JP2002033344A - 半導体の樹脂封止及びその製造装置 - Google Patents

半導体の樹脂封止及びその製造装置

Info

Publication number
JP2002033344A
JP2002033344A JP2000218369A JP2000218369A JP2002033344A JP 2002033344 A JP2002033344 A JP 2002033344A JP 2000218369 A JP2000218369 A JP 2000218369A JP 2000218369 A JP2000218369 A JP 2000218369A JP 2002033344 A JP2002033344 A JP 2002033344A
Authority
JP
Japan
Prior art keywords
resin
curing
coated
semiconductor
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000218369A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002033344A5 (enrdf_load_stackoverflow
Inventor
Yasumasa Morita
康正 森田
Kimihiro Iritono
公浩 入戸野
Susumu Kiyokawa
清川　　晋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Misato Co Ltd
Original Assignee
Stanley Electric Co Ltd
Misato Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd, Misato Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2000218369A priority Critical patent/JP2002033344A/ja
Publication of JP2002033344A publication Critical patent/JP2002033344A/ja
Publication of JP2002033344A5 publication Critical patent/JP2002033344A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2000218369A 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置 Pending JP2002033344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000218369A JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000218369A JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Publications (2)

Publication Number Publication Date
JP2002033344A true JP2002033344A (ja) 2002-01-31
JP2002033344A5 JP2002033344A5 (enrdf_load_stackoverflow) 2007-09-06

Family

ID=18713331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000218369A Pending JP2002033344A (ja) 2000-07-19 2000-07-19 半導体の樹脂封止及びその製造装置

Country Status (1)

Country Link
JP (1) JP2002033344A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535001A (ja) * 2018-08-24 2021-12-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドPPG Industries Ohio, Inc. 成形されたポリマー物品を調製するための方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535001A (ja) * 2018-08-24 2021-12-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッドPPG Industries Ohio, Inc. 成形されたポリマー物品を調製するための方法

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