JP2002009450A - Inspection and manufacturing method of printed-wiring board, printed-wiring board, and electric device using printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the bonding between a photosensitive resin and plated metal on the internal wall of a via hole from being broken, and at the same time to improve copper adhesion in the via hole in the intermediate processes of the manufacture of a printed-wiring board. SOLUTION: A process that forms regions 2a, 2b, and 2c for inspection that are formed by including a via hole for inspection on a printed-wiring board 1, a process that peels an upper-side pad that is plated and formed at the upper side of a resin layer, and a process that observes a plated layer on the internal wall of the via hole for inspection are included.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a printed wiring board having a small diameter via hole, a method for manufacturing the printed wiring board, a printed wiring board manufactured by the manufacturing method, and an electric device using the printed wiring board. Inspection method of printed wiring board, method of manufacturing printed wiring board, method of manufacturing printed wiring board, and printed wiring board manufactured by the manufacturing method and printed wiring capable of improving reliability of printed wiring board having via hole The present invention relates to an electric device using a plate.

[0002]

2. Description of the Related Art At present, multi-layer printed wiring boards formed by connecting vias to each other via a resin layer to form inner wirings occupy the mainstream of printed wiring boards due to a demand for high integration. In this multilayer printed wiring board, a via hole is typically formed by forming a photosensitive resin layer on the surface of a base substrate and exposing the photosensitive resin layer via a photomask.
It is formed by developing. Thereafter, the inside of the via hole is made conductive using a method such as electroless plating or electroplating, and wiring is formed in the vertical direction of the resin layer. By repeating these steps a plurality of times, a multilayer printed wiring board is manufactured. As a method used for forming the above-described via hole, a method such as a laser drilling method or a drilling method using a drill may be employed other than the photolithography method.

As described above, a via hole is formed by piercing a resin such as a photosensitive resin, and the photosensitive resin generally has poor adhesion to a metal to be plated, and is usually roughened by various means. The adhesion to the plating metal is improved by using means such as plating or using a plating catalyst, so that reliability with respect to conductivity is ensured.

[0004]

As described above, in order to improve the adhesion between the photosensitive resin and the metal to be plated, various element technologies such as a photosensitive resin, a plating catalyst, and a roughening treatment are used. The adhesion in the vicinity of the via hole described above is improved.

[0005] However, the reliability of the conductivity may be lost due to the fluctuation of the adhesiveness to the plated metal particularly on the inner wall of the via hole due to various conditions. A printed wiring board having a defect in conductivity causes problems such as a reduction in product yield and an increase in cost of the printed wiring board. Conventionally, in order to solve such inconvenience, a method of electrically inspecting a via hole has been proposed. This method uses a test coupon, such as a via chain, to measure the change in resistance (ΔR) on a completed board, and checks the continuity of the via hole to confirm the reliability of the printed wiring board including the via hole. Things.

This method makes it possible to inspect a printed wiring board nondestructively. However, in this method, the reliability of the via hole cannot be confirmed during the manufacturing process of the printed wiring board, and if a defect occurs in the via hole, a post-process performed after the formation of the via hole is wasted. There are inconveniences.

For this reason, in the technical field of printed wiring boards, it has been necessary to be able to perform a nondestructive inspection at the manufacturing stage on the adhesiveness between the photosensitive resin and the plated metal on the inner wall of the via hole. It had been. In addition, it has been required to be able to inspect the adhesion to a plated metal, for example, copper, in a via hole in an intermediate step of manufacturing a printed wiring board, and to be able to detect defects in the via hole at an early stage.

[0008]

The object of the present invention is to provide a method for inspecting a printed wiring board, a method for manufacturing a printed wiring board, and a printed wiring board and an electric device manufactured by the method according to the present invention. It is solved by.

That is, according to the first aspect of the present invention, a printed wiring board formed by including a step of providing a resin layer on the surface of a base substrate and forming a via hole and an inspection via hole in the resin layer. Forming a via hole and an inspection via hole in the resin layer, plating the resin layer to form a plating layer inside the via hole and the inspection via hole, Forming an inspection area formed by including the upper plating layer in the via hole from the plating layer inside the inspection via hole, removing the upper plating layer, and plating the inner wall of the inspection via hole. Inspecting the printed wiring board.

