JP2002030482A - Chemical treating apparatus and chemical treating method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the wasteful outflow of a plating solution in a plating treating apparatus in which a tape with a width of 158 mm is subjected to plating treatment while being carried in a vertical state and further to make bubbles hard to be entangled in a plating solution. SOLUTION: A plating solution jetted to the inside of an internal treating tank 43 is applied on the surface layer of tape 57 in the process of passing through the inside of the internal treating tank 43. The greater part of the plating solution jetted to the inside of the internal treating tank 43 is recovered into a plating solution tank via an internal drain tube 70 with hardly entangling bubbles. The remaining plating solution flows out into an external treating tank 42 via a slit 52 in the internal treating tank 43 and first to third intermediate treating tanks 44, 45 and 46 and is recovered into the plating solution tank via an intermediate drain tube 74 and an external drain tube 71, and its flowout from the slit 51 of the external treating tank 42 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical processing apparatus for performing plating, etching, and the like, and a chemical processing method using the same.

[0002]

2. Description of the Related Art A plating apparatus, which is one of chemical processing apparatuses, includes a long tape having a surface layer such as a lead wiring made of copper or aluminum on a surface in a semiconductor technology such as BGA, CSP and COF. In some cases, the surface layer of the tape is electroplated with gold, copper, nickel, or the like while transporting the tape vertically, that is, with the tape width direction vertical.

FIG. 12 is a schematic diagram showing an example of such a conventional plating apparatus. In this plating apparatus, a plurality of plating units 1 are arranged in series. The plating unit 1 includes an external processing tank 2 as shown in FIGS. An internal processing tank 3 is provided at a central portion in the external processing tank 2, and a lid 4 is provided at an upper portion of the external processing tank 2. In this case, the bottom of the external processing tank 2 also serves as the bottom of the internal processing tank 3. 13 and 14 of the external processing tank 2 are provided with slits 5 and 6 formed of vertically long rectangular holes at predetermined positions on the left side wall and the right side wall, respectively. Slits 7 and 8 formed of vertically elongated grooves are provided at predetermined positions on the left side wall and the right side wall in FIGS. 13 and 14 of the internal processing tank 3. Internal processing tank 3
14 is slightly lower than the left side wall and the right side wall in FIG. 14 (see FIG. 13).
An anode electrode 10 is provided at a predetermined location in the internal processing tank 3.

A transport roller 11 and an electrode roller (cathode electrode) 12 are opposed to each other in a roller chamber (not shown) provided between the external processing tanks 2 and on the left side of the leftmost external processing tank 2 in FIG. It is provided. FIG.
A supply reel (not shown) is provided on the left side of the leftmost roller chamber in FIG. The supply reel is wound with a tape 13 made of a metal foil such as copper or aluminum and formed with a circuit pattern and a plating pattern for connecting the circuit patterns as a surface layer.

[0005] The tape 13 fed from the supply reel
After passing through a plurality of plating units 1 sequentially, it is wound on a take-up reel (not shown) provided on the right side of the rightmost plating unit 1 in FIG. In this case, in each plating section 1, the tape 13 is provided between the transport roller 11 and the electrode roller 12 in the roller chamber, the slit 5 of the external processing tank 2, the slits 7 and 8 of the internal processing tank 3, and the external processing tank 2. Through the slits 6 sequentially. Further, although not shown, in order to prevent poor contact between the electrode roller 12 and the surface layer of the tape 13 and prevent sparking, pure water in a pure water tank is pumped up and the electrode roller is showered. The pure water after spraying on the contact portion between the tape 12 and the tape 13 is collected in a pure water tank via a drain pipe.

A supply pipe 21 is provided at the center of the bottom of the internal processing tank 3.
Are connected at one end. In the middle of each supply pipe 21, a flow sensor 22 and a pump 23 are interposed. The pump 23 is controlled by the control unit 2 based on the flow signal of the flow sensor 22.
4 is driven. The other end of each supply pipe 21 is connected to a common plating solution tank 26 via a common supply pipe 25. Common plating solution tank 26
The inside contains a plating solution 27. Drain pipes 28 and 29 are provided at the bottom of the external processing tank 2 between the slits 5 and 6 of the external processing tank 2 and the slits 7 and 8 of the internal processing tank 3.
Are connected at one end. The other end of each drain tube 28, 29 is connected to a common plating solution tank 26 via a common drain tube 30.

Next, the operation of the plating apparatus will be described. The tape 13 fed from the supply reel is
When the plurality of transport rollers 11 are rotated in a predetermined direction, the transport rollers 11 sequentially pass through the plurality of internal processing tanks 3 and are taken up on a take-up reel. At this time, when each pump 23 is driven, the plating solution 27 in the common plating solution tank 26 is jetted into each internal processing tank 3 through the common supply pipe 25 and each supply pipe 21, and the inside of each internal processing tank 3 is discharged. It is applied to the surface layer of the passing tape 13. Then, the anode electrode 10 and the electrode roller 1
When a plating current flows between the tapes 2 and 3, the surface layer of the tape 13 passing through each internal processing tank 3 is plated. The plating solution 27 jetted into each internal processing tank 3 overflows from the overflow section 9 of each internal processing tank 3 and flows out into each external processing tank 2, and flows through each drain pipe 28, 29 and the common drain pipe 30. It is collected in the common plating solution tank 26 through the same.

