JP2002022415A - 微小突起物検査装置 - Google Patents

微小突起物検査装置

Info

Publication number
JP2002022415A
JP2002022415A JP2001128287A JP2001128287A JP2002022415A JP 2002022415 A JP2002022415 A JP 2002022415A JP 2001128287 A JP2001128287 A JP 2001128287A JP 2001128287 A JP2001128287 A JP 2001128287A JP 2002022415 A JP2002022415 A JP 2002022415A
Authority
JP
Japan
Prior art keywords
light
detection signal
detection
light beam
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001128287A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002022415A5 (enExample
Inventor
Ryoji Matsunaga
良治 松永
Tsutomu Takahashi
勉 高橋
Hideo Ishimori
英男 石森
Takahito Tabata
高仁 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP2001128287A priority Critical patent/JP2002022415A/ja
Publication of JP2002022415A publication Critical patent/JP2002022415A/ja
Publication of JP2002022415A5 publication Critical patent/JP2002022415A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Liquid Crystal (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)
JP2001128287A 2000-05-01 2001-04-25 微小突起物検査装置 Pending JP2002022415A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001128287A JP2002022415A (ja) 2000-05-01 2001-04-25 微小突起物検査装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000131966 2000-05-01
JP2000-131966 2000-05-01
JP2001128287A JP2002022415A (ja) 2000-05-01 2001-04-25 微小突起物検査装置

Publications (2)

Publication Number Publication Date
JP2002022415A true JP2002022415A (ja) 2002-01-23
JP2002022415A5 JP2002022415A5 (enExample) 2006-10-26

Family

ID=26591328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001128287A Pending JP2002022415A (ja) 2000-05-01 2001-04-25 微小突起物検査装置

Country Status (1)

Country Link
JP (1) JP2002022415A (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327346A (ja) * 2002-05-14 2003-11-19 Sharp Corp 光学式物体識別装置およびそれを用いた印刷装置
JP2003329407A (ja) * 2002-05-14 2003-11-19 Sharp Corp 光学式距離測定装置およびそれを用いた印刷装置
US7133127B2 (en) 2002-07-10 2006-11-07 Hitachi High-Technologies Corporation Lighting optical machine and defect inspection system
JP2007107923A (ja) * 2005-10-11 2007-04-26 V Technology Co Ltd 微小高さ測定装置
JP2007212305A (ja) * 2006-02-09 2007-08-23 V Technology Co Ltd 微小高さ測定装置及び変位計ユニット
JP2008185551A (ja) * 2007-01-31 2008-08-14 V Technology Co Ltd 高さ測定装置
JP2009150910A (ja) * 2009-04-02 2009-07-09 Lasertec Corp 欠陥検査装置、欠陥検査方法、光学式走査装置、半導体デバイス製造方法
JP2010091343A (ja) * 2008-10-06 2010-04-22 Hitachi High-Technologies Corp 微小突起物検査装置
KR101114362B1 (ko) * 2009-03-09 2012-02-14 주식회사 쓰리비 시스템 결점검사를 위한 검사장치
JP2012058134A (ja) * 2010-09-10 2012-03-22 Daido Steel Co Ltd 凹部の検査方法と凹部の検査装置
WO2016100740A1 (en) * 2014-12-17 2016-06-23 Kla-Tencor Corporation Line scan knife edge height sensor for semiconductor inspection and metrology
WO2017041047A1 (en) * 2015-09-04 2017-03-09 Kla-Tencor Corporation Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
WO2017053325A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Increasing dynamic range of a height sensor for inspection and metrology
US20220156911A1 (en) * 2020-11-13 2022-05-19 Taiwan Semiconductor Manufacturing Company Limited Optical inspection of a wafer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151265U (enExample) * 1978-04-12 1979-10-20
JPH05322516A (ja) * 1991-03-25 1993-12-07 Rikagaku Kenkyusho 試料変位測定装置
JPH08327334A (ja) * 1995-06-05 1996-12-13 Toshiba Corp ギャップ測定装置
JPH10227618A (ja) * 1996-12-09 1998-08-25 Fujitsu Ltd 高さ検査方法、それを実施する高さ検査装置
JPH11351841A (ja) * 1998-06-09 1999-12-24 Mitsutoyo Corp 非接触三次元測定方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151265U (enExample) * 1978-04-12 1979-10-20
JPH05322516A (ja) * 1991-03-25 1993-12-07 Rikagaku Kenkyusho 試料変位測定装置
JPH08327334A (ja) * 1995-06-05 1996-12-13 Toshiba Corp ギャップ測定装置
JPH10227618A (ja) * 1996-12-09 1998-08-25 Fujitsu Ltd 高さ検査方法、それを実施する高さ検査装置
JPH11351841A (ja) * 1998-06-09 1999-12-24 Mitsutoyo Corp 非接触三次元測定方法