In the inspection method of the present invention, it is preferable that the peeling step is performed a plurality of times from opposite directions. In the inspection method of the present invention, it is preferable that a plurality of the inspection via holes are formed across the peeling direction of the upper plating layer. In the inspection method of the present invention, it is preferable that the inspection via holes are formed in a staggered manner across the peeling direction of the upper plating layer. In the inspection method of the present invention, it is preferable that the via hole and the inspection via hole are formed to have a pointed shape.

Further, according to the invention of claim 6 of the present invention, a printed wiring board formed including a step of providing a resin layer on the surface of a base substrate and forming a via hole and an inspection via hole in the resin layer. Forming a via hole and an inspection via hole in the resin layer; plating the resin layer to form a plating layer inside the via hole and the inspection via hole; Forming an inspection area surrounding the via hole and including the upper plating layer continuous from the plating layer inside the inspection via hole; removing the upper plating layer; and forming an inspection area on the inner wall of the inspection via hole. Observing the plating layer, the method for manufacturing a printed wiring board is provided. In the manufacturing method of the present invention, it is preferable that the peeling step is performed a plurality of times from opposite directions. The manufacturing method of the present invention may include a step of cutting and removing the inspection region.

According to the ninth aspect of the present invention,
A printed wiring board formed by providing a resin layer on a surface of a base substrate and forming a via hole and an inspection via hole in the resin layer, wherein a via hole and an inspection via hole are formed in the resin layer. And plating on the resin layer to form a plating layer inside the via hole and the inspection via hole, including an upper plating layer surrounding the inspection via hole and continuing from the plating layer inside the inspection via hole. Providing a printed wiring board manufactured by a process including the steps of: forming an inspection area formed by :, removing the upper plating layer, and observing a plating layer on an inner wall of the inspection via hole. Is done.

According to a tenth aspect of the present invention, there is provided a printed wiring board including a step of providing a resin layer on a surface of a base substrate and forming a via hole and an inspection via hole in the resin layer. The electric device used, wherein a via hole and an inspection via hole are formed in the resin layer, and plating is performed on the resin layer to form a plating layer inside the via hole and the inspection via hole. Forming an inspection region surrounding the test via hole and including the upper plating layer continuous from the plating layer inside the test via hole, peeling the upper plating layer, and an inner wall of the test via hole. Observing a plating layer in the printed wiring board, and a plurality of electrical devices mounted on the printed wiring board. And a component, the electrical device is provided.

According to an eleventh aspect of the present invention, there is provided a method for inspecting a printed wiring board, comprising the steps of preparing a substrate having a resin layer on the surface, and forming a via hole and an inspection via hole in the resin layer. Forming a conductive layer in the via hole and the test via hole, and forming an upper conductive layer surrounding the test via hole on the surface of the resin layer and continuous with the conductive layer in the test via hole. And a step of peeling the upper conductive layer, and a step of observing the conductive layer in the inspection via hole after the peeling.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. The present invention can be preferably applied particularly to a via hole formed at a stop, but not limited to a via hole formed at a stop, and is applicable to any type of via hole. It is possible to

FIG. 1 is a front view schematically showing a printed wiring board having an inspection via hole used in the present invention. Inspection via holes used in the method for inspecting a printed wiring board according to the present invention are formed in the inspection regions 2a, 2b, and 2c of the printed wiring board 1 shown in FIG.
These inspection areas 2a, 2b and 2c are provided on the outer peripheral portion of the printed wiring board 1 where the inner wiring is not performed, and are formed without damaging the inner wiring formed on the printed wiring board 1. The arrangement is such that the adhesion of the plated metal layer on the inner wall of the device can be inspected. In the present invention, various metals can be used as the plating metal. For example, in the present invention, a metal such as copper or gold plated with nickel as a base can be used as the plating metal.

