JP2002026170A - Resin-sealed semiconductor device and its manufacturing method - Google Patents
Resin-sealed semiconductor device and its manufacturing methodInfo
- Publication number
- JP2002026170A JP2002026170A JP2000204813A JP2000204813A JP2002026170A JP 2002026170 A JP2002026170 A JP 2002026170A JP 2000204813 A JP2000204813 A JP 2000204813A JP 2000204813 A JP2000204813 A JP 2000204813A JP 2002026170 A JP2002026170 A JP 2002026170A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- circuit board
- printed circuit
- hole
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は,樹脂封止型半導体
装置及びその製造方法に関する。The present invention relates to a resin-sealed semiconductor device and a method of manufacturing the same.
【0002】[0002]
【従来の技術】一般に,従来の樹脂封止型半導体装置の
構造は,図8に示すように,プリント基板上601に絶
縁接着剤619を介して半導体ペレット602が積載さ
れ半導体ぺレット602とプリント基板601とが,金
属ワイヤ603を介して電気的に接続される。また,金
属ワイヤ603と半導体ペレット602を保護するため
に絶縁樹脂604により封止されている。2. Description of the Related Art In general, a conventional resin-encapsulated semiconductor device has a structure in which a semiconductor pellet 602 is mounted on a printed circuit board 601 via an insulating adhesive 619 as shown in FIG. The substrate 601 is electrically connected via a metal wire 603. Further, it is sealed with an insulating resin 604 to protect the metal wire 603 and the semiconductor pellet 602.
【0003】かかる従来の樹脂封止型半導体装置の製造
方法を図9に基づいて説明する。A method of manufacturing such a conventional resin-encapsulated semiconductor device will be described with reference to FIG.
【0004】まず,図9(a)に示すように,プリント
基板601上に絶縁接着剤619を塗布する。次いで,
図9(b)に示すように,プリント基板601に塗布さ
れた絶縁接着剤619上に半導体ペレット602を積載
する。First, as shown in FIG. 9A, an insulating adhesive 619 is applied on a printed circuit board 601. Then,
As shown in FIG. 9B, the semiconductor pellet 602 is stacked on the insulating adhesive 619 applied to the printed board 601.
【0005】さらに,図9(c)に示すように,半導体
ペレット602とプリント基板601とを電気的に導通
するために金属ワイヤ603を接続する。最後に,図9
(d)に示すように,金属ワイヤ603と半導体ペレッ
ト602を保護するため絶縁樹脂604により,金属ワ
イヤ603と半導体ペレット602を封止する。Further, as shown in FIG. 9C, a metal wire 603 is connected to electrically connect the semiconductor pellet 602 to the printed board 601. Finally, FIG.
As shown in (d), the metal wire 603 and the semiconductor pellet 602 are sealed with an insulating resin 604 to protect the metal wire 603 and the semiconductor pellet 602.
【0006】[0006]
【発明が解決しようとする課題】しかしながら,従来の
樹脂封止型半導体装置及び製造方法では,以下のような
問題があった。However, the conventional resin-encapsulated semiconductor device and the manufacturing method have the following problems.
【0007】.半導体ペレットはプリント基板上に載
置され,半導体ペレット裏面はプリント基板と電気的に
接続されないので,半導体ペレットの裏面電位を制御す
ることができない。 .例えば略350μm厚さの半導体ペレット上に金属
ワイヤが接続されて,例えば略200μm高さの凸部が
形成されるので,半導体装置全体の厚さが増大する。 .半導体ペレットを接着するための接着剤が例えば熱
などの衝撃により樹脂界面で剥離し,半導体装置の信頼
性が低下する。 .金属ワイヤを使用しているため,樹脂を塗布する際
の負荷などに起因して配線が変形し,隣接する配線と接
触して電気的なショートが発生する。 .半導体ペレットよりも広い範囲で塗布される絶縁接
着剤は,半導体ペレットの接着圧力により不安定な形状
で拡大してしまうので,プリント基板側の金属ワイヤの
接続を,半導体ペレットから例えば略0.8mm以上離
隔した位置でおこなわなければならない。このため,プ
リント基板の配線を形成できない部分が増大する。[0007] Since the semiconductor pellet is mounted on the printed board and the back surface of the semiconductor pellet is not electrically connected to the printed board, the back potential of the semiconductor pellet cannot be controlled. . For example, a metal wire is connected to a semiconductor pellet having a thickness of approximately 350 μm to form a projection having a height of approximately 200 μm, for example, so that the thickness of the entire semiconductor device increases. . The adhesive for bonding the semiconductor pellets peels off at the resin interface due to, for example, the impact of heat or the like, and the reliability of the semiconductor device is reduced. . Since the metal wire is used, the wiring is deformed due to a load at the time of applying the resin, and contacts with the adjacent wiring to cause an electric short circuit. . Since the insulating adhesive applied in a wider range than the semiconductor pellet expands in an unstable shape due to the bonding pressure of the semiconductor pellet, the connection of the metal wire on the printed circuit board side to the semiconductor pellet is, for example, about 0.8 mm. This must be done at a distance above. For this reason, the portion of the printed circuit board where wiring cannot be formed increases.
【0008】したがって,本発明の課題は,上記問題を
解決して,半導体ペレット裏面を制御し,かつ,半導体
装置の厚さを低減することが可能な新規かつ改良された
樹脂封止型半導体装置及びその製造方法を提供すること
にある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above problems and to provide a new and improved resin-sealed semiconductor device capable of controlling the back surface of a semiconductor pellet and reducing the thickness of the semiconductor device. And a method for manufacturing the same.
【0009】[0009]
【課題を解決するための手段】上記課題を解決するた
め,請求項1に記載の発明では,プリント基板の所定位
置に半導体ペレットを挿入するための貫通孔が形成さ
れ,前記貫通孔に挿入された前記半導体ペレット表面は
金属ワイヤを介して前記プリント基板と電気的に接続さ
れ,かつ,前記半導体ペレット裏面は導電樹脂を介して
前記プリント基板と電気的に接続され,前記半導体ペレ
ット表面及び前記金属ワイヤが絶縁樹脂で封止されてい
ることを特徴とする樹脂封止型半導体装置が提供され
る。According to the first aspect of the present invention, a through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed circuit board, and the through hole is inserted into the through hole. The surface of the semiconductor pellet is electrically connected to the printed circuit board via a metal wire, and the back surface of the semiconductor pellet is electrically connected to the printed circuit board via a conductive resin. A resin-sealed semiconductor device is provided, wherein the wires are sealed with an insulating resin.
【0010】本項記載の発明では,半導体ペレットの裏
面電位を制御することができると共に,プリント基板の
貫通孔に半導体ペレットを挿入して半導体ペレットの厚
さが低減されるので,半導体装置の厚さを低減すること
ができる。According to the invention described in this section, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor pellet can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. Can be reduced.
【0011】また,上記課題を解決するため,請求項2
に記載の発明のように,プリント基板の所定位置に半導
体ペレットを挿入するための貫通孔が形成され,前記貫
通孔に挿入された前記半導体ペレット表面は金属ワイヤ
を介して前記プリント基板と電気的に接続され,かつ,
前記半導体ペレット裏面は銅箔を介して前記プリント基
板と電気的に接続され,前記半導体ペレット及び前記金
属ワイヤが絶縁樹脂で封止されていることを特徴とする
樹脂封止型半導体装置が提供される。According to another aspect of the present invention, there is provided a semiconductor device comprising:
A through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and the surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. Connected to and
A resin-encapsulated semiconductor device is provided, wherein the back surface of the semiconductor pellet is electrically connected to the printed board via a copper foil, and the semiconductor pellet and the metal wire are sealed with an insulating resin. You.
