JP4897961B2 - Wiring board for electronic component inspection and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component inspection wiring board for inspecting the continuity and operation of electronic components and a method for manufacturing the same.

  A plurality of thin film wiring layers having a surface on which such electronic components are mounted and formed between organic insulating layers, and such thin films, in order to inspect the continuity and operation of electronic components to be inspected such as IC chips and LSIs There has been proposed a probe card including a base substrate made of ceramic with a via conductor penetrating under a wiring layer (see, for example, Patent Document 1).

JP 2006-275714 A (pages 1 to 6, FIGS. 1 to 5)

  By the way, the 1st laminated body which has the surface which mounts the to-be-inspected electronic component, and has a comparatively high-density wiring layer which collects the inspection information of this electronic component between several ceramic layers, Below this 1st laminated body In the case of forming a second laminated body in which via conductors pass through a plurality of ceramic layers, the densities of the conductors such as the wiring layers of the two are different. For this reason, a certain difference may occur in the firing shrinkage between the first and second laminates. As a result, when the same ratio is applied to the first laminated body and the second laminated body, and these are laminated and fired at the same time, the pads located on the surface layer of the resulting ceramic substrate, or the via conductor exposed on the surface layer However, since there is a deviation from a desired position, there is a problem that the inspection information of the electronic component to be inspected cannot be collected accurately.

  The present invention solves the problems described in the background art, and includes a first laminate having a wiring layer having a relatively higher density than the second laminate described below between a plurality of ceramic layers, and the first laminate. Provided is a wiring board for inspecting electronic components and a method for manufacturing the same, comprising a second laminated body that is laminated on the back side and through which a via conductor penetrates a plurality of ceramic layers, and that can accurately collect inspection information of electronic components to be inspected. This is the issue.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention provides that the first laminated body and the second laminated body are formed of ceramics having the same material composition, and between via conductors formed in each of the first laminated body and the second laminated body. The idea is to make the land connecting the two large-diameters and to make the percentages of the two different when the first laminated body and the second laminated body are manufactured.
That is, an electronic component inspection wiring board according to the present invention comprises a plurality of ceramic layers, a plurality of pads formed on the surface, a wiring layer formed between the ceramic layers, and the pads and wiring layers. A first laminate having a plurality of via conductors connecting between the back surface and a plurality of via conductors having the same material composition as the ceramic layer and including a plurality of ceramic layers and penetrating between the front surface and the back surface. and, and a second laminate laminated to the back surface side of the first laminate, the conductor density of the first laminate, as compared to the conductor density of the second laminate was high, the Corresponding to the difference in firing shrinkage between the two laminates, the first laminate and the second laminate are produced at different rates. Via conductor exposed on the back surface of the first laminated body between the first laminated body and the second laminated body A plurality of lands that connect via conductors exposed on the surface of the second laminate, and a solid wiring layer located around the lands with a gap between them are arranged, and the diameter of the lands is 2 2 to 5 times the diameter of one via conductor.

According to this, the density of conductors such as the wiring layers of the first laminate and the second laminate is different, and the first and second laminates are different from each other in terms of the firing shrinkage rates. Even when the rate of splitting with the multilayer body is different from each other, via conductors exposed on the back surface of the first multilayer body and via conductors exposed on the surface of the second multilayer body are interposed via the lands. The first and second stacked bodies are stacked in a securely connected state. Therefore, it is possible to energize the electronic component to be inspected such as an IC chip or LSI mounted on the pad on the surface of the first laminated body, or to accurately collect inspection information of the electronic component.
Moreover, since the solid wiring layer can be used as a power supply layer or a grounding layer, it can be used for power feeding to the electronic component to be inspected or grounding of the wiring layer formed in the first laminate. .
If the diameter of the land is less than twice the diameter of the via conductor, it may be difficult to establish conduction between the land and the via conductor. On the other hand, the diameter of the land exceeds five times the diameter of the via conductor. Then, the area of the land becomes excessive, and it becomes difficult to arrange a desired number of via conductors. For this reason, the diameter of the land was made into the said range.