The similar inspection areas 3a, 3b, 3c are formed at the end 4a where the inspection areas 2a, 2b, 2c of FIG. 1 are formed.
Is provided also at the end 4b opposite to the printed wiring board 1 so that the reliability of the formed via hole can be inspected over the entire surface of the printed wiring board 1. In the outer peripheral portion shown in FIG. 1, various patterns such as test coupons required for manufacturing and registration marks for performing lamination are arranged in addition to the above-described inspection via holes. Is also good. In FIG. 1, the boundary between the region where the inner layer wiring is formed and the outer peripheral portion where the inspection region is formed is indicated by a broken line.

The printed wiring board 1 shown in FIG. 1 is formed by laminating three layers of photosensitive resin, and the inspection area is mutually different for each layer so that the adhesion of via holes can be inspected for each layer. The inspection areas 2a, 2b,
2c and the pair of inspection areas 3a, 3b, 3c on the opposite side are shown.

FIG. 2 is a top view showing another embodiment of the printed wiring board 1 to which the inspection method of the present invention is applied.
In the printed wiring board 1 shown in FIG. 2, the inspection regions 2a, 2b, and 2c described in FIG. 1 are arranged along the long ends 4c of the printed wiring board 1 facing each other as described in FIG. It is shown formed similarly.

In the present invention, as shown in FIGS. 1 and 2, two opposite ends 4a, 4b and 4c,
Although it is possible to provide an inspection area for 4d,
As long as cost and workability are allowed, printed wiring board 1
It is also possible to provide an inspection area at all four ends.

FIG. 3 is a sectional view of the printed wiring board 1 of the present invention cut along the line AA in FIG.
FIG. 3 is a diagram showing an inspection via hole formed in the inspection regions 2a and 2b. For convenience of explanation, the inspection area 2c and the resin layer therefor are omitted. As shown in FIG. 3, the printed wiring board 1 of the present invention includes a base substrate 5 on which an inner layer wiring is formed, and an SLC (Surface) formed from a plurality of layers of a photosensitive resin on both sides of the base substrate 5. Laminar Circuit) layers 6 and 7 are laminated.

The inspection via holes 8 and 9 used in the present invention are formed in the inspection regions 2a and 2b, respectively.
These inspection regions 2a and 2b are formed in the upper SLC layer 6. Further, the inspection regions 2d and 2e are formed in the lower SLC layer 7, and the inspection via holes 10 and 11 are formed in the corresponding regions. A plating layer (not shown) is provided on the inner side walls of the inspection via holes 8, 9, 10, and 11, and an upper plating layer and a lower plating layer which are opposed to each other with a photosensitive resin layer therebetween to form an inspection region. It is continuous with the plating layer on the side. Further, in the present invention, when the surface of the base substrate is covered with a copper foil, it is not necessary to particularly provide the lower plating layer described above, and the copper foil is used as it is instead of the lower plating layer. be able to. In addition, if the inspection of the via hole can be appropriately performed, the inspection area can be configured without using the lower plating layer or the copper foil.

Hereinafter, the upper SLC layer 6 and the lower SLC
Since the layer 7 has the same configuration, the upper SLC
Only the layer 6 will be described in detail. As shown in FIG. 3, the upper SLC layer 6 has two photosensitive resin layers 6a and 6a.
b, and each photosensitive resin layer 6
Pads 12a, 12b, 12c, 1 formed of a plating layer or a copper foil are formed on the upper and lower surfaces of a, 6b.
2d is provided. The pads 12a and 12b face each other to form an inspection area 2a, and the pads 12c and 12d face each other to form an inspection area 2b.

FIG. 3 shows that the SLC layer 6 is formed by two photosensitive resin layers 6a and 6b, but this photosensitive resin layer is not limited to two layers. It is also possible to use three or more photosensitive resin layers as needed. In addition, the inspection via holes 8 and 9 shown in FIG. 3 are formed as one set of five,
In the present invention, any number of inspection via holes can be formed and used in one inspection region as needed.