【0012】本項記載の発明では,半導体ペレットの裏
面電位を制御することができると共に,プリント基板の
貫通孔に挿入した半導体ペレットの裏面を銅箔により電
気的に接続するので,請求項1に記載の半導体装置と比
較して,さらに厚さ低減することができる。According to the present invention, the back potential of the semiconductor pellet can be controlled, and the back surface of the semiconductor pellet inserted into the through hole of the printed circuit board is electrically connected by the copper foil. The thickness can be further reduced as compared with the described semiconductor device.
【0013】また,上記課題を解決するため,請求項3
に記載の発明のように,プリント基板の所定位置に半導
体ペレットを挿入するための凹部溝あるいは貫通孔が形
成され,前記凹部溝あるいは前記貫通孔に挿入された前
記半導体ペレット表面は金属ワイヤを介して前記プリン
ト基板と電気的に接続され,かつ,前記半導体ペレット
裏面は導電配線が形成される導電配線テープを介して前
記プリント基板と電気的に接続され,前記半導体ペレッ
ト及び前記金属ワイヤ及び前記導電配線テープが絶縁樹
脂で封止されていることを特徴とする樹脂封止型半導体
装置が提供される。[0013] In order to solve the above-mentioned problems, a third aspect of the present invention is provided.
As described in the invention described in (1), a concave groove or a through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and the surface of the semiconductor pellet inserted into the concave groove or the through hole is formed through a metal wire. And the back surface of the semiconductor pellet is electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed. A resin-sealed semiconductor device is provided, wherein the wiring tape is sealed with an insulating resin.
【0014】本項記載の発明では,半導体ペレットの裏
面電位を制御することができると共に,プリント基板の
貫通孔に挿入した半導体ペレット裏面を導電性テープに
より電気的に接続するので,請求項2に記載の半導体装
置と比較して,さらに厚さ低減することができる。さら
に,接着剤をプリント基板上に塗布しないので,熱応力
による接着剤の剥離がなく,半導体ペレット裏面から電
気的導通を図ることができる。According to the present invention, the back potential of the semiconductor pellet can be controlled, and the back surface of the semiconductor pellet inserted into the through hole of the printed circuit board is electrically connected by a conductive tape. The thickness can be further reduced as compared with the described semiconductor device. Further, since the adhesive is not applied onto the printed circuit board, the adhesive is not peeled off due to thermal stress, and electrical conduction can be achieved from the back surface of the semiconductor pellet.
【0015】また,上記課題を解決するため,請求項4
に記載の発明のように,プリント基板の所定位置に凹部
溝あるいは貫通孔が形成され,前記凹部溝あるいは前記
貫通孔に挿入された前記半導体ペレット表裏両面共に,
導電配線が形成される導電配線テープを介して前記プリ
ント基板と電気的に接続され,前記半導体ペレット及び
前記導電配線テープが絶縁樹脂で封止されていることを
特徴とする樹脂封止型半導体装置が提供される。[0015] In order to solve the above-mentioned problems, a fourth aspect of the present invention is provided.
A recessed groove or a through-hole is formed at a predetermined position on a printed circuit board, and both the front and back surfaces of the semiconductor pellet inserted into the recessed groove or the through-hole,
A resin-sealed semiconductor device electrically connected to the printed circuit board via a conductive wiring tape on which conductive wiring is formed, wherein the semiconductor pellet and the conductive wiring tape are sealed with an insulating resin. Is provided.
【0016】本項記載の発明では,半導体ペレットの裏
面電位を制御することができると共に,プリント基板の
貫通孔に挿入した半導体ペレット表裏両面を導電性テー
プにより電気的に接続するので,請求項3に記載の半導
体装置と比較して,さらに厚さ低減することができる。
さらに,接着剤をプリント基板上に塗布しないので,熱
応力による接着剤の剥離がなく,半導体ペレット両面か
ら電気的導通を図ることができる。さらに配線が固定が
されている導電性テープにより半導体ペレットとプリン
ト基板の電気的接続を図るため隣接する配線が変形して
電気的にショートすることがない。According to the present invention, the back surface potential of the semiconductor pellet can be controlled, and the front and back surfaces of the semiconductor pellet inserted into the through holes of the printed circuit board are electrically connected by a conductive tape. The thickness can be further reduced as compared with the semiconductor device described in (1).
Furthermore, since the adhesive is not applied on the printed circuit board, the adhesive is not peeled off due to thermal stress, and electrical conduction can be achieved from both surfaces of the semiconductor pellet. Further, since the semiconductor pellet and the printed circuit board are electrically connected by the conductive tape to which the wiring is fixed, the adjacent wiring is not deformed and electrically short-circuited.
【0017】また,上記課題を解決するため,請求項5
に記載の発明のように,プリント基板の所定位置に貫通
孔を形成する工程と,前記貫通孔を覆い,かつ前記貫通
孔内部方向が粘着面となるように粘着テープを前記プリ
ント基板の裏面に貼り付ける工程と,前記半導体ペレッ
トを前記プリント基板の前記貫通孔に挿入して,前記粘
着テープの前記粘着面に前記半導体ペレットを接着する
工程と,選択的に,前記粘着テープを介して前記貫通孔
に突起形状物を挿入して前記半導体ペレットを所定高さ
位置に固定する,あるいは平坦なステージで前記半導体
ペレットを所定位置に固定する工程と,前記半導体ペレ
ット表面と前記プリント基板とを金属ワイヤで電気的に
接続する工程と,前記半導体ペレット表面と前記金属ワ
イヤとを絶縁樹脂により封止する工程と,前記プリント
基板に貼り付けられた前記粘着テープを剥ぎ取る工程
と,前記プリント基板の上下を反対にした後,前記プリ
ント基板裏面の所定位置にメタルマスクを貼り付け,前
記半導体ペレット裏面と前記プリント基板裏面とが電気
的に導通するように印刷法により所定範囲に導電樹脂を
塗布する工程と,前記導電樹脂の充填により形成された
凸部をスキージにより平坦にする工程と,を有すること
を特徴とする樹脂封止型半導体装置の製造方法が提供さ
れる。According to another aspect of the present invention, there is provided a semiconductor device comprising:
Forming a through hole at a predetermined position on a printed circuit board, and applying an adhesive tape to the back surface of the printed circuit board such that the through hole is covered and the inside of the through hole is an adhesive surface. Attaching the semiconductor pellet to the through-hole of the printed circuit board, and bonding the semiconductor pellet to the adhesive surface of the adhesive tape; and selectively attaching the semiconductor pellet through the adhesive tape. Fixing the semiconductor pellet at a predetermined height by inserting a projection into the hole, or fixing the semiconductor pellet at a predetermined position on a flat stage, and connecting a metal wire to the surface of the semiconductor pellet with the printed board. Electrically connecting the semiconductor pellet surface and the metal wire with an insulating resin, and attaching the semiconductor pellet surface and the metal wire to the printed circuit board. After the step of peeling off the adhesive tape and turning the printed circuit board upside down, a metal mask is attached at a predetermined position on the back surface of the printed circuit board to electrically connect the back surface of the semiconductor pellet and the back surface of the printed circuit board. A step of applying a conductive resin to a predetermined area by a printing method, and a step of flattening a convex portion formed by filling the conductive resin with a squeegee. Is provided.