The material of the ceramic layer forming the first and second laminates is a high-temperature fired ceramic made of alumina having the same material composition, or a low-temperature fired ceramic made of glass-ceramic having the same material composition.
Further, the wiring layer and the via conductor are formed of W or Mo in the case of a high-temperature fired ceramic, and are formed of Ag or Cu in the case of a low-temperature fired ceramic.
Moreover, solid shaped wiring layer and are located on the same plane around the land is a wiring layer for grounding or for power.

On the other hand, the method for manufacturing a wiring board for inspecting electronic components according to the present invention (Claim 2) includes a plurality of green sheets made of ceramics having the same material composition in two upper and lower sets, and each green sheet in the upper set and forming a plurality of via holes in relatively accordance with large numbers multiplying ratio position, forming a plurality of via holes in the position according to a relatively small split multiplying ratio is below the set of the green sheets A process of forming a via conductor by filling a conductive paste containing metal powder for each via hole, and a wiring made of the same conductive paste on at least one of the front and back surfaces of the plurality of green sheets in the upper set Forming a layer, and between the back surface of the lowermost green sheet in the upper set and the surface of the uppermost green sheet in the lower set The via conductor exposed to the former back surface and the latter surface, and connected via a large land more than twice those of the diameter, and a solid-like wiring layer through the gap around the該Ra down soil By stacking the upper and lower two green sheets so as to be positioned, the first laminated body composed of the upper pair and the conductor density is relatively high, and the second laminate composed of the lower pair and the conductor density is relatively low. A step of forming a green sheet laminate having a laminate, and a step of firing the green sheet laminate .

According to this, via holes are formed in the upper set of green sheets, whose conductor density will be relatively higher, in accordance with a large allocation rate, and via holes are formed in the lower set of green sheets in accordance with a small allocation rate. ing. When a green sheet laminate is formed by laminating these upper and lower sets, the upper set of via conductors and the lower set of via conductors are securely connected via the land having a relatively large diameter. For this reason, even if the green sheet laminate is fired, the via conductor on the first laminate side with relatively large firing shrinkage and the via conductor on the second laminate side with relatively little firing shrinkage are connected to the land. Baked in the state. As a result, as compared with the conventional case where the same allocation rate is applied to the green sheets that are the first laminated body and the second laminated body, either via on the first laminated body side or the second laminated body side. There is no risk of the conductor and land coming off. Furthermore, the via conductor on the first laminated body side is located immediately below a pad formed on the surface thereof. Therefore, it is possible to reliably provide an electronic component inspection wiring board capable of energizing an electronic component to be inspected mounted on the surface of the first laminated body and accurately collecting inspection information of the electronic component.

  In addition, the said dividing rate is the same between the two points, and the length in the green sheet before firing is divided by the length in the ceramic layer after firing (division: length before firing / length after firing). I) Value. Usually, the multiplication rate is about 1.1 to 1.2. The difference between the large and small percentages is in the range of about 0.001 to 0.003. By setting this range, the upper and lower groups of green sheets are stacked and fired at the same time, and then the positions and dimensions of the pads formed on the surface layer or the internal via conductors are brought closer to the set values. Is possible.

In other words, the step of firing a green sheet laminate obtained by laminating a plurality of green sheets having different percentages, and the surface layer of the first laminate comprising a plurality of ceramic layers obtained by the firing are exposed. A method of manufacturing a wiring board for inspecting electronic components, which includes a step of forming a pad above each of the plurality of via conductors that have been fired, can be included in the present invention.
In this case, when the electrode of the electronic component to be inspected is connected to the pad, the inspection information of the electronic component is passed through the via conductors on the first and second laminated bodies side and the land securely connected thereto. It is possible to reliably manufacture a wiring board for inspecting electronic components, which can be collected accurately.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a vertical sectional view showing an electronic component inspection wiring board (hereinafter simply referred to as an inspection wiring board) 1 according to an embodiment of the present invention.
The wiring board for inspection 1 has a rectangular shape (square or rectangular) in plan view, and includes a first laminate C1 having a plurality of ceramic layers s1 to s3 and having a front surface 2 and a back surface 3, as shown in FIG. The second laminated body C2 is formed of a plurality of ceramic layers s4 to s6 laminated on the back surface 3 side and made of the same material composition as described above, and has a front surface 4 and a back surface 5. The ceramic layers s1 to s6 are made of alumina having the same material composition.
As shown in FIG. 1, the first laminate C1 includes wiring layers 7 and 8 formed between the ceramic layers s1 to s3, a plurality of pads 6 formed on the front surface 2, and the front and back surfaces 2 and 3 And a plurality of via conductors v that conducts. The second stacked body C2 is a wiring layer formed on the surface 4. The land 10 and a plurality of via conductors V penetrating along the thickness direction of the ceramic layers s4 to s6 are provided.

In the first laminate C1, a plurality of pads 6 are formed near the center of the surface 2 of the uppermost ceramic layer s1. The plurality of pads 6 are densely arranged in the mounting area “a” on which the electronic components to be inspected are mounted, and are used to inspect the performance of the electronic components by individually contacting the electrodes of the electronic components to be inspected. It is done.
The wiring layers 7 and 8 are made of W or Mo and have a predetermined pattern. The wiring layers 7 and 8 are electrically connected to each other through the via conductors v penetrating the ceramic layers s1 to s3 and can be electrically connected to the pad 6. Yes. The via conductor v penetrating the lowermost ceramic layer s3 is exposed on the back surface 3 side of the first stacked body C. Each via conductor v is also made of W or Mo.

In the second laminated body C2, the surface 4 of the uppermost ceramic layer s4 has, for example, a solid wiring layer 9 serving as a ground layer or a power supply layer and a plan view as shown in the horizontal partial sectional view of FIG. A land 10 having a circular shape in plan view formed on the inner side of each of the plurality of gaps c having an annular shape is formed on the same plane. The wiring layer 9 and each land 10 are also made of W or Mo, and the gaps c and lands 10 are arranged in a lattice shape in the wiring layer 9 in plan view.
As shown in FIG. 1, the via conductor v exposed on the back surface 3 side of the first stacked body C <b> 1 is connected to the upper surface of the land 10. In addition, the plurality of lands 10 includes a plurality of back surface side pads 11 formed on the back surface 5 of the second stacked body C2 through a plurality of long via conductors V penetrating the ceramic layers s4 to s6 of the second stacked body C2. And are individually conducted.
In the first laminated body C1 and the second laminated body C2, the density per unit volume of the former pad 6, the wiring layers 7 and 8, and the conductor composed of the via conductors v is the latter wiring layer 9, land 10, The density per unit volume of the conductor composed of the via conductor V and the back surface side pad 11 is higher.
The long via conductor V and the back surface side pad 11 are also made of W or Mo. The back surface side pad 11 outputs inspection information of the electronic component to be inspected transmitted via the pad 6, the land 10, and the via conductors v and V to an external electronic device.

As shown in the partially enlarged view of FIG. 3, the diameter d1 of each land 10 is equal to the diameter d2 of the via conductor v on the first stacked body C1 side and the diameter d2 of the long via conductor V penetrating the second stacked body C2. On the other hand, it is 2-5 times those.
According to the inspection wiring substrate 1 as described above, the via conductor v exposed on the back surface 3 side of the first multilayer body C1 and the long via conductor V exposed on the front surface 4 of the second multilayer body C2 are formed by the land 10. It is securely connected via For this reason, the pad 6 on the front surface 2 side and the back surface side pad 11 on the back surface 5 side can be reliably conducted via the land 10 and the via conductors v and V. Therefore, it becomes possible to energize the electronic components to be inspected such as IC chips mounted on the pads 6 formed on the surface 2 of the first laminate C1, and to accurately collect the inspection information of the electronic components.

The inspection wiring board 1 as described above was manufactured as follows.
The same kind of alumina powder, organic binder, solvent and the like are blended in the same amount to make a ceramic slurry having the same material composition, and six green sheets g1 to g6 are produced by the doctor blade method as shown in FIG. .
In FIG. 4, the upper green sheets g1 to g3 each have a thickness of about 180 to 300 μm and later become the ceramic layers s1 to s3 of the first laminate C1, and the lower green sheets g4 to g6 each have a thickness. Is about 180 to 516 μm, and later become ceramic layers s4 to s6 of the second laminate C2.
With respect to the upper green sheets g1 to g3 (sets), each of the multiplying rates was 1.2, and a plurality of via holes h were formed at predetermined positions by punching as shown in FIG. In addition, the lower green sheets g4 to g6 (group) were each set at a rate of 1.198, and a plurality of via holes h were formed at predetermined positions in the same manner as described above (via hole forming step).

Next, each of the via holes h for each of the green sheets g1 to g6 was filled with a conductive paste containing W powder using a metal mask and a squeegee (both not shown). As a result, as shown in FIG. 5, an unfired via conductor v was formed in each via hole h for each of the green sheets g1 to g6 (via conductor forming step).
Next, the same conductive paste as described above is applied to the front surface of the green sheets g2 to g4 and the back surface 5 of the green sheet g6 by screen printing, as shown in FIG. 5, and unfired wiring layers 7 to 9 each having a predetermined pattern. Then, the land 10 and the back surface side pad 11 were formed (wiring layer forming step). Among these, on the surface 4 of the green sheet g4, a wiring layer 9 that covers almost the entire surface 4 in a solid shape is formed, and a plurality of gaps c exhibiting an annular shape formed in a lattice shape in plan view. A circular land 10 was formed in the same plane as the wiring layer 9 on the inner side. The diameter (d1) of the land 10 was set to be 2 to 5 times the diameter (d2) of each via conductor v located above and below in FIG.
The wiring layer 9 and the plurality of lands 10 may be formed on the back surface 3 side of the green sheet g3, which will be the back surface 3 of the first stacked body C1 later. In this case, the difference in the multiplication rate is increased to, for example, 0.003.

Further, in FIG. 5, the upper green sheets g1 to g3 (group) and the lower green sheets g4 to g6 (group) are connected to the former and the plurality of via conductors v exposed on the back surface 3 of the lowermost green sheet g3. In the latter case, the green sheets g1 to g6 were laminated while being pressed along the thickness direction so as to be in contact with the upper surfaces of the plurality of lands 10 located on the surface 4 of the uppermost green sheet g4.
As a result, as shown in FIG. 6, the first laminated body C1 made of green sheets g1 to g3 and the second laminated body C2 made of green sheets g4 to g6 are laminated, and the via conductors v of both are formed on the land 10. The connected green sheet laminated body GS was formed (lamination process). The green sheet laminate GS was heated to a predetermined temperature range (simultaneously) and fired (firing step).

As a result, as shown in FIG. 7, the first and second laminated bodies C1 and C2 made of ceramic layers s1 to s6 having the front surface 2 and the back surface 5 and integrated, the fired wiring layers 7 to 9, A ceramic laminate SS including the via conductors v and V, the land 10 and the back surface side pad 11 was obtained.
In the firing step, the green sheets g1 to g3 on the upper layer side of the green sheet laminate GS have the wiring layers 7 and 8 having a relatively high density. Firing shrinkage was relatively large along the thickness direction. On the other hand, since the green sheets g4 to g6 in the lower layer side have a plurality of long via conductors V at a relatively low density except for the solid wiring layer 9, the land 10, and the back surface side pad 11, According to the multiplying factor: 1.198, the firing shrinkage remained relatively small along the plane direction and the thickness direction.

Since there is a difference in firing shrinkage between the first laminated body C1 and the second laminated body C2, each land 10 formed on the surface 4 of the green sheet g4 is applied even if the above-mentioned different percentages are applied. Is set to 2 to 5 times the diameter (d2) of each via conductor v exposed on the back surface 3 of the green sheet g3, so that the connection between the land 10 and the via conductor v is reliably maintained. I was able to.
As a result, as shown in FIG. 7, in the ceramic laminate SS, the wiring layers 7 and 8 and the lands 10 can be conducted through the via conductors v penetrating the ceramics s1 to s3. 10 and the back surface side pad 11 can be conducted through a long via conductor V penetrating the ceramics s4 to s6.

Next, a pad (6) in contact with the electronic component to be inspected is formed on each of the plurality of via conductors v exposed at the center of the surface 2 of the ceramic laminate SS (ceramic layer s1) as follows. .
As shown on the left side of FIG. 8, a Ti thin film layer 12 and a Cu thin film layer 13 were sequentially formed on the surface 2 of the ceramic layer s1 by sputtering. Next, as shown on the right side of FIG. 8, after forming a resist layer 14 made of a photosensitive resin on the Cu thin film layer 13, a photolithography technique is applied to the resist layer 14, so that each via conductor v is formed. A cylindrical through-hole 15 was formed above the top.
Next, as shown on the left side of FIG. 9, a Cu plating layer 16 and a Ni plating layer 17 were sequentially formed on the Cu thin film layer 13 exposed on the bottom surface of each through hole 15 by electrolytic plating. In this state, as shown on the right side of FIG. 9, the resist layer 14 was dissolved and removed with a developer.

Further, as shown on the left side of FIG. 10, the portions of the Ti thin film layer 12 and the Cu thin film layer 13 that are not covered with the Cu plating layer 16 and the Ni plating layer 17 were removed by contacting them with an etching solution. As a result, four layers of the Ti thin film layer 12, the Cu thin film layer 13, the Cu plating layer 16, and the Ni plating layer 17 were formed in a cylindrical shape above each via conductor v exposed on the surface 2. Then, as shown on the right side of FIG. 10, the Au plating layer m was coated on the entire surface of the four-layered cylindrical body by electrolytic plating. As a result, the plurality of pads 6 could be formed on the surface 2 with high positional accuracy.
As a result, a plurality of pads 6 for contacting the electrodes of the electronic component to be inspected are formed in the mounting area a of the front surface 2, and the pads 6 and the back surface side pads 11 can be reliably conducted via the land 10. Thus, the inspection wiring board 1 shown in FIG. 1 was obtained.

  According to the manufacturing method of the inspection wiring board 1 as described above, via holes h are formed in the upper set of green sheets g1 to g3 in accordance with a large percentage, and the lower set of green sheets g4 to g6. The via hole h is formed at a position according to a small percentage, and the diameter d1 of each land 10 is 2 to 5 times the diameter d2 of each via conductor v exposed on the back surface 3 of the green sheet g3. . For this reason, the positional accuracy of the two via conductors v and V and the pad 6 is improved, and the two via conductors v and V are reliably connected via the baked land 10. Accordingly, the electronic component to be inspected mounted on the pad 6 formed on the surface 2 of the first laminated body C1 is energized, and the inspection information of the electronic component is transmitted via the land 10 and the via conductors v and V. It was possible to reliably provide the inspection wiring board 1 that can be accurately collected from the back-side pad 11.

FIG. 11 is a vertical sectional view showing the inspection wiring board 1a of the reference form .
As shown in FIG. 11, the inspection wiring board 1a is formed by integrally laminating a first laminated body C1 and a second laminated body C2 similar to the inspection wiring board 1.
The inspection wiring board 1a is different from the inspection wiring board 1 in that a plurality of lands 10 are formed in a lattice shape between the back surface 3 of the first stacked body C1 and the front surface 4 of the second stacked body C2. The thin linear wiring layers 9a for signals are arranged in the same plane between them. A via conductor v on the first stacked body C1 side and a long via conductor V on the second stacked body C2 side are connected above and below the plurality of lands 10. The diameter d1 of each land 10 is 2 to 5 times the diameter d2 of the upper and lower via conductors v and V.

The inspection wiring board 1a can be manufactured in the same manner as the inspection wiring board 1. However, a linear conductive paste that forms the signal wiring layer 9a is formed on the surface 4 of the second laminate C2. Is done. As a result, the difference in firing shrinkage during firing between the first laminate C1 formed from the green sheets g1 to g3 and the second laminate C2 formed from the green sheets g4 to g6 It is slightly larger than the case of manufacturing. For this reason, for example, the lowering rate of the green sheets g4 to g6 in the lower group is reduced by about 0.003 or larger than that of the upper side green sheets g1 to g3. It is desirable to form the via hole h. In addition, you may form the electrically conductive paste of the said wiring layer 9a in the back surface 3 of the green sheet g3 used as the back surface 3 of the 1st laminated body C1.
Even with the above-described wiring board for inspection 1a, the same operation as that of the wiring board for inspection 1 can be obtained, and the same effect can be obtained.

