JP2002020463A - Production method of phenolaralkyl resin - Google Patents

Production method of phenolaralkyl resin

Info

Publication number
JP2002020463A
JP2002020463A JP2000207661A JP2000207661A JP2002020463A JP 2002020463 A JP2002020463 A JP 2002020463A JP 2000207661 A JP2000207661 A JP 2000207661A JP 2000207661 A JP2000207661 A JP 2000207661A JP 2002020463 A JP2002020463 A JP 2002020463A
Authority
JP
Japan
Prior art keywords
compound
phenol
aralkyl resin
buffer
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000207661A
Other languages
Japanese (ja)
Other versions
JP4039598B2 (en
Inventor
Katsuhiko Oshimi
克彦 押見
Masayuki Kiyoyanagi
正幸 清柳
Nobuo Takahashi
信雄 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2000207661A priority Critical patent/JP4039598B2/en
Publication of JP2002020463A publication Critical patent/JP2002020463A/en
Application granted granted Critical
Publication of JP4039598B2 publication Critical patent/JP4039598B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide an easily producing method of a phenolaralkyl resin having excellent heat stability with time using inexpensive raw materials. SOLUTION: The production method of a phenolaralkyl resin comprises reacting an aromatic bishalogeno methyl compound with a phenolic compound, and then adding a specific buffering agent in a step of recovering the unreacted phenolic compound.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は低コストで、作業性
に優れたフェノールアラルキル樹脂の製造法に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a phenol aralkyl resin having low cost and excellent workability.

【0002】[0002]

【従来の技術】フェノールアラルキル樹脂は、半導体封
止剤エポキシ樹脂の硬化剤やエポキシ樹脂の原料、接着
剤、成形材料、塗料として有用な化合物であり、その硬
化物の優れた電気特性、耐熱性、接着性、耐湿性(耐水
性)等により電気・電子部品、構造用材料、接着剤、塗
料等の分野で幅広く用いられている。
2. Description of the Related Art Phenol aralkyl resin is a compound useful as a semiconductor encapsulant epoxy resin curing agent, epoxy resin raw material, adhesive, molding material, and paint. The cured product has excellent electrical properties and heat resistance. Due to its adhesiveness, moisture resistance (water resistance), etc., it is widely used in the fields of electric / electronic parts, structural materials, adhesives, paints and the like.

【0003】フェノールアラルキル樹脂は、通常、下記
式(1) R−(CHX) (1) (式中、Rはフェニレン基、アルキル置換フェニレン
基、ビフェニレン基、二価のジフェニルエーテル残基、
またはナフチレン基を示し、Xはハロゲン原子を示
す。)で示される芳香族ビスハロゲノメチル化合物や下
記式(2) R−(CHOR’) (2) (式中、Rはフェニレン基、アルキル置換フェニレン
基、ビフェニレン基、二価のジフェニルエーテル残基、
またはナフチレン基を示し、R’は低級アルキル基を示
す。)で示される芳香族ビスアルコキシメチル化合物と
フェノール化合物を反応させることにより得られる。し
かし、芳香族ビスハロゲノメチル化合物を使用する方法
は反応中に生成するハロゲン化水素ガスを窒素ガス等の
不活性ガスを通気させて系外へ除去するか、減圧状態に
して除去する方法が採られているが、十分に除去される
前に、未反応フェノール化合物を回収するために生成し
た樹脂が高温下にさらされると反応系中に残留している
ハロゲン化水素の影響から樹脂が高分子量化を起こしそ
の溶融粘度が上昇するという品質上の問題があった。こ
の問題は、反応スケールが大きくなるほどフェノール化
合物の回収に時間を要するために顕著である。残留した
ハロゲン化水素や酸触媒を使用した場合にはその酸触媒
を中和することによってこの問題に対処することは可能
であるが、反応系は通常水を含む系でないので、残留ハ
ロゲン化水素を苛性ソーダ等のアルカリで中和すること
はpH終点を判別しにくい上、終点を確認しながら中和
剤を添加するという煩雑な操作を要する等の問題があっ
た。一方、ハロゲン化水素が発生しない芳香族ビスアル
コキシメチル化合物を使用する方法は原料として高価な
ビスアルコキシメチル化合物を使用するためコスト的に
は不利である。
[0003] The phenol aralkyl resin is usually represented by the following formula (1) R- (CH 2 X) 2 (1) (where R is a phenylene group, an alkyl-substituted phenylene group, a biphenylene group, a divalent diphenyl ether residue,
Or X represents a naphthylene group, and X represents a halogen atom. )) Or an aromatic bishalogenomethyl compound represented by the following formula (2): R- (CH 2 OR ') 2 (2) (wherein R is a phenylene group, an alkyl-substituted phenylene group, a biphenylene group, a divalent diphenyl ether residue) Group,
Or, it represents a naphthylene group, and R ′ represents a lower alkyl group. )) And a phenol compound. However, the method of using an aromatic bishalogenomethyl compound is to remove the hydrogen halide gas generated during the reaction out of the system by passing an inert gas such as nitrogen gas, or to remove the hydrogen halide gas under reduced pressure. However, before the resin is sufficiently removed, if the resin produced to recover unreacted phenolic compounds is exposed to high temperatures, the resin will have a high molecular weight due to the effect of hydrogen halide remaining in the reaction system. And there is a quality problem that the melt viscosity increases. This problem is significant because the larger the reaction scale, the longer it takes to recover the phenol compound. If a residual hydrogen halide or acid catalyst is used, it is possible to address this problem by neutralizing the acid catalyst, but since the reaction system is not usually a system containing water, the residual hydrogen halide Neutralization with an alkali such as caustic soda has problems that it is difficult to determine the pH end point and that a complicated operation of adding a neutralizing agent while confirming the end point is required. On the other hand, a method using an aromatic bisalkoxymethyl compound that does not generate hydrogen halide is disadvantageous in cost because an expensive bisalkoxymethyl compound is used as a raw material.

