JP2001526837A5 - - Google Patents
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- Publication number
- JP2001526837A5 JP2001526837A5 JP1998542958A JP54295898A JP2001526837A5 JP 2001526837 A5 JP2001526837 A5 JP 2001526837A5 JP 1998542958 A JP1998542958 A JP 1998542958A JP 54295898 A JP54295898 A JP 54295898A JP 2001526837 A5 JP2001526837 A5 JP 2001526837A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/833,273 US5864176A (en) | 1997-04-04 | 1997-04-04 | Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film of liquid, that evaporates without leaving any residue, between the faces |
| US08/833,369 US5821505A (en) | 1997-04-04 | 1997-04-04 | Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink |
| US08/833,368 US5844208A (en) | 1997-04-04 | 1997-04-04 | Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature |
| US08/833,273 | 1997-04-04 | ||
| US08/833,368 | 1997-04-04 | ||
| US08/833,369 | 1997-04-04 | ||
| PCT/US1998/006701 WO1998046059A1 (en) | 1997-04-04 | 1998-04-03 | Temperature control system for an electronic device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005066502A Division JP4122009B2 (ja) | 1997-04-04 | 2005-03-10 | 電子機械的サブアセンブリ、および電子装置を熱交換部材に熱結合する方法 |
| JP2007301819A Division JP2008118149A (ja) | 1997-04-04 | 2007-11-21 | 電子機械的アセンブリ、および電子装置を熱交換部材に熱結合する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001526837A JP2001526837A (ja) | 2001-12-18 |
| JP2001526837A5 true JP2001526837A5 (enExample) | 2005-11-10 |
| JP4077523B2 JP4077523B2 (ja) | 2008-04-16 |
Family
ID=27420238
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54295898A Expired - Lifetime JP4077523B2 (ja) | 1997-04-04 | 1998-04-03 | 電子装置用温度制御システム |
| JP2005066502A Expired - Fee Related JP4122009B2 (ja) | 1997-04-04 | 2005-03-10 | 電子機械的サブアセンブリ、および電子装置を熱交換部材に熱結合する方法 |
| JP2007301819A Pending JP2008118149A (ja) | 1997-04-04 | 2007-11-21 | 電子機械的アセンブリ、および電子装置を熱交換部材に熱結合する方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005066502A Expired - Fee Related JP4122009B2 (ja) | 1997-04-04 | 2005-03-10 | 電子機械的サブアセンブリ、および電子装置を熱交換部材に熱結合する方法 |
| JP2007301819A Pending JP2008118149A (ja) | 1997-04-04 | 2007-11-21 | 電子機械的アセンブリ、および電子装置を熱交換部材に熱結合する方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (4) | EP0993243B1 (enExample) |
| JP (3) | JP4077523B2 (enExample) |
| DE (3) | DE69839520D1 (enExample) |
| WO (1) | WO1998046059A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6668570B2 (en) | 2001-05-31 | 2003-12-30 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an electronic device under test |
| US6658736B1 (en) * | 2002-08-09 | 2003-12-09 | Unisys Corporation | Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent |
| US6975028B1 (en) | 2003-03-19 | 2005-12-13 | Delta Design, Inc. | Thermal apparatus for engaging electronic device |
| US6995980B2 (en) * | 2003-08-21 | 2006-02-07 | Unisys Corporation | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
| US7199597B2 (en) * | 2004-02-16 | 2007-04-03 | Delta Design, Inc. | Dual feedback control system for maintaining the temperature of an IC-chip near a set-point |
| DE102004042075A1 (de) * | 2004-08-31 | 2005-10-20 | Infineon Technologies Ag | Schaltungsanordnung mit temperaturgesteuerter Schaltungseinheit und Verfahren zur Temperatursteuerung |
| DE102005001163B3 (de) * | 2005-01-10 | 2006-05-18 | Erich Reitinger | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung |
| JP4418772B2 (ja) | 2005-04-28 | 2010-02-24 | 富士通マイクロエレクトロニクス株式会社 | 温度制御装置 |
| JP4315141B2 (ja) | 2005-09-09 | 2009-08-19 | セイコーエプソン株式会社 | 電子部品の温度制御装置並びにハンドラ装置 |
| JP5552452B2 (ja) * | 2011-03-04 | 2014-07-16 | パナソニック株式会社 | 加熱冷却試験方法および加熱冷却試験装置 |
| EP2782666B1 (de) | 2011-11-24 | 2016-02-03 | Wintershall Holding GmbH | Derivate von tris(2-hydroxyphenyl)methanen, deren herstellung und verwendung für die erdölförderung |
| GB2507732A (en) * | 2012-11-07 | 2014-05-14 | Oclaro Technology Ltd | Laser temperature control |
| DE102013010088A1 (de) | 2013-06-18 | 2014-12-18 | VENSYS Elektrotechnik GmbH | Kühlvorrichtung für ein Stromumrichtermodul |
| JP2018523122A (ja) * | 2015-07-21 | 2018-08-16 | デルタ・デザイン・インコーポレイテッドＤｅｌｔａ Ｄｅｓｉｇｎ， Ｉｎｃ． | 連続的な流体熱界面材料の分配 |
| KR200494784Y1 (ko) * | 2018-11-06 | 2021-12-28 | 김진국 | 세정기 |
| CN113412031A (zh) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | 一种升温模组及电子设备 |
| AU2022204614A1 (en) * | 2021-08-27 | 2023-03-16 | Ametek, Inc. | Temperature dependent electronic component heating system |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3979671A (en) * | 1975-03-06 | 1976-09-07 | International Business Machines Corporation | Test fixture for use in a high speed electronic semiconductor chip test system |
| JPS5961027A (ja) * | 1982-09-29 | 1984-04-07 | Toshiba Corp | 半導体基板加熱装置 |
| JPS5986235A (ja) * | 1982-11-09 | 1984-05-18 | Shimada Phys & Chem Ind Co Ltd | 半導体基板の電気的特性測定方法 |
| US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
| US4854726A (en) * | 1986-05-29 | 1989-08-08 | Hughes Aircraft Company | Thermal stress screening system |
| JPH07105422B2 (ja) * | 1987-03-16 | 1995-11-13 | 東京エレクトロン株式会社 | 半導体ウエハ載置台 |
| BE1000697A6 (fr) * | 1987-10-28 | 1989-03-14 | Irish Transformers Ltd | Appareil pour tester des circuits electriques integres. |
| JPH01152639A (ja) * | 1987-12-10 | 1989-06-15 | Canon Inc | 吸着保持装置 |
| US4848090A (en) * | 1988-01-27 | 1989-07-18 | Texas Instruments Incorporated | Apparatus for controlling the temperature of an integrated circuit package |
| US4962416A (en) * | 1988-04-18 | 1990-10-09 | International Business Machines Corporation | Electronic package with a device positioned above a substrate by suction force between the device and heat sink |
| US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
| US4975803A (en) * | 1988-12-07 | 1990-12-04 | Sundstrand Corporation | Cold plane system for cooling electronic circuit components |
| JP3201868B2 (ja) * | 1992-03-20 | 2001-08-27 | アジレント・テクノロジーズ・インク | 導電性熱インターフェース及びその方法 |
| JPH05267200A (ja) * | 1992-03-24 | 1993-10-15 | Hitachi Ltd | 半導体熱処理装置 |
| US5448147A (en) * | 1992-05-08 | 1995-09-05 | Tel-Varian Limited | Selectable feedback control system |
| US5420521A (en) | 1992-10-27 | 1995-05-30 | Ej Systems, Inc. | Burn-in module |
| JP3067480B2 (ja) * | 1993-08-26 | 2000-07-17 | 三菱自動車工業株式会社 | レーザ焼入れ用レーザ吸収剤 |
| JPH08286551A (ja) * | 1995-04-12 | 1996-11-01 | Ricoh Co Ltd | 温度制御装置 |
| GB9610663D0 (en) * | 1996-05-22 | 1996-07-31 | Univ Paisley | Temperature control apparatus and methods |
-
1998
- 1998-04-03 EP EP99124051A patent/EP0993243B1/en not_active Expired - Lifetime
- 1998-04-03 WO PCT/US1998/006701 patent/WO1998046059A1/en not_active Ceased
- 1998-04-03 EP EP98918008A patent/EP1016337B1/en not_active Expired - Lifetime
- 1998-04-03 EP EP08156473.4A patent/EP2086306B1/en not_active Expired - Lifetime
- 1998-04-03 DE DE69839520T patent/DE69839520D1/de not_active Expired - Lifetime
- 1998-04-03 DE DE69818468T patent/DE69818468T2/de not_active Expired - Lifetime
- 1998-04-03 EP EP99124050A patent/EP0994645B1/en not_active Expired - Lifetime
- 1998-04-03 JP JP54295898A patent/JP4077523B2/ja not_active Expired - Lifetime
- 1998-04-03 DE DE69822158T patent/DE69822158T2/de not_active Expired - Lifetime
-
2005
- 2005-03-10 JP JP2005066502A patent/JP4122009B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-21 JP JP2007301819A patent/JP2008118149A/ja active Pending