【0018】本項記載の発明では,絶縁接着剤を使用せ
ずに半導体ペレット表面とプリント基板とを金属ワイヤ
で配線できるので,絶縁樹脂を塗布する面積を低減する
ことができる。この結果,半導体装置の全体面積も小さ
くすることができる。According to the present invention, since the surface of the semiconductor pellet and the printed circuit board can be wired with metal wires without using an insulating adhesive, the area for applying the insulating resin can be reduced. As a result, the overall area of the semiconductor device can be reduced.
【0019】また,上記課題を解決するため,請求項6
に記載の発明のように,プリント基板の所定位置に貫通
孔を形成する工程と,前記貫通孔を覆い,かつ前記貫通
孔内部方向が粘着面となるように粘着テープを前記プリ
ント基板の裏面に貼り付ける工程と,前記半導体ペレッ
トを前記プリント基板の前記貫通孔に挿入して,前記粘
着テープの前記粘着面に前記半導体ペレットを接着する
工程と,選択的に,前記粘着テープを介して前記貫通孔
に突起形状物を挿入して前記半導体ペレットを所定高さ
位置に固定する,あるいは平坦なステージで前記半導体
ペレットを所定位置に固定する工程と,前記半導体ペレ
ット表面と前記プリント基板とを金属ワイヤで電気的に
接続する工程と,前記半導体ペレット表面と前記金属ワ
イヤとを絶縁樹脂により封止する工程と,前記プリント
基板に貼り付けられた前記粘着テープを剥ぎ取る工程
と,前記プリント基板の上下を反対にした後,前記半導
体ペレット裏面と前記プリント基板裏面とが電気的に導
通するように,塗布法により塗布ノズルを介して所定範
囲に導電樹脂を塗布する工程と,前記導電樹脂の充填に
より形成された凸部を研磨により平坦にする工程と,を
有することを特徴とする樹脂封止型半導体装置の製造方
法が提供される。According to another aspect of the present invention, there is provided a semiconductor device comprising:
Forming a through hole at a predetermined position on a printed circuit board, and applying an adhesive tape to the back surface of the printed circuit board such that the through hole is covered and the inside of the through hole is an adhesive surface. Attaching the semiconductor pellet to the through-hole of the printed circuit board, and bonding the semiconductor pellet to the adhesive surface of the adhesive tape; and selectively attaching the semiconductor pellet through the adhesive tape. Fixing the semiconductor pellet at a predetermined height by inserting a projection into the hole, or fixing the semiconductor pellet at a predetermined position on a flat stage, and connecting a metal wire to the surface of the semiconductor pellet with the printed board. Electrically connecting the semiconductor pellet surface and the metal wire with an insulating resin, and attaching the semiconductor pellet surface and the metal wire to the printed circuit board. After the step of peeling off the adhesive tape and turning the printed board upside down, a predetermined range is applied through a coating nozzle by a coating method so that the back surface of the semiconductor pellet and the back surface of the printed board are electrically connected to each other. A step of applying a conductive resin to the semiconductor device, and a step of polishing and flattening the convex portion formed by filling the conductive resin.
【0020】本項記載の発明では,絶縁樹脂を塗布する
面積を低減して半導体装置の全体面積も小さくすること
ができると共に,メタルマスクを使用せずに半導体ペレ
ット裏面の配線を形成できるので,請求項5に記載の発
明と比較して,低コストで製造できる。According to the invention described in this section, the area for applying the insulating resin can be reduced to reduce the overall area of the semiconductor device, and the wiring on the back surface of the semiconductor pellet can be formed without using a metal mask. Compared with the invention described in claim 5, it can be manufactured at low cost.
【0021】[0021]
【発明の実施の形態】以下,本発明の好適な実施の形態
について,添付図面を参照しながら詳細に説明する。
尚,以下の説明および添付図面において,同一の機能及
び構成を有する構成要素については,同一符号を付する
ことにより,重複説明を省略する。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
In the following description and the accompanying drawings, components having the same functions and configurations will be denoted by the same reference numerals, and redundant description will be omitted.
【0022】(第1の実施の形態)まず,図1を参照し
ながら,第1の実施の形態について説明する。図1は,
本実施形態にかかる樹脂封止型半導体装置の断面図であ
る。(First Embodiment) First, a first embodiment will be described with reference to FIG. Figure 1
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device according to an embodiment.
【0023】まず,図1に示すように,プリント基板1
01の貫通孔120に半導体ペレット102が挿入され
ている。半導体ペレット102の表面は,プリント基板
101との電気的導通を図るために金属ワイヤ103が
接続されている。また,金属ワイヤ103及び半導体ペ
レット102の表面は,金属ワイヤ103及び半導体ペ
レット102を保護するため,絶縁樹脂104で封止さ
れている。このとき,金属ワイヤの高さ106は,例え
ば略150〜250μmであるので,絶縁樹脂が形成さ
れる高さ107は,例えば略170〜270μmであ
る。First, as shown in FIG.
The semiconductor pellet 102 is inserted into the through-hole 120 of No. 01. A metal wire 103 is connected to the surface of the semiconductor pellet 102 for electrical connection with the printed board 101. The surfaces of the metal wire 103 and the semiconductor pellet 102 are sealed with an insulating resin 104 to protect the metal wire 103 and the semiconductor pellet 102. At this time, since the height 106 of the metal wire is, for example, approximately 150 to 250 μm, the height 107 at which the insulating resin is formed is, for example, approximately 170 to 270 μm.
【0024】一方,プリント基板101の裏面の開放部
は,導電樹脂105により封止されている。この導電樹
脂105を介して,プリント基板101と半導体ペレッ
ト102の裏面とが電気的に導通されるので,半導体ペ
レット102裏面電位を制御することができる。プリン
ト基板101と比較して半導体ペレット102が薄い場
合には,ワイヤボンド位置の認識できるようにするた
め,あるいは,金属ワイヤ103とプリント基板101
の配線が電気的にショートしないように,半導体ペレッ
ト102を底上げする。このとき,プリント基板101
の裏面に形成される導電樹脂105の凸部厚さ108
は,メタルマスクを使用して印刷法で導電樹脂を形成し
た場合には,例えば略100μmである。On the other hand, an open portion on the back surface of the printed circuit board 101 is sealed with a conductive resin 105. Since the printed board 101 and the back surface of the semiconductor pellet 102 are electrically connected via the conductive resin 105, the back potential of the semiconductor pellet 102 can be controlled. When the semiconductor pellet 102 is thinner than the printed board 101, the position of the wire bond can be recognized, or the metal wire 103 and the printed board 101 can be recognized.
The semiconductor pellet 102 is raised so that the wiring of FIG. At this time, the printed circuit board 101
Convex part thickness 108 of conductive resin 105 formed on the back surface of
Is about 100 μm, for example, when the conductive resin is formed by a printing method using a metal mask.
【0025】以上のように,第1の実施の形態において
は,半導体ペレットの裏面電位を制御することができる
と共に,プリント基板の貫通孔に半導体ペレットを挿入
するので半導体装置の厚さは,従来構造の半導体装置と
比較して例えば略2/3程度の厚さに低減することがで
きる。As described above, in the first embodiment, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor device can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. For example, the thickness can be reduced to about 2/3 as compared with the semiconductor device having the structure.
【0026】(第2の実施の形態)第1の実施の形態で
は,半導体ペレット裏面とプリント基板とを導電樹脂を
使用して電気的導通を図っているが,本実施形態では銅
箔を使用する。(Second Embodiment) In the first embodiment, electrical conduction is achieved between the back surface of the semiconductor pellet and the printed board by using a conductive resin. In the present embodiment, copper foil is used. I do.
