JP2002016163A - Ceramic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic package capable of conduction of the conductor layer of a sealed surface and an internal connection terminal and an electronic component mounting part inside a cavity even when the seal path width for a seal ring is small. SOLUTION: Conductor wiring 24 in continuity with the seal ring 13 is formed on the side wall surface 23 of the cavity 22 by castration. Also, the conductor wiring 24 is in the conductive state through a wiring pattern with a part of the internal connection terminal 12 formed inside the cavity 22 and a brazing filler metal flow blocking part 26 is provided on the wiring pattern so as not to expose a conductor to the surface of an insulation body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a miniaturized ceramic package formed by laminating ceramic green sheets, and more particularly, to a method of forming conduction between upper and lower insulators laminated in a limited space. A ceramic package.

[0002]

2. Description of the Related Art In recent years, electronic components such as LSI chips and crystal oscillators have been put to practical use mounted on ceramic packages. Ceramics such as alumina are suitable for electronic components because of their excellent thermal conductivity, heat resistance, durability, airtightness, and the like, and ceramic packages are currently in active use. This ceramic package reduces the package size in response to the miniaturization of electronic components,
In order to increase the mounting density on the component mounting board and further improve the electrical characteristics, it is generally manufactured on a ceramic multilayer substrate formed by laminating and firing insulators consisting of multiple ceramic green sheets. You. This ceramic multilayer substrate is formed by forming holes for through holes and cavities for mounting electronic components on ceramic green sheets, forming wiring patterns of metal conductors and through hole conductors, and laminating a plurality of ceramic green sheets. It is formed of a laminate. Furthermore, firing the laminated body that formed the snap line according to the external dimensions of the ceramic package,
After electrolytic plating, the laminate is folded at a snap line to form a ceramic package.

As shown in FIGS. 10A, 10B, and 10C, an electronic component is mounted in a cavity of the ceramic package 80, and the electronic component in the cavity is sealed with a lid 81. In order to prevent this, a seal ring 82 is formed by forming a metal conductor wiring pattern around the cavity, and an external connection terminal 83 is formed on the back side of the ceramic package 80 for connection with an external electrode. I have. The external connection terminal 83 is routed from the inside of the ceramic package 80 to the outside through a wiring pattern, a through-hole conductor, and a conductor wiring 85 by castellation comprising a recess provided on the outside of the ceramic package 80. And an internal connection terminal 84 which is a connection terminal for an electronic component provided.

[0004] The castellation means that a conductor is formed on the wall surface of a ceramic through-hole, and the through-hole is cut vertically to form a conductor wiring on the side wall surface of the ceramic. Further, the conductor wiring 85 formed by the castellation also serves to form a meniscus of solder when the external connection terminal 83 is connected to the electronic component mounting board by soldering or the like, and also to strengthen the connection.
An electronic component such as a semiconductor chip or a crystal oscillator is connected to the internal connection terminal 84 using a bonding wire, a conductive resin, or the like.
It is in an electrically conductive state. In such a ceramic package 80, the seal ring 82 and one of the internal connection terminals 84 are connected to use the seal ring 82 and the electronic component mounting portion 91 as a ground electrode, or the seal ring 82 and the electronic component mounting portion 91 are used. 91 may be connected.

[0005] As these connection methods, FIG.
As shown in (B) and (C), a through-hole conductor 86 is formed from the seal ring 82 and connected to the internal connection terminal 84 and the electronic component mounting portion 91 via the wiring pattern 87, and further, the conductor wiring of castellation 85 is connected to the external connection terminal 83. Also, as another connection method,
As shown in FIGS. 12A, 12B and 12C, the internal electrode terminals 84 and the through holes 89 are formed from the seal ring 82 via the conductor wiring 88 of the castellation at the upper ceramic corner and the wiring pattern 90. , And is connected to an external connection terminal 83 via a lower-layer castellated conductor wiring 85. The ceramic package 8 thus connected and formed.
Since the seal ring 82 of No. 0 has an insulating layer formed on the surface of the connection portion with the internal connection terminal 84 and the electronic component mounting portion 91, the cover 81 made of a ceramic, a metal plate or the like (FIG.
(A) is prevented from flowing into the internal electrode terminal 84 and the electronic component mounting portion 91 when the brazing material or the adhesive is joined. Before the lid 81 is joined, the seal ring 8
In some cases, a metal ring for sealing with the lid 81 is brazed to the cover 2, but in this case, the flow of the brazing material can also be prevented.

