JP2002026170A - Resin-sealed semiconductor device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device, in which the rear surface of a semiconductor pellet can be controlled and the thickness of the semiconductor device can be reduced. SOLUTION: A through-hole 120 is made at a prescribed position of a printed board 101, and the surface of a semiconductor pellet 102 inserted into the through-hole 120 is connected electrically with the printed board 101 via a metal wire 103 while the rear surface of the semiconductor pellet 102 is connected electrically with the printed board 101 via a conductive resin 105. The surface of the semiconductor pellet 102 and the metal wire 103 are sealed with an insulating resin 104.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin-sealed semiconductor device and a method of manufacturing the same.

[0002]

2. Description of the Related Art In general, a conventional resin-encapsulated semiconductor device has a structure in which a semiconductor pellet 602 is mounted on a printed circuit board 601 via an insulating adhesive 619 as shown in FIG. The substrate 601 is electrically connected via a metal wire 603. Further, it is sealed with an insulating resin 604 to protect the metal wire 603 and the semiconductor pellet 602.

A method of manufacturing such a conventional resin-encapsulated semiconductor device will be described with reference to FIG.

First, as shown in FIG. 9A, an insulating adhesive 619 is applied on a printed circuit board 601. Then,
As shown in FIG. 9B, the semiconductor pellet 602 is stacked on the insulating adhesive 619 applied to the printed board 601.

Further, as shown in FIG. 9C, a metal wire 603 is connected to electrically connect the semiconductor pellet 602 to the printed board 601. Finally, FIG.
As shown in (d), the metal wire 603 and the semiconductor pellet 602 are sealed with an insulating resin 604 to protect the metal wire 603 and the semiconductor pellet 602.

[0006]

However, the conventional resin-encapsulated semiconductor device and the manufacturing method have the following problems.

[0007] Since the semiconductor pellet is mounted on the printed board and the back surface of the semiconductor pellet is not electrically connected to the printed board, the back potential of the semiconductor pellet cannot be controlled. . For example, a metal wire is connected to a semiconductor pellet having a thickness of approximately 350 μm to form a projection having a height of approximately 200 μm, for example, so that the thickness of the entire semiconductor device increases. . The adhesive for bonding the semiconductor pellets peels off at the resin interface due to, for example, the impact of heat or the like, and the reliability of the semiconductor device is reduced. . Since the metal wire is used, the wiring is deformed due to a load at the time of applying the resin, and contacts with the adjacent wiring to cause an electric short circuit. . Since the insulating adhesive applied in a wider range than the semiconductor pellet expands in an unstable shape due to the bonding pressure of the semiconductor pellet, the connection of the metal wire on the printed circuit board side to the semiconductor pellet is, for example, about 0.8 mm. This must be done at a distance above. For this reason, the portion of the printed circuit board where wiring cannot be formed increases.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above problems and to provide a new and improved resin-sealed semiconductor device capable of controlling the back surface of a semiconductor pellet and reducing the thickness of the semiconductor device. And a method for manufacturing the same.

[0009]

According to the first aspect of the present invention, a through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed circuit board, and the through hole is inserted into the through hole. The surface of the semiconductor pellet is electrically connected to the printed circuit board via a metal wire, and the back surface of the semiconductor pellet is electrically connected to the printed circuit board via a conductive resin. A resin-sealed semiconductor device is provided, wherein the wires are sealed with an insulating resin.

According to the invention described in this section, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor pellet can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. Can be reduced.

According to another aspect of the present invention, there is provided a semiconductor device comprising:
A through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and the surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. Connected to and
A resin-encapsulated semiconductor device is provided, wherein the back surface of the semiconductor pellet is electrically connected to the printed board via a copper foil, and the semiconductor pellet and the metal wire are sealed with an insulating resin. You.

According to the present invention, the back potential of the semiconductor pellet can be controlled, and the back surface of the semiconductor pellet inserted into the through hole of the printed circuit board is electrically connected by the copper foil. The thickness can be further reduced as compared with the described semiconductor device.

[0013] In order to solve the above-mentioned problems, a third aspect of the present invention is provided.
As described in the invention described in (1), a concave groove or a through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and the surface of the semiconductor pellet inserted into the concave groove or the through hole is formed through a metal wire. And the back surface of the semiconductor pellet is electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed. A resin-sealed semiconductor device is provided, wherein the wiring tape is sealed with an insulating resin.