【0027】以下,図2に基づいて,第2の実施の形態
を説明する。図2は,本実施形態にかかる樹脂封止型半
導体装置の構成を示す断面図である。Hereinafter, a second embodiment will be described with reference to FIG. FIG. 2 is a cross-sectional view illustrating a configuration of the resin-encapsulated semiconductor device according to the present embodiment.
【0028】まず,図2に示すように,プリント基板2
01の貫通孔220には,プリント基板201と略同一
厚さの半導体ペレット202挿入されている。半導体ペ
レット202の表面は,プリント基板201との電気的
導通を図るために金属ワイヤ203が接続されている。
また,金属ワイヤ203及び半導体ペレット202の表
面は,金属ワイヤ203及び半導体ペレット202を保
護するため,絶縁樹脂204で封止されている。このと
き,金属ワイヤの高さ206は,例えば略150〜25
0μmであるので,絶縁樹脂が形成される高さ207
は,例えば略170〜270μmである。First, as shown in FIG.
01, a semiconductor pellet 202 having substantially the same thickness as the printed circuit board 201 is inserted. A metal wire 203 is connected to the surface of the semiconductor pellet 202 to establish electrical conduction with the printed circuit board 201.
The surfaces of the metal wire 203 and the semiconductor pellet 202 are sealed with an insulating resin 204 to protect the metal wire 203 and the semiconductor pellet 202. At this time, the height 206 of the metal wire is, for example, approximately 150 to 25.
Since the thickness is 0 μm, the height at which the insulating resin is formed 207
Is, for example, approximately 170 to 270 μm.
【0029】一方,プリント基板201の裏面には,貫
通孔220を覆うように銅箔209が装着されており,
導電性接着剤210を介して,半導体ペレット202が
接着されている。このように,半導体ペレット202の
裏面は,銅箔209を介してプリント基板201と電気
的に導通されるので,半導体ペレット202の裏面電位
を制御することができる。なお,この銅箔209の厚さ
は,例えば略10μmである。On the other hand, a copper foil 209 is mounted on the back surface of the printed circuit board 201 so as to cover the through hole 220.
The semiconductor pellet 202 is bonded via the conductive adhesive 210. As described above, since the back surface of the semiconductor pellet 202 is electrically connected to the printed board 201 via the copper foil 209, the back potential of the semiconductor pellet 202 can be controlled. The thickness of the copper foil 209 is, for example, approximately 10 μm.
【0030】以上のように,第2の実施の形態において
は,半導体ペレットの裏面電位を制御することができる
と共に,プリント基板と半導体ペレットの厚さが略同一
である場合には,プリント基板裏面に装着した銅箔上
に,半導体ペレットを搭載するすることができるので半
導体装置の厚さは,第1の実施の形態と比較して,例え
ば略90μm程度の厚さを低減することができる。As described above, in the second embodiment, the back potential of the semiconductor pellet can be controlled, and if the thickness of the printed board and the semiconductor pellet are substantially the same, the back face of the printed board can be controlled. Since the semiconductor pellet can be mounted on the copper foil mounted on the semiconductor device, the thickness of the semiconductor device can be reduced, for example, by about 90 μm as compared with the first embodiment.
【0031】(第3の実施の形態)第2の実施の形態で
は,半導体ペレット裏面とプリント基板とを銅箔を使用
して電気的導通を図っているが,本実施形態では導電配
線が形成されている導電性テープを使用する。(Third Embodiment) In the second embodiment, the back surface of the semiconductor pellet and the printed circuit board are electrically connected to each other by using a copper foil, but in the present embodiment, conductive wiring is formed. Use the conductive tape that has been used.
【0032】以下,図3に基づいて,第3の実施の形態
を説明する。図3は,本実施形態にかかる樹脂封止型半
導体装置の構成を示す断面図である。Hereinafter, a third embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view illustrating the configuration of the resin-encapsulated semiconductor device according to the present embodiment.
【0033】プリント基板301の貫通孔320には,
半導体ペレット302が挿入されている。半導体ペレッ
ト302の表面は,プリント基板301との電気的導通
を図るために金属ワイヤ303が接続されている。In the through hole 320 of the printed circuit board 301,
The semiconductor pellet 302 is inserted. A metal wire 303 is connected to the surface of the semiconductor pellet 302 for electrical conduction with the printed board 301.
【0034】一方,半導体ペレット302の裏面は,導
電配線が形成されている導電性テープ311が接着さ
れ,プリント基板301の表面と電気的に接続されてい
る。また,金属ワイヤ303,半導体ペレット302,
導電性テープ311を保護するため,金属ワイヤ303
及び半導体ペレット302表面及び貫通孔320の内部
は,絶縁樹脂304で封止されている。このとき,金属
ワイヤの高さ306は,例えば略150〜250μmで
あるので,絶縁樹脂304が形成される高さ307は,
例えば略170〜270μmである。On the other hand, a conductive tape 311 on which conductive wiring is formed is adhered to the back surface of the semiconductor pellet 302, and is electrically connected to the surface of the printed circuit board 301. Also, a metal wire 303, a semiconductor pellet 302,
To protect the conductive tape 311, a metal wire 303 is used.
The surface of the semiconductor pellet 302 and the inside of the through hole 320 are sealed with an insulating resin 304. At this time, since the height 306 of the metal wire is, for example, approximately 150 to 250 μm, the height 307 at which the insulating resin 304 is formed is:
For example, it is approximately 170 to 270 μm.
【0035】以上のように,第3の実施の形態において
は,半導体ペレットの裏面電位を制御することができる
と共に,プリント基板の貫通孔に半導体ペレットを挿入
し,半導体ペレットの裏面を導電性テープを介してプリ
ント基板と電気的な導通を図っているので,半導体装置
の厚さは,第2の実施の形態と比較して,例えば略10
μm程度薄くすることができる。また,接着剤をプリン
ト基板上に塗布していないので,熱応力などにより半導
体ペレットが接着剤から剥離することがなく,半導体ペ
レット裏面と電気的な導通を図ることができる。As described above, in the third embodiment, the back potential of the semiconductor pellet can be controlled, the semiconductor pellet is inserted into the through hole of the printed board, and the back surface of the semiconductor pellet is electrically conductive tape. Is electrically connected to the printed circuit board through the substrate, so that the thickness of the semiconductor device is, for example, approximately 10
The thickness can be reduced by about μm. Further, since the adhesive is not applied on the printed board, the semiconductor pellet does not peel off from the adhesive due to thermal stress or the like, and electrical conduction with the back surface of the semiconductor pellet can be achieved.
【0036】(第4の実施の形態)第3の実施の形態で
は,半導体ペレット裏面とプリント基板とを導電配線が
形成されている導電性テープを使用して電気的導通を図
っているが,本実施形態では半導体ペレットの表裏両面
を導電性テープを使用してプリント基板と電気的な導通
を図っている。(Fourth Embodiment) In the third embodiment, electrical conduction is achieved between the back surface of the semiconductor pellet and the printed board by using a conductive tape on which conductive wiring is formed. In the present embodiment, both sides of the semiconductor pellet are electrically connected to the printed circuit board by using a conductive tape.
【0037】以下,図4に基づいて,第4の実施の形態
を説明する。図4は,本実施形態にかかる樹脂封止型半
導体装置の構成を示す断面図である。Hereinafter, a fourth embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view illustrating a configuration of the resin-sealed semiconductor device according to the present embodiment.