The upper pad 12a is connected to the inspection via hole 8
Is connected to the lower pad 12b via a plating layer provided inside the lower pad 12d. Similarly, the upper pad 12c is connected to the lower pad 12d via a plating layer provided inside the inspection via hole 9.
It is continuous. If the plating layers continuous from the upper pads 12a, 12c to the lower pads 12b, 12d are not sufficiently adhered to the photosensitive resin, a manufacturing process of a multilayer printed wiring board manufactured through various processes. In some cases, the plating layer in the via hole may be peeled off, resulting in poor conduction. For this reason, it is particularly important to inspect the adhesion of the plating layer on the inner wall portion of the via hole.

FIG. 4 is a sectional view showing in detail an inspection area formed on the printed wiring board 1 of the present invention. As described with reference to FIG. 3, the multilayer printed wiring board 1 shown in FIG.
A layer 13, a lower SLC layer 14 similarly built up and formed, and a base substrate 15 sandwiched between these SLC layers 13 and 14 are formed. Base substrate 1
5 is formed by laminating a plurality of wiring boards, and in a region (not shown) of the base substrate 15, a plurality of via holes used for conduction between the inner layer wiring and the inner layer wiring are formed. Upper SLC layer 13 and lower SLC layer 14
Have the same configuration, and hereinafter, the upper SLC
The layer 13 will be described in detail.

The upper SLC layer 13 is formed of two photosensitive resin layers 13a and 13b in FIG. As the photosensitive resin, specifically, a photosensitive epoxy resin can be used, but the present invention is not particularly limited to the photosensitive epoxy resin, and the same electrical characteristics can be obtained. As far as possible, any resin can be used. In order to manufacture the SLC layer 13 shown in FIG.
The lower pad 16 is plated by a method such as electroless plating or electroplating. Also, base substrate 1
5, a copper foil is provided on the lower pad 16
The copper foil can be used as it is. In the following steps, description will be made assuming that the lower pad 16 is formed by plating for simplification of the description.

Next, a photosensitive epoxy resin is applied to the base substrate 15 so as to cover the plated lower pads 16, thereby forming a photosensitive resin layer 13a. Next, a photomask is arranged on the photosensitive resin layer 13a, exposure and development are performed, and an inspection via hole 17 is formed using the same method as the via hole formed in the region of the inner wiring.

Thereafter, electroless plating or electroplating is performed on the photosensitive resin layer 13a in which the inspection via hole 17 is formed, and the upper pad 18 is formed by a continuous plating layer from the inside of the inspection via hole 17. The use area is formed. When the inspection via hole 17 is formed by a perforation means such as laser perforation in the present invention, a thermosetting epoxy resin or a thermosetting resin other than the epoxy resin is used instead of the photosensitive epoxy resin. Can also be used.

FIG. 5 shows the lower pad 16 described with reference to FIG.
And the shape of the upper pad 18. The upper pad 18 and the lower pad 16 form a pair to form one inspection area 2a and the like. FIG. 5A shows the shape of the upper pad 18, and FIG. 5B shows the shape of the lower pad 16. As shown in FIG.
Is formed from a plating layer having a substantially octagonal shape, and a plurality of inspection via holes 17 are formed in the vicinity of a central portion thereof. The upper pad 18 and the lower pad 16 used in the present invention do not need to have the shape shown in FIG. 5 in particular, and the respective shapes can be appropriately changed and used as needed. Further, in order to form the above-mentioned shape, any conventionally known method can be used.

In FIG. 5A, a portion where the upper pad 18 and the lower pad 16 overlap and the lower pad 16 is hidden is indicated by a broken line. The inspection via hole 17 shown in FIG. 5A extends to the lower pad 16 indicated by a broken line, and the upper pad 18 and the lower pad 16 are connected by a plating layer. The inspection via holes 17 shown in FIG. 5A are formed in two rows extending substantially in parallel. These inspection via holes 17
Are shown in a zigzag pattern.

However, in the present invention, it is not necessary to arrange the inspection via holes 17 particularly in a staggered manner, and the inspection via holes can be formed in a line. Further, the number of inspection via holes 17 formed in one inspection region can be appropriately set as needed. In particular, in terms of effectively using the limited inspection area to increase the number of samples,
By forming the inspection via holes 17 in a staggered manner as shown in FIG. 5A, arrows B and B shown in FIG.
It is preferable because the peeling can be performed without being hindered by the inspection via holes 17 formed on the front side in the peeling direction from the two directions of C, and more inspection via holes 17 can be inspected at the same time.

