990-05-30 Anelva Corp Thin film depositing device
JPH04289159A (en) * 1991-03-19 1992-10-14 Fujitsu Ltd Deposition preventing device in film forming device
JPH0593261A (en) * 1991-01-31 1993-04-16 Sumitomo Heavy Ind Ltd Mechanism for preventing contamination of ion plating apparatus
JPH05222520A (en) * 1992-02-06 1993-08-31 Ishikawajima Harima Heavy Ind Co Ltd Film forming system
JPH0719361U (en) * 1993-09-08 1995-04-07 日本板硝子株式会社 Earth shield structure of film forming equipment
JPH0724971U (en) * 1993-10-06 1995-05-12 三菱重工業株式会社 Vacuum container
JPH10298737A (en) * 1997-04-25 1998-11-10 Japan Energy Corp Contamination preventing material for thin film forming device, thin film forming device and formation of thin film

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60239951A (en) * 1984-05-15 1985-11-28 Matsushita Electric Ind Co Ltd Vacuum deposition device
JPH02141575A (en) * 1988-11-21 1990-05-30 Anelva Corp Thin film depositing device
JPH0593261A (en) * 1991-01-31 1993-04-16 Sumitomo Heavy Ind Ltd Mechanism for preventing contamination of ion plating apparatus
JPH04289159A (en) * 1991-03-19 1992-10-14 Fujitsu Ltd Deposition preventing device in film forming device
JPH05222520A (en) * 1992-02-06 1993-08-31 Ishikawajima Harima Heavy Ind Co Ltd Film forming system
JPH0719361U (en) * 1993-09-08 1995-04-07 日本板硝子株式会社 Earth shield structure of film forming equipment
JPH0724971U (en) * 1993-10-06 1995-05-12 三菱重工業株式会社 Vacuum container
JPH10298737A (en) * 1997-04-25 1998-11-10 Japan Energy Corp Contamination preventing material for thin film forming device, thin film forming device and formation of thin film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009091628A (en) * 2007-10-09 2009-04-30 Fujinon Corp Particle sticking preventive cover, vapor deposition system provided with the particle sticking preventive cover, and vapor deposition method
CN102069359A (en) * 2011-01-04 2011-05-25 宁波江丰电子材料有限公司 Method for processing defensive move plate structure
CN102069359B (en) * 2011-01-04 2012-12-19 宁波江丰电子材料有限公司 Method for processing defensive move plate structure
JP2012153942A (en) * 2011-01-26 2012-08-16 Ulvac Techno Ltd Sheet for film forming apparatus and method of manufacturing the same
WO2014065125A1 (en) * 2012-10-26 2014-05-01 富士フイルム株式会社 Anti-adhesive plate for vacuum film deposition apparatus, method of manufacturing anti-adhesive plate for vacuum film deposition apparatus, vacuum film deposition apparatus, and vacuum film deposition method

Similar Documents

Publication Publication Date Title
JP4693002B2 (en) Arc ion plating equipment
KR100800223B1 (en) Arc ion plating apparatus
WO2015041296A1 (en) Film-forming mask and touch panel substrate
JP2002069611A (en) Method for extending line in re-using treatment kit
JP2007297704A (en) Deposition apparatus, deposition method, method of manufacturing of electro-optical apparatus and film-forming apparatus
TW380278B (en) Back sputtering shield
JP2002038253A (en) Deposition shield and vacuum film-formation equipment therewith
JP2002371351A (en) Film forming apparatus
CN102400108B (en) Thin film deposition machine and bearing part thereof
JP2004214015A (en) Deposition mask, deposition method, manufacturing method of organic el panel, and organic el display panel
US20090056625A1 (en) Shielding member of processing system
JP5907977B2 (en) Apparatus and method for coating the surface of a substrate
JP5779491B2 (en) Target device, sputtering device, and method of manufacturing target device
TW201634717A (en) Masking arrangement for masking a substrate during a deposition process, deposition apparatus for layer deposition on a substrate, and method for cleaning a masking arrangement
US20100055348A1 (en) Deposition apparatus and deposition method
KR101293129B1 (en) Sputtering apparatus
JP2007224376A (en) Vacuum vapor deposition apparatus and method
JP2009097063A (en) Vacuum deposition system
TWI523964B (en) In-line sputtering apparatus
KR20140106143A (en) Anti-Finger print Boat
JP2009024195A (en) Tray for masking, and film-forming apparatus and film-forming method using the same
JP2005113159A (en) Vapor deposition apparatus
KR100980258B1 (en) The dome for fixing deposition products in the deposition device of multi-layer film
TWM653571U (en) Auxiliary target structure for semiconductor sputtering equipment
WO2010049279A1 (en) A vacuum vapor coating device for coating a substrate

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070725

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100817

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101221