【0038】プリント基板401の貫通孔420には,
半導体ペレット402が挿入されており,半導体ペレッ
ト402の表面は,プリント基板401と電気的導通を
図るため,導電配線が形成される導電性テープ411が
貼り付けられている。In the through hole 420 of the printed circuit board 401,
The semiconductor pellet 402 is inserted, and a conductive tape 411 on which conductive wiring is formed is attached to the surface of the semiconductor pellet 402 in order to establish electrical conduction with the printed board 401.
【0039】一方,半導体ペレット402の裏面は,導
電配線が形成されている導電性テープ412が接着さ
れ,プリント基板401の表面と電気的に接続されてい
る。また,半導体ペレット402,導電性テープ41
1,412を保護するため,半導体ペレット402表面
及び貫通孔420の内部は,絶縁樹脂404で封止され
ている。このときの絶縁樹脂404の高さ407は,例
えば略50μmである。On the other hand, a conductive tape 412 on which conductive wiring is formed is adhered to the back surface of the semiconductor pellet 402 and is electrically connected to the surface of the printed circuit board 401. In addition, the semiconductor pellet 402, the conductive tape 41
The surface of the semiconductor pellet 402 and the inside of the through-hole 420 are sealed with an insulating resin 404 in order to protect the semiconductor chip 1, 412. The height 407 of the insulating resin 404 at this time is, for example, approximately 50 μm.
【0040】以上のように,第4の実施の形態において
は,半導体ペレットの裏面電位を制御することができる
と共に,プリント基板の貫通孔に半導体ペレットを挿入
し,半導体ペレットの表裏両面を導電性テープを介して
プリント基板と電気的な導通を図っているので,半導体
装置の厚さは,第3の実施の形態と比較して,例えば略
120〜220μm程度薄くすることができる。また,
接着剤をプリント基板上に塗布していないので,熱応力
などにより接着剤から剥離することがなく,半導体ペレ
ット裏面と電気的に導通を図ることができる。さらに,
導電配線が形成される導電性テープを介して半導体ペレ
ットとプリント基板の電気的導通を図っているので,導
電配線が変形して隣接配線と電気的にショートすること
はない。As described above, in the fourth embodiment, the back potential of the semiconductor pellet can be controlled, and the semiconductor pellet is inserted into the through hole of the printed circuit board, and the front and back surfaces of the semiconductor pellet are electrically conductive. Since electrical conduction with the printed circuit board is achieved via the tape, the thickness of the semiconductor device can be reduced, for example, by about 120 to 220 μm as compared with the third embodiment. Also,
Since the adhesive is not applied on the printed circuit board, it does not peel off from the adhesive due to thermal stress or the like, and can be electrically connected to the back surface of the semiconductor pellet. further,
Since electrical conduction between the semiconductor pellet and the printed circuit board is achieved via the conductive tape on which the conductive wiring is formed, the conductive wiring is not deformed and short-circuited with the adjacent wiring.
【0041】(第5の実施の形態)次いで,本実施形態
にかかる半導体装置の製造方法について,第1の実施の
形態にかかる樹脂封止型半導体装置を例に,図5及び図
6に基づいて説明する。図5及び図6は,本実施形態に
かかる半導体装置の製造方法を説明するための工程断面
図である。(Fifth Embodiment) Next, a method of manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 5 and 6, taking the resin-sealed semiconductor device according to the first embodiment as an example. Will be explained. 5 and 6 are process cross-sectional views illustrating the method for manufacturing a semiconductor device according to the present embodiment.
【0042】まず,図5(a)に示すように,プリント
基板501の所定位置に貫通孔520を形成する。次い
で,貫通孔520を覆うようにプリント基板501の裏
面に粘着テープ512を貼り付ける。このとき,粘着テ
ープ512の粘着面は,貫通孔520内部の方向となる
ように貼り付けられる。さらに,プリント基板501の
貫通孔520に半導体ペレット502を挿入し,粘着テ
ープ512に接着する。First, as shown in FIG. 5A, a through hole 520 is formed at a predetermined position on the printed circuit board 501. Next, an adhesive tape 512 is attached to the back surface of the printed circuit board 501 so as to cover the through holes 520. At this time, the adhesive surface of the adhesive tape 512 is stuck so as to be in the direction inside the through hole 520. Further, the semiconductor pellet 502 is inserted into the through hole 520 of the printed circuit board 501 and adhered to the adhesive tape 512.
【0043】次いで,図5(b)に示すように,突起部
514を有するステージ513を使用して,突起部51
4がプリント基板501の裏面から粘着テープ512に
接着された半導体ペレット502を押し上げるように,
貫通孔520内に挿入され,半導体ペレット502を底
上げして所定高さの位置に固定される。Next, as shown in FIG. 5B, using a stage 513 having a projection 514, the projection 51 is used.
4 pushes up the semiconductor pellet 502 adhered to the adhesive tape 512 from the back surface of the printed circuit board 501,
The semiconductor pellet 502 is inserted into the through hole 520 and fixed at a predetermined height with the bottom of the semiconductor pellet 502 raised.
【0044】次いで,図5(c)に示すように,半導体
ペレット502の表面とプリント基板501との電気的
導通を図るため,金属ワイヤ503を接続する。さら
に,図5(d)に示すように,金属ワイヤ503及び半
導体ペレット502を覆うように絶縁樹脂504を塗布
し硬化させる。その後,図5(e)に示すように,ステ
ージ513からプリント基板501を取り外し,さらに
プリント基板501から粘着テープ512を取り除く。Next, as shown in FIG. 5C, a metal wire 503 is connected to the surface of the semiconductor pellet 502 and the printed circuit board 501 for electrical conduction. Further, as shown in FIG. 5D, an insulating resin 504 is applied and cured so as to cover the metal wire 503 and the semiconductor pellet 502. Thereafter, as shown in FIG. 5E, the printed circuit board 501 is removed from the stage 513, and the adhesive tape 512 is further removed from the printed circuit board 501.
【0045】次いで,図6(a)に示すように,プリン
ト基板501の上下を反対にする。その後,図6(b)
に示すように,プリント基板501の裏面の所定位置に
メタルマスク515を施した後,印刷法により,プリン
ト基板501の裏面の開口部から,貫通孔520内部及
びプリント基板501の裏面の所定範囲に導電樹脂50
7が塗布される。さらに,導電樹脂507が塗布された
メタルマスク515上面に沿ってスキージ516を移動
して,必要以上に塗布された導電樹脂507を伸展して
平坦にする。さらに,塗布された導電樹脂507を塗布
し硬化させることにより,半導体ペレット502の裏面
とプリント基板501とが電気的に導通される。Next, as shown in FIG. 6A, the printed board 501 is turned upside down. Then, FIG.
As shown in FIG. 7, after a metal mask 515 is applied to a predetermined position on the back surface of the printed circuit board 501, a printing method is used to move the metal mask 515 from the opening on the back surface of the printed circuit board 501 to the inside of the through hole 520 and a predetermined range of the back surface of the printed circuit board 501. Conductive resin 50
7 is applied. Further, the squeegee 516 is moved along the upper surface of the metal mask 515 on which the conductive resin 507 is applied, and the conductive resin 507 applied more than necessary is extended and flattened. Further, by applying and curing the applied conductive resin 507, the back surface of the semiconductor pellet 502 and the printed board 501 are electrically connected.