According to the present invention, the back potential of the semiconductor pellet can be controlled, and the back surface of the semiconductor pellet inserted into the through hole of the printed circuit board is electrically connected by a conductive tape. The thickness can be further reduced as compared with the described semiconductor device. Further, since the adhesive is not applied onto the printed circuit board, the adhesive is not peeled off due to thermal stress, and electrical conduction can be achieved from the back surface of the semiconductor pellet.

[0015] In order to solve the above-mentioned problems, a fourth aspect of the present invention is provided.
A recessed groove or a through-hole is formed at a predetermined position on a printed circuit board, and both the front and back surfaces of the semiconductor pellet inserted into the recessed groove or the through-hole,
A resin-sealed semiconductor device electrically connected to the printed circuit board via a conductive wiring tape on which conductive wiring is formed, wherein the semiconductor pellet and the conductive wiring tape are sealed with an insulating resin. Is provided.

According to the present invention, the back surface potential of the semiconductor pellet can be controlled, and the front and back surfaces of the semiconductor pellet inserted into the through holes of the printed circuit board are electrically connected by a conductive tape. The thickness can be further reduced as compared with the semiconductor device described in (1).
Furthermore, since the adhesive is not applied on the printed circuit board, the adhesive is not peeled off due to thermal stress, and electrical conduction can be achieved from both surfaces of the semiconductor pellet. Further, since the semiconductor pellet and the printed circuit board are electrically connected by the conductive tape to which the wiring is fixed, the adjacent wiring is not deformed and electrically short-circuited.

According to another aspect of the present invention, there is provided a semiconductor device comprising:
Forming a through hole at a predetermined position on a printed circuit board, and applying an adhesive tape to the back surface of the printed circuit board such that the through hole is covered and the inside of the through hole is an adhesive surface. Attaching the semiconductor pellet to the through-hole of the printed circuit board, and bonding the semiconductor pellet to the adhesive surface of the adhesive tape; and selectively attaching the semiconductor pellet through the adhesive tape. Fixing the semiconductor pellet at a predetermined height by inserting a projection into the hole, or fixing the semiconductor pellet at a predetermined position on a flat stage, and connecting a metal wire to the surface of the semiconductor pellet with the printed board. Electrically connecting the semiconductor pellet surface and the metal wire with an insulating resin, and attaching the semiconductor pellet surface and the metal wire to the printed circuit board. After the step of peeling off the adhesive tape and turning the printed circuit board upside down, a metal mask is attached at a predetermined position on the back surface of the printed circuit board to electrically connect the back surface of the semiconductor pellet and the back surface of the printed circuit board. A step of applying a conductive resin to a predetermined area by a printing method, and a step of flattening a convex portion formed by filling the conductive resin with a squeegee. Is provided.

According to the present invention, since the surface of the semiconductor pellet and the printed circuit board can be wired with metal wires without using an insulating adhesive, the area for applying the insulating resin can be reduced. As a result, the overall area of the semiconductor device can be reduced.

According to another aspect of the present invention, there is provided a semiconductor device comprising:
Forming a through hole at a predetermined position on a printed circuit board, and applying an adhesive tape to the back surface of the printed circuit board such that the through hole is covered and the inside of the through hole is an adhesive surface. Attaching the semiconductor pellet to the through-hole of the printed circuit board, and bonding the semiconductor pellet to the adhesive surface of the adhesive tape; and selectively attaching the semiconductor pellet through the adhesive tape. Fixing the semiconductor pellet at a predetermined height by inserting a projection into the hole, or fixing the semiconductor pellet at a predetermined position on a flat stage, and connecting a metal wire to the surface of the semiconductor pellet with the printed board. Electrically connecting the semiconductor pellet surface and the metal wire with an insulating resin, and attaching the semiconductor pellet surface and the metal wire to the printed circuit board. After the step of peeling off the adhesive tape and turning the printed board upside down, a predetermined range is applied through a coating nozzle by a coating method so that the back surface of the semiconductor pellet and the back surface of the printed board are electrically connected to each other. A step of applying a conductive resin to the semiconductor device, and a step of polishing and flattening the convex portion formed by filling the conductive resin.

According to the invention described in this section, the area for applying the insulating resin can be reduced to reduce the overall area of the semiconductor device, and the wiring on the back surface of the semiconductor pellet can be formed without using a metal mask. Compared with the invention described in claim 5, it can be manufactured at low cost.

[0021]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
In the following description and the accompanying drawings, components having the same functions and configurations will be denoted by the same reference numerals, and redundant description will be omitted.