FIG. 5B is a diagram showing the lower pad 16. FIG. 5B shows that the lower pad 16 has a rectangular shape. However, in the present invention, the lower pad 16 does not necessarily need to be formed in a rectangular shape, and any shape can be used according to conditions such as workability and cost. FIG. 5B shows a portion 17 a in which the inspection via hole 17 extends from the upper pad 18 to the lower pad 16 and is connected to the lower pad 16.

The method for inspecting a printed wiring board according to the present invention is performed by peeling the upper pad 18 beyond the inspection via hole 17 using the inspection region formed as described above. FIG. 6 is a diagram showing a peeling pattern when the method for inspecting a printed wiring board of the present invention is applied to the above-described inspection area. In FIG. 6A, the upper pad 18 is peeled off from the lower side of FIG. 6 in a direction crossing the row of the inspection via holes 17 in a direction indicated by an arrow D. FIG. 6B shows the upper pad 18 shown in FIG. 6A in a direction indicated by an arrow E, which is opposite to the direction shown in FIG. It is the figure which showed the peeling pattern at the time of performing 2nd peeling.

The peel pattern shown in FIG. 6 shows a peel pattern obtained when the adhesion between the plating layer and the photosensitive resin layer on the inner wall of the inspection via hole 17 is sufficient. In the peeling pattern shown in FIG. 6, the plating layer is broken at the circular boundary surface between the upper pad 18 and the inspection via hole 17, and the plating layer remains over the entire inner wall of the inspection via hole 17. Have been.

Further, as shown in FIG. 6, the inspection via holes 17 formed in a staggered shape need not all be the same size, and correspond to the via holes formed in the printed wiring board 1. By setting the diameter, via holes formed with different diameters can be inspected by a peel test in one inspection region.

Inspection of the degree of the plating layer remaining in the via hole after the peeling performed as described above, that is, the inspection of the adhesiveness, is performed so that the inspection via hole 17 to be formed is 0.1%.
Since it may be as small as about mm, judgment is made by observing with a means such as a microscope.

FIG. 7 is a schematic view showing the state of peeling of the plating layer, with a cross section of a peeling pattern obtained by the printed wiring board inspection method of the present invention. FIG.
2 shows a plating layer remaining when the adhesion of the plating layer in the inspection via hole 13 shown in FIG. The plating layer 19 continuous from the upper pad 18 to the lower pad 16 is broken at the boundary between the upper pad 18 and the upper end of the inspection via hole 17 by peeling, and the plating layer inside the inspection via hole 17 is completely retained. Is shown.

FIG. 7B is a view showing a state in the case of the adhesion failure shown in FIG.
7 is formed on the upper surface 15 of the base layer 15.
a. FIG. 7C shows that the inner wall of the inspection via hole 17 and the plating layer 19 have sufficient adhesion to the lower pad 16 and the plating layer adjacent thereto.
It is shown that the plating layer 19 on the side wall of the inspection via hole 17 has peeled off due to poor adhesion between the plating layer 19 and the via hole 17.

The inspection via hole 17 and the plating layer formed on the inspection via hole 17 are formed at the same time as the via hole formed in the wiring region of the base substrate 15 by the same method. As shown,
By using the printed wiring board inspection method of the present invention, it is possible to inspect the adhesion of the plating layer 19 on the inner wall of the via hole formed in the wiring region of the base substrate 15 of the printed wiring board. Therefore, according to the present invention, inconvenience such as poor conduction inside the via hole is reduced.
It is possible to prevent the loss of work due to performing the next process while the plating state of the lower via hole is defective without impairing the state of the internal wiring area of the printed wiring board.