【0046】さらに,図6(c)に示すように,プリン
ト基板501からメタルマスク515を除去する。その
後,図6(d)に示すように,プリント基板の上下を元
に戻して,本実施形態にかかる樹脂封止型半導体装置が
完成する。Further, as shown in FIG. 6C, the metal mask 515 is removed from the printed circuit board 501. After that, as shown in FIG. 6D, the printed circuit board is turned upside down to complete the resin-sealed semiconductor device according to the present embodiment.
【0047】以上のように,第5の実施の形態によれ
ば,絶縁接着剤を使用しないので,金属ワイヤのプリン
ト基板への配線位置を半導体ペレットから例えば略0.
3mm程度の位置で実行できるので,絶縁樹脂の塗布面
積が小さくなる。この結果,半導体装置の面積を微小化
することができる。As described above, according to the fifth embodiment, since the insulating adhesive is not used, the wiring position of the metal wire to the printed circuit board is set to, for example, about 0.
Since it can be performed at a position of about 3 mm, the application area of the insulating resin is reduced. As a result, the area of the semiconductor device can be reduced.
【0048】(第6の実施の形態)第5の実施の形態に
おいては,プリント基板裏面の導電樹脂を印刷法により
塗布しているが,本実施形態では塗布ノズルを使用して
塗布法により導電樹脂を塗布する方法について説明す
る。(Sixth Embodiment) In the fifth embodiment, the conductive resin on the back surface of the printed circuit board is applied by the printing method. In the present embodiment, the conductive resin is applied by the applying method using an application nozzle. A method for applying the resin will be described.
【0049】以下,本実施形態にかかる半導体装置の製
造方法について,図7に基づいて説明する。図7は,本
実施形態にかかる半導体装置の製造方法を説明するため
の工程断面図である。なお,図5(a)〜図6(a)ま
での工程は,第5の実施の形態と同様であるので,その
説明は省略する。Hereinafter, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIG. FIG. 7 is a process cross-sectional view for explaining the method for manufacturing the semiconductor device according to the present embodiment. Note that the steps from FIG. 5A to FIG. 6A are the same as in the fifth embodiment, and a description thereof will be omitted.
【0050】まず,図7(a)に示すように,第5の実
施の形態での図5(a)〜図6(a)に示す工程で形成
されたプリント基板は,金属ワイヤ503および半導体
ペレット502を覆うように絶縁樹脂504を塗布し硬
化させる。First, as shown in FIG. 7 (a), the printed circuit board formed in the steps shown in FIGS. 5 (a) to 6 (a) in the fifth embodiment is composed of a metal wire 503 and a semiconductor. An insulating resin 504 is applied and cured so as to cover the pellet 502.
【0051】次いで,図7(b)に示すように,塗布ノ
ズル517により,プリント基板501の裏面の開口部
から,貫通孔520内部及びプリント基板501の裏面
の所定範囲に導電樹脂507が塗布される。さらに,塗
布された導電樹脂507を硬化させることにより,半導
体ペレット502の裏面とプリント基板501とが電気
的に導通される。Next, as shown in FIG. 7B, a conductive resin 507 is applied to the inside of the through hole 520 and a predetermined area of the back surface of the printed circuit board 501 from an opening on the back surface of the printed circuit board 501 by a coating nozzle 517. You. Further, by curing the applied conductive resin 507, the back surface of the semiconductor pellet 502 and the printed board 501 are electrically connected.
【0052】最後に,図7(c)に示すように,プリン
ト基板501の裏面に必要以上に形成された導電樹脂5
07の凸部を,研磨機518により研削して,導電樹脂
を平坦化する。また,図7(d)に示すように,プリン
ト基板の上下を元に戻して,本実施形態にかかる樹脂封
止型半導体装置が完成する。Finally, as shown in FIG. 7C, the conductive resin 5 formed unnecessarily on the back surface of the printed circuit board 501.
07 is ground by a polishing machine 518 to flatten the conductive resin. In addition, as shown in FIG. 7D, the printed circuit board is turned upside down to complete the resin-sealed semiconductor device according to the present embodiment.
【0053】以上のように,第6の実施の形態によれ
ば,絶縁接着剤を使用しないので,金属ワイヤのプリン
ト基板への配線位置を半導体ペレットから例えば略0.
3mm程度の位置で実行できるので,絶縁樹脂の塗布面
積が小さくなる。この結果,半導体装置の面積を微小化
することができる。さらに,第5の実施の形態と比較し
て,メタルマスクを使用しないので,製造コストの低減
を図ることができる。As described above, according to the sixth embodiment, since the insulating adhesive is not used, the wiring position of the metal wire on the printed circuit board is set to, for example, about 0.
Since it can be performed at a position of about 3 mm, the application area of the insulating resin is reduced. As a result, the area of the semiconductor device can be reduced. Further, as compared with the fifth embodiment, since a metal mask is not used, manufacturing costs can be reduced.
【0054】以上,本発明に係る好適な実施の形態につ
いて説明したが,本発明はかかる構成に限定されない。
当業者であれば,特許請求の範囲に記載された技術思想
の範囲内において,各種の修正例および変更例を想定し
得るものであり,それらの修正例および変更例について
も本発明の技術範囲に包含されるものと了解される。The preferred embodiment according to the present invention has been described above, but the present invention is not limited to this configuration.
Those skilled in the art can envisage various modified examples and modified examples within the scope of the technical idea described in the claims, and those modified examples and modified examples are also included in the technical scope of the present invention. It is understood to be included in.
【0055】例えば,上記第1の実施の形態において
は,プリント基板と比較して薄い半導体ペレットを使用
した構成を例に挙げて説明したが,プリント基板と同等
の厚さの半導体ペレットでも対応することができる。For example, in the first embodiment, a configuration using a semiconductor pellet thinner than a printed board has been described as an example, but a semiconductor pellet having a thickness equivalent to that of a printed board is also applicable. be able to.
【0056】また,例えば,上記第3の実施の形態及び
第4の実施の形態においては,貫通孔を有するプリント
基板を使用した構成を例に挙げて説明したが,貫通して
いない凹部溝であっても実施することができる。Further, for example, in the third and fourth embodiments, the configuration using a printed circuit board having a through hole has been described as an example. It can be implemented even if there is.
【0057】また,例えば,上記第5の実施の形態及び
第6の実施の形態では,突起形状のあるステージを使用
した構成を例に挙げて説明したが,平坦なステージであ
っても実施することができる。Further, for example, in the fifth and sixth embodiments, a configuration using a stage having a protruding shape has been described as an example. However, the present invention is also applicable to a flat stage. be able to.
【0058】[0058]
【発明の効果】半導体ペレットの裏面電位を制御するこ
とができると共に,プリント基板の貫通孔に半導体ペレ
ットを挿入して半導体ペレットの厚さが低減されるの
で,半導体装置の厚さを低減することができる。絶縁接
着剤を使用せずに半導体ペレット表面とプリント基板と
を配線できるので,絶縁樹脂を塗布する面積を低減する
ことができる。この結果,半導体装置の全体面積も微小
化することができる。According to the present invention, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor pellet can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. Can be. Since the surface of the semiconductor pellet and the printed circuit board can be wired without using an insulating adhesive, the area for applying the insulating resin can be reduced. As a result, the entire area of the semiconductor device can be reduced.
【図1】第1の実施の形態にかかる樹脂封止型半導体装
置を示す断面図である。FIG. 1 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a first embodiment.
【図2】第2の実施の形態にかかる樹脂封止型半導体装
置を示す断面図である。FIG. 2 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a second embodiment.
【図3】第3の実施の形態にかかる樹脂封止型半導体装
置を示す断面図である。FIG. 3 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a third embodiment.