(First Embodiment) First, a first embodiment will be described with reference to FIG. Figure 1
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device according to an embodiment.

First, as shown in FIG.
The semiconductor pellet 102 is inserted into the through-hole 120 of No. 01. A metal wire 103 is connected to the surface of the semiconductor pellet 102 for electrical connection with the printed board 101. The surfaces of the metal wire 103 and the semiconductor pellet 102 are sealed with an insulating resin 104 to protect the metal wire 103 and the semiconductor pellet 102. At this time, since the height 106 of the metal wire is, for example, approximately 150 to 250 μm, the height 107 at which the insulating resin is formed is, for example, approximately 170 to 270 μm.

On the other hand, an open portion on the back surface of the printed circuit board 101 is sealed with a conductive resin 105. Since the printed board 101 and the back surface of the semiconductor pellet 102 are electrically connected via the conductive resin 105, the back potential of the semiconductor pellet 102 can be controlled. When the semiconductor pellet 102 is thinner than the printed board 101, the position of the wire bond can be recognized, or the metal wire 103 and the printed board 101 can be recognized.
The semiconductor pellet 102 is raised so that the wiring of FIG. At this time, the printed circuit board 101
Convex part thickness 108 of conductive resin 105 formed on the back surface of
Is about 100 μm, for example, when the conductive resin is formed by a printing method using a metal mask.

As described above, in the first embodiment, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor device can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. For example, the thickness can be reduced to about 2/3 as compared with the semiconductor device having the structure.

(Second Embodiment) In the first embodiment, electrical conduction is achieved between the back surface of the semiconductor pellet and the printed board by using a conductive resin. In the present embodiment, copper foil is used. I do.

Hereinafter, a second embodiment will be described with reference to FIG. FIG. 2 is a cross-sectional view illustrating a configuration of the resin-encapsulated semiconductor device according to the present embodiment.

First, as shown in FIG.
01, a semiconductor pellet 202 having substantially the same thickness as the printed circuit board 201 is inserted. A metal wire 203 is connected to the surface of the semiconductor pellet 202 to establish electrical conduction with the printed circuit board 201.
The surfaces of the metal wire 203 and the semiconductor pellet 202 are sealed with an insulating resin 204 to protect the metal wire 203 and the semiconductor pellet 202. At this time, the height 206 of the metal wire is, for example, approximately 150 to 25.
Since the thickness is 0 μm, the height at which the insulating resin is formed 207
Is, for example, approximately 170 to 270 μm.

On the other hand, a copper foil 209 is mounted on the back surface of the printed circuit board 201 so as to cover the through hole 220.
The semiconductor pellet 202 is bonded via the conductive adhesive 210. As described above, since the back surface of the semiconductor pellet 202 is electrically connected to the printed board 201 via the copper foil 209, the back potential of the semiconductor pellet 202 can be controlled. The thickness of the copper foil 209 is, for example, approximately 10 μm.

As described above, in the second embodiment, the back potential of the semiconductor pellet can be controlled, and if the thickness of the printed board and the semiconductor pellet are substantially the same, the back face of the printed board can be controlled. Since the semiconductor pellet can be mounted on the copper foil mounted on the semiconductor device, the thickness of the semiconductor device can be reduced, for example, by about 90 μm as compared with the first embodiment.

(Third Embodiment) In the second embodiment, the back surface of the semiconductor pellet and the printed circuit board are electrically connected to each other by using a copper foil, but in the present embodiment, conductive wiring is formed. Use the conductive tape that has been used.

Hereinafter, a third embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view illustrating the configuration of the resin-encapsulated semiconductor device according to the present embodiment.

In the through hole 320 of the printed circuit board 301,
The semiconductor pellet 302 is inserted. A metal wire 303 is connected to the surface of the semiconductor pellet 302 for electrical conduction with the printed board 301.

On the other hand, a conductive tape 311 on which conductive wiring is formed is adhered to the back surface of the semiconductor pellet 302, and is electrically connected to the surface of the printed circuit board 301. Also, a metal wire 303, a semiconductor pellet 302,
To protect the conductive tape 311, a metal wire 303 is used.
The surface of the semiconductor pellet 302 and the inside of the through hole 320 are sealed with an insulating resin 304. At this time, since the height 306 of the metal wire is, for example, approximately 150 to 250 μm, the height 307 at which the insulating resin 304 is formed is:
For example, it is approximately 170 to 270 μm.