The width of the slits 5 and 6 of the external processing tank 2 and the width of the slits 7 and 8 of the internal processing tank 3
Is considerably larger than the thickness, for example, about 10 mm. The reason why the width of the slits 5 to 8 is increased in this way is that even if the tape 13 dances in the plating solution 27 jetted into the internal processing tank 3, the surface layer of the tape 13 This is to prevent contact with the inner wall surface.
As a result, the plating solution 27 jetted into each internal processing tank 3
Not only overflows from the overflow section 9 of each internal processing tank 3 and flows out into the external processing tank 2, but also flows out into the external processing tank 2 from the slits 7 and 8 of each internal processing tank 3.

On the other hand, the tape 13 generally has a width of 35 mm, 48 mm and 70 mm. In the case of such a tape 13, since the width is relatively small, the height (depth) of the internal processing tank 3 is relatively low (shallow).
The length of the slits 7 and 8 in the vertical direction may be relatively short. For this reason, the amount of the plating solution 27 flowing out of the slits 7 and 8 of the internal processing tank 3 into the external processing tank 2 is relatively small and the power of the plating solution 27 is relatively weak. It hardly escapes into the room.

Recently, attempts have been made to use a relatively wide tape, for example, 158 mm wide. However, in the case of such a tape, since the width is relatively large, the height (depth) of the internal processing tank 3 is relatively high (deep), and the vertical length of the slits 7 and 8 is also relatively large. become longer. As a result, the internal processing tank 3
The amount of the plating solution 27 flowing out of the slits 7 and 8 into the external processing tank 2 is relatively large, and the force of the plating solution 27 is relatively strong. The plating liquid 27 flows out of the slits 5 and 6 of the external processing tank 2 into the roller chamber. . When the plating solution 27 flows into the roller chamber, the plating solution 27 is wasted and not only increases the cost, but also the plating solution 27 is mixed into the pure water in the pure water tank.
The surface of the electrode roller 12 is plated by the spray of the mixed liquid, and a problem occurs in electrical contact.

When the width of the tape 13 is relatively large, the height (depth) of the internal processing tank 3 is relatively high (deep), and the vertical length of the slits 7 and 8 is relatively long, The amount of the plating solution 27 flowing out from the slits 7 and 8 of the internal processing tank 3 into the external processing tank 2 is relatively large, so that the outflow momentum becomes relatively strong. The difference in elevation when overflowing into the processing tank 2 becomes relatively large, and in any case, bubbles containing oxygen and the like are easily trapped. On the other hand, for example, when the plating of the surface layer is gold plating, the plating solution includes a cyan plating solution and a non-cyan plating solution. In the case of the non-cyan plating solution, bubbles containing oxygen and the like are involved. In this case, the life is significantly shortened.

[0012]

An object of the present invention is to prevent a chemical solution such as a plating solution from flowing out of a slit of an external processing tank. Another object of the present invention is to prevent bubbles including oxygen and the like from being entrained in a chemical solution such as a plating solution even when the height (depth) of the internal processing tank is relatively high (deep). .

[0013]

According to a first aspect of the present invention, there is provided a chemical treatment apparatus for carrying in and out a tape provided in an external processing tank and for carrying in a tape provided in an internal processing tank. And a chemical treatment apparatus for chemically treating a surface layer of a tape passing through an opening for carrying out a tape with a chemical solution jetted into the internal processing tank, wherein first and second intermediate portions are provided outside the internal processing tank. A tank is provided, an external drain hole and an intermediate drain hole are provided at the bottom of the external processing tank and the bottom of the first intermediate tank, and a flow regulating means is provided in the second intermediate tank. Claim 1
In the chemical treatment method according to the fifth aspect of the present invention, the tape may be inserted into an opening for carrying in and out of the tape provided in the external processing tank and a opening for carrying in and out of the tape provided in the internal processing tank. In the chemical treatment method of performing a chemical treatment on the surface layer of the tape with a chemical solution ejected into the internal treatment tank, a first layer may be provided outside the internal treatment tank.
And a second intermediate tank, an external drain hole and an intermediate drain hole are provided at the bottom of the external processing tank and the bottom of the first intermediate tank, and a flow regulating means is provided in the second intermediate tank. The flow rate regulating means regulates the amount of the chemical liquid flowing out of the second intermediate tank to the external processing tank, and discharges the chemical liquid, which has been jetted into the internal processing tank to treat the surface layer of the tape, to the external drain hole. And recovering from the intermediate drain hole. According to the first or fifteenth aspect of the present invention, the flow rate of the chemical liquid flowing from the internal processing tank through the first intermediate tank into the second intermediate tank to the external processing tank is controlled by the flow rate regulating means. Regulation, and a part of the chemical solution in the internal processing tank is recovered through the intermediate drain hole, and the rest is recovered through the external drain hole. Therefore, it is possible to prevent the chemical solution from flowing out from the slit of the external processing tank. In addition, the first
The flow rate of the chemical liquid flowing into the second intermediate tank through the intermediate tank to the external processing tank is regulated by the flow rate regulating means, and a part of the chemical liquid in the internal processing tank is recovered through the intermediate drain hole. By collecting the remainder through the external drain hole, even if the height (depth) of the internal processing tank is relatively high (deep), bubbles containing oxygen and the like are entrained in the chemical liquid such as the plating liquid. It can be difficult.