The present invention is not limited to the embodiments described above.
For example, the ceramic layer and the green sheet for forming the first laminate and the second laminate may be ceramic materials having the same material composition or component composition, such as high-temperature fired ceramics such as aluminum nitride and mullite, Alternatively, a low-temperature fired ceramic such as glass-ceramic (for example, alumina) may be used.
The plurality of lands formed between the back surface of the first stacked body and the front surface of the second stacked body may be arranged in a staggered manner in a plan view.
Further, the land may have a substantially square or regular polygonal shape in plan view, and in these cases, the shortest distance in plan view is the diameter.

1 is a vertical cross-sectional view illustrating an electronic component inspection wiring board according to an embodiment of the present invention. The horizontal fragmentary sectional view which shows the land vicinity in the said wiring board for an inspection. The partial expanded sectional view which shows the said land vicinity. Schematic which shows one manufacturing process of the said wiring board for an inspection. Schematic which shows the manufacturing process following FIG. Schematic which shows the green sheet laminated body obtained at the manufacturing process following FIG. Schematic which shows the ceramic laminated body obtained at the manufacturing process following FIG. Schematic which shows the manufacturing process following FIG. Schematic which shows the manufacturing process following FIG. Schematic which shows the manufacturing process following FIG. The vertical sectional view which shows the wiring board for electronic component inspection of a reference form .

Explanation of symbols

1 ... ............... electronic component test wiring substrates 2 ............ surface 3,5 ............ backside 6 .................. pad 7-9 ... ......... wiring layer 10 ......... …… Land C1 ……………… First laminate C2 ………… Second laminate s1 to s6 …… Ceramic layers v, V ………… Via conductors d1, d2 …… Diameter g1 to g6 …… Green sheet h ……………… via hole GS …………… green sheet laminate

Claims (2)

A first laminate comprising a plurality of ceramic layers, a plurality of pads formed on the surface, a wiring layer formed between the ceramic layers, and a plurality of via conductors connecting between the pads and the wiring layers and the back surface; ,
A second laminated body having the same material composition as the ceramic layer and comprising a plurality of ceramic layers, having a plurality of via conductors penetrating between the front surface and the back surface, and laminated on the back surface side of the first laminated body; With
The conductor density of the first laminate is higher than the conductor density of the second laminate ,
Corresponding to the difference between the firing shrinkage rates of the two laminates, the percentages of the laminates when producing the first laminate and the second laminate are different ,
Between the first laminate and the second laminate, a plurality of lands connecting the via conductor exposed on the back surface of the first laminate and the via conductor exposed on the surface of the second laminate, and the land A solid wiring layer located around the gap is arranged,
The diameter of the land is 2 to 5 times the diameter of the two via conductors.
A wiring board for inspecting electronic components. For each of the upper and lower sets of green sheets made of ceramics of the same material composition , a plurality of via holes are formed in the upper set of green sheets at positions according to a relatively large percentage. Forming a plurality of via holes at positions according to a relatively small percentage on each green sheet of the side set;
Filling a conductive paste containing metal powder for each via hole to form a via conductor;
Forming a wiring layer made of the same conductive paste on at least one of the front and back surfaces of the plurality of green sheets in the upper set;
Between the back surface of the lowermost green sheet in the upper set and the surface of the uppermost green sheet in the lower set, the via conductor exposed on the former back surface and the latter surface is determined from these diameters. also connects via a large land more than doubled, and through the gap around the該Ra down de to position solidly wiring layers, by laminating the upper and lower two sets of the green sheets, upper Forming a green sheet laminate having a first laminate comprising a set and a relatively high conductor density and a second laminate comprising a lower set and a relatively low conductor density;
Firing the green sheet laminate ,
A method for manufacturing an electronic component inspection wiring board.

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