As described above, in the third embodiment, the back potential of the semiconductor pellet can be controlled, the semiconductor pellet is inserted into the through hole of the printed board, and the back surface of the semiconductor pellet is electrically conductive tape. Is electrically connected to the printed circuit board through the substrate, so that the thickness of the semiconductor device is, for example, approximately 10
The thickness can be reduced by about μm. Further, since the adhesive is not applied on the printed board, the semiconductor pellet does not peel off from the adhesive due to thermal stress or the like, and electrical conduction with the back surface of the semiconductor pellet can be achieved.

(Fourth Embodiment) In the third embodiment, electrical conduction is achieved between the back surface of the semiconductor pellet and the printed board by using a conductive tape on which conductive wiring is formed. In the present embodiment, both sides of the semiconductor pellet are electrically connected to the printed circuit board by using a conductive tape.

Hereinafter, a fourth embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view illustrating a configuration of the resin-sealed semiconductor device according to the present embodiment.

In the through hole 420 of the printed circuit board 401,
The semiconductor pellet 402 is inserted, and a conductive tape 411 on which conductive wiring is formed is attached to the surface of the semiconductor pellet 402 in order to establish electrical conduction with the printed board 401.

On the other hand, a conductive tape 412 on which conductive wiring is formed is adhered to the back surface of the semiconductor pellet 402 and is electrically connected to the surface of the printed circuit board 401. In addition, the semiconductor pellet 402, the conductive tape 41
The surface of the semiconductor pellet 402 and the inside of the through-hole 420 are sealed with an insulating resin 404 in order to protect the semiconductor chip 1, 412. The height 407 of the insulating resin 404 at this time is, for example, approximately 50 μm.

As described above, in the fourth embodiment, the back potential of the semiconductor pellet can be controlled, and the semiconductor pellet is inserted into the through hole of the printed circuit board, and the front and back surfaces of the semiconductor pellet are electrically conductive. Since electrical conduction with the printed circuit board is achieved via the tape, the thickness of the semiconductor device can be reduced, for example, by about 120 to 220 μm as compared with the third embodiment. Also,
Since the adhesive is not applied on the printed circuit board, it does not peel off from the adhesive due to thermal stress or the like, and can be electrically connected to the back surface of the semiconductor pellet. further,
Since electrical conduction between the semiconductor pellet and the printed circuit board is achieved via the conductive tape on which the conductive wiring is formed, the conductive wiring is not deformed and short-circuited with the adjacent wiring.

(Fifth Embodiment) Next, a method of manufacturing a semiconductor device according to the present embodiment will be described with reference to FIGS. 5 and 6, taking the resin-sealed semiconductor device according to the first embodiment as an example. Will be explained. 5 and 6 are process cross-sectional views illustrating the method for manufacturing a semiconductor device according to the present embodiment.

First, as shown in FIG. 5A, a through hole 520 is formed at a predetermined position on the printed circuit board 501. Next, an adhesive tape 512 is attached to the back surface of the printed circuit board 501 so as to cover the through holes 520. At this time, the adhesive surface of the adhesive tape 512 is stuck so as to be in the direction inside the through hole 520. Further, the semiconductor pellet 502 is inserted into the through hole 520 of the printed circuit board 501 and adhered to the adhesive tape 512.

Next, as shown in FIG. 5B, using a stage 513 having a projection 514, the projection 51 is used.
4 pushes up the semiconductor pellet 502 adhered to the adhesive tape 512 from the back surface of the printed circuit board 501,
The semiconductor pellet 502 is inserted into the through hole 520 and fixed at a predetermined height with the bottom of the semiconductor pellet 502 raised.

Next, as shown in FIG. 5C, a metal wire 503 is connected to the surface of the semiconductor pellet 502 and the printed circuit board 501 for electrical conduction. Further, as shown in FIG. 5D, an insulating resin 504 is applied and cured so as to cover the metal wire 503 and the semiconductor pellet 502. Thereafter, as shown in FIG. 5E, the printed circuit board 501 is removed from the stage 513, and the adhesive tape 512 is further removed from the printed circuit board 501.

Next, as shown in FIG. 6A, the printed board 501 is turned upside down. Then, FIG.
As shown in FIG. 7, after a metal mask 515 is applied to a predetermined position on the back surface of the printed circuit board 501, a printing method is used to move the metal mask 515 from the opening on the back surface of the printed circuit board 501 to the inside of the through hole 520 and a predetermined range of the back surface of the printed circuit board 501. Conductive resin 50
7 is applied. Further, the squeegee 516 is moved along the upper surface of the metal mask 515 on which the conductive resin 507 is applied, and the conductive resin 507 applied more than necessary is extended and flattened. Further, by applying and curing the applied conductive resin 507, the back surface of the semiconductor pellet 502 and the printed board 501 are electrically connected.