[0014]

FIG. 1 is a schematic block diagram of a plating apparatus according to a first embodiment of the present invention. In this plating apparatus, a plurality of plating sections 41
Are arranged in series. The plating unit 41 includes an external processing tank 42 as shown in FIG. An internal processing tank 43 is provided at a central portion in the external processing tank 42. In this case, the bottom of the external processing tank 42, and the upper and lower walls in FIG. 2 also serve as the bottom, upper and lower walls of the internal processing tank 43. The first to third intermediate tanks 44 to 43 are provided outside the central portions of the left side wall and the right side wall of the internal processing tank 43.
46 are provided. A lid 4 is provided above the external processing tank 42.
7 are provided. An anode electrode 48 is provided at a predetermined location in the internal processing tank 43.

A slit (opening) 51 (see FIG. 4) composed of a vertically long rectangular hole is provided at each predetermined position on the left side wall and the right side wall in FIG. 2 of the external processing tank 42. Slits 52 (see FIG. 4) formed of vertically elongated rectangular holes are provided at predetermined positions on the left side wall and the right side wall of the internal processing tank 43 in FIG. Slits 53 (see FIG. 4) formed of vertically elongated rectangular holes are provided at predetermined positions on the left side wall and the right side wall of the second intermediate tank 45 in FIG.
A slit 54 (see FIG. 4) formed of a vertically long groove is provided at a predetermined position of the third intermediate tank 46.

A transport roller 55 and an electrode roller (cathode electrode) 56 are opposed to each other in a roller chamber (not shown) provided between the external processing tanks 42 and on the left side of the leftmost external processing tank 42 in FIG. It is provided. A supply reel (not shown) is provided on the left side of the leftmost roller chamber in FIG. On the supply reel,
A tape 57 made of a metal foil such as copper or aluminum and having a circuit pattern and a plating pattern for connecting the circuit pattern formed as a surface layer is wound thereon.

The tape 57 fed from the supply reel
After passing through a plurality of plating units 41 in sequence, it is wound on a take-up reel (not shown) provided on the right side of the rightmost plating unit 41 in FIG. In this case, in each plating section 41, the tape 57 is provided between the transport roller 55 and the electrode roller 56 in the roller chamber and the slits 5 of the tanks 42, 43, 45, and 46.
1, 52, 53, and 54. Although not shown, the tape 5 by the electrode roller 55
In order to prevent poor contact with the surface layer of No. 7 and prevent sparks from being generated, pure water in a pure water tank is pumped up by a pump and sprayed onto a contact portion between the electrode roller 56 and the tape 57 by a shower, so that a roller chamber is formed. The pure water after spraying is collected in a pure water tank via a drain pipe.

A plating solution tank 61 is provided below each external processing tank 42. A plating solution 62 is contained in the plating solution tank 61. A supply hole is provided at the center of the bottom of the internal processing tank 43, and the supply pipe 6 is provided in the supply hole.
3 is connected to one end. Each supply pipe 63 extends through the bottom (or side wall) of the corresponding plating solution tank 61 in a liquid-tight manner and extends to the outside of the plating solution tank 61. A flow sensor 64 and a pump 65 are provided in the middle of the extension. Intervened. The pump 65 is driven under the control of the control unit 66 based on the flow signal of the flow sensor 64. The other end of each supply pipe 63 is connected to the bottom of the corresponding plating solution tank 61.

As shown in FIG. 2, the plating section 41 has a symmetrical structure. So, next,
As a representative, the right part of FIG. 2 will be described with reference to FIGS. An internal drain hole is provided at the bottom inside the slit 52 of the internal processing tank 43, and the upper end of the internal drain tube 70 is connected to the internal drain hole. The lower end of the internal drain tube 70 is immersed in the plating solution 62 in the corresponding plating solution tank 61. An external drain hole is provided at a predetermined location on the bottom of the external processing tank 42, and one end of an external drain tube 71 is connected to the external drain hole. A valve 72 is provided in the middle of the external drain tube 71. The other end of the external drain tube 71 is connected to the corresponding plating solution tank 6.
Plating solution 6 housed in the inside of one side wall
2 is connected to a portion below the liquid level.

The first intermediate tank 44 includes a bottom portion of the external processing tank 42, a right wall of the internal processing tank 43, a left wall of the second intermediate tank 45, and a left wall of the second intermediate tank 45. Processing tank 43
And a pair of partition walls 73 provided between the right side wall and the right side wall. In this case, the height of the partition wall 73 is the same as the height of the internal processing tank 43. An intermediate drain hole is provided at the center of the bottom of the intermediate tank 44, and one end of an intermediate drain tube 74 is connected to the intermediate drain hole. In the middle of the intermediate drain tube 74, a valve (drain amount adjusting means) 75 is provided. Intermediate drain tube 74
Is connected to a portion of the side wall of the corresponding plating solution tank 61 which is lower than the level of the plating solution 62 contained therein.