【0004】[0004]

【発明が解決しようとする課題】本発明は、安価な芳香
族ビスハロゲノメチル化合物を使用して、容易に中和操
作を行うことができるフェノールアラルキル樹脂の製造
方法を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing a phenol aralkyl resin which can be easily neutralized using an inexpensive aromatic bishalogenomethyl compound. .

【0005】[0005]

【課題を解決するための手段】本発明者らは前記課題を
解決するため鋭意研究の結果、芳香族ビスハロゲノメチ
ル化合物とフェノール化合物を反応させた後、未反応フ
ェノール化合物を回収する工程において特定の緩衝剤を
添加することにより、高温下におけるフェノールアラル
キル樹脂の高分子量化を防ぐことができ、品質の安定し
たフェノールアラルキル樹脂が得られることを見出し、
本発明に到達した。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems. As a result, after reacting an aromatic bishalogenomethyl compound with a phenol compound, the present inventors have specified a process for recovering an unreacted phenol compound. By adding a buffering agent, it was possible to prevent the phenol aralkyl resin from having a high molecular weight at a high temperature, and to obtain a phenol aralkyl resin having a stable quality.
The present invention has been reached.

【0006】即ち、本発明は、(1)一般式(1) R−(CHX) (1) (式中、Rはフェニレン基、アルキル置換フェニレン
基、ビフェニレン基、二価のジフェニルエーテル残基、
またはナフチレン基を示し、Xはハロゲン原子を示す)
で示される芳香族ビスハロゲノメチル化合物とフェノー
ル化合物を反応させた後、pHが4〜9を示す緩衝剤を
添加した後に未反応フェノール化合物を回収することを
特徴とするフェノールアラルキル樹脂の製造法、(2)
緩衝剤が無機化合物である上記(1)に記載のフェノー
ルアラルキル樹脂の製造法、(3)緩衝剤がリン酸塩で
ある上記(1)に記載のフェノールアラルキル樹脂の製
造法に関する。
That is, the present invention relates to (1) a compound represented by the general formula (1) R- (CH 2 X) 2 (1) (wherein R is a phenylene group, an alkyl-substituted phenylene group, a biphenylene group, a divalent diphenyl ether residue) Group,
Or a naphthylene group, and X represents a halogen atom)
A method for producing a phenol aralkyl resin, comprising reacting an aromatic bishalogenomethyl compound and a phenol compound represented by the formula: and then collecting an unreacted phenol compound after adding a buffer having a pH of 4 to 9, (2)
The present invention relates to the method for producing a phenol aralkyl resin according to the above (1), wherein the buffer is an inorganic compound, and (3) the method for producing a phenol aralkyl resin according to the above (1), wherein the buffer is a phosphate.