Further, as shown in FIG. 6C, the metal mask 515 is removed from the printed circuit board 501. After that, as shown in FIG. 6D, the printed circuit board is turned upside down to complete the resin-sealed semiconductor device according to the present embodiment.

As described above, according to the fifth embodiment, since the insulating adhesive is not used, the wiring position of the metal wire to the printed circuit board is set to, for example, about 0.
Since it can be performed at a position of about 3 mm, the application area of the insulating resin is reduced. As a result, the area of the semiconductor device can be reduced.

(Sixth Embodiment) In the fifth embodiment, the conductive resin on the back surface of the printed circuit board is applied by the printing method. In the present embodiment, the conductive resin is applied by the applying method using an application nozzle. A method for applying the resin will be described.

Hereinafter, a method for manufacturing a semiconductor device according to the present embodiment will be described with reference to FIG. FIG. 7 is a process cross-sectional view for explaining the method for manufacturing the semiconductor device according to the present embodiment. Note that the steps from FIG. 5A to FIG. 6A are the same as in the fifth embodiment, and a description thereof will be omitted.

First, as shown in FIG. 7 (a), the printed circuit board formed in the steps shown in FIGS. 5 (a) to 6 (a) in the fifth embodiment is composed of a metal wire 503 and a semiconductor. An insulating resin 504 is applied and cured so as to cover the pellet 502.

Next, as shown in FIG. 7B, a conductive resin 507 is applied to the inside of the through hole 520 and a predetermined area of the back surface of the printed circuit board 501 from an opening on the back surface of the printed circuit board 501 by a coating nozzle 517. You. Further, by curing the applied conductive resin 507, the back surface of the semiconductor pellet 502 and the printed board 501 are electrically connected.

Finally, as shown in FIG. 7C, the conductive resin 5 formed unnecessarily on the back surface of the printed circuit board 501.
07 is ground by a polishing machine 518 to flatten the conductive resin. In addition, as shown in FIG. 7D, the printed circuit board is turned upside down to complete the resin-sealed semiconductor device according to the present embodiment.

As described above, according to the sixth embodiment, since the insulating adhesive is not used, the wiring position of the metal wire on the printed circuit board is set to, for example, about 0.
Since it can be performed at a position of about 3 mm, the application area of the insulating resin is reduced. As a result, the area of the semiconductor device can be reduced. Further, as compared with the fifth embodiment, since a metal mask is not used, manufacturing costs can be reduced.

The preferred embodiment according to the present invention has been described above, but the present invention is not limited to this configuration.
Those skilled in the art can envisage various modified examples and modified examples within the scope of the technical idea described in the claims, and those modified examples and modified examples are also included in the technical scope of the present invention. It is understood to be included in.

For example, in the first embodiment, a configuration using a semiconductor pellet thinner than a printed board has been described as an example, but a semiconductor pellet having a thickness equivalent to that of a printed board is also applicable. be able to.

Further, for example, in the third and fourth embodiments, the configuration using a printed circuit board having a through hole has been described as an example. It can be implemented even if there is.

Further, for example, in the fifth and sixth embodiments, a configuration using a stage having a protruding shape has been described as an example. However, the present invention is also applicable to a flat stage. be able to.

[0058]

According to the present invention, the back potential of the semiconductor pellet can be controlled, and the thickness of the semiconductor pellet can be reduced by inserting the semiconductor pellet into the through hole of the printed circuit board. Can be. Since the surface of the semiconductor pellet and the printed circuit board can be wired without using an insulating adhesive, the area for applying the insulating resin can be reduced. As a result, the entire area of the semiconductor device can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a first embodiment.

FIG. 2 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a second embodiment.

FIG. 3 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a third embodiment.

FIG. 4 is a cross-sectional view illustrating a resin-sealed semiconductor device according to a fourth embodiment.

FIG. 5 is a process cross-sectional view for explaining a manufacturing process showing the resin-sealed semiconductor device according to the fifth embodiment.

FIG. 6 is a process cross-sectional view for explaining a manufacturing process showing the resin-sealed semiconductor device according to the fifth embodiment.

FIG. 7 is a process cross-sectional view for explaining a manufacturing process of the resin-sealed semiconductor device according to the sixth embodiment.