The second intermediate tank 45 has a structure in which an upper support plate 77 and a lower support plate 78 are provided at upper and lower portions of a rectangular tubular portion 76. In this case, the height of the second intermediate tank 45 is slightly lower than the height of the internal processing tank 43. A pair of flow regulating rollers 79 are arranged on both sides of the tape transport path in the rectangular tubular portion 76. A portion corresponding to the tape 57 of the pair of flow regulating rollers 79 is a small diameter portion 79a, which is substantially I-shaped as a whole. Upper shaft 79b and lower shaft 79c of one flow regulating roller 79
Is rotatably supported by the upper support plate 77 and the lower support plate 78 at a position close to the main body so as to substantially contact the wall surface 76a of the rectangular tubular portion 76. The upper shaft 79b and the lower shaft 79c of the other flow regulating roller 79 are provided on the upper support plate 77 and the lower support plate 78 at positions close to each other so that the main body thereof substantially contacts the wall surface 76a of the intermediate tank 44. It is rotatably supported by the circular holes 77a and 78a and movably in the left-right direction in FIG.

That is, one of the pair of flow regulating rollers 79 is rotatably provided at a position fixed relative to the tape 57, and the other is rotatable so as to be close to and away from the tape 57. It is provided in. With such a configuration, the tape 57 can be inserted between the pair of flow regulating rollers 79 while holding the other flow regulating roller 79 at a position separated from the one flow regulating roller 79. Here, in a state in which the other flow regulating roller 79 is pressed against one flow regulating roller 79, the interval between the small diameter portions 79 a of the pair of flow regulating rollers 79 is the tape 5.
7 is about 1 mm larger.

The third intermediate tank 46 comprises the bottom of the external processing tank 42, the right side wall of the second intermediate tank 45, and a substantially U-shaped damming wall 81 in a plane. In this case, the height of the dam wall 81 is a height corresponding to a substantially central portion of the slit 53 of the third intermediate tank 46 in the vertical direction. A rectangular opening 82 is provided at a predetermined position below the upper wall and the lower wall in FIG. 3 of the dam wall 81, and a shutter (outflow amount adjusting means) 83 is provided outside the opening 82 so as to be vertically movable. ing. The shutter 83 is fixed at an arbitrary height position by screwing a screw 85 inserted into a vertically long slit 84 provided in the shutter 83 into the damming wall 81, and adjusting the opening amount of the opening 82. Can be done.

Here, the width of the tape 57 is, for example, 158 m.
m, which is relatively large. For this reason, the internal processing tank 4
3 is relatively high (deep), and the slit 52
Is also relatively long. Also, the slits 51, 5 and 5 of the external processing tank 42 and the second intermediate tank 45 are provided.
The vertical length of 3 is the same as the length of the slit 52 of the internal processing tank 43. The height position of the bottom surface of the slit 54 of the third intermediate tank 46 is different from the other slits 51 to 53.
And the same height position as the bottom. Further, the width of the slit 51 of the external processing tank 42 is about 10 to 12 mm, and the width of the slit 52 of the internal processing tank 43 is 5 to 6 mm.
mm, the width of the slit 53 on the left side of the second intermediate tank 45 is about 2 to 3 mm, and the width of the slit 53 on the right side of the second intermediate tank 45 is about 4 to 5 mm. And the width of the slit 54 of the third intermediate tank 46 is 5
It is about 6 mm.

Next, the operation of the plating apparatus will be described. The tape 57 fed from the supply reel is
When the plurality of transport rollers 55 are rotated in a predetermined direction, the transport rollers 55 sequentially pass through the plurality of internal processing tanks 43 and are taken up on a take-up reel. At this time, when each pump 65 is driven, the plating solution 62 in each plating solution tank 61 is jetted into each internal processing tank 43 through each supply pipe 63, and each of the internal processing tanks 43 is discharged.
It is applied to the surface layer of the tape 57 passing therethrough. Then, when a plating current flows between the anode electrode 49 and the electrode roller 56, plating is performed on the surface layer of the tape 57 passing through each internal processing tank 43.

Here, the reason why the plating section 41 is divided into a plurality of sections will be described. In order to transport and plate the tape 57 at a predetermined speed, a plating time corresponding to the plating thickness to be formed is required, and the plating processing length of the tape 57 is a length corresponding to the plating time. Since the application of voltage to the pattern formed on the tape 57 is performed by the electrode roller (cathode electrode) 56, when the plating process length of the tape 57 is increased, the vicinity of the electrode roller 56 and the electrode roller 56 are determined by the resistance value of the pattern. This is because the difference between the voltage at the central portion and the variation in the plating thickness becomes large, so that the plating section 41 is divided into a plurality of sections and the distance between the electrode rollers 56 is shortened.

The plating solution 6 jetted into the internal processing tank 43
Most of 2 is collected in the plating solution tank 61 via the internal drain tube 70. In this case, even if the height of the internal processing tank 43 is relatively high, most of the plating solution 62 jetted into the internal processing tank 43 does not overflow into the plating solution tank 61 without overflowing to the outside of the internal processing tank 3. Since it is collected, bubbles containing oxygen and the like are hardly involved. Also, since the lower end of the internal drain tube 70 is immersed in the plating solution 62 in the plating solution tank 61, air bubbles are hardly involved here.