【図4】第4の実施の形態にかかる樹脂封止型半導体装
置を示す断面図である。FIG. 4 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a fourth embodiment.
【図5】第5の実施形態にかかる樹脂封止型半導体装置
を示す製造工程を説明するための工程断面図である。FIG. 5 is a process cross-sectional view for explaining a manufacturing process showing the resin-sealed semiconductor device according to the fifth embodiment.
【図6】第5の実施形態にかかる樹脂封止型半導体装置
を示す製造工程を説明するための工程断面図である。FIG. 6 is a process cross-sectional view for explaining a manufacturing process showing the resin-sealed semiconductor device according to the fifth embodiment.
【図7】第6の実施形態にかかる樹脂封止型半導体装置
の製造工程を説明するための工程断面図である。FIG. 7 is a process cross-sectional view for explaining a manufacturing process of the resin-sealed semiconductor device according to the sixth embodiment.
【図8】従来における樹脂封止型半導体装置を示す断面
図である。FIG. 8 is a cross-sectional view showing a conventional resin-encapsulated semiconductor device.
【図9】従来における樹脂封止型半導体装置の製造工程
を説明するための工程断面図である。FIG. 9 is a process cross-sectional view for explaining a manufacturing process of a conventional resin-encapsulated semiconductor device.
101 プリント基板 102 半導体ペレット 103 金属ワイヤ 104 絶縁樹脂 105 導電樹脂 120 貫通孔 209 銅箔 210 導電性接着剤 311 導電テープ 507 導電樹脂 510 導電性接着剤 512 粘着テープ 513 ステージ 514 突起部 515 メタルマスク 516 スキージ 517 塗布ノズル 518 研磨機 101 Printed Circuit Board 102 Semiconductor Pellet 103 Metal Wire 104 Insulating Resin 105 Conductive Resin 120 Through Hole 209 Copper Foil 210 Conductive Adhesive 311 Conductive Tape 507 Conductive Resin 510 Conductive Adhesive 512 Adhesive Tape 513 Stage 514 Projection 515 Metal Mask 516 Squeegee 517 Coating nozzle 518 Polishing machine
Claims (6)
トを挿入するための貫通孔が形成され,前記貫通孔に挿
入された前記半導体ペレット表面は金属ワイヤを介して
前記プリント基板と電気的に接続され,かつ,前記半導
体ペレット裏面は導電樹脂を介して前記プリント基板と
電気的に接続され,前記半導体ペレット表面及び前記金
属ワイヤが絶縁樹脂で封止されていることを特徴とする
樹脂封止型半導体装置。A through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and a surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. And a resin-sealed semiconductor, wherein the back surface of the semiconductor pellet is electrically connected to the printed circuit board via a conductive resin, and the front surface of the semiconductor pellet and the metal wire are sealed with an insulating resin. apparatus.
トを挿入するための貫通孔が形成され,前記貫通孔に挿
入された前記半導体ペレット表面は金属ワイヤを介して
前記プリント基板と電気的に接続され,かつ,前記半導
体ペレット裏面は銅箔を介して前記プリント基板と電気
的に接続され,前記半導体ペレット及び前記金属ワイヤ
が絶縁樹脂で封止されていることを特徴とする樹脂封止
型半導体装置。2. A through hole for inserting a semiconductor pellet at a predetermined position on a printed board, and a surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. And a back surface of the semiconductor pellet is electrically connected to the printed circuit board via a copper foil, and the semiconductor pellet and the metal wire are sealed with an insulating resin. .
レットを挿入するための凹部溝あるいは貫通孔が形成さ
れ,前記凹部溝あるいは前記貫通孔に挿入された前記半
導体ペレット表面は金属ワイヤを介して前記プリント基
板と電気的に接続され,かつ,前記半導体ペレット裏面
は導電配線が形成される導電配線テープを介して前記プ
リント基板と電気的に接続され,前記半導体ペレット及
び前記金属ワイヤ及び前記導電配線テープが絶縁樹脂で
封止されていることを特徴とする樹脂封止型半導体装
置。3. A concave groove or through hole for inserting a semiconductor pellet is formed at a predetermined position on the surface of a printed circuit board, and the surface of the semiconductor pellet inserted into the concave groove or the through hole is formed through a metal wire. The back surface of the semiconductor pellet is electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed, and the semiconductor pellet, the metal wire, and the conductive wiring tape are electrically connected to the printed board. Is sealed with an insulating resin.
トを挿入するための凹部溝あるいは貫通孔が形成され,
前記凹部溝あるいは前記貫通孔に挿入された前記半導体
ペレット表裏両面共に,導電配線が形成される導電配線
テープを介して前記プリント基板と電気的に接続され,
前記半導体ペレット及び前記導電配線テープが絶縁樹脂
で封止されていることを特徴とする樹脂封止型半導体装
置。4. A concave groove or through hole for inserting a semiconductor pellet at a predetermined position on a printed circuit board is formed.
Both the front and back surfaces of the semiconductor pellet inserted into the concave groove or the through hole are electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed,
A resin-sealed semiconductor device, wherein the semiconductor pellet and the conductive wiring tape are sealed with an insulating resin.
する工程と,前記貫通孔を覆い,かつ前記貫通孔内部方
向が粘着面となるように粘着テープを前記プリント基板
の裏面に貼り付ける工程と,前記半導体ペレットを前記
プリント基板の前記貫通孔に挿入して,前記粘着テープ
の前記粘着面に前記半導体ペレットを接着する工程と,
選択的に,前記粘着テープを介して前記貫通孔に突起形
状物を挿入して前記半導体ペレットを所定高さ位置に固
定する,あるいは平坦なステージで前記半導体ペレット
を所定位置に固定する工程と,前記半導体ペレット表面
と前記プリント基板とを金属ワイヤで電気的に接続する
工程と,前記半導体ペレット表面と前記金属ワイヤとを
絶縁樹脂により封止する工程と,前記プリント基板に貼
り付けられた前記粘着テープを剥ぎ取る工程と,前記プ
リント基板の上下を反対にした後,前記プリント基板裏
面の所定位置にメタルマスクを貼り付け,前記半導体ペ
レット裏面と前記プリント基板裏面とが電気的に導通す
るように印刷法により所定範囲に導電樹脂を塗布する工
程と,前記導電樹脂の充填により形成された凸部をスキ
ージにより平坦にする工程と,を有することを特徴とす
る樹脂封止型半導体装置の製造方法。5. A step of forming a through hole at a predetermined position on a printed circuit board, and a step of attaching an adhesive tape to the back surface of the printed circuit board so as to cover the through hole and make the inside of the through hole an adhesive surface. Inserting the semiconductor pellet into the through-hole of the printed circuit board and bonding the semiconductor pellet to the adhesive surface of the adhesive tape;
Selectively fixing the semiconductor pellet at a predetermined position by inserting a projection into the through hole via the adhesive tape, or fixing the semiconductor pellet at a predetermined position on a flat stage; A step of electrically connecting the surface of the semiconductor pellet and the printed board with a metal wire, a step of sealing the surface of the semiconductor pellet and the metal wire with an insulating resin, and the step of adhering the adhesive bonded to the printed board. After removing the tape and turning the printed circuit board upside down, a metal mask is attached to a predetermined position on the back surface of the printed circuit board so that the back surface of the semiconductor pellet and the back surface of the printed circuit board are electrically connected to each other. A step of applying a conductive resin to a predetermined area by a printing method, and flattening a convex portion formed by filling the conductive resin with a squeegee. Method for manufacturing a resin-sealed semiconductor device characterized by having a that step.