The above-described method for inspecting a printed wiring board of the present invention can be performed using various means. For example,
For the simplest inspection, the upper pad 1
8 is peeled off along a row of the inspection via holes 17 by means having a sharp edge such as a cutter or a razor, and the peeled portion is manually peeled off using a gripper such as tweezers. After that, the inspection via hole 17 is enlarged by an enlargement means such as a microscope.
Can be performed by observing the inside of the substrate and judging the residual state of the plating layer. In addition, the method for inspecting a printed wiring board according to the present invention can be performed, for example, by peeling off the upper pad 18 according to a known method such as a conductor peeling strength test.

The adhesion can be evaluated by, for example, expressing the number of samples showing good adhesion among the total number of the inspection via holes 17. In the present invention, any means other than the above-described method can be used as long as it can appropriately perform peeling.

In the present invention, after performing the above-described inspection, another lower pad is formed on a substrate having good adhesiveness, and then a photosensitive resin layer is applied to form another upper pad. By creating another inspection area and performing the same inspection, a multilayer printed wiring board having high reliability can be created. In addition, since the above-described inspection region can be formed only by forming a pattern for an inspection via hole at an end of a photomask for exposing the photosensitive resin, manufacturing of a printed wiring board is performed. There is no need to add another tool or device to the process.

Thereafter, in the present invention, a layer of a photosensitive resin is laminated on the already formed via hole as necessary, and the above-described steps are repeated to obtain a printed wiring board with improved via hole reliability. It can be manufactured. In the present invention, unless the inspection area is inconvenient in relation to the electric circuit formed on the printed wiring board of the present invention and other electric devices used together with the printed wiring board of the present invention, the inspection area is used. It can be used as it is without cutting and removing. Further, it is also possible to provide a printed wiring board in a form in which the inspection area is removed from the printed wiring board by adding the step of cutting the inspection area described above to the method for manufacturing a printed wiring board of the present invention.

On the printed wiring board manufactured according to the present invention, known electric elements such as a CPU, a resistor, various memories, an LSI, an IC, a capacitor, and a transformer are mounted to constitute an electric device. It can be used as a module of a desired electric device.

Although the present invention has been described with reference to the embodiment shown in the drawings, the present invention is not limited to the above-described embodiment. The present invention can be applied to the above-described via holes formed at the end, for example, via holes such as shape follow vias of any shape that are not penetrated, so-called skip vias. In addition, the shape of the via hole to which the present invention is applied is not limited to the shape shown in the drawings, and the via hole may have any shape.

When the method for inspecting and manufacturing a printed wiring board according to the present invention is applied to a shape follow-up via formed at a stop, or a so-called skip via, particularly, a residual state of a plating layer at a portion formed at a stop is provided. , It is possible to perform a highly accurate inspection, and it is possible to manufacture a multilayer printed wiring board with higher reliability at a higher yield and at a lower cost.

In the printed wiring board manufactured by the method for manufacturing a printed wiring board of the present invention, the reliability of the via hole is improved as described above, so that it is possible to provide a high-quality electric device. Become. Furthermore, for the method of manufacturing the base substrate, the method of manufacturing other elements such as via holes or through holes, and the method of forming the inner layer wiring in the printed wiring board of the present invention, any known structure, material, and manufacturing method may be used. Is possible.

[Brief description of the drawings]

FIG. 1 shows a first example of a printed wiring board formed according to the present invention.
FIG.

FIG. 2 shows a second example of a printed wiring board formed according to the present invention.
FIG.

FIG. 3 is a view showing a cross section of the multilayer printed wiring board and an inspection area taken along the line AA of FIG. 1;

FIG. 4 is a detailed sectional view of the printed wiring board shown in FIG. 3;

FIG. 5 is a diagram showing an upper pad and a lower pad for forming an inspection area used in the present invention.

FIG. 6 is a diagram showing a state in which peeling is performed by the printed wiring board inspection method of the present invention.