On the other hand, a part of the plating solution 62 jetted into the internal processing tank 43 flows into the first intermediate tank 44 through the slit 52 of the internal processing tank 43, and a pair of flow regulating rollers described later. 79, the first intermediate tank 4
4 temporarily stored. Then, the first intermediate tank 44
A part of the plating solution 62 that has flowed into the
4 and is collected in the plating solution tank 61. At this time, if the amount of the plating solution 62 stored in the intermediate drain tube 74 is too small, the plating solution 6
2 is not filled and air is partially present, so that bubbles are trapped in the plating solution 62. If the amount of the plating solution 62 stored in the first intermediate tank 44 is too large, the amount flowing into the second intermediate tank 45 from the slit 53 increases, which is caused by the second intermediate tank 45, as described later. This increases the amount of bubbles involved when the plating solution 62 flows out of the tank 45. For this reason, it is necessary that an appropriate amount of the plating solution 62 is always stored in the first intermediate tank 44. A valve 75 provided in the middle of the intermediate drain pipe 74 is for adjusting the amount of the plating solution 62 stored in the first intermediate tank 44. The plating solution 62 stored in 44 is maintained at an appropriate amount.

As a result, even if the height of the internal processing tank 43 is relatively high, the plating solution 62 in the internal processing tank 43 passes through the first slit 52 through the slit 52, as shown by a dashed line in FIG.
The intermediate drain 44 is relatively slowly flowed into the intermediate tank 44 and is temporarily stored therein. Even if air bubbles are involved in the intermediate tank 44, the amount thereof can be considerably reduced. Since it is connected to a portion of the side wall in the solution tank 61 below the level of the plating solution 62 contained therein, bubbles are hardly trapped here.

On the other hand, the remainder of the plating solution 62 flowing into the first intermediate tank 44 flows into the second intermediate tank 45 through the slit 53 on the left side of the second intermediate tank 45. The flow rate of the plating solution 62 flowing into the second intermediate tank 45 is regulated by the pair of flow regulation rollers 79 toward the right slit 53.

Here, the function of the pair of flow regulating rollers 79 will be described. As described above, it is necessary to always store an appropriate amount of the plating solution 62 in the first intermediate tank 44 in order to reduce bubbles trapped in the plating solution 62 flowing out of the first intermediate tank 44. is there. For this reason, the left slit 53 is provided from the first intermediate tank 44 to the second intermediate tank 45.
, The plating solution 62 always flows. Slit 5
A tape 57 is conveyed to substantially the center of the third intermediate tank 3, and the plating solution 62 flows vigorously around the tape 57.
3 spills out vigorously, at which time many bubbles are involved. The function of the pair of flow regulating rollers 79 is as follows.
The purpose is to reduce the plating solution 62 flowing out of the slit 53 on the right side of the intermediate tank 45 to reduce the amount of bubbles involved. At this time, when the surface layer of the tape 57 is a lead wiring or the like made of metal, when the tip of the tape 57 drawn out from the supply reel is inserted between the pair of flow rate regulating rollers 79, the pair of flow rate regulating rollers 79 is used. If the distance between the rollers 79 is small, the insertion work becomes difficult, and the surface layer of the tape 57 comes into contact with the pair of flow regulating rollers 79 to be deformed or deteriorated. For this reason, as described above, the other of the pair of flow regulating rollers 79 can be moved toward and away from the tape 57, and the position where the other flow regulating roller 79 is separated from the one flow regulating roller 79. And the tape 57 can be inserted between the pair of flow regulating rollers 79.

Then, in this state, the plating solution 62 flowing from the first intermediate tank 44 into the second intermediate tank 45 is reduced by the small diameter portion 79a of each flow rate regulating roller 79 and the wall surface 76b of the square tubular portion 76. And the other of the pair of flow regulating rollers 79 is moved to the one flow regulating roller 79 side by the flow pressure of the plating solution 62,
Is pressed against. Therefore, the plating solution 62 that has flowed into the second intermediate tank 45 forms a gap between the small-diameter portions 79a of the pair of flow regulating rollers 79 and a gap between each of the flow regulating rollers 79 and the wall surface 76a of the square tubular portion 76. After passing through the gap, it flows out of the right slit 53 into the third intermediate tank 46.

When the other flow regulating roller 79 is pressed against the one flow regulating roller 79, the plating solution 62 causes the respective flow regulating rollers 79 to move along the flow of the plating solution 62, respectively. While flowing in the direction indicated by the arrow in FIG. 3, the air flows through the gap between the small diameter portions 79 a of the pair of flow regulating rollers 79.
The smaller the gap between the small diameter portions 79a, the smaller the flow rate of the plating solution 62 flowing therethrough. Further, since each of the flow regulating rollers 79 is located at a position substantially in contact with the wall surface 76a, the flow rate of the plating liquid 62 flowing between each of the flow regulating rollers 79 and the wall surface 76a is also reduced. Therefore, as shown by the dashed line in FIG.
Most of the plating solution 62 that has flowed into the first intermediate tank 44 from the third slit 52 is recovered into the plating solution tank 61 via the intermediate drain pipe 74, and the slit 53 on the right side of the second intermediate tank 45. The flow out of the outlet is considerably smaller. As a result, the third intermediate tank 46 is inserted through the slit 53.
The height of the liquid surface of the plating solution 62 flowing out into the inside decreases, and the momentum of the outflow also weakens.
The bubbles trapped in the plating solution 62 flowing out of the substrate are reduced.