[0006]

However, the conventional ceramic package as described above has the following problems. (1) With the miniaturization of ceramic packages, the seal path width of the seal ring has become increasingly narrower, and it has become difficult to form through holes between the seal path widths. (2) Even when the castellation at the corner of the ceramic package is used, since the seal path width is narrow, it is difficult to form a wiring pattern extending from the castellation at the through hole or the corner to the internal electrode terminal or the electronic component mounting portion. It has become to. The present invention has been made in view of such circumstances, and even if the seal path width of the seal ring is narrow, it is possible to conduct the conductive layer on the seal surface and the internal connection terminal and the electronic component mounting portion in the cavity. It is an object of the present invention to provide a ceramic package having a reduced thickness.

[0007]

According to a first aspect of the present invention, there is provided a ceramic package comprising: an upper insulator having a cavity penetrating the front and back surfaces; and a lower insulator forming a bottom plate. Formed and surrounded by the side wall and bottom plate of the cavity part to form a cavity for mounting electronic components, and formed of a metal conductor to join and seal the lid on the upper surface of the side wall and seal around the cavity A ceramic package having a ring, wherein conductive wires in a conductive state with a seal ring are formed by castellation on a side wall surface of a cavity, and the conductive wires are connected to a part of internal connection terminals formed in the cavity. The wiring pattern is in a conductive state via the pattern, and the wiring pattern is provided with a flow stopping portion for the joining brazing material so that the conductor is not exposed on the surface of the insulator. Since the conductor wiring is formed by castellation on the side wall surface of the insulator forming the cavity in this manner, a through-hole conductor and a wiring pattern for wiring are not required, and even in a ceramic package having a narrow seal path width of the seal ring, the conductor wiring is not required. It can be formed, and the brazing material flowing along the conductor wiring is prevented from flowing to the internal connection terminal by the flow stopper, so that a miniaturized ceramic package can be easily obtained.

According to a second aspect of the present invention, there is provided a ceramic package in which an upper insulator having a cavity penetrating the front and back surfaces and a lower insulator forming a bottom plate are laminated to form an insulator. A ceramic package that is surrounded by side walls and a bottom plate, forms a cavity for mounting electronic components, and is formed of a metal conductor to bond and seal a lid on the top surface of the side wall and has a seal ring that surrounds the cavity The conductor wiring in a conductive state with the seal ring is formed on the side wall surface of the cavity by printing, and the conductive wiring is in a conductive state with a part of the internal connection terminal formed in the cavity through a wiring pattern. In addition, the wiring pattern is provided with a flow stopping portion for a brazing filler metal so that the conductor is not exposed on the surface of the insulator. In this way, the conductor wiring is formed by printing on the side wall surface of the insulator forming the cavity, and the seal path width is formed sufficiently large without forming a narrow portion of the seal path width due to a concave portion such as castellation on the seal ring. As a result, the sealability is good, and the brazing material flowing along the conductor wiring is prevented from flowing to the internal connection terminal by the flow stopping portion, so that a miniaturized ceramic package can be obtained.

According to a third aspect of the present invention, there is provided a ceramic package in which an insulator is formed by laminating an upper insulator having a cavity penetrating the front and back sides and a lower insulator forming a bottom plate. A ceramic package that is surrounded by side walls and a bottom plate, forms a cavity for mounting electronic components, and is formed of a metal conductor to bond and seal a lid on the top surface of the side wall and has a seal ring that surrounds the cavity In addition, the conductor wiring in conduction with the seal ring is formed by castellation on the side wall surface of the cavity, and the conductor wiring is in conduction with the electronic component mounting portion formed in the cavity through the wiring pattern. In addition, the wiring pattern is provided with a flow stopping portion for the brazing filler metal so that the conductor is not exposed on the surface of the insulator. Since the conductor wiring is formed by castellation on the side wall surface of the insulator forming the cavity in this manner, a through-hole conductor and a wiring pattern for wiring are not required, and even in a ceramic package having a narrow seal path width of the seal ring, the conductor wiring is not required. It can be formed, and the brazing material that has flowed along the conductor wiring is prevented from flowing to the electronic component mounting portion by the flow stopping portion, so that a miniaturized ceramic package can be easily obtained.