FIG. 8 is a cross-sectional view showing a conventional resin-encapsulated semiconductor device.

FIG. 9 is a process cross-sectional view for explaining a manufacturing process of a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 101 Printed Circuit Board 102 Semiconductor Pellet 103 Metal Wire 104 Insulating Resin 105 Conductive Resin 120 Through Hole 209 Copper Foil 210 Conductive Adhesive 311 Conductive Tape 507 Conductive Resin 510 Conductive Adhesive 512 Adhesive Tape 513 Stage 514 Projection 515 Metal Mask 516 Squeegee 517 Coating nozzle 518 Polishing machine

Claims (6)

[Claims] A through hole for inserting a semiconductor pellet is formed at a predetermined position on a printed board, and a surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. And a resin-sealed semiconductor, wherein the back surface of the semiconductor pellet is electrically connected to the printed circuit board via a conductive resin, and the front surface of the semiconductor pellet and the metal wire are sealed with an insulating resin. apparatus. 2. A through hole for inserting a semiconductor pellet at a predetermined position on a printed board, and a surface of the semiconductor pellet inserted into the through hole is electrically connected to the printed board via a metal wire. And a back surface of the semiconductor pellet is electrically connected to the printed circuit board via a copper foil, and the semiconductor pellet and the metal wire are sealed with an insulating resin. . 3. A concave groove or through hole for inserting a semiconductor pellet is formed at a predetermined position on the surface of a printed circuit board, and the surface of the semiconductor pellet inserted into the concave groove or the through hole is formed through a metal wire. The back surface of the semiconductor pellet is electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed, and the semiconductor pellet, the metal wire, and the conductive wiring tape are electrically connected to the printed board. Is sealed with an insulating resin. 4. A concave groove or through hole for inserting a semiconductor pellet at a predetermined position on a printed circuit board is formed.
Both the front and back surfaces of the semiconductor pellet inserted into the concave groove or the through hole are electrically connected to the printed board via a conductive wiring tape on which conductive wiring is formed,
A resin-sealed semiconductor device, wherein the semiconductor pellet and the conductive wiring tape are sealed with an insulating resin. 5. A step of forming a through hole at a predetermined position on a printed circuit board, and a step of attaching an adhesive tape to the back surface of the printed circuit board so as to cover the through hole and make the inside of the through hole an adhesive surface. Inserting the semiconductor pellet into the through-hole of the printed circuit board and bonding the semiconductor pellet to the adhesive surface of the adhesive tape;
Selectively fixing the semiconductor pellet at a predetermined position by inserting a projection into the through hole via the adhesive tape, or fixing the semiconductor pellet at a predetermined position on a flat stage; A step of electrically connecting the surface of the semiconductor pellet and the printed board with a metal wire, a step of sealing the surface of the semiconductor pellet and the metal wire with an insulating resin, and the step of adhering the adhesive bonded to the printed board. After removing the tape and turning the printed circuit board upside down, a metal mask is attached to a predetermined position on the back surface of the printed circuit board so that the back surface of the semiconductor pellet and the back surface of the printed circuit board are electrically connected to each other. A step of applying a conductive resin to a predetermined area by a printing method, and flattening a convex portion formed by filling the conductive resin with a squeegee. Method for manufacturing a resin-sealed semiconductor device characterized by having a that step. 6. A step of forming a through hole at a predetermined position on a printed circuit board, and a step of attaching an adhesive tape to the back surface of the printed circuit board so as to cover the through hole and make the inside of the through hole an adhesive surface. Inserting the semiconductor pellet into the through-hole of the printed circuit board and bonding the semiconductor pellet to the adhesive surface of the adhesive tape;
Selectively fixing the semiconductor pellet at a predetermined position by inserting a projection into the through hole via the adhesive tape, or fixing the semiconductor pellet at a predetermined position on a flat stage; A step of electrically connecting the surface of the semiconductor pellet and the printed board with a metal wire, a step of sealing the surface of the semiconductor pellet and the metal wire with an insulating resin, and the step of adhering the adhesive bonded to the printed board. After removing the tape and turning the printed circuit board upside down, the conductive resin is applied to a predetermined area through a coating nozzle by a coating method so that the back surface of the semiconductor pellet and the back surface of the printed circuit board are electrically connected to each other. Applying a conductive resin, and flattening the convex portion formed by filling the conductive resin by polishing. Method of manufacturing a sealing-type semiconductor device.