The plating solution 62 that has flowed into the third intermediate tank 46 flows into the external processing tank 42 through the slit 54 and the two openings 82. At this time, the shutter 83
The height of the third intermediate tank 4 is adjusted by adjusting the height position of the plating solution 62 and the amount of the plating solution 62 flowing out of the two openings 82.
The amount of the plating solution 62 that flows directly from the slit 54 of the sixth embodiment toward the slit 51 of the external processing tank 42 is reduced. As a result, bubbles trapped in the plating solution 62 flowing out of the slit 54 of the third intermediate tank 46 are reduced. Also,
Most of the plating solution 62 jetted into the internal processing tank 43 has already been recovered through the internal drain pipe 70 and the intermediate drain pipe 74, and the slit 5 in the third intermediate tank 46.
4 can reduce the amount of the plating solution 62 directly flowing out toward the slit 51 of the external processing tank 42.
The plating solution 62 is prevented from flowing out of the slit 51 of the external processing tank 42 into the roller chamber.

The plating solution 6 flowing into the external processing tank 42
2 is a plating solution tank 61 through an external drain pipe 71.
Collected inside. At this time, by adjusting the valve 72 and adjusting the recovery amount of the plating solution 62 via the external drain pipe 71, the amount of the plating solution 62 temporarily stored in the external processing tank 42 does not become extremely small. To do. As a result, it is possible to prevent bubbles from being easily trapped in the plating solution 62 sucked into one end of the external drain tube 71. Further, since the other end of the external drain tube 71 is connected to a portion of the side wall in the plating solution tank 61 which is lower than the level of the plating solution 62 contained therein, bubbles are removed here. There is almost no involvement.

As described above, in this plating apparatus,
Since the plating solution 62 can be prevented from flowing out of the slit 51 of the external processing tank 42 into the roller chamber, the plating solution 62 can be prevented from being wasted, and the cost can be reduced. Further, since the plating solution 62 can be prevented from flowing into the roller chamber,
The plating solution 62 does not mix with the pure water in the pure water tank connected to the roller chamber via the drain tube, and thus the surface of the electrode roller 56 is not plated, and the tape transport function is not impaired. You can do so. In this plating apparatus, the recovered plating solution 62
Since it is possible to prevent air bubbles from being trapped therein, the life of the plating solution as a whole can be extended even if the plating solution 62 is a non-cyan plating solution.

Further, in this plating apparatus, since the plating solution tank 61 is provided below each external processing tank 42, the length of the supply pipe 63, the internal drain pipe 70, the external drain pipe 71, and the intermediate drain pipe 74 is reduced. Can be as short as possible. As a result, when the plating solution 62 is a non-cyan plating solution, the amount of gold spontaneously deposited in these pipes can be reduced as much as possible. As much as possible, the cost can be reduced.

Incidentally, the first to third intermediate tanks 44, 4
In the case where the plating solutions 5 and 46 are not provided, in order to prevent the plating solution 62 adhered to the surface of the tape 57 after passing through the internal treatment tank 43 from dropping naturally and adhering to the electrode roller 56 in the next roller chamber, the internal treatment When the tape transport speed is about 1 m / min, the interval between the slit 52 at the subsequent stage of the tank 43 and the slit 51 at the latter stage of the external processing tank 42 needs to be about 500 mm. On the other hand, the first to third intermediate tanks 4
In the case where 4, 45, and 46 are provided, even if the interval is set to about 250 mm, which is a half of the above, the plating solution 62 attached to the surface of the tape 57 after passing through the internal processing tank 43 is forcibly dropped, and the electrode in the next roller chamber is formed. It can be prevented from adhering to the roller 56. As a result, the distance can be made relatively small, such as about 250 mm, and the overall length of the apparatus can be made relatively short.

Next, FIG. 8 shows a plan view similar to FIG. 3 in the second embodiment of the present invention, FIG. 9 shows a cross-sectional view along the line AA, and FIG. 11 is a sectional view taken along the line CC of FIG. In these drawings, the same parts as those in FIGS. 3 to 6 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

The plating section 41 does not include the internal drain pipe 70, but instead includes the internal processing tank 43, the external processing tank 42, and the first intermediate tank at both ends of the right side wall of the internal processing tank 43. The overflow guide portion 90 is formed by utilizing a predetermined part of each of the reference numerals 45. That is, the overflow guide portion 90 has cutouts 91 formed at both ends of the upper surface of the right side wall of the internal processing tank 43, and the height provided outside the right side wall is the same as the height of the internal processing tank 43. The plating solution 62 having a certain guide wall 92 and overflowing from the notch 91 flows into the right side wall and the guide wall 9.
It leads to between 2. Overflow guide 90
A rectangular opening 9 is provided at a predetermined portion of the lower portion of the guide wall 92.
A shutter (overflow amount adjusting means) 94 is provided outside the shutter 3 so as to be vertically movable. The shutter 94 has a vertically long slit 95 provided on itself.
Is screwed into the guide wall 92 so as to be fixed at an arbitrary height position, so that the opening amount of the opening 93 can be adjusted.

