JP2001356144A - Electronic part testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part testing device allowing many sorts and capable of automating tray replacement without increasing the outer shape of the testing device. SOLUTION: This electronic part testing device 1 is provided with a tray storage section 200 storing IC mounting trays KST. A multi-classification stocker 500, which has a plurality of tables 501 to be mounted with the trays KST, first moving means 502 and 503 moving the tables to a storage position ST and a discharge position DC, and second moving means 504, 505, 506 moving the trays on the tables moved to the discharge position DC to a prescribed position 406, is arranged in parallel with the tray stocker STK provided on the tray storage section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component testing apparatus for testing various electronic components (hereinafter, also typically referred to as ICs) such as semiconductor integrated circuit devices.

[0002]

2. Description of the Related Art In an electronic component test apparatus called a handler, a large number of ICs stored in a tray are conveyed into a test apparatus, and each IC is brought into electrical contact with a test head. Have the body (tester) perform the test.
When the test is completed, each IC is taken out of the test head and placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

In order to replace the IC after the test with a tray corresponding to the test result, prepare empty trays corresponding to categories such as non-defective products, defective products, and re-inspection, replace the ICs with the empty trays, and fill the trays. When this happens, carry it out and replace it with a new empty tray.

[0004]

By the way, the number of categories to be sorted may exceed the number of classifiable handlers depending on the inspection specifications of IC products. In preparation for such cases, by attaching an external multi-class stocker,
It has been practiced to deal with the classification of IC products in a less frequent category.

However, since the conventional multi-class stocker is an external type, there is a problem that the outer shape of the handler is increased by the size of the stocker. In addition, since the conventional multi-class stocker is provided on the stage for replacing the tested IC product on the tray, interference with the IC transport device that suctions and holds the IC product becomes a problem.
The operating range of the C transport device may be restricted.

Further, since the conventional multi-class stocker is external or retrofitted, it must be controlled independently of the handler. Even if the handler has a tray transport device, the tray of the multi-class stocker can be replaced. Was manual. For this reason, re-inspection of IC products could not be performed automatically.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component testing apparatus capable of performing multi-classification without increasing the outer shape of the testing apparatus and automating tray replacement.

According to a first aspect of the present invention, there is provided an electronic component test apparatus provided with a tray storage unit for storing a tray for mounting an electronic component under test, comprising: a plurality of tables on which trays are mounted; A first moving unit for moving the table to a storage position and a discharging position; and a second moving unit for moving a tray of the table moved to the discharging position to a predetermined position. Provided is an electronic component test apparatus provided with a multi-class stocker attached to a provided tray stocker.

According to a second aspect of the present invention, a plurality of tables on which trays are mounted, first moving means for moving the tables to a storing position and a discharging position, and moving to the discharging position A second moving means for moving the tray of the table to a predetermined position, and a multi-class stocker attached to a tray stocker provided in a tray storage section of the electronic component test apparatus is provided.

The predetermined position in the present invention is not particularly limited, but may be a position where the tested electronic component is replaced on the tray, or a position where the tray is transferred to and from the third moving means.

[0011]

According to the present invention, when an electronic component under test of a category exceeding the number of classified tray stockers in the tray storage section occurs, one of the trays mounted on the table is moved to the discharge position by the first moving means, The tray is moved by a second moving means to a predetermined position such as an electronic component replacement position or a tray transfer position.

When the electronic components of the category have been mounted, the electronic components are returned to the discharge position from the predetermined position by the second moving means, and further returned to the storage position by the first moving means.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a multi-class stocker 50 according to the present invention.
FIG. 2 is a partially cutaway perspective view showing an electronic component testing apparatus in which the reference numeral 0 is incorporated. FIG. Note that FIG. 2 is a diagram for understanding a tray handling method in the electronic component test apparatus according to the present embodiment, and in fact, parts shown in plan view of members arranged vertically are also shown. is there. Therefore, the mechanical (three-dimensional) structure will be described with reference to FIG.

As shown in FIGS. 1 and 2, an electronic component test apparatus 1 of the present embodiment stores a chamber section 100 including a test head and an IC under test to be tested from now on. It is composed of a tray storage unit 200 for sorting and storing, a loader unit 300 for sending ICs to be tested into the chamber unit 100, and an unloader unit 400 for sorting and extracting tested ICs tested in the chamber unit 100. ing.

In the following description, a case is shown in which the multi-class stocker 500 of the present invention is applied to the chamber-type electronic component test apparatus 1, but the multi-class stocker 50 according to the present invention is shown.
0 can be applied to any handler using a tray on which an IC under test is mounted (hereinafter, also referred to as a customer tray KST), and is not limited to the following chamber-type electronic component test apparatus. It can also be applied to a heat plate type.

