JP2001502123A5 - - Google Patents

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Publication number
JP2001502123A5
JP2001502123A5 JP1999511887A JP51188799A JP2001502123A5 JP 2001502123 A5 JP2001502123 A5 JP 2001502123A5 JP 1999511887 A JP1999511887 A JP 1999511887A JP 51188799 A JP51188799 A JP 51188799A JP 2001502123 A5 JP2001502123 A5 JP 2001502123A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP1999511887A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001502123A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB1998/000916 external-priority patent/WO1999008297A2/en
Publication of JP2001502123A publication Critical patent/JP2001502123A/ja
Publication of JP2001502123A5 publication Critical patent/JP2001502123A5/ja
Ceased legal-status Critical Current

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JP11511887A 1997-08-05 1998-06-11 複数の電子部品の製造方法 Ceased JP2001502123A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP97202432 1997-08-05
EP97202432.7 1997-08-05
PCT/IB1998/000916 WO1999008297A2 (en) 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components

Publications (2)

Publication Number Publication Date
JP2001502123A JP2001502123A (ja) 2001-02-13
JP2001502123A5 true JP2001502123A5 (https=) 2006-01-05

Family

ID=8228622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11511887A Ceased JP2001502123A (ja) 1997-08-05 1998-06-11 複数の電子部品の製造方法

Country Status (8)

Country Link
US (1) US6240621B1 (https=)
EP (1) EP0941545B1 (https=)
JP (1) JP2001502123A (https=)
KR (1) KR100561792B1 (https=)
CN (1) CN1179381C (https=)
DE (1) DE69833193T2 (https=)
TW (1) TW412763B (https=)
WO (1) WO1999008297A2 (https=)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
EP1070389B1 (en) 1998-04-07 2007-12-05 X2Y Attenuators, L.L.C. Component carrier
US6815220B2 (en) 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6891461B2 (en) 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6452247B1 (en) * 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
JP2004507198A (ja) 2000-08-15 2004-03-04 エクストゥーワイ、アテニュエイタズ、エル、エル、シー 回路のエネルギーを調整するための電極装置
US7433168B2 (en) 2000-10-17 2008-10-07 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
JP3955241B2 (ja) * 2002-06-21 2007-08-08 東京エレクトロン株式会社 Ｍｅｍｓアレイとその製造方法及びそれに基づくｍｅｍｓデバイスの製造方法
TWI291186B (en) * 2002-09-10 2007-12-11 Tdk Corp Multi-layer capacitor
ATE426837T1 (de) * 2002-09-27 2009-04-15 Koninkl Philips Electronics Nv Lithographisches verfahren zur verdrahtung einer seitenoberflache eines substrats
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
WO2005002018A2 (en) 2003-05-29 2005-01-06 X2Y Attenuators, Llc Connector related structures including an energy
EP1649572A4 (en) 2003-07-21 2012-06-27 X2Y Attenuators Llc FILTER ASSEMBLY
WO2005065097A2 (en) 2003-12-22 2005-07-21 X2Y Attenuators, Llc Internally shielded energy conditioner
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で重なり合った調整器
US7586728B2 (en) 2005-03-14 2009-09-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8134548B2 (en) * 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
EP1991996A1 (en) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energy conditioner structures
JP4872134B2 (ja) * 2008-03-31 2012-02-08 Ｔｄｋ株式会社 端子電極形成方法
JP5233637B2 (ja) * 2008-04-02 2013-07-10 日立金属株式会社 多層セラミック基板、及び電子部品
CN102122553B (zh) * 2010-12-17 2013-03-20 深圳顺络电子股份有限公司 卧式结构的低阻值片式负温度系数热敏电阻及其制造方法
DE102011005658A1 (de) * 2011-03-16 2012-09-20 Sirona Dental Systems Gmbh Träger, vorzugsweise für ein elektronisches Bauteil, eine Baugruppe solcher Träger und ein Verfahren zur Herstellung einer Baugruppe solcher Träger
DE102012109704A1 (de) * 2012-10-11 2014-04-17 Epcos Ag Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung
JP6136507B2 (ja) * 2013-04-16 2017-05-31 Tdk株式会社 積層コンデンサアレイ
DE102018115205A1 (de) * 2018-06-25 2020-01-02 Vishay Electronic Gmbh Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten
CN109963409B (zh) 2019-04-10 2021-02-23 京东方科技集团股份有限公司 基板侧面导线的制造方法和基板结构

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770434A (en) * 1971-10-15 1973-11-06 Rca Corp Method for making an image screen structure for an apertured-mask cathode-ray tube using a mask having temporary apertures
US3809973A (en) * 1973-07-06 1974-05-07 Sprague Electric Co Multilayer ceramic capacitor and method of terminating
US4356529A (en) * 1981-01-21 1982-10-26 Sprague Electric Company Terminated monolithic ceramic chip capacitor
US4486738A (en) * 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components
US4453199A (en) * 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
US4788523A (en) * 1987-12-10 1988-11-29 United States Of America Viad chip resistor
US5278012A (en) * 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
US5144527A (en) * 1989-08-24 1992-09-01 Murata Manufacturing Co., Ltd. Multilayer capacitor and method of fabricating the same
US5281769A (en) * 1990-11-05 1994-01-25 Nippon Telegraph And Telephone Corporation Dewall plating technique
US5625220A (en) * 1991-02-19 1997-04-29 Texas Instruments Incorporated Sublithographic antifuse
JP3018645B2 (ja) * 1991-10-03 2000-03-13 株式会社村田製作所 チップ部品の製造方法
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
US5517385A (en) * 1992-11-19 1996-05-14 International Business Machines Corporation Decoupling capacitor structure
JP2550852B2 (ja) * 1993-04-12 1996-11-06 日本電気株式会社 薄膜キャパシタの製造方法
US5323520A (en) * 1993-04-29 1994-06-28 Fujitsu Limited Process for fabricating a substrate with thin film capacitor
US5414589A (en) * 1993-06-07 1995-05-09 Rohm Co., Ltd. Capacitor having a changeable dielectric capacity and manufacturing method thereof
JP2870371B2 (ja) * 1993-08-05 1999-03-17 株式会社村田製作所 積層電子部品、その製造方法およびその特性測定方法
JP3027081B2 (ja) * 1993-12-09 2000-03-27 アルプス電気株式会社 薄膜素子
JPH07161223A (ja) * 1993-12-10 1995-06-23 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミックコンデンサ
EP0706678B1 (en) * 1994-04-28 1999-02-24 Koninklijke Philips Electronics N.V. Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
US5600533A (en) * 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
WO1996030916A2 (en) 1995-03-27 1996-10-03 Philips Electronics N.V. Method of manufacturing an electronic multilayer component
US5712759A (en) * 1995-12-22 1998-01-27 International Business Machines Corporation Sidewall capacitor with L-shaped dielectric
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
KR100326979B1 (ko) * 1996-12-18 2002-05-10 포만 제프리 엘 캐패시터형성방법및그캐패시터구조체
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor

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