That is, in the plating section 41, a part of the plating solution 62 jetted into the internal processing tank 43 is guided from the notch 91 into the overflow guide section 90, and from the opening 93 of the overflow guide section 90. External processing tank 42
And is collected in the plating solution tank 61 via the external drain pipe 71. In this case, by adjusting the opening amount of the opening 93 with the shutter 94, the liquid level of the plating solution 62 in the overflow guide portion 90 becomes the notch 91.
Do not drop below the bottom of the. That is, since it is possible to adjust the state in which the inside of the overflow guide portion 90 is always filled with the plating solution 62, it is possible to prevent bubbles from being caught in the plating solution 62 flowing out to the overflow guide portion 90. Can be

Further, since most of the plating solution 62 jetted into the internal processing tank 43 is caused to flow out from the overflow guide portion 90, the pressure of the plating solution in the internal processing tank 43 is reduced. The amount of the plating solution 62 can be reduced accordingly, and the momentum of the outflow can be slightly reduced. As a result, it is possible to make it more difficult for bubbles to be caught in the plating solution 62 flowing out of the slit 52. In this case, FIGS.
As shown in (2), a pair of slit width adjusting plates 97 for substantially reducing the width of the slit 52 may be provided inside the right side wall of the internal processing tank 43 so as to be position-adjustable.

In each of the above embodiments, the pair of flow regulating rollers 79 has the small diameter portion 79a. However, the flow regulating roller 79 disposed on the surface of the tape 57 where the pattern is not formed has the small diameter portion 79a. It is not necessary to provide 79a. Further, the present invention is not limited to the plating process, and can be applied to other chemical processes such as a degreasing process, an oxide film removing process, and a plating pretreatment.

[0044]

As described above, according to the present invention, the flow rate of the chemical liquid flowing from the internal processing tank through the first intermediate tank into the second intermediate tank is regulated to the external processing tank. Means, a part of the chemical liquid in the internal processing tank is recovered through the intermediate drain hole, and the rest is recovered through the external drain hole. The flow rate can be reduced, so that the outflow of the chemical solution from the slit of the external processing tank can be prevented.
In addition, the flow rate of the chemical liquid flowing from the internal processing tank into the second intermediate tank via the first intermediate tank to the external processing tank is regulated by a flow rate regulating means, and a part of the chemical liquid in the internal processing tank is controlled. Is recovered through the intermediate drain hole and the remainder is recovered through the external drain hole, so that even if the height (depth) of the internal processing tank is relatively high (deep), it can be used in a chemical solution such as a plating solution. Bubbles containing oxygen and the like can be prevented from being easily caught.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a plating apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of a main part of the plating unit shown in FIG. 1 in a state where a lid is omitted.

FIG. 3 is an enlarged plan view of a portion on the right side of a plating section shown in FIG. 2;

FIG. 4 is a sectional view taken along the line AA in FIG. 3;

FIG. 5 is a sectional view taken along the line BB in FIG. 3;

FIG. 6 is a sectional view taken along line CC of FIG. 3;

FIG. 7 is a cross-sectional view for explaining the level of the plating solution.

FIG. 8 is a plan view similar to FIG. 3 according to a second embodiment of the present invention.

FIG. 9 is a sectional view taken along the line AA of FIG. 8;

FIG. 10 is a sectional view taken along the line BB of FIG. 8;

FIG. 11 is a sectional view taken along the line CC of FIG. 8;

FIG. 12 is a schematic configuration diagram of an example of a conventional plating apparatus.

FIG. 13 is a sectional view of a part of the plating section shown in FIG. 12;

FIG. 14 is a plan view of the plating unit shown in FIG. 13 in a state where a lid is omitted.

[Explanation of symbols]

 41 Plating Unit 42 External Processing Tank 43 Internal Processing Tank 44 First Intermediate Tank 45 Second Intermediate Tank 46 Third Intermediate Tank 51-54 Slit 57 Tape 61 Plating Solution Tank 62 Plating Solution 64 Supply Pipe 66 Pump 70 Inside Drain tube 71 External drain tube 72 Valve 74 Intermediate drain tube 75 Valve 79 Flow control roller 82 Opening 83 Shutter 90 Overflow guide 91 Cutout 93 Opening 94 Shutter

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/60 311 H01L 21/60 311W (72) Inventor Mitsuhiko Yamamoto 3-10-6 Imai, Ome-shi, Tokyo Casio Micronics Co., Ltd. (72) Inventor Kozo Kanaya 962 Fujishin Kamimitsukamae, Kashiwa City, Chiba Prefecture Seto Giken Kogyo Co., Ltd. F-term (reference) 4K024 CB19 EA04 5F044 MM48 MM49

Claims (26)