FIG. 7 is a diagram showing a state of a plating layer inside an inspection via hole obtained by using the printed wiring board inspection method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed wiring board 2a, 2b, 2c ... Inspection area 3a, 3b, 3c ... Inspection area 4a, 4b, 4c, 4d ... Printed wiring board edge 5 ... Base board 6 ... SLC layer 6a, 6b ... Photosensitivity Resin layer 7 SLC layer 8, 9, 10, 11 ... Inspection via hole 12a, 12b, 12c, 12d Upper pad 13 Upper SLC layer 13a, 13b Photosensitive resin layer 14 Lower SLC layer 15 Base board 16: Lower pad 17: Via hole for inspection 18 ... Upper pad 19: Plating layer in via hole for inspection

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Akira Morisawa 800 Miyake, Yasu-cho, Yasu-cho, Yasu-gun, Shiga Prefecture Inside the Yasu Office of IBM Japan, Ltd. (72) Inventor Hiroshi Nakano Yasu-cho, Yasu-gun, Shiga Prefecture 800 Miyake, Oji City IBM Japan, Ltd. Yasu Office F-term (reference) 2G051 AA68 AB20 5E346 AA41 CC09 CC32 DD12 FF04 GG33

Claims (11)

[Claims] 1. A method for inspecting a printed wiring board, comprising: providing a resin layer on a surface of a base substrate, and forming a via hole and an inspection via hole in the resin layer. And forming a test via hole, plating on the resin layer to form a plating layer inside the via hole and the test via hole, surrounding the test via hole, and forming a plating layer inside the test via hole. Forming an inspection area formed including an upper plating layer continuous from the above, a step of peeling the upper plating layer, and a step of observing a plating layer on an inner wall of the inspection via hole. Board inspection method. 2. The inspection method according to claim 1, wherein the peeling step is performed a plurality of times from opposite directions. 3. The inspection method according to claim 1, wherein a plurality of the inspection via holes are formed across a peeling direction of the upper plating layer. 4. The inspection method according to claim 1, wherein the inspection via holes are formed in a staggered manner across the peeling direction of the upper plating layer. 5. The inspection method according to claim 1, wherein the via hole and the inspection via hole are formed in a stop shape. 6. A method for manufacturing a printed wiring board, comprising: providing a resin layer on a surface of a base substrate, and forming a via hole and an inspection via hole in the resin layer, wherein the via hole is formed in the resin layer. And forming a test via hole, plating on the resin layer to form a plating layer inside the via hole and the test via hole, surrounding the test via hole, and forming a plating layer inside the test via hole. Forming an inspection area formed including an upper plating layer continuous from the above, a step of peeling the upper plating layer, and a step of observing a plating layer on an inner wall of the inspection via hole. Plate manufacturing method. 7. The method according to claim 6, wherein the peeling step is performed a plurality of times from opposite directions. 8. The manufacturing method according to claim 6, further comprising a step of cutting and removing the inspection area. 9. A printed wiring board formed by providing a resin layer on a surface of a base substrate and forming a via hole and an inspection via hole in the resin layer, wherein the resin layer has a via hole and an inspection via hole. Forming a via hole; plating the resin layer to form a plating layer inside the via hole and the inspection via hole, surrounding the inspection via hole and continuing from the plating layer inside the inspection via hole. It is manufactured by a process including a step of forming an inspection area including an upper plating layer, a step of peeling the upper plating layer, and a step of observing a plating layer on an inner wall of the inspection via hole. Printed wiring board. 10. An electric device using a printed wiring board formed by providing a resin layer on a surface of a base substrate and forming a via hole and an inspection via hole in the resin layer, wherein the resin layer Forming a via hole and an inspection via hole on the resin layer, plating the resin layer to form a plating layer inside the via hole and the inspection via hole, surrounding the inspection via hole and inside the inspection via hole. Forming a test region including the upper plating layer continuous from the plating layer; removing the upper plating layer; and observing a plating layer on an inner wall of the inspection via hole. An electric device, comprising: a printed wiring board manufactured by a process; and a plurality of electrical elements mounted on the printed wiring board. 11. A method for inspecting a printed wiring board, comprising: preparing a substrate having a resin layer on the surface; forming a via hole and an inspection via hole in the resin layer; Forming a conductive layer in the via hole, forming an upper conductive layer surrounding the inspection via hole on the surface of the resin layer and continuing to the conductive layer in the inspection via hole, and removing the upper conductive layer And a step of observing a conductive layer in the inspection via hole after the separation.