According to a fourth aspect of the present invention, there is provided a ceramic package in which an upper insulator having a cavity penetrating the front and back surfaces and a lower insulator forming a bottom plate are laminated to form an insulator, and the cavity portion is formed. A ceramic package that is surrounded by side walls and a bottom plate, forms a cavity for mounting electronic components, and is formed of a metal conductor to bond and seal a lid on the top surface of the side wall and has a seal ring that surrounds the cavity A conductive wiring in a conductive state with the seal ring is formed on the side wall surface of the cavity by printing, and the conductive wiring is in a conductive state with an electronic component mounting portion formed in the cavity through a wiring pattern. In addition, the wiring pattern is provided with a flow stopping portion for the brazing filler metal so that the conductor is not exposed on the surface of the insulator. As described above, the conductor wiring is formed on the side wall surface of the insulator forming the cavity by printing, and the seal path width can be increased without forming a narrow portion of the seal path width due to the concave portion such as the castellation in the seal ring. Therefore, the sealing material is good, and the brazing material flowing along the conductor wiring is prevented from flowing to the electronic component mounting portion by the flow stopping portion, so that a miniaturized ceramic package can be obtained.

In the ceramic package according to the first and second aspects of the present invention, the flow stopper is formed by sandwiching a part of a wiring pattern connecting between the conductive wiring and a part of the internal connection terminal with an insulator. Is also good. This eliminates the need for a special operation for forming the flow stopping portion, and provides a ceramic package in which the brazing material or the adhesive does not easily flow into a part of the internal connection terminal. In the ceramic packages according to the third and fourth aspects of the present invention, the flow stopping portion may be formed by sandwiching a part of a wiring pattern for connecting between the conductor wiring and the electronic component mounting portion with an insulator. This eliminates the need for a special work for forming the flow stopping portion, and provides a ceramic package in which the brazing material or the adhesive does not easily flow into the electronic component mounting portion.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. FIGS. 1A and 1B are perspective views of the front and back surfaces of a ceramic package according to the first embodiment of the present invention, and FIGS. 2A and 2B are seals of the same ceramic package, respectively. FIG. 3 is a cross-sectional view illustrating a connection between a ring and an internal connection terminal, a partially enlarged plan view, FIG. 3 is a perspective view of a ceramic package according to a second embodiment of the present invention, and FIG. 4 is a third embodiment of the present invention. 5A and 5B are a cross-sectional view and a partially enlarged plan view, respectively, illustrating the connection between a seal ring and an electronic component mounting portion of the ceramic package according to the embodiment. FIG. FIG. 7 is a perspective view of a ceramic package according to a fourth embodiment, FIG. 7 is a cross-sectional view illustrating connection between the ceramic package and an electronic component mounting board, FIG.
(B) and (C) are illustrations of a method of forming a castellation of a ceramic package, respectively, and FIGS.
(B) is explanatory drawing of the formation method of a flow stop part, respectively.

First, referring to FIGS. 1A and 1B, a ceramic package 1 according to a first embodiment of the present invention will be described.
The structure of 0 will be described. This ceramic package 10
Is an electronic component mounting portion 11 on which a semiconductor element or the like is mounted;
The semiconductor device includes a plurality of internal connection terminals 12 for connecting the semiconductor elements and the like with bonding wires and the like, and a seal ring 13 used when mounting and sealing the semiconductor elements and the like. And
Conductor wiring 24 connecting the seal ring 13 and a part of the internal connection terminal 12 is formed by castellation on the side wall surface 23 of the insulator forming the cavity 22. An external connection terminal 14 is provided on the back side,
Conductor wiring (connection wiring) 15 is formed by castellation to connect the external connection terminal 14 and the internal connection terminal 12. Then, as shown in FIG. 7, when the ceramic package 10 is connected to the electronic component mounting board 18 by solder 16 or the like, the conductor wiring 15 forms a meniscus 17, and the connection of the external connection terminal 14 and the meniscus 17 The ceramic package 10 is mounted on the electronic component mounting board 1
8 is firmly connected.