[Claims] 1. A surface layer of a tape passing through an opening for carrying in and out of a tape provided in an external processing tank and an opening for carrying in and out of a tape provided in an internal processing tank is subjected to the internal processing. In a chemical treatment apparatus for performing a chemical treatment by a chemical liquid ejected into a tank, first and second intermediate tanks are provided outside the internal processing tank, and a bottom of the external processing tank and the first intermediate tank are provided. An external drain hole and an intermediate drain hole are provided at the bottom of
Wherein the flow control means is provided in the intermediate tank. 2. The chemical processing apparatus according to claim 1, wherein an internal drain hole is provided at a bottom of the internal processing tank. 3. The invention according to claim 1, wherein the internal processing tank is provided with an overflow guide for flowing a chemical solution overflowing from the internal processing tank to the external processing tank. Chemical processing equipment. 4. The chemical processing apparatus according to claim 3, wherein the inside of the overflow guide is filled with a chemical solution during the chemical treatment of the surface layer of the tape. 5. The chemical processing apparatus according to claim 3, wherein the overflow guide has flow rate adjusting means for adjusting an amount of a chemical solution flowing into the external processing tank. 6. The drain amount adjusting device according to claim 1, wherein the intermediate drain tube connected to the intermediate drain hole adjusts an amount of a chemical solution flowing out of the intermediate drain tube. A chemical treatment apparatus, characterized by comprising means. 7. The intermediate drain pipe according to claim 6, wherein a predetermined amount of a chemical liquid is stored in the first intermediate tank during the chemical treatment of the surface layer of the tape by the drain amount adjusting means. A chemical treatment apparatus characterized by being adjusted so as to be filled with a chemical solution. 8. A chemical processing apparatus according to claim 1, wherein said flow rate control means comprises a pair of flow rate control rollers provided on both sides of a tape transport path. . 9. The invention according to claim 8, wherein at least one of the pair of flow regulating rollers is substantially I-shaped, and at least one of the pair of flow regulating rollers is capable of coming and going with respect to the other. A chemical treatment device, which is provided. 10. The drain amount adjusting device according to claim 1, wherein the external drain tube connected to the external drain hole adjusts an amount of a chemical solution flowing out from the external drain tube. A chemical treatment apparatus, characterized by comprising means. 11. The third intermediate tank according to any one of claims 1 to 10, wherein the third intermediate tank has an outflow portion on both sides in a direction orthogonal to the tape transport path, outside the second intermediate tank. A chemical treatment apparatus characterized by being provided with: 12. The chemical treatment apparatus according to claim 11, wherein the outflow portion has an outflow amount adjusting means for adjusting an amount of a chemical solution flowing out to the external processing tank. 13. The chemical processing apparatus according to claim 1, wherein the chemical solution is a plating solution. 14. The chemical processing apparatus according to claim 13, wherein the plating solution is a non-cyan plating solution. 15. A tape is inserted into an opening for carrying in and out of the tape provided in the external processing tank and a opening for taking in and out of the tape provided in the internal processing tank. In the chemical treatment method of performing a chemical treatment by a chemical solution ejected into the internal processing tank, a first and second intermediate tanks are provided outside the internal processing tank, and a bottom portion of the external processing tank and the second intermediate tank are provided. An external drain hole and an intermediate drain hole are provided at the bottom of the first intermediate tank, and a flow rate regulating means is provided in the second intermediate tank. A chemical treatment method comprising: controlling a flow amount of a liquid; and ejecting the chemical liquid into the internal treatment tank to treat a surface layer of the tape and collecting the chemical liquid from the external drain hole and the intermediate drain hole. 16. The invention according to claim 15, wherein an internal drain hole is provided in a bottom portion of the internal processing tank, and a chemical solution which has been jetted into the internal processing tank to process the surface layer of the tape is provided in the internal drain tank. A chemical treatment method comprising recovering from a hole. 17. The chemical processing method according to claim 15, wherein an overflow guide portion is provided in the internal processing tank, and a chemical liquid overflowing from the internal processing tank flows out to the external processing tank. . 18. The chemical treatment method according to claim 17, wherein a chemical liquid is filled in the inside of the overflow guide to chemically treat the surface layer of the tape. 19. The chemical according to claim 17, wherein a flow rate adjusting means is provided in the overflow guide portion so that the amount of the chemical solution flowing out of the internal processing tank can be adjusted. Processing method. 20. The invention according to claim 15, wherein a drain amount adjusting means is provided in the intermediate drain tube connected to the intermediate drain hole, and the drain amount adjusting means discharges from the intermediate drain tube. A chemical treatment method characterized in that the amount of a chemical solution to be applied can be adjusted. 21. The method according to claim 20, wherein a predetermined amount of a chemical liquid is stored in the first intermediate tank by the drain amount adjusting means, and the intermediate drain pipe is filled with the chemical liquid. A chemical treatment method comprising: performing a chemical treatment on the surface layer of the tape by adjusting. 22. The invention according to claim 15, wherein a drain amount adjusting means is provided in the external drain tube connected to the external drain hole, and the drain amount adjusting means discharges from the external drain tube. A chemical treatment method characterized in that the amount of a chemical solution to be applied can be adjusted. 23. The invention according to claim 15, wherein a third intermediate tank having an outflow portion on both sides in a direction orthogonal to the tape transport path is provided outside the second intermediate tank. Wherein the third intermediate tank prevents the chemical solution from flowing out of a slit of the external processing tank. 24. The chemical treatment method according to claim 23, wherein a flow rate adjusting means is provided in the outflow portion, and the amount of the chemical solution flowing out of the outflow portion can be adjusted. 25. The chemical treatment method according to claim 15, wherein said chemical treatment is electrolytic plating. 26. The chemical treatment method according to claim 25, wherein the plating solution for the electrolytic plating is a non-cyan plating solution.