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327346A (ja) * 2002-05-14 2003-11-19 Sharp Corp 光学式物体識別装置およびそれを用いた印刷装置
JP2003329407A (ja) * 2002-05-14 2003-11-19 Sharp Corp 光学式距離測定装置およびそれを用いた印刷装置
US7133127B2 (en) 2002-07-10 2006-11-07 Hitachi High-Technologies Corporation Lighting optical machine and defect inspection system
US7417720B2 (en) 2002-07-10 2008-08-26 Hitachi High-Technologies Corporation Lighting optical machine and defect inspection system
JP2007107923A (ja) * 2005-10-11 2007-04-26 V Technology Co Ltd 微小高さ測定装置
JP2007212305A (ja) * 2006-02-09 2007-08-23 V Technology Co Ltd 微小高さ測定装置及び変位計ユニット
JP2008185551A (ja) * 2007-01-31 2008-08-14 V Technology Co Ltd 高さ測定装置
JP2010091343A (ja) * 2008-10-06 2010-04-22 Hitachi High-Technologies Corp 微小突起物検査装置
KR101114362B1 (ko) * 2009-03-09 2012-02-14 주식회사 쓰리비 시스템 결점검사를 위한 검사장치
JP2009150910A (ja) * 2009-04-02 2009-07-09 Lasertec Corp 欠陥検査装置、欠陥検査方法、光学式走査装置、半導体デバイス製造方法
JP2012058134A (ja) * 2010-09-10 2012-03-22 Daido Steel Co Ltd 凹部の検査方法と凹部の検査装置
CN107003112A (zh) * 2014-12-17 2017-08-01 科磊股份有限公司 用于半导体检验及计量的线扫描刀口高度传感器
KR102280137B1 (ko) 2014-12-17 2021-07-20 케이엘에이 코포레이션 반도체 검사 및 계측을 위한 라인 주사 나이프 에지 높이 센서
CN114719765A (zh) * 2014-12-17 2022-07-08 科磊股份有限公司 用于半导体检验及计量的线扫描刀口高度传感器
WO2016100740A1 (en) * 2014-12-17 2016-06-23 Kla-Tencor Corporation Line scan knife edge height sensor for semiconductor inspection and metrology
KR20170096001A (ko) * 2014-12-17 2017-08-23 케이엘에이-텐코 코포레이션 반도체 검사 및 계측을 위한 라인 주사 나이프 에지 높이 센서
US9885656B2 (en) 2014-12-17 2018-02-06 Kla-Tencor Corporation Line scan knife edge height sensor for semiconductor inspection and metrology
JP2018506843A (ja) * 2014-12-17 2018-03-08 ケーエルエー−テンカー コーポレイション 半導体検査及び度量衡用ラインスキャンナイフエッジ高さセンサ
TWI699842B (zh) * 2015-09-04 2020-07-21 美商克萊譚克公司 使用用於半導體檢查及度量之差分偵測技術而改善高度感測器之橫向解析度之方法
US10088298B2 (en) 2015-09-04 2018-10-02 Kla-Tencor Corporation Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
WO2017041047A1 (en) * 2015-09-04 2017-03-09 Kla-Tencor Corporation Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
US9958257B2 (en) 2015-09-21 2018-05-01 Kla-Tencor Corporation Increasing dynamic range of a height sensor for inspection and metrology
WO2017053325A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Increasing dynamic range of a height sensor for inspection and metrology
US20220156911A1 (en) * 2020-11-13 2022-05-19 Taiwan Semiconductor Manufacturing Company Limited Optical inspection of a wafer
US11423526B2 (en) * 2020-11-13 2022-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Optical inspection of a wafer
US20220292667A1 (en) * 2020-11-13 2022-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Optical inspection of a wafer
US11954841B2 (en) * 2020-11-13 2024-04-09 Taiwan Semiconductor Manufacturing Company, Ltd. Optical inspection of a wafer
US20240202903A1 (en) * 2020-11-13 2024-06-20 Taiwan Samiconductor Manufacturing Company, Ltd. Optical inspection of a wafer
US12400313B2 (en) * 2020-11-13 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Optical inspection of a wafer

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