JP2001513450A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001513450A5 JP2001513450A5 JP2000507086A JP2000507086A JP2001513450A5 JP 2001513450 A5 JP2001513450 A5 JP 2001513450A5 JP 2000507086 A JP2000507086 A JP 2000507086A JP 2000507086 A JP2000507086 A JP 2000507086A JP 2001513450 A5 JP2001513450 A5 JP 2001513450A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5490697P | 1997-08-06 | 1997-08-06 | |
| US60/054,906 | 1997-08-06 | ||
| PCT/US1998/016289 WO1999007515A1 (en) | 1997-08-06 | 1998-08-05 | Improved polishing pads and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001513450A JP2001513450A (ja) | 2001-09-04 |
| JP2001513450A5 true JP2001513450A5 (enrdf_load_html_response) | 2006-01-05 |
Family
ID=21994291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000507086A Pending JP2001513450A (ja) | 1997-08-06 | 1998-08-05 | 改良研磨パッド及びこれに関連する方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1011919B1 (enrdf_load_html_response) |
| JP (1) | JP2001513450A (enrdf_load_html_response) |
| KR (1) | KR100499601B1 (enrdf_load_html_response) |
| CN (1) | CN1265618A (enrdf_load_html_response) |
| DE (1) | DE69827147T2 (enrdf_load_html_response) |
| WO (1) | WO1999007515A1 (enrdf_load_html_response) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1015176B1 (en) * | 1997-04-04 | 2003-03-12 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
| JP3918359B2 (ja) * | 1998-05-15 | 2007-05-23 | Ｊｓｒ株式会社 | 研磨パッド用重合体組成物および研磨パッド |
| JP4954377B2 (ja) * | 2000-02-04 | 2012-06-13 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| JP4959901B2 (ja) * | 2000-05-27 | 2012-06-27 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械平坦化用溝付き研磨パッド |
| US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| SG131737A1 (en) * | 2001-03-28 | 2007-05-28 | Disco Corp | Polishing tool and polishing method and apparatus using same |
| US6568997B2 (en) | 2001-04-05 | 2003-05-27 | Rodel Holdings, Inc. | CMP polishing composition for semiconductor devices containing organic polymer particles |
| US7214623B2 (en) * | 2003-10-13 | 2007-05-08 | International Business Machines Corporation | Planarization system and method using a carbonate containing fluid |
| US20060089095A1 (en) | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| CN101115779B (zh) | 2005-03-08 | 2012-09-19 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
| KR101134058B1 (ko) | 2005-05-17 | 2012-04-16 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4898172B2 (ja) * | 2005-09-08 | 2012-03-14 | 日本ミクロコーティング株式会社 | 研磨パッド及びその製造方法並びに研磨方法 |
| JP5031236B2 (ja) | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| KR100882045B1 (ko) | 2006-02-15 | 2009-02-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 그루브형 서브패드를 구비한 폴리싱 장치 |
| CA2661504C (en) | 2006-07-14 | 2013-04-23 | Saint-Gobain Abrasives, Inc. | Backingless abrasive article |
| WO2008026451A1 (en) | 2006-08-28 | 2008-03-06 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5314353B2 (ja) * | 2008-08-05 | 2013-10-16 | 旭ダイヤモンド工業株式会社 | 超砥粒チップ及び超砥粒工具 |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
| FR3025741B1 (fr) * | 2014-09-15 | 2019-05-24 | Airbus Group Sas | Film adhesif multifonctionnel pour la protection de surface de pieces |
| CN104889874B (zh) * | 2015-06-25 | 2017-08-04 | 蓝思科技（长沙）有限公司 | 一种蓝宝石抛光用吸附垫及其制备方法 |
| CN108025420B (zh) | 2015-09-25 | 2020-10-27 | 嘉柏微电子材料股份公司 | 具有高模量比的聚氨酯化学机械抛光垫 |
| JP6380333B2 (ja) * | 2015-10-30 | 2018-08-29 | 株式会社Sumco | ウェーハ研磨装置およびこれに用いる研磨ヘッド |
| CN105538047B (zh) * | 2015-12-11 | 2017-09-22 | 中国航空工业集团公司北京航空材料研究院 | 一种航空有机透明制件的表面研抛方法 |
| US20180134918A1 (en) * | 2016-11-11 | 2018-05-17 | Jh Rhodes Company, Inc. | Soft polymer-based material polishing media |
| WO2019012391A1 (en) * | 2017-07-11 | 2019-01-17 | 3M Innovative Properties Company | ABRASIVE ARTICLES COMPRISING ADAPTABLE COATINGS, AND POLISHING SYSTEM MANUFACTURED THEREFROM |
| CN109794863A (zh) * | 2019-03-05 | 2019-05-24 | 北京国瑞升精机科技有限公司 | 一种亲水性抛光膜及其制备方法 |
| CN110744444B (zh) * | 2019-10-29 | 2022-02-15 | 武汉新芯集成电路制造有限公司 | 研磨垫及研磨装置 |
| WO2023149434A1 (ja) | 2022-02-02 | 2023-08-10 | 株式会社クラレ | 研磨層、研磨パッド、研磨パッドの製造方法及び研磨方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4129457A (en) * | 1977-05-23 | 1978-12-12 | International Business Machines Corporation | Post-polishing cleaning of semiconductor surfaces |
| US4581287A (en) * | 1984-06-18 | 1986-04-08 | Creative Products Resource Associates, Ltd. | Composite reticulated foam-textile cleaning pad |
| US4787732A (en) * | 1986-04-24 | 1988-11-29 | Nick Siviglia | Contact lens and method of making same |
| US5007128B1 (en) * | 1989-01-18 | 1993-12-07 | Minnesota Mining And Manufacturing Company | Compounding,glazing or polishing pad |
| US5396737B1 (en) * | 1989-01-18 | 1997-12-23 | Minnesota Mining & Mfg | Compound glazing or polishing pad |
| JP2632738B2 (ja) * | 1990-04-27 | 1997-07-23 | 信越半導体 株式会社 | パッキングパッド、および半導体ウェーハの研磨方法 |
| US5157877A (en) * | 1990-04-27 | 1992-10-27 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a semiconductor wafer |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5704987A (en) * | 1996-01-19 | 1998-01-06 | International Business Machines Corporation | Process for removing residue from a semiconductor wafer after chemical-mechanical polishing |
-
1998
- 1998-08-05 JP JP2000507086A patent/JP2001513450A/ja active Pending
- 1998-08-05 CN CN 98807897 patent/CN1265618A/zh active Pending
- 1998-08-05 DE DE69827147T patent/DE69827147T2/de not_active Expired - Lifetime
- 1998-08-05 KR KR10-2000-7001162A patent/KR100499601B1/ko not_active Expired - Lifetime
- 1998-08-05 WO PCT/US1998/016289 patent/WO1999007515A1/en active IP Right Grant
- 1998-08-05 EP EP98938386A patent/EP1011919B1/en not_active Expired - Lifetime