Next, referring to FIGS. 2A and 2B,
A method for connecting the seal ring 13 and the internal connection terminal 12 of the ceramic package 10 according to the first embodiment of the present invention will be described. The ceramic package 10 includes first to third insulators 19 and 2 made of ceramic green sheets.
The first and second cavities 19a and 20a, which are formed by laminating the first and second cavities 0 and 21 and which penetrate the first and second insulators 19 and 20 constituting the upper insulator through the front and back surfaces, respectively. Side wall and third insulator 2 forming lower insulator
1 has a cavity 22 surrounded by a bottom plate 29. Electronic components such as a semiconductor element and a quartz oscillator are mounted in the cavity 22, and the seal ring 13 is provided.
A lid (not shown) over the lid and the lid and seal ring 1
And 3 are sealed with a brazing material or the like. The seal ring 13 formed for sealing is provided with a metal conductor, for example, a conductor layer made of a refractory metal such as tungsten or molybdenum on the outer periphery of the upper surface of the first insulator 19. . A conductor wiring 24 which is in conduction with the seal ring 13 is formed by castellation on the side wall surface 23 on the first insulator 19 side forming the cavity 22.

Here, a method of forming the conductor wiring 24 by castellation will be described. 8 (A), (B),
As shown in FIG. 8C, a hole 27 (preferably an elliptical hole) is formed in the first insulator 19 made of a ceramic green sheet (see FIG. 8A), and a metal conductor paste is screen-printed. To print from the top of hole 27 and at the same time
7, the metal conductor paste is adhered to the wall surface of the hole 27, the remaining metal conductor paste is absorbed, and the metal conductor is formed on the wall surface of the hole 27 (see FIG. 8B). 27 is punched out at an appropriate position (shown by a broken line) so that the wall surface is exposed, or the ceramic is cut along a break groove formed in advance after firing the ceramic. In the present embodiment, a die is punched to a size that forms the cavity 22 through the substantial center of the hole 27 (FIG. 8).
(C), the first cavity 19a is formed in the first insulator 19, and the conductor wiring 24 is formed on the side wall surface 23 thereof.
Is formed.

As shown in FIG. 2B, the second insulator 2
On the surface of No. 0, a receiving pattern 25 which is a part of a wiring pattern is formed by printing a metal conductor in order to make a conductive state with the conductor wiring 24 formed by castellation, and is connected to this receiving pattern 25. The internal connection terminals 12 are also formed by printing at the same time. Further, the wiring pattern for connection with the conductor wiring 15 formed by the castellation connected to the external connection terminal 14 in this printing is used as the connection portion 12a so that the internal connection terminal 12 serves as the outer wall surface of the second insulator 20. Formed to extend. In the receiving pattern 25, the brazing filler metal used for bonding by the seal ring 13 flows along the metal surface of the conductor wiring 24, and is prevented from flowing any further by the flow stopper 26. The flow stopping portion 26 is formed by covering a part of the wiring pattern as a connection portion 25a between the receiving pattern 25 and the internal connection terminal 12 with an insulator so as not to expose the metal surface of the wiring pattern. Thereby, for example, the sealing lid is directly placed on the sealing ring 13 via the sealing brazing material, and the brazing material at the time of joining is used, and the Kovar for joining the sealing ring 13 to the sealing lid is used. Is prevented from flowing into the internal connection terminals 12 when the metal ring made of silver is brazed. The internal connection terminal 12 is connected to the external connection terminal 14 via a conductor wiring 15 formed by castellation of the second and third insulators 20 and 21. First to third insulators 19, 2
The ceramic green sheets forming 0 and 21 are laminated to form a laminated body, and the ceramic package 10 is formed by co-firing with a high melting point metal.

Next, the connection between the seal ring 13 and the internal connection terminal 12 of the ceramic package 30 according to the second embodiment of the present invention will be described. Note that the same reference numerals are used for components that are substantially the same as those of the ceramic package 10 according to the first embodiment. As shown in FIG.
The conductor wiring pattern 28 connecting the internal connection terminals 3 to the internal connection terminals 12 is made of a metal conductor, for example, a refractory metal paste made of tungsten, molybdenum, or the like. 2 (A),
(See (B))). This end face printing method can be formed by, for example, attaching a high melting point metal paste to a rod-shaped object having a pattern width equal to the pattern width of the conductor wiring pattern 28 and performing transfer printing on the side wall surface 23 of the first insulator 19.

The ceramic package 30 of the present embodiment
In the method described above, the ceramic package 10 according to the first embodiment forms the conductor wiring 24 on the side wall surface 23 of the first insulator 19 by castellation, whereas the end surface printing is performed directly on the side wall surface 23. Go to conductor wiring pattern 2
8 is formed in the same manner as when the ceramic package 10 is formed.

Next, referring to FIGS. 4, 5A and 5B, connection between the seal ring 13 of the ceramic package 40 and the electronic component mounting portion 11 according to the third embodiment of the present invention. Will be described. Note that the same reference numerals are used for the same portions as those used in the above description. The ceramic package 40 is formed by laminating first to third insulators 19, 20, and 21 made of three layers of ceramic green sheets, and forming the cavity 22 into first and second insulators 19 and 20 as upper insulators. Are formed as side walls, and a third insulator 21 as a lower insulator is formed as a bottom plate 29. Electronic components are mounted in the cavity 22, and the seal ring 13
And the seal and the seal ring 13 are joined with a brazing material or the like and sealed. The seal ring 13 formed for the sealing is formed by providing a metal conductor, for example, a conductor layer made of a refractory metal such as tungsten or molybdenum, surrounding the cavity on the upper surface of the first insulator 19. ing. First and second insulators 1 surrounding cavity 22
Conductor wires 24a that are in conduction with the seal ring 13 are continuously formed by castellation on the continuous side wall surfaces 23a of 9, 20. As a result, the conductor wiring 24 and the seal ring 13 form a conductive state.

The third forming the bottom plate 29 of the cavity 22
On the surface of the insulator 21 on the cavity 22 side, the electronic component mounting portion 11 is formed by printing with a metal conductor, for example, a refractory metal such as tungsten or molybdenum. Further, a part of the electronic component mounting portion 11 is cut out, and a receiving pattern 25 is formed therein, and the receiving pattern 25 and the electronic component mounting portion 1 are formed.
1 is connected at a connection portion 25a, and a brazing filler metal used for bonding with the seal ring 13 is a conductor wiring 2
4a, flows into the receiving pattern 25 along the metal surface,
The flow that stops flowing out is stopped by the flow stopper 26. The flow stopping portion 26 is formed by covering a part of the wiring pattern, which is the connection portion 25a between the receiving pattern 25 and the electronic component mounting portion 11, with an insulator so as not to expose the metal surface of the wiring pattern. When it is necessary to make the seal ring 13 and the internal electrode terminal 12 conductive, the ceramic package 10 according to the first embodiment of the present invention or the ceramic package 10 according to the second embodiment of the present invention is used. The conduction may be formed by the method described for the ceramic package 30. In this case, for example, the electronic component mounting portion 11
Can also be easily used as a ground electrode.

Next, a ceramic package 50 according to a fourth embodiment of the present invention will be described. Note that the same reference numerals are used for the same portions as those used in the above description. As shown in FIG. 6, in the ceramic package 50 according to the present embodiment, in the ceramic package 40 according to the third embodiment of the present invention, the side walls 23a of the first and second insulators 19 and 20 are provided. While the conductor wiring 24a is formed by castellation,
It is formed by the same forming method as that for forming the ceramic package 40 according to the third embodiment of the present invention, except that the conductor wiring pattern 28a is formed by directly performing end face printing on the side wall surface 23a.

The conductor wiring pattern 28a connecting the seal ring 13 and the internal connection terminal 12 of the ceramic package 50 is made of a metal conductor, for example, a high melting point metal paste made of tungsten, molybdenum, or the like.
Side wall surface 2 of first and second insulators 19 and 20 forming
3a is formed by printing an end face. As a method of this end face printing, for example, the conductor wiring pattern 28a
Can be formed by attaching a high-melting metal paste to a rod-shaped object having a pattern width equal to the above pattern width and transferring and printing it on the side wall surface 23a of the first insulator 19 and the second insulator 20.

Here, the flow stopping portion 26 is formed by the conductor wiring 2.
An insulator between the receiving pattern 25 and the internal connection terminal 12 or the wiring pattern of the electronic component mounting portion 11 connected to
For example, it is formed by printing an insulating paste made of the same material as the ceramic green sheet (FIG. 2).
(B) and FIG. 5 (B)). On the other hand, FIG.
As shown in the figure, the conductor wiring 24 (the conductor wiring pattern 2
The same applies to the case of (8)), by sandwiching a part between the first insulator 19 and the second insulator 20 between a part of the wiring pattern which is a connection portion between the receiving pattern 25 to be connected to the internal connection terminal 12. The flow stopping portion 26a is formed, or as shown in FIG. 9B, the conductor wiring 24a (the conductor wiring pattern 28a
The same applies to the case of (2). The flow is performed by sandwiching a part between the second insulator 20 and the third insulator 21 between the receiving pattern 25 to be connected and the wiring pattern that is the connection part of the electronic component mounting unit 11. By forming the stopper 26b, the flow of the brazing filler metal from the seal ring 13 through the conductor wirings 24 and 24a to the receiving pattern 25 prevents the internal connection terminal 12 and the electronic component mounting part from flowing along the joint. 11 may not be flowed.

Next, the ceramic package 10,
The method of manufacturing the semiconductor devices 30, 40 and 50 will be described. To a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica or calcia to alumina (Al ₂ O ₃ ) powder, a plasticizer such as dioxyl phthalate, a binder such as an acrylic resin, and toluene, xylene, and alcohols And kneading well, defoaming and viscosity of 2,000 to 40,000
A slurry of cps is prepared, a roll-shaped sheet having a thickness of, for example, 0.3 mm is formed by a doctor blade method or the like, and cut into a suitable size to prepare a plurality of rectangular ceramic green sheets (insulators). .

Next, a plurality of through holes are formed in each ceramic green sheet using a punching die, an NC punching machine, or the like, and a conductor paste made of a high melting point metal such as tungsten or molybdenum is screen-printed in each through hole. Filled by a method or the like to form a via. Further, a wiring pattern or a plating wiring pattern is formed by the same conductive paste as the via conductor by a screen printing method or the like, and the ceramic green sheets are overlapped.
The laminate is formed by thermocompression bonding at 50 ° C. and 50 to 250 kg / cm ² to form a ceramic green sheet laminate. Next, snap lines for forming individual ceramic packages are formed in the ceramic green sheet laminate, and the ceramic green sheet and the high melting point metal are simultaneously fired at about 1550 ° C. in a reducing atmosphere. Next, a metal package is subjected to a surface treatment such as Ni plating or Au plating, and then divided along a snap line to form a ceramic package. FIG.
5 (B), the insulating paste forming the flow stopping portion 26 shown in FIG. 5 (B) is formed in a slurry state before being formed on the ceramic green sheet.

In this embodiment, the number of laminated ceramic green sheets (insulators) is a three-layer structure of first to third insulators 19, 20, and 21, but the number of layers is limited. Not something. The material of the ceramic green sheet (insulator) is not limited to alumina, and ceramics such as aluminum nitride and low-temperature fired glass ceramic can be used.

[0027]

In the ceramic package according to the first and fifth aspects of the present invention, the conductor wiring in a conductive state with the seal ring is formed by castellation on the side wall surface of the cavity, and the seal ring and the cavity are formed. A part of the internal connection terminals formed is electrically conductive through the conductor wiring, and the conductor of the wiring pattern connecting between the conductor wiring and a part of the internal connection terminal is exposed on the surface of the insulator. Since there is no flow stop for the brazing filler metal, it is not necessary to use a through-hole conductor or a wiring pattern, and even if the ceramic package has a narrow seal path width of the seal ring, the conductor wiring is provided by the castellation provided on the side wall surface of the cavity. To prevent the flow of brazing material to the internal connection terminals and to provide a compact ceramic package. It can be.

In the ceramic package according to the second and fifth aspects of the present invention, the conductor wiring which is in a conductive state with the seal ring is formed by printing on the side wall surface of the cavity, and is formed in the seal ring and the cavity. The part of the internal connection terminal is electrically connected to the part of the internal connection terminal through the conductor wiring so that the conductor of the wiring pattern connecting the conductor wiring and the part of the internal connection terminal is not exposed on the surface of the insulator. Since there is a flow stop for the brazing filler metal, conductor wiring is formed by printing on the side wall surface of the insulator that forms the cavity, and a narrow part of the seal path width such as a castellation is formed in the seal ring. Therefore, a large seal path width of the seal ring can be formed, and a miniaturized ceramic package having good sealability can be provided.

In the ceramic package according to the third and sixth aspects of the present invention, the conductor wiring which is in a conductive state with the seal ring is formed on the side wall surface of the cavity by castellation, and formed in the seal ring and the cavity. The electronic component mounting portion is electrically connected to the electronic component mounting portion via the conductive wiring, and the conductor of the wiring pattern connecting between the conductive wiring and the electronic component mounting portion is joined so that the conductor of the wiring pattern is not exposed on the surface of the insulator. Since it has a flow stopper for the material,
Through-hole conductors and wiring patterns for wiring are not required, and conductor wiring is possible even for ceramic packages with a narrow seal ring seal path width, preventing the flow of brazing material to electronic component mounting parts, and miniaturizing ceramic packages. Obtained easily.

[0030] In the ceramic package according to the fourth and sixth aspects of the present invention, the conductor wiring which is in a conductive state with the seal ring is formed on the side wall surface of the cavity by printing, and is formed in the seal ring and the cavity. The brazing filler metal is in a conductive state with the electronic component mounting portion via the conductor wiring, and the conductor of the wiring pattern connecting the conductor wiring and the electronic component mounting portion is not exposed on the surface of the insulator. , The seal path width of the seal ring can be formed large, the sealing performance is good, and the flow of the brazing material to the electronic component mounting portion is prevented, so that a miniaturized ceramic package can be obtained.

In the ceramic package according to the fifth aspect, the flow stopping portion is formed by sandwiching a part of a wiring pattern for connecting between the conductor wiring and a part of the internal connection terminal with an insulator. It is possible to easily provide a ceramic package in which the brazing material or the adhesive does not flow into the terminals. In the ceramic package according to the sixth aspect, since the flow stopping portion is formed by sandwiching a part of a wiring pattern connecting between the electronic component mounting portions with an insulator, the brazing material or the adhesive to the electronic component mounting portion is provided. It is possible to easily provide a ceramic package in which the agent does not flow.

[Brief description of the drawings]

FIGS. 1A and 1B are perspective views of the front and back surfaces of a ceramic package according to a first embodiment of the present invention, respectively.

FIGS. 2A and 2B are a cross-sectional view and a partially enlarged plan view illustrating a connection between a seal ring and an internal connection terminal of the ceramic package.

FIG. 3 is a perspective view of a ceramic package according to a second embodiment of the present invention.

FIG. 4 is a perspective view of a ceramic package according to a third embodiment of the present invention.

FIGS. 5A and 5B are a cross-sectional view and a partially enlarged plan view illustrating a connection between a seal ring of the same ceramic package and an electronic component mounting portion, respectively.

FIG. 6 is a perspective view of a ceramic package according to a fourth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating the connection between the ceramic package and the electronic component mounting board.

FIGS. 8A, 8B, and 8C are diagrams illustrating a method of forming a castellation of a ceramic package.

FIGS. 9A and 9B are illustrations of a method of forming a flow stop portion.

FIGS. 10A, 10B, and 10C are perspective views of a lid, a front side, and a back side of a conventional ceramic package, respectively.

FIGS. 11A, 11B, and 11C are explanatory diagrams illustrating connection between a seal ring of a conventional ceramic package and an internal connection terminal or an electronic component mounting portion, respectively.

12 (A), (B), and (C) are explanatory views illustrating the connection between another seal ring of a conventional ceramic package and an internal connection terminal or an electronic component mounting portion.

[Explanation of symbols]

10: ceramic package, 11: electronic component mounting part,
12: Internal connection terminal, 12a: Connection, 13: Seal ring, 14: External connection terminal, 15: Conductor wiring, 16:
Solder, 17: Meniscus, 18: Electronic component mounting board,
19: first insulator, 19a: first cavity portion, 2
0: second insulator, 20a: second cavity portion, 2
1: third insulator, 22: cavity, 23, 23a:
Side wall surface, 24, 24a: conductor wiring, 25: receiving pattern, 25a: connection portion, 26, 26a, 26b: flow stop portion, 27: hole, 28, 28a: conductor wiring pattern, 2
9: bottom plate, 30, 40: ceramic package,

Claims (6)

[Claims] An insulator is formed by laminating an upper insulator having a cavity penetrating the front and back and a lower insulator forming a bottom plate, and mounting an electronic component surrounded by a side wall of the cavity portion and the bottom plate. A ceramic package having a seal ring formed of a metal conductor for joining and sealing a lid on the upper surface of the side wall and surrounding a periphery of the cavity, wherein the side wall surface of the cavity is formed. A conductor wiring in conduction with the seal ring is formed by castellation, and the conductor wiring is in conduction with a part of an internal connection terminal formed in the cavity via a wiring pattern, A ceramic package, characterized in that the wiring pattern is provided with a flow stopping portion for a brazing filler metal so that a conductor is not exposed on the surface of the insulator. 2. An insulator is formed by laminating an upper insulator having a cavity passing through the front and back and a lower insulator forming a bottom plate, and mounting an electronic component surrounded by the side wall of the cavity and the bottom plate. A ceramic package having a seal ring formed of a metal conductor for joining and sealing a lid on the upper surface of the side wall and surrounding a periphery of the cavity, wherein the side wall surface of the cavity is formed. A conductive wire in a conductive state with the seal ring is formed by printing, and the conductive wire is in a conductive state through a wiring pattern with a part of an internal connection terminal formed in the cavity; A ceramic package, characterized in that the wiring pattern is provided with a flow stopping portion of a brazing filler metal so that a conductor is not exposed on the surface of the insulator. 3. An insulator is formed by laminating an upper insulator having a cavity passing through the front and back and a lower insulator forming a bottom plate, and mounting an electronic component surrounded by the side wall of the cavity and the bottom plate. A ceramic package having a seal ring formed of a metal conductor for joining and sealing a lid on the upper surface of the side wall and surrounding a periphery of the cavity, wherein the side wall surface of the cavity is formed. A conductor wire in a conductive state with the seal ring is formed by castellation, and the conductor wire is in a conductive state via a wiring pattern with an electronic component mounting portion formed in the cavity; A ceramic package, wherein the pattern is provided with a flow stopping portion for a brazing filler metal so that a conductor is not exposed on the surface of the insulator. 4. An insulator is formed by laminating an upper insulator having a cavity passing through the front and back and a lower insulator forming a bottom plate, and mounting an electronic component surrounded by the side wall of the cavity and the bottom plate. A ceramic package having a seal ring formed of a metal conductor for joining and sealing a lid on the upper surface of the side wall and surrounding a periphery of the cavity, wherein the side wall surface of the cavity is formed. A conductive wiring which is electrically connected to the seal ring is formed by printing, and the conductive wiring is electrically connected to an electronic component mounting portion formed in the cavity via a wiring pattern; A ceramic package having a flow stopping portion for a brazing filler metal so that a conductor is not exposed on the surface of the insulator. 5. The ceramic package according to claim 1, wherein the flow stopping portion sandwiches a part of the wiring pattern connecting between the conductor wiring and a part of the internal connection terminal with the insulator. A ceramic package characterized by being formed of: 6. The ceramic package according to claim 3, wherein the flow stop portion is formed by sandwiching a part of the wiring pattern connecting between the conductor wiring and the electronic component mounting portion with the insulator. A ceramic package characterized by being made.