【0007】[0007]

【発明の実施の形態】本発明の製造法で用いられる原料
である芳香族ビスハロゲノメチル化合物は式(1)で示
される。式(1)におけるRとしては、フェニレン基、
アルキル置換フェニレン基、ビフェニレン基、二価のジ
フェニルエーテル残基、またはナフチレン基であり、具
体的には、次式
BEST MODE FOR CARRYING OUT THE INVENTION An aromatic bishalogenomethyl compound as a raw material used in the production method of the present invention is represented by the formula (1). R in the formula (1) is a phenylene group,
An alkyl-substituted phenylene group, a biphenylene group, a divalent diphenyl ether residue, or a naphthylene group, specifically, the following formula

【0008】[0008]

【化1】 Embedded image

【0009】などで示される。また、Xはフッ素、塩
素、臭素又はヨウ素等のハロゲン原子を示す。
And the like. X represents a halogen atom such as fluorine, chlorine, bromine or iodine.

【0010】用いうる芳香族ビスハロゲノメチル化合物
の具体例としては、1,2−ジ(クロロメチル)ベンゼ
ン、1,2−ジ(ブロモメチル)ベンゼン、1,3−ジ
(クロロメチル)ベンゼン、1,3−ジ(ブロモメチ
ル)ベンゼン、1,3−ジ(フルオロメチル)ベンゼ
ン、1,4−ジ(クロロメチル)ベンゼン、1,4−ジ
(ブロモメチル)ベンゼン、1,4−ジ(フルオロメチ
ル)ベンゼン、1,4−ジ(クロロメチル)−2,5−
ジメチルベンゼン、1,3−ジ(クロロメチル)−4,
6−ジメチルベンゼン、1,3−ジ(クロロメチル)−
2,4−ジメチルベンゼン、4,4’−ビス(クロロメ
チル)−1,1’−ビフェニル、4,4’−ビス(ブロ
モメチル)−1,1’−ビフェニル、2,4’−ビス
(クロロメチル)−1,1’−ビフェニル、2,4’−
ビス(ブロモメチル)−1,1’−ビフェニル、2,
2’−ビス(クロロメチル)−1,1’−ビフェニル、
2,2’−ビス(ブロモメチル)−1,1’−ビフェニ
ル、4,4’−ビス(クロロメチル)ジフェニルエーテ
ル、2,7’−ビス(クロロメチル)ナフタレン等が挙
げられる。これらのうち、工業的にはXが塩素である化
合物が好ましい。
Specific examples of the aromatic bishalogenomethyl compound that can be used include 1,2-di (chloromethyl) benzene, 1,2-di (bromomethyl) benzene, 1,3-di (chloromethyl) benzene, 1,3-di (bromomethyl) benzene, 1,3-di (fluoromethyl) benzene, 1,4-di (chloromethyl) benzene, 1,4-di (bromomethyl) benzene, 1,4-di (fluoromethyl) Benzene, 1,4-di (chloromethyl) -2,5-
Dimethylbenzene, 1,3-di (chloromethyl) -4,
6-dimethylbenzene, 1,3-di (chloromethyl)-
2,4-dimethylbenzene, 4,4′-bis (chloromethyl) -1,1′-biphenyl, 4,4′-bis (bromomethyl) -1,1′-biphenyl, 2,4′-bis (chloro Methyl) -1,1′-biphenyl, 2,4′-
Bis (bromomethyl) -1,1′-biphenyl, 2,
2′-bis (chloromethyl) -1,1′-biphenyl,
2,2′-bis (bromomethyl) -1,1′-biphenyl, 4,4′-bis (chloromethyl) diphenyl ether, 2,7′-bis (chloromethyl) naphthalene, and the like. Of these, compounds in which X is chlorine are preferred industrially.

【0011】用いうるフェノール化合物の具体例として
は、フェノール、p−クレゾール、o−クレゾール、m
−クレゾール、p−エチルフェノール、o−エチルフェ
ノール、p−イソプロピルフェノール、p−n−プロピ
ルフェノール、、p−sec−ブチルフェノール、o−
sec−ブチルフェノール、p−tert−ブチルフェ
ノール、o−tert−ブチルフェノール、p−ter
t−アミルフェノール、p−tert−オクチルフェノ
ール、ノニルフェノール、ドデシルフェノール、p−シ
クロヘキシルフェノール、o−フェニルフェノール、p
−フェニルフェノール、p−クミルフェノール、p−ク
ロロフェノール、o−クロロフェノール、p−ブロモフ
ェノール、o−ブロモフェノール、α−ナフトール、β
−ナフトール、レゾルシン、カテコール、ハイドロキノ
ン、ピロガロール、フロログリシノール、p−アミノフ
ェノール、m−アミノフェノール、2,2−ビス(4−
ヒドロキシフェニル)プロパン、ビス(ヒドロキシフェ
ニル)メタン、4,4’−チオジフェノール等が挙げら
れるが、フェノール性水酸基を有する限りこれらに限定
されるものではない。本発明においては、これらのうち
フェノール、p−クレゾール、o−クレゾール又はm−
クレゾールが好ましい。また、これらフェノール化合物
は単独でまたは2種以上を混合して使用することができ
る。
Specific examples of phenol compounds that can be used include phenol, p-cresol, o-cresol, m
-Cresol, p-ethylphenol, o-ethylphenol, p-isopropylphenol, pn-propylphenol, p-sec-butylphenol, o-
sec-butylphenol, p-tert-butylphenol, o-tert-butylphenol, p-ter
t-amylphenol, p-tert-octylphenol, nonylphenol, dodecylphenol, p-cyclohexylphenol, o-phenylphenol, p
-Phenylphenol, p-cumylphenol, p-chlorophenol, o-chlorophenol, p-bromophenol, o-bromophenol, α-naphthol, β
-Naphthol, resorcin, catechol, hydroquinone, pyrogallol, phloroglucinol, p-aminophenol, m-aminophenol, 2,2-bis (4-
Examples thereof include (hydroxyphenyl) propane, bis (hydroxyphenyl) methane, and 4,4′-thiodiphenol, but are not limited thereto as long as they have a phenolic hydroxyl group. In the present invention, phenol, p-cresol, o-cresol or m-
Cresol is preferred. These phenol compounds can be used alone or in combination of two or more.

【0012】式(1)の化合物に対するフェノール化合
物の使用量は式(1)の化合物1モルに対して通常1.
0〜10モル、好ましくは1.2〜5.0モルである。
The amount of the phenol compound to be used relative to the compound of the formula (1) is usually 1.
It is 0 to 10 mol, preferably 1.2 to 5.0 mol.

【0013】本発明の製造法においては、必要により酸
触媒を用いる。酸触媒としては種々のものが使用できる
が硫酸、p−トルエンスルホン酸、シュウ酸等の有機あ
るいは無機酸、塩化第二錫、塩化亜鉛、塩化第二鉄等の
フリーデルクラフツ型触媒等が挙げられる。なかでも塩
化第二錫、硫酸、p−トルエンスルホン酸が好ましい。
これら酸触媒の使用量は触媒の種類により異なるが、式
(1)の化合物に対して0.0005〜1重量%の範囲
内で添加すれば良い。
In the production method of the present invention, an acid catalyst is used if necessary. Various acids can be used as the acid catalyst, and examples thereof include organic or inorganic acids such as sulfuric acid, p-toluenesulfonic acid, and oxalic acid, and Friedel-Crafts type catalysts such as stannic chloride, zinc chloride, and ferric chloride. Can be Among them, stannic chloride, sulfuric acid and p-toluenesulfonic acid are preferred.
The amount of these acid catalysts varies depending on the type of the catalyst, but may be added in the range of 0.0005 to 1% by weight based on the compound of the formula (1).

【0014】反応温度は通常40〜200℃、好ましく
は50〜150℃である。反応時間は0.5〜20時
間、好ましくは1〜15時間である。反応は、全原料を
一括投入して昇温しながら行っても、フェノール化合物
を予め一定の温度に保った状態で芳香族ビスハロゲノメ
チル化合物を逐次添加して行っても良い。また、反応は
残留ハロゲン化水素量が少なくなる無溶媒で行うことが
好ましいが、反応に直接関与しないトルエン、モノクロ
ロベンゼン、ジクロロベンゼン、低級アルコール等の有
機化合物を溶媒として用いることもできる。
[0014] The reaction temperature is usually 40 to 200 ° C, preferably 50 to 150 ° C. The reaction time is 0.5 to 20 hours, preferably 1 to 15 hours. The reaction may be carried out while all the raw materials are charged at once and the temperature is raised, or may be carried out by sequentially adding an aromatic bishalogenomethyl compound while keeping the phenol compound at a constant temperature in advance. The reaction is preferably carried out without a solvent in which the amount of residual hydrogen halide is reduced, but an organic compound which does not directly participate in the reaction, such as toluene, monochlorobenzene, dichlorobenzene, or a lower alcohol, can be used as a solvent.

【0015】反応中生成するハロゲン化水素ガスは窒素
ガス等の不活性ガスを流すことによって系外へ除去する
か、減圧状態にして除去する。
The hydrogen halide gas generated during the reaction is removed from the system by flowing an inert gas such as nitrogen gas, or is removed under reduced pressure.

【0016】本発明においては、式(1)の化合物とフ
ェノール化合物の反応が終了した後、緩衝剤を添加す
る。緩衝剤としては、pH4〜9を示し、緩衝作用を示
すものであれば特に制限はなく、有機酸塩と無機塩基の
組み合わせ、無機酸塩等が挙げられる。但し、有機酸塩
を使用する場合、中和によって生成した有機酸が高温、
高真空下における未反応フェノール化合物回収の工程で
フェノール化合物に混入して回収されることが予想され
るので回収フェノール化合物をリサイクルする場合には
好ましくない。用いうる無機酸塩の具体例としてはリン
酸二水素カリウム、リン酸水素二ナトリウム、リン酸二
水素ナトリウム、トリポリリン酸ソーダ、ホウ酸ナトリ
ウム等が挙げられるが、リン酸二水素カリウム、リン酸
水素二ナトリウム、リン酸二水素ナトリウム、トリポリ
リン酸ソーダ等のリン酸塩が好ましい。緩衝剤は水溶液
で添加しても粉末で添加しても構わない。添加量は、反
応混合物に残留しているハロゲン化水素量及び使用した
酸触媒量にもよるが式(1)の化合物に対して通常0.
5〜10重量%である。なお、上記緩衝剤を添加する操
作はpHを確認しながら中和剤を添加する等の煩雑な操
作を必要とせず、緩衝剤を一括に添加すればよいので作
業性に優れる。
In the present invention, a buffer is added after the reaction of the compound of the formula (1) with the phenol compound is completed. The buffer is not particularly limited as long as it has a pH of 4 to 9 and exhibits a buffering action, and examples thereof include a combination of an organic acid salt and an inorganic base, and an inorganic acid salt. However, when an organic acid salt is used, the organic acid generated by the neutralization is at a high temperature,
Since it is expected that the unreacted phenol compound is mixed with the phenol compound and recovered in the step of recovering the unreacted phenol compound under a high vacuum, it is not preferable when the recovered phenol compound is recycled. Specific examples of the inorganic acid salt that can be used include potassium dihydrogen phosphate, disodium hydrogen phosphate, sodium dihydrogen phosphate, sodium tripolyphosphate, and sodium borate. Phosphates such as disodium, sodium dihydrogen phosphate and sodium tripolyphosphate are preferred. The buffer may be added as an aqueous solution or as a powder. The addition amount depends on the amount of hydrogen halide remaining in the reaction mixture and the amount of the acid catalyst used, but is usually 0.1 to 10% for the compound of the formula (1).
5 to 10% by weight. The operation of adding the buffer does not require a complicated operation such as adding a neutralizing agent while checking the pH, and the operation is excellent because the buffer may be added all at once.

【0017】緩衝剤を添加した後に未反応フェノール化
合物や溶媒を回収することにより目的とするフェノール
アラルキル樹脂を得ることができる。未反応フェノール
化合物の回収は常圧下または減圧下で留去するのが好ま
しい。水蒸気を吹き込んで、水蒸気蒸留で留去すること
も可能である。フェノール化合物の蒸留回収の温度は通
常100〜180℃、減圧度は通常0.1〜25kPa
程度である。
The desired phenol aralkyl resin can be obtained by recovering the unreacted phenol compound and the solvent after adding the buffer. The unreacted phenol compound is preferably recovered by distillation under normal pressure or reduced pressure. It is also possible to blow in steam and distill off by steam distillation. The temperature for distillation and recovery of the phenol compound is usually 100 to 180 ° C, and the degree of reduced pressure is usually 0.1 to 25 kPa.
It is about.