する工程と,前記貫通孔を覆い,かつ前記貫通孔内部方
向が粘着面となるように粘着テープを前記プリント基板
の裏面に貼り付ける工程と,前記半導体ペレットを前記
プリント基板の前記貫通孔に挿入して,前記粘着テープ
の前記粘着面に前記半導体ペレットを接着する工程と,
選択的に,前記粘着テープを介して前記貫通孔に突起形
状物を挿入して前記半導体ペレットを所定高さ位置に固
定する,あるいは平坦なステージで前記半導体ペレット
を所定位置に固定する工程と,前記半導体ペレット表面
と前記プリント基板とを金属ワイヤで電気的に接続する
工程と,前記半導体ペレット表面と前記金属ワイヤとを
絶縁樹脂により封止する工程と,前記プリント基板に貼
り付けられた前記粘着テープを剥ぎ取る工程と,前記プ
リント基板の上下を反対にした後,前記半導体ペレット
裏面と前記プリント基板裏面とが電気的に導通するよう
に,塗布法により塗布ノズルを介して所定範囲に導電樹
脂を塗布する工程と,前記導電樹脂の充填により形成さ
れた凸部を研磨により平坦にする工程と,を有すること
を特徴とする樹脂封止型半導体装置の製造方法。6. A step of forming a through hole at a predetermined position on a printed circuit board, and a step of attaching an adhesive tape to the back surface of the printed circuit board so as to cover the through hole and make the inside of the through hole an adhesive surface. Inserting the semiconductor pellet into the through-hole of the printed circuit board and bonding the semiconductor pellet to the adhesive surface of the adhesive tape;
Selectively fixing the semiconductor pellet at a predetermined position by inserting a projection into the through hole via the adhesive tape, or fixing the semiconductor pellet at a predetermined position on a flat stage; A step of electrically connecting the surface of the semiconductor pellet and the printed board with a metal wire, a step of sealing the surface of the semiconductor pellet and the metal wire with an insulating resin, and the step of adhering the adhesive bonded to the printed board. After removing the tape and turning the printed circuit board upside down, the conductive resin is applied to a predetermined area through a coating nozzle by a coating method so that the back surface of the semiconductor pellet and the back surface of the printed circuit board are electrically connected to each other. Applying a conductive resin, and flattening the convex portion formed by filling the conductive resin by polishing. Method of manufacturing a sealing-type semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000204813A JP4147729B2 (en) | 2000-07-06 | 2000-07-06 | Resin-sealed semiconductor device and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000204813A JP4147729B2 (en) | 2000-07-06 | 2000-07-06 | Resin-sealed semiconductor device and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002026170A true JP2002026170A (en) | 2002-01-25 |
JP4147729B2 JP4147729B2 (en) | 2008-09-10 |
Family
ID=18702011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000204813A Expired - Fee Related JP4147729B2 (en) | 2000-07-06 | 2000-07-06 | Resin-sealed semiconductor device and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4147729B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008512647A (en) * | 2004-09-07 | 2008-04-24 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | Semiconductor sensor device including hollow housing and sensor chip, and manufacturing method thereof |
JP2008232878A (en) * | 2007-03-22 | 2008-10-02 | Institute Of National Colleges Of Technology Japan | Distribution type sensor system by optical spectrum pattern matching method |
JP2008232893A (en) * | 2007-03-22 | 2008-10-02 | Institute Of National Colleges Of Technology Japan | Methods of achieving ultra narrowband of sensor and increasing number of sensors connectable to system in distribution type measurement system using light wavelength detection method |
JP2018518049A (en) * | 2015-05-13 | 2018-07-05 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Optoelectronic semiconductor component and method for manufacturing optoelectronic semiconductor component |
-
2000
- 2000-07-06 JP JP2000204813A patent/JP4147729B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008512647A (en) * | 2004-09-07 | 2008-04-24 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | Semiconductor sensor device including hollow housing and sensor chip, and manufacturing method thereof |
JP4712042B2 (en) * | 2004-09-07 | 2011-06-29 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | Semiconductor sensor device including hollow housing and sensor chip, and manufacturing method thereof |
JP2008232878A (en) * | 2007-03-22 | 2008-10-02 | Institute Of National Colleges Of Technology Japan | Distribution type sensor system by optical spectrum pattern matching method |
JP2008232893A (en) * | 2007-03-22 | 2008-10-02 | Institute Of National Colleges Of Technology Japan | Methods of achieving ultra narrowband of sensor and increasing number of sensors connectable to system in distribution type measurement system using light wavelength detection method |
JP4586167B2 (en) * | 2007-03-22 | 2010-11-24 | 独立行政法人国立高等専門学校機構 | Ultra-narrow band sensor in distributed measurement system using optical wavelength detection method and method for increasing the number of sensors that can be connected to the system |
JP2018518049A (en) * | 2015-05-13 | 2018-07-05 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Optoelectronic semiconductor component and method for manufacturing optoelectronic semiconductor component |
US10381391B2 (en) | 2015-05-13 | 2019-08-13 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
Also Published As
Publication number | Publication date |
---|---|
JP4147729B2 (en) | 2008-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7019404B2 (en) | Multilayered circuit substrate, semiconductor device and method of producing same | |
JPH1012773A (en) | Resin-sealed semiconductor device and its manufacture | |
JP2000195984A (en) | Semiconductor device, its manufacture carrier substrate therefor and its manufacture | |
JP4147729B2 (en) | Resin-sealed semiconductor device and manufacturing method thereof | |
JP2000277665A (en) | Semiconductor device and manufacture thereof | |
JP3915630B2 (en) | TAB tape, manufacturing method thereof, and semiconductor device using the same | |
JP2000243875A (en) | Semiconductor device | |
JP3699271B2 (en) | Semiconductor package and manufacturing method thereof | |
JPH11176849A (en) | Manufacture of semiconductor device | |
JP3337911B2 (en) | Semiconductor device and manufacturing method thereof | |
JPH0786340A (en) | Connection of semiconductor element | |
JP3589093B2 (en) | TAB tape with heat sink and reinforcing plate and semiconductor device | |
JP3362007B2 (en) | Semiconductor device, method of manufacturing the same, and tape carrier | |
JPH07170048A (en) | Component mounting structure of flexible printed-wiring board and mounting of component | |
JP2970595B2 (en) | BGA type semiconductor device | |
JP3820991B2 (en) | Semiconductor device and manufacturing method thereof | |
JPH1116939A (en) | Semiconductor device and manufacture thereof | |
JP3257931B2 (en) | Semiconductor package, method of manufacturing the same, and semiconductor device | |
JPH05251602A (en) | Manufacture of hybrid ic | |
JP2001015561A (en) | Radiating plate/reinforcing plate-attached tab tape and semiconductor device | |
JP3563846B2 (en) | Method of manufacturing lead frame member for BGA type resin-sealed semiconductor device | |
JP2002261183A (en) | Interconnection board, semiconductor device and method for manufacturing the same | |
JPH10335776A (en) | Printed circuit board | |
JPH09181223A (en) | Semiconductor device | |
JP2004146562A (en) | Lead frame, resin sealed semiconductor device using the same, and manufacturing method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061018 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080226 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080421 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080603 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080616 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110704 Year of fee payment: 3 |
|
R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110704 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110704 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120704 Year of fee payment: 4 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120704 Year of fee payment: 4 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120704 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130704 Year of fee payment: 5 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |