JP2002015647A - Reed conductor for thermal fuse and thermal fuse - Google Patents

Reed conductor for thermal fuse and thermal fuse

Info

Publication number
JP2002015647A
JP2002015647A JP2000194160A JP2000194160A JP2002015647A JP 2002015647 A JP2002015647 A JP 2002015647A JP 2000194160 A JP2000194160 A JP 2000194160A JP 2000194160 A JP2000194160 A JP 2000194160A JP 2002015647 A JP2002015647 A JP 2002015647A
Authority
JP
Japan
Prior art keywords
lead conductor
fusible alloy
thermal fuse
alloy
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000194160A
Other languages
Japanese (ja)
Inventor
Yoshio Asami
芳男 浅見
Shinichi Kato
伸一 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anzen Dengu KK
Original Assignee
Anzen Dengu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anzen Dengu KK filed Critical Anzen Dengu KK
Priority to JP2000194160A priority Critical patent/JP2002015647A/en
Priority to TW089117645A priority patent/TW460887B/en
Priority to CNB00134689XA priority patent/CN1172343C/en
Priority to DE10128240A priority patent/DE10128240A1/en
Publication of JP2002015647A publication Critical patent/JP2002015647A/en
Priority to HK02104710.9A priority patent/HK1043658B/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05Component parts thereof
    • H01H85/143Electrical contacts; Fastening fusible members to such contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05Component parts thereof
    • H01H85/165Casings
    • H01H85/175Casings characterised by the casing shape or form
    • H01H85/1755Casings characterised by the casing shape or form composite casing

Landscapes

  • Fuses (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a reed conductor for a thermal fuse and a thermal fuse which uses the reed conductor wherein the influence of welding on fusible alloy due to oxidation is reduced. SOLUTION: This is the reed conductor which has a constitution that a metal 2 for the fusible alloy welding which is hard to receive the influence of oxidation by the time lapse is installed on a surface of a tip end part, and is welded to the fusible alloy 10. In addition, this reed conductor 1 is housed in a thin-type insulator case, and the thermal fuse has an improved assembling property at the time of assembling and an improved tensile strength of the reed conductor 1 after assembling.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】この発明は、薄型の温度ヒュ
ーズ用のリード導体およびそのリード導体を用いた温度
ヒューズに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-type lead conductor for a thermal fuse and a thermal fuse using the lead conductor.

【0002】[0002]

【従来の技術】温度ヒューズとしては、一般にアキシャ
ル型と称される円筒状のものが広く使われているが、最
近、機械の小型化、薄型化に伴って、例えば薄型の温度
ヒューズもさかんに使用されている。
2. Description of the Related Art As a thermal fuse, a cylindrical fuse generally called an axial type is widely used, but recently, as the size and thickness of a machine are reduced, for example, a thin thermal fuse is also actively used. It is used.

【0003】このような温度ヒューズに用いられるリー
ド導体も帯状に形成されている。
A lead conductor used for such a thermal fuse is also formed in a belt shape.

【0004】このリード導体としては特開平11−40
026号に示されるものが既に提案されている。図9は
そのリード導体1’の斜視図を示す。
The lead conductor is disclosed in Japanese Patent Application Laid-Open No. 11-40 / 1999.
No. 026 has already been proposed. FIG. 9 shows a perspective view of the lead conductor 1 '.

【0005】このリード導体1’は、ニッケルからなる
リード導体1’の先端部表面に銅導体2’が設けられて
構成されている。
The lead conductor 1 'is configured such that a copper conductor 2' is provided on the surface of the tip of the lead conductor 1 'made of nickel.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、銅導体
2’を用いたものは経時変化によりその表面が酸化し、
可溶合金への溶接が困難になる、という課題がある。
However, in the case of using the copper conductor 2 ', its surface is oxidized due to aging,
There is a problem that welding to a fusible alloy becomes difficult.

【0007】この発明は上記のことに鑑み提案されたも
ので、その目的とするところは、酸化による可溶合金へ
の溶接の影響を軽減した温度ヒューズ用リード導体を提
供することにある。
The present invention has been proposed in view of the above, and it is an object of the present invention to provide a lead conductor for a thermal fuse in which the influence of welding to a fusible alloy by oxidation is reduced.

【0008】また、併せてこのリード導体を用いて温度
ヒューズを組立てる場合、組立性を良好とし、かつ組立
後のリード導体の引っ張り強度を向上させた温度ヒュー
ズを提供することにある。
Another object of the present invention is to provide a thermal fuse in which, when assembling a thermal fuse using the lead conductor, the thermal fuse is improved in assemblability and the tensile strength of the assembled lead conductor is improved.

【0009】[0009]

【課題を解決するための手段】この発明は、薄型の温度
ヒューズ用リード導体において、細長い薄板状のリード
導体1,100の先端部表面に、酸化により可溶合金へ
の溶接の影響を受けにくい金属2を設けたことを特徴と
する。
SUMMARY OF THE INVENTION The present invention relates to a thin thermal fuse lead conductor, and the surface of the leading end of the elongated thin plate-shaped lead conductor 1, 100 is hardly affected by welding to a fusible alloy by oxidation. It is characterized in that a metal 2 is provided.

【0010】また、前記リード導体1,100と酸化に
より可溶合金への溶接の影響を受けにくい金属2との組
み合わせは、リード導体1,100は銅もしくは銅合金
で、可溶合金溶接用の金属2はすずもしくは銀からな
る、または、リード導体1,100が鉄もしくは鉄合金
で、可溶合金溶接用の金属2はすずもしくは銀からな
る、または、リード導体1,100がアルミニウムもし
くはアルミニウム合金で、可溶合金溶接用の金属2はす
ずもしくは銀からなる、構成とし、上記目的を達成して
いる。
The combination of the lead conductors 1,100 and the metal 2 which is less susceptible to welding to the fusible alloy by oxidation is such that the lead conductors 1,100 are made of copper or a copper alloy and used for welding fusible alloys. The metal 2 is made of tin or silver, or the lead conductor 1, 100 is iron or an iron alloy, and the metal 2 for welding a fusible alloy is made of tin or silver, or the lead conductor 1, 100 is aluminum or an aluminum alloy. Thus, the metal 2 for welding a fusible alloy is made of tin or silver, thereby achieving the above object.

【0011】また、ニッケルまたはニッケル合金からな
る細長い薄板状のリード導体1の先端部に可溶合金溶接
用の金属2を設けた一対のリード導体1間に可溶合金が
溶接され、かつこの可溶合金10は絶縁基板4と蓋とか
らなる薄型絶縁体内に設けた構成としている。
Further, a fusible alloy is welded between a pair of lead conductors 1 provided with a metal 2 for welding a fusible alloy at the tip of an elongated thin plate-like lead conductor 1 made of nickel or a nickel alloy. The molten alloy 10 is provided in a thin insulator comprising the insulating substrate 4 and a lid.

【0012】さらに、本発明の温度ヒューズは、薄形絶
縁体を構成する絶縁基板4の上面に、先端部に可溶合金
溶接用の金属2を有する一対のリード導体1が間隔を介
し設けられ、そのリード導体間に前記可溶合金10が設
けられ、その上に蓋5が設けられてなる薄形の温度ヒュ
ーズであって、前記絶縁基板4の上面にはその長さ方向
に沿って一側端から他側端にかけて前記リード導体1、
可溶合金10が配設される帯状の凹部6が形成され、こ
の凹部6の両端にはそれぞれリード導体位置決め兼固定
用の突部7が形成され、前記リード導体1には前記突部
7と嵌合可能な取付用の穴3が形成されたことを特徴と
する。
Further, in the thermal fuse of the present invention, a pair of lead conductors 1 having a metal 2 for welding a fusible alloy at a tip end thereof are provided on an upper surface of an insulating substrate 4 constituting a thin insulator with a space therebetween. A thin thermal fuse in which the fusible alloy 10 is provided between the lead conductors and a lid 5 is provided on the fusible alloy 10. From the side end to the other side end, the lead conductor 1,
A strip-shaped recess 6 in which the fusible alloy 10 is provided is formed, and protrusions 7 for positioning and fixing the lead conductor are formed at both ends of the recess 6, and the protrusion 7 is formed on the lead conductor 1. A fitting hole 3 capable of fitting is formed.

【0013】[0013]

【発明の実施の形態】以下、図面に沿って本発明を説明
する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

【0014】[0014]

【実施例1】図1(a)、(b)および図2は本発明の
一実施例を示す。このうち図1(a)は本発明の一実施
例にかかるリード導体の平面図、(b)は側面図、図2
は斜視図を示す。
Embodiment 1 FIGS. 1A, 1B and 2 show an embodiment of the present invention. 1A is a plan view of a lead conductor according to one embodiment of the present invention, FIG. 1B is a side view, FIG.
Shows a perspective view.

【0015】これらの図において、1は薄く、かつ細長
い形状をしたリード導体で、このリード導体1の先端部
表面には、可溶合金溶接時に酸化していても酸化の影響
を受けにくい金属または銅に比べ経時変化によって表面
が酸化の影響を受けにくい可溶合金溶接用の金属2が設
けられている。この先端部表面の薄い金属2は可溶合金
への溶接部分となる。3は必要に応じて形成される取付
用の穴であり、可溶合金溶接用の金属2が設けられた先
端部よりやや外側に形成されている。
In these figures, reference numeral 1 denotes a thin and elongated lead conductor, and the surface of the leading end of the lead conductor 1 is made of a metal or a metal which is hardly affected by oxidation even if it is oxidized during welding of a fusible alloy. A metal 2 for welding a fusible alloy, whose surface is less susceptible to oxidation due to aging than copper, is provided. The thin metal 2 on the surface of the tip becomes a welded portion to the fusible alloy. Reference numeral 3 denotes a mounting hole formed as needed, which is formed slightly outside the tip end where the metal 2 for fusible alloy welding is provided.

【0016】リード導体1とその先端部表面に設ける可
溶合金溶接用の金属2の組み合わせは、例えば次の通り
である。また、リード導体1はヒューズが取り付けられ
る場所の材質によっては、すず(Sn),ニッケル(N
i),銀(Ag)などのメッキが必要に応じ適宜選択さ
れ施される。 リード導体 可溶合金溶接用金属 ニッケル(Ni)またはアロイ等 すず(Sn)または銀(Ag) のニッケル合金 銅(Cu)または銅合金 すず(Sn)または銀(Ag) 鉄(Fe)または鉄合金 すず(Sn)または銀(Ag) アルミニウム(Al)または すず(Sn)または銀(Ag) アルミニウム合金
The combination of the lead conductor 1 and the metal 2 for welding a fusible alloy provided on the surface of the tip portion thereof is, for example, as follows. Further, the lead conductor 1 may be made of tin (Sn), nickel (N
i), silver (Ag) or the like is appropriately selected and applied as needed. Lead conductor Soluble alloy welding metal Nickel (Ni) or alloy, etc. Tin (Sn) or silver (Ag) nickel alloy Copper (Cu) or copper alloy Tin (Sn) or silver (Ag) Iron (Fe) or iron alloy Tin (Sn) or silver (Ag) Aluminum (Al) or Tin (Sn) or silver (Ag) Aluminum alloy

【0017】上記において、金属2をすずとした場合、
すずは可溶合金と同じ元素のため、酸化しても溶接時に
酸化物ごと溶けてしまうので、酸化の影響を受けにく
く、速やかに溶接することができる。
In the above, when metal 2 is tin,
Since tin is the same element as the fusible alloy, even if it is oxidized, it dissolves together with the oxide at the time of welding, so that it is less susceptible to oxidation and can be welded quickly.

【0018】また、銀は従来の銅に比べ酸化の影響を受
けにくい。
Silver is less susceptible to oxidation than conventional copper.

【0019】リード導体1に金属2を設ける場合、例え
ば溶融メッキ,電気メッキ,真空蒸着,圧延等の手段を
用いれば良い。
When the metal 2 is provided on the lead conductor 1, for example, means such as hot-dip plating, electroplating, vacuum deposition, and rolling may be used.

【0020】図3(a)〜(d)は上記リード導体1が
組み込まれる温度ヒューズ用絶縁基板4を示す。
FIGS. 3A to 3D show an insulating substrate 4 for a thermal fuse in which the lead conductor 1 is incorporated.

【0021】この絶縁基板4はセラミック、絶縁性の樹
脂成形品等から形成され、図5において後述する蓋5と
ともに薄形絶縁体を構成する。6は絶縁基板4の長さ方
向に沿ってその一側端6aから他側端6bにかけて帯状
に形成されたリード導体1および可溶合金配設用の凹部
である。この凹部6の両端部には例えば短円柱状をなす
リード導体位置決め兼用固定用の突部7がそれぞれ形成
されている。また、凹部6の中央部の両側に相当する上
下には例えば長方形をなす突部8が形成されている。こ
のため、凹部6の中央部の縦方向の幅は上下にそれぞれ
形成された矩形横長の突部8によって幅狭になってい
る。9は凹部6の上辺側および下辺側にそってそれぞれ
形成された蓋取付用突部である。この突部9は絶縁基板
4の一側端6aのやや内側から他側端6bの手前にかけ
て上辺、下辺の長さ方向に沿って形成されている。
The insulating substrate 4 is formed of ceramic, an insulating resin molded product or the like, and forms a thin insulator together with a lid 5 described later in FIG. Reference numeral 6 denotes a strip for forming the lead conductor 1 and the fusible alloy, which is formed in a band shape from one side end 6a to the other side end 6b along the length direction of the insulating substrate 4. Protrusions 7 for positioning and fixing the lead conductor, for example, each having a short columnar shape, are formed at both ends of the concave portion 6, respectively. On the upper and lower sides corresponding to both sides of the central portion of the concave portion 6, for example, a rectangular projection 8 is formed. For this reason, the width of the central portion of the concave portion 6 in the vertical direction is reduced by the rectangular horizontally long protrusions 8 formed at the top and bottom, respectively. Reference numeral 9 denotes a lid mounting projection formed along the upper side and the lower side of the concave portion 6, respectively. The protrusion 9 is formed along the length direction of the upper side and the lower side from slightly inside the one end 6a of the insulating substrate 4 to just before the other end 6b.

【0022】図4は上記絶縁基板4の凹部6に間隔を介
し取付けられた一対のリード導体1とその間に橋渡しす
るように凹部6の幅狭部分に設けられた低融点の可溶合
金10を取付けた状態を示す。
FIG. 4 shows a pair of lead conductors 1 attached to the concave portion 6 of the insulating substrate 4 with a space therebetween and a low melting point fusible alloy 10 provided in a narrow portion of the concave portion 6 so as to bridge therebetween. Shows the mounted state.

【0023】帯状をなすリード導体1の先端部部分は凹
部6内に収納されるよう凹部6とほぼ同じ幅寸法となっ
ており、突部7には嵌合可能な取付用の穴3が嵌め入ま
れる。したがって、絶縁基板4の突部7に穴3を合わ
せ、その穴3を嵌合させれば容易に凹部6内の所定位置
にリード導体1を位置決めして固定することができる。
なお、リード導体1の先端は突部8の端部に当接され位
置決めされる。また、絶縁基板4の上面の左右にそれぞ
れ設けられた一対のリード導体1間に低融点の可溶合金
10が設けられ、ロジン系のフラックスが塗布される。
この場合、半田付けによってリード導体1と可溶合金1
0とが溶接されるが、すずからなる可溶合金溶接用の金
属2は半田熱によって速やかに溶け、かつ両者を確実に
接続し得る。
The leading end portion of the strip-shaped lead conductor 1 has substantially the same width as the concave portion 6 so as to be housed in the concave portion 6, and the fitting hole 3 for fitting is fitted in the projecting portion 7. Entered. Therefore, if the hole 3 is aligned with the protrusion 7 of the insulating substrate 4 and the hole 3 is fitted, the lead conductor 1 can be easily positioned and fixed at a predetermined position in the recess 6.
In addition, the tip of the lead conductor 1 is positioned in contact with the end of the protrusion 8. Further, a low-melting-point fusible alloy 10 is provided between a pair of lead conductors 1 provided on the left and right sides of the upper surface of the insulating substrate 4, respectively, and a rosin-based flux is applied.
In this case, the lead conductor 1 and the fusible alloy 1 are soldered.
Although 0 is welded, the metal 2 for welding a fusible alloy made of tin is quickly melted by the solder heat, and the two can be reliably connected.

【0024】図5(a)〜(d)は、リード導体1等が
設けられた絶縁基板4の上面に被せられる蓋5を示す。
FIGS. 5A to 5D show a lid 5 which is placed on the upper surface of the insulating substrate 4 on which the lead conductors 1 and the like are provided.

【0025】この蓋5はセラミック、絶縁性の樹脂成形
品等からなり、その内面は絶縁基板4の上面に被せられ
るようほぼ対応した凹凸形状に形成されている。
The lid 5 is made of a ceramic, an insulating resin molded product, or the like. The inner surface of the lid 5 is formed in a substantially corresponding uneven shape so as to cover the upper surface of the insulating substrate 4.

【0026】すなわち、蓋5の内面外周部は縁状に肉厚
になっており、その肉厚部11に絶縁基板4の肉盛りの
突部9との嵌合用の溝12が矩形枠状に形成されてい
る。また、溝12の内側には横長矩形の凹部13が形成
され、この凹部13の両側部から前記溝12にかけて絶
縁基板4の突部7と嵌合可能な凹部13aが形成されて
いる。
That is, the outer peripheral portion of the inner surface of the lid 5 has an edge-like thickness, and a groove 12 for fitting the projection 9 of the build-up of the insulating substrate 4 is formed in the thick portion 11 in a rectangular frame shape. Is formed. Further, a horizontally long rectangular concave portion 13 is formed inside the groove 12, and a concave portion 13 a which can be fitted to the protrusion 7 of the insulating substrate 4 is formed from both sides of the concave portion 13 to the groove 12.

【0027】組立てにあたっては、図6に示すように、
絶縁基板4の上面に前述のようにして一対のリード導体
1等を取付け、図4に示したように可溶合金10と接続
し、上方から外形が絶縁基板4と同形状の蓋5を被せれ
ばよい。この場合、蓋5の溝12内にエポキシ樹脂等の
封止剤を注入する。凹部13a内に絶縁基板4の突部7
が収納されるが溝12は蓋5の内側に矩形状に形成され
ているため、余分な封止剤を逃すことができ、その液だ
れを防ぐことができる。
In assembling, as shown in FIG.
The pair of lead conductors 1 and the like are mounted on the upper surface of the insulating substrate 4 as described above, connected to the fusible alloy 10 as shown in FIG. 4, and covered with a lid 5 having the same outer shape as the insulating substrate 4 from above. You can do it. In this case, a sealing agent such as an epoxy resin is injected into the groove 12 of the lid 5. The protrusion 7 of the insulating substrate 4 is provided in the recess 13a.
However, since the groove 12 is formed in a rectangular shape inside the lid 5, it is possible to escape an excess sealant and prevent dripping thereof.

【0028】また、絶縁基板4の上面と蓋5との内面と
の各凹凸部がほぼ接触するように形成されているため、
接触面積が大であり、充分な強度を確保し得る。
Further, since the concave and convex portions on the upper surface of the insulating substrate 4 and the inner surface of the lid 5 are formed so as to be almost in contact with each other,
The contact area is large, and sufficient strength can be secured.

【0029】また、リード導体1の穴3は絶縁基板4の
凸部7と嵌合されているため、十分な引っ張り強度を有
し、使用に際して折り曲げたり、引っ張られても抜け出
ることはない。
Further, since the hole 3 of the lead conductor 1 is fitted with the convex portion 7 of the insulating substrate 4, it has a sufficient tensile strength, and does not come out even if it is bent or pulled in use.

【0030】図7は上記のようにして組立てられた温度
ヒューズの平面図を示す。図では内部構造がわかるよう
に蓋5の一部を切除して示している。なお、可溶合金1
0上にはその酸化防止、クリーニング、濡れ性等の目的
でロジン系のフラックス14が塗布されている。
FIG. 7 is a plan view of the thermal fuse assembled as described above. In the figure, a part of the lid 5 is cut away to show the internal structure. The fusible alloy 1
A rosin-based flux 14 is applied on top of the surface 0 to prevent oxidation, cleaning, wettability and the like.

【0031】なお、上記実施例において、突部7がない
タイプの絶縁基板4であっても良い。この場合、リード
導体1に取付用の穴3を形成する必要はない。
In the above embodiment, the insulating substrate 4 may be of a type without the protrusion 7. In this case, it is not necessary to form the mounting hole 3 in the lead conductor 1.

【0032】また、絶縁基板4や蓋5は図示例のみに限
定されることはなく、他の適宜の形状であっても良いこ
とは勿論である。
Further, the insulating substrate 4 and the lid 5 are not limited to the illustrated example, but may have other appropriate shapes.

【0033】図8は本発明のリード導体100の他の形
状例を示す。この例ではリード導体100の先端部付近
に絶縁基板(図示せず)への取付けの際の位置決め固定
用のくびれ部101が形成され、かつ可溶合金と溶接さ
れる先端部表面に可溶合金溶接用の金属2が設けられて
いる。また、リード導体100の反対側の端部は必要に
応じ適形状の取付部102が形成され、かつ必要に応じ
取付用の穴103が形成されている。
FIG. 8 shows another example of the shape of the lead conductor 100 of the present invention. In this example, a constriction portion 101 for positioning and fixing is formed near the front end portion of the lead conductor 100 when the lead conductor 100 is mounted on an insulating substrate (not shown), and the front surface of the front end portion to be welded to the fusible alloy has A metal 2 for welding is provided. At the opposite end of the lead conductor 100, a mounting portion 102 having an appropriate shape is formed as necessary, and a mounting hole 103 is formed as necessary.

【0034】[0034]

【発明の効果】以上のように本発明によれば、リード導
体には、可溶合金との接続部に酸化の影響を受けにくい
可溶合金溶接用の金属を設けたため、速やかに溶接する
ことができる。
As described above, according to the present invention, the lead conductor is provided with a fusible alloy welding metal which is hardly affected by oxidation at the connection with the fusible alloy. Can be.

【0035】また、リード導体に取付用の穴を形成し、
絶縁基板にそれと嵌合する位置決め固定用の突部を形成
しておけば、リード導体の可溶合金への溶接を速やかに
行うことができる利点に加え、リード導体を取付ける際
の温度ヒューズの組立性も良好となり、また、組立後、
リード導体の引っ張り強度も、リード導体の取付用の穴
が突部に嵌合しているため、格段に向上する。
Also, a mounting hole is formed in the lead conductor,
Forming positioning and fixing projections on the insulating substrate that fits with them allows the lead conductor to be welded to the fusible alloy quickly, as well as assembling the thermal fuse when attaching the lead conductor. Performance is good, and after assembly,
The tensile strength of the lead conductor is also remarkably improved because the mounting hole for the lead conductor is fitted to the projection.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)は本発明のリード導体の一実施例の平面
図、(b)はその側面図を示す。
FIG. 1A is a plan view of an embodiment of a lead conductor of the present invention, and FIG. 1B is a side view thereof.

【図2】同上の実施例の斜視図を示す。FIG. 2 is a perspective view of the embodiment.

【図3】本発明の一実施例のリード導体が組み込まれる
絶縁基板の一例であって(a)は平面図、(b)は
(a)図中A−A縦断面図、(c)は右側面図、(d)
は正面図を示す。
3A and 3B are examples of an insulating substrate on which a lead conductor according to an embodiment of the present invention is incorporated, wherein FIG. 3A is a plan view, FIG. 3B is a longitudinal sectional view taken along line AA in FIG. Right side view, (d)
Shows a front view.

【図4】絶縁基板にリード導体を組み込んだ平面図を示
す。
FIG. 4 is a plan view in which a lead conductor is incorporated into an insulating substrate.

【図5】(a)は絶縁基板へ取付けられる蓋の平面図、
(b)は(a)中B−B線断面図、(c)は右側面図、
(d)は正面図を示す。
FIG. 5A is a plan view of a lid attached to an insulating substrate,
(B) is a sectional view taken along line BB in (a), (c) is a right side view,
(D) shows a front view.

【図6】温度ヒューズの組立説明図を示す。FIG. 6 is an explanatory view for assembling the thermal fuse.

【図7】温度ヒューズの完成品の部分切欠平面図を示
す。
FIG. 7 shows a partially cutaway plan view of a completed thermal fuse.

【図8】本発明の他の実施例の平面図を示す。FIG. 8 shows a plan view of another embodiment of the present invention.

【図9】従来例を示す。FIG. 9 shows a conventional example.

【符号の説明】[Explanation of symbols]

1 リード導体 2 可溶合金溶接用の金属 3 取付用の穴 4 絶縁基板 5 蓋 6 凹部 6a 一側端 6b 他側端 7 リード導体位置決め兼固定用突部 8 突部 9 蓋取付用突部 10 可溶合金 11 肉厚部 12 溝 13 凹部 14 フラックス REFERENCE SIGNS LIST 1 lead conductor 2 fusible alloy welding metal 3 mounting hole 4 insulating substrate 5 lid 6 recess 6 a one side end 6 b other side end 7 lead conductor positioning and fixing projection 8 projection 9 lid mounting projection 10 Fusible alloy 11 Thick part 12 Groove 13 Recess 14 Flux

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】薄型の温度ヒューズ用リード導体におい
て、細長い薄板状のリード導体(1,100)の先端部
表面に、酸化により可溶合金への溶接の影響を受けにく
い金属(2)を設けたことを特徴とする温度ヒューズ用
リード導体。
In a thin thermal fuse lead conductor, a metal (2) which is not easily affected by welding to a fusible alloy due to oxidation is provided on the tip surface of an elongated thin plate-shaped lead conductor (1, 100). A lead conductor for a thermal fuse.
【請求項2】 リード導体(1,100)と酸化により
可溶合金への溶接の影響を受けにくい金属(2)との組
み合わせは、 リード導体(1,100)は銅もしくは銅合金で、可溶
合金溶接用の金属(2)はすずもしくは銀からなる、ま
たは、 リード導体(1,100)が鉄もしくは鉄合金で、可溶
合金溶接用の金属(2)はすずもしくは銀からなる、 または、 リード導体(1,100)がアルミニウムもしくはアル
ミニウム合金で、可溶合金溶接用の金属(2)はすずも
しくは銀からなる、 ことを特徴とする温度ヒューズ用リード導体。
2. A combination of a lead conductor (1,100) and a metal (2) which is less susceptible to welding to a fusible alloy by oxidation, wherein the lead conductor (1,100) is made of copper or a copper alloy. The metal for welding molten alloy (2) is made of tin or silver, or the lead conductor (1,100) is iron or an iron alloy, and the metal for welding fusible alloy (2) is made of tin or silver, or A lead conductor for a thermal fuse, wherein the lead conductor (1,100) is aluminum or an aluminum alloy, and the metal (2) for welding a fusible alloy is made of tin or silver.
【請求項3】 ニッケルまたはニッケル合金からなる細
長い薄板状のリード導体(1,100)の先端部に可溶
合金溶接用の金属(2)を設けた一対のリード導体
(1,100)間に可溶合金(10)が溶接され、かつこ
の可溶合金(10)は絶縁基板(4)と蓋(5)とから
なる薄形絶縁体内に設けられてなることを特徴とする温
度ヒューズ。
3. A pair of lead conductors (1,100), each of which is provided with a metal (2) for welding a fusible alloy at the tip of an elongated thin plate-like lead conductor (1,100) made of nickel or a nickel alloy. A thermal fuse, wherein a fusible alloy (10) is welded, and the fusible alloy (10) is provided in a thin insulator comprising an insulating substrate (4) and a lid (5).
【請求項4】 薄形絶縁体を構成する絶縁基板(4)の
上面に、先端部に可溶合金溶接用の金属(2)を有する
一対のリード導体(1,100)が間隔を介し設けら
れ、そのリード導体(1,100)間に前記可溶合金
(10)が設けられ、その上に蓋(5)が設けられてな
る薄型の温度ヒューズであって、 前記絶縁基板(4)の上面にはその長さ方向に沿って一
側端から他側端にかけて前記リード導体(1,10
0)、可溶合金(10)が配設される帯状の凹部(6)
が形成され、 この凹部(6)の両端部にはそれぞれリード導体位置決
め兼固定用の突部(7)が形成され、 前記リード導体(1,100)には前記突部(7)と嵌
合可能な取付用の穴(3)が形成されたことを特徴とす
る温度ヒューズ。
4. A pair of lead conductors (1, 100) having a metal (2) for welding a fusible alloy at a tip end thereof are provided on an upper surface of an insulating substrate (4) constituting a thin insulator with an interval therebetween. And a fusible alloy (10) provided between the lead conductors (1, 100), and a lid (5) provided on the fusible alloy (10). On the upper surface, the lead conductors (1, 10) extend from one end to the other end along the length direction.
0), a strip-shaped recess (6) in which the fusible alloy (10) is disposed
A projection (7) for positioning and fixing the lead conductor is formed at each end of the recess (6), and the projection (7) is fitted to the lead conductor (1,100). A thermal fuse, characterized in that a possible mounting hole (3) is formed.
JP2000194160A 2000-06-28 2000-06-28 Reed conductor for thermal fuse and thermal fuse Pending JP2002015647A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000194160A JP2002015647A (en) 2000-06-28 2000-06-28 Reed conductor for thermal fuse and thermal fuse
TW089117645A TW460887B (en) 2000-06-28 2000-08-30 Lead conductor for thermal fuse and thermal fuse
CNB00134689XA CN1172343C (en) 2000-06-28 2000-12-05 Temperature fuse and lead wire conductor for same
DE10128240A DE10128240A1 (en) 2000-06-28 2001-06-11 Connecting strip for thin thermal- or electrical fuse, has end coated with metal undergoing no deleterious effect as a result of oxidation during attachment to fuse metal
HK02104710.9A HK1043658B (en) 2000-06-28 2002-06-25 Lead conductor for thermal fuse, and thermal fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000194160A JP2002015647A (en) 2000-06-28 2000-06-28 Reed conductor for thermal fuse and thermal fuse

Publications (1)

Publication Number Publication Date
JP2002015647A true JP2002015647A (en) 2002-01-18

Family

ID=18693030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000194160A Pending JP2002015647A (en) 2000-06-28 2000-06-28 Reed conductor for thermal fuse and thermal fuse

Country Status (5)

Country Link
JP (1) JP2002015647A (en)
CN (1) CN1172343C (en)
DE (1) DE10128240A1 (en)
HK (1) HK1043658B (en)
TW (1) TW460887B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159350A (en) * 2006-12-22 2008-07-10 Matsushita Electric Ind Co Ltd Thermal fuse
JP2009295412A (en) * 2008-06-05 2009-12-17 Panasonic Corp Thermal fuse

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386962B (en) * 2006-03-29 2013-02-21 Cooper Technologies Co Hybrid chip fuse assembly having wire leads
JP5555146B2 (en) * 2010-12-01 2014-07-23 株式会社日立製作所 Metal-resin composite structure and manufacturing method thereof, bus bar, module case, and resin connector part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116466A (en) * 1997-06-23 1999-01-22 Matsushita Electric Ind Co Ltd Temperature fuse, its manufacture, temperature fuse part using it, and battery and power supply apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116466A (en) * 1997-06-23 1999-01-22 Matsushita Electric Ind Co Ltd Temperature fuse, its manufacture, temperature fuse part using it, and battery and power supply apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159350A (en) * 2006-12-22 2008-07-10 Matsushita Electric Ind Co Ltd Thermal fuse
JP2009295412A (en) * 2008-06-05 2009-12-17 Panasonic Corp Thermal fuse

Also Published As

Publication number Publication date
TW460887B (en) 2001-10-21
HK1043658B (en) 2005-05-06
DE10128240A1 (en) 2002-01-17
CN1172343C (en) 2004-10-20
CN1332466A (en) 2002-01-23
HK1043658A1 (en) 2002-09-20

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