【0018】[0018]

【実施例】次に本発明を実施例により更に具体的に説明
するが、本発明はこれら実施例に限定されるものではな
い。なお、実施例中の軟化点、溶融粘度は以下の条件で
測定した。 ・軟化点:JIS K−7234に準じた方法で測定 ・溶融粘度:150℃におけるコーンプレート法におけ
る溶融粘度 測定機械:コーンプレート(ICI)高温粘度計(RESE
ACH EQUIPMENT(LONDON)LTD.製)
EXAMPLES Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. The softening point and melt viscosity in the examples were measured under the following conditions. -Softening point: Measured by a method according to JIS K-7234-Melt viscosity: Melt viscosity in cone plate method at 150 ° C Measurement machine: Cone plate (ICI) high temperature viscometer (RESE)
ACH EQUIPMENT (LONDON) LTD.)

【0019】実施例1 撹拌機、温度計、コンデンサーを備えた四つ口フラスコ
にフェノール164.7重量部を仕込み、50℃で撹拌
しながら4,4’−ビス(クロロメチル)−1,1’−
ビフェニル141.9重量部を加えた。ここにp−トル
エンスルホン酸一水和物0.05重量部を加え、常圧下
53〜56℃で1.5時間、68〜72℃で1時間で反
応を行い、次いで98.7〜100kPaの減圧下で7
8〜82℃で1時間反応を行った。反応液を70℃まで
冷却した後、トリポリリン酸ソーダ4.0重量部を添加
し0.5時間撹拌した。次いで、系内の未反応フェノー
ルを0.6〜1.3kPaの減圧下、140〜150℃
で回収した。この結果、182.2重量部のフェノール
アラルキル樹脂(P1)を得た。得られたフェノールア
ラルキル樹脂(P1)の溶融粘度は0.12Pa・s、
軟化点は106℃であった。
Example 1 A four-necked flask equipped with a stirrer, a thermometer and a condenser was charged with 164.7 parts by weight of phenol and stirred at 50 ° C. with 4,4′-bis (chloromethyl) -1,1. '-
141.9 parts by weight of biphenyl were added. 0.05 parts by weight of p-toluenesulfonic acid monohydrate was added thereto, and the mixture was reacted at normal pressure at 53 to 56 ° C. for 1.5 hours and at 68 to 72 ° C. for 1 hour, and then at 98.7 to 100 kPa. 7 under reduced pressure
The reaction was performed at 8-82 ° C for 1 hour. After the reaction solution was cooled to 70 ° C., 4.0 parts by weight of sodium tripolyphosphate was added and stirred for 0.5 hour. Next, unreacted phenol in the system is reduced to 140 to 150 ° C. under a reduced pressure of 0.6 to 1.3 kPa.
Was collected. As a result, 182.2 parts by weight of a phenol aralkyl resin (P1) was obtained. The melt viscosity of the obtained phenol aralkyl resin (P1) is 0.12 Pa · s,
The softening point was 106 ° C.

【0020】比較例1 撹拌機、温度計、コンデンサーを備えたを備えた四つ口
フラスコにフェノール164.7重量部を仕込み、50
℃で撹拌しながら4,4’−ビス(クロロメチル)−
1,1’−ビフェニル141.9重量部を加え徐々に昇
温した。常圧下53〜56℃で1.5時間、68〜72
℃で1時間反応を行い、次いで98.7〜100kPa
の減圧下で78〜82℃で1時間反応を行った。次いで
系内の未反応フェノールを0.6〜1.3kPaの減圧
下、140〜150℃で回収した。この結果、175.
5重量部のフェノールアラルキル樹脂(P2)を得た。
得られたフェノールアラルキル樹脂(P2)の溶融粘度
は0.12Pa・s、軟化点は110℃であった。
Comparative Example 1 164.7 parts by weight of phenol was charged into a four-necked flask equipped with a stirrer, a thermometer and a condenser.
4,4'-bis (chloromethyl)-
141.9 parts by weight of 1,1'-biphenyl was added and the temperature was gradually raised. 1.5-hour at 53-56 ° C under normal pressure, 68-72
C. for 1 hour, then 98.7-100 kPa
The reaction was carried out at 78 to 82 ° C. for 1 hour under reduced pressure. Next, unreacted phenol in the system was recovered at 140 to 150 ° C. under a reduced pressure of 0.6 to 1.3 kPa. As a result, 175.
5 parts by weight of a phenol aralkyl resin (P2) was obtained.
The obtained phenol aralkyl resin (P2) had a melt viscosity of 0.12 Pa · s and a softening point of 110 ° C.

【0021】試験例 実施例1及び比較例1において得られたフェノールアラ
ルキル樹脂をそれぞれ0.6〜1.3kPaの減圧下、
145℃にて10時間保持し、溶融粘度を測定した。そ
の結果を図1に示す。
Test Example Each of the phenol aralkyl resins obtained in Example 1 and Comparative Example 1 was subjected to a reduced pressure of 0.6 to 1.3 kPa under reduced pressure.
It was kept at 145 ° C. for 10 hours, and the melt viscosity was measured. The result is shown in FIG.

【0022】図1より本発明の製造法で得たフェノール
アラルキル樹脂は熱時経時安定性に優れていることが明
らかである。
From FIG. 1, it is clear that the phenol aralkyl resin obtained by the production method of the present invention has excellent stability over time when heated.

【0023】[0023]

【発明の効果】本発明の製造法により、安価な原料を使
用して、熱時経時安定性に優れたフェノールアラルキル
樹脂を容易に製造することができる。
According to the production method of the present invention, it is possible to easily produce a phenol aralkyl resin excellent in stability over time during heating using inexpensive raw materials.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例1及び比較例1で得られたフェノールア
ラルキル樹脂の熱時の粘度変化を示す。横軸は経過時
間、縦軸は溶融粘度をそれぞれ示す。
FIG. 1 shows a change in viscosity of a phenol aralkyl resin obtained in Example 1 and Comparative Example 1 when heated. The horizontal axis shows the elapsed time and the vertical axis shows the melt viscosity.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】一般式(1) R−(CHX) (1) (式中、Rはフェニレン基、アルキル置換フェニレン
基、ビフェニレン基、二価のジフェニルエーテル残基、
またはナフチレン基を示し、Xはハロゲン原子を示
す。)で示される芳香族ビスハロゲノメチル化合物とフ
ェノール化合物を反応させた後、pHが4〜9を示す緩
衝剤を添加した後に未反応フェノール化合物を回収する
ことを特徴とするフェノールアラルキル樹脂の製造法。
A compound of the general formula (1) R- (CH 2 X) 2 (1) wherein R is a phenylene group, an alkyl-substituted phenylene group, a biphenylene group, a divalent diphenyl ether residue,
Or X represents a naphthylene group, and X represents a halogen atom. A method for producing a phenol aralkyl resin, comprising reacting an aromatic bishalogenomethyl compound represented by the formula (1) with a phenol compound, adding a buffer having a pH of 4 to 9, and recovering the unreacted phenol compound. .
【請求項2】緩衝剤が無機化合物である請求項1に記載
のフェノールアラルキル樹脂の製造法。
2. The method for producing a phenol aralkyl resin according to claim 1, wherein the buffer is an inorganic compound.
【請求項3】緩衝剤がリン酸塩である請求項1に記載の
フェノール樹脂の製造法。
3. The method according to claim 1, wherein the buffer is a phosphate.
JP2000207661A 2000-07-10 2000-07-10 Method for producing phenol aralkyl resin Expired - Fee Related JP4039598B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008114766A1 (en) * 2007-03-12 2008-09-25 Tohto Kasei Co., Ltd. Novel polyvalent hydroxy compound, method for producing the compound, epoxy resin and epoxy resin composition each using the compound, and cured product of the composition
JP2009001812A (en) * 2008-08-04 2009-01-08 Nippon Steel Chem Co Ltd Polyvalent hydroxy resin, epoxy resin, their manufacturing method, epoxy resin composition using them, and cured product
JP2012252273A (en) * 2011-06-06 2012-12-20 Asahi Kasei E-Materials Corp Photosensitive resin composition and novel phenolic resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008114766A1 (en) * 2007-03-12 2008-09-25 Tohto Kasei Co., Ltd. Novel polyvalent hydroxy compound, method for producing the compound, epoxy resin and epoxy resin composition each using the compound, and cured product of the composition
JP2009001812A (en) * 2008-08-04 2009-01-08 Nippon Steel Chem Co Ltd Polyvalent hydroxy resin, epoxy resin, their manufacturing method, epoxy resin composition using them, and cured product
JP2012252273A (en) * 2011-06-06 2012-12-20 Asahi Kasei E-Materials Corp Photosensitive resin composition and novel phenolic resin

Also Published As

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