JP2002009200A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP2002009200A
JP2002009200A JP2000185862A JP2000185862A JP2002009200A JP 2002009200 A JP2002009200 A JP 2002009200A JP 2000185862 A JP2000185862 A JP 2000185862A JP 2000185862 A JP2000185862 A JP 2000185862A JP 2002009200 A JP2002009200 A JP 2002009200A
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor
semiconductor device
sealing resin
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000185862A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002009200A5 (https=
Inventor
Haruto Nagata
治人 永田
Takeshi Morikawa
健 森川
Atsuo Oki
篤夫 大木
Fumio Sato
文男 佐藤
Yoshiaki Shimizu
義明 清水
Yuki Koishi
勇喜 小石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000185862A priority Critical patent/JP2002009200A/ja
Publication of JP2002009200A publication Critical patent/JP2002009200A/ja
Publication of JP2002009200A5 publication Critical patent/JP2002009200A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2000185862A 2000-06-21 2000-06-21 半導体装置の製造方法 Pending JP2002009200A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000185862A JP2002009200A (ja) 2000-06-21 2000-06-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000185862A JP2002009200A (ja) 2000-06-21 2000-06-21 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008313841A Division JP2009055069A (ja) 2008-12-10 2008-12-10 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002009200A true JP2002009200A (ja) 2002-01-11
JP2002009200A5 JP2002009200A5 (https=) 2006-04-06

Family

ID=18686119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000185862A Pending JP2002009200A (ja) 2000-06-21 2000-06-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2002009200A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235913A (ja) * 2008-03-31 2008-10-02 Renesas Technology Corp 半導体装置の製造方法
JP2012227371A (ja) * 2011-04-20 2012-11-15 Disco Abrasive Syst Ltd パッケージ基板の加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235913A (ja) * 2008-03-31 2008-10-02 Renesas Technology Corp 半導体装置の製造方法
JP2012227371A (ja) * 2011-04-20 2012-11-15 Disco Abrasive Syst Ltd パッケージ基板の加工方法

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