[0016] the tray storage section 200 tray storage unit 200 includes a pre-test IC stocker 201 for storing the IC before test, post-test IC stores the IC classified according to the result of the test stocker 20
2 are provided. These stockers 201, 20
Reference numeral 2 denotes a “tray stocker” according to the present invention.

Pre-test IC stocker 201 and tested IC
Although not shown in detail, the stocker 202 includes a frame-shaped tray support frame, and an elevator that can enter from a lower portion of the tray support frame and move up and down. The tray support frame includes: A plurality of customer trays KST are stacked and supported.
ST is moved up and down by the elevator.

The pre-test IC stocker 201 includes:
While the customer trays KST in which the ICs to be tested are stored are stacked and held, the customer tray KST in which the ICs to be tested are appropriately classified is stored in the tested IC stocker 202. Laminated and held.

Test IC Stocker 201 and Tested IC
On the upper part of the stocker 202, the IC stocker 201 to be tested and the tested IC stocker 2
A tray transfer arm 205 that moves over the entire range in the array direction of No. 02 is provided. In this example, the IC under test is
Since the windows 306 and 406 of the loader unit 300 and the unloader unit 400 are provided immediately above the stocker 201 and the tested IC stocker 202 (without shifting in the Y-axis direction), the tray transfer arm 205 is also moved in the X-axis and Z-axis directions. It can be moved only to. Incidentally, depending on the positional relationship between the tray storage unit 200 and the loader unit 300 or the unloader unit 400, the tray transfer arm 205 is
It may be movable in all directions of the Y axis and the Z axis.

The tray transfer arm 205 includes a pair of tray storage portions 205a and 205b for holding the customer trays KST side by side (in the X direction), and includes a loader section 300 and an unloader section 400; The customer tray KST is transferred to and from the tested IC stocker 202.

Since the pre-test IC stocker 201 and the tested IC stocker 202 have the same structure, the number of the pre-test IC stocker 201 and the number of the tested IC stocker 202 can be appropriately changed as necessary. Can be set. In the example shown in FIG. 1 and FIG.
01, two stockers STK-B, two empty stockers STK-E to be sent to the unloader section 400, and six stockers STK-1, STK-2 in the tested IC stocker 202. , ‥ ・, STK-6
Are provided so that they can be sorted and stored in a maximum of six categories according to the test results. For example, in addition to good and bad products, among the good products,
It can be classified into medium-speed ones, low-speed ones, and failures that require retesting.

Loader section 300 The above-mentioned customer tray KST is carried to the loader section 300, where the customer tray KST is loaded.
The IC under test loaded in ST is transferred to the test tray TST stopped in the loader unit 300.

From the customer tray KST to the test tray T
As an IC transfer device for transferring the IC under test to ST,
As shown in FIG. 1, two rails 301 provided on the upper portion of the substrate 105, and a movable arm capable of reciprocating in the Y direction between the test tray TST and the customer tray KST by the two rails 301. An XY transfer device 304 including a movable head 302 and a movable head 303 supported by the movable arm 302 and capable of moving in the X direction along the movable arm 302 is used.

The movable head 3 of the XY transfer device 304
03, a suction head is mounted downward, and the suction head moves while sucking air, thereby sucking the IC under test from the customer tray KST, and
Transfer C to the test tray TST. For example, about eight such suction heads are mounted on the movable head 303, and eight ICs to be tested are stored in the test tray T at a time.
Can be transshipped to ST.

Incidentally, in a general customer tray KST, a concave pocket for mounting an IC under test is provided.
Since the shape of the IC under test is relatively larger than the shape of the IC under test, the position of the IC under test stored in the customer tray KST has a large variation. Therefore, in this state, the IC under test is sucked to the suction head,
If you carry it directly to the test tray TST,
It is difficult to accurately drop the IC into the recess formed in the IC housing.

For this reason, in the electronic component test apparatus 1 of this embodiment, an IC position correcting means called a precisor 305 is provided between the installation position of the customer tray KST and the test tray TST. This Precisor 305
Has a relatively deep concave portion, and the peripheral edge of the concave portion is surrounded by an inclined surface. Therefore, when the IC under test sucked by the suction head is dropped into the concave portion, the test object is tested on the inclined surface. The drop position of the IC will be corrected. This allows
The mutual positions of the eight ICs to be tested are accurately determined, and the ICs whose positions have been corrected are sucked again by the suction head and are reloaded on the test tray TST, whereby the test tray TS
The IC under test can be accurately transferred to the IC receiving recess formed in the T.

FIG. 3 is a cross-sectional view taken along the line III-III of FIG. 1, and is a vertical cross-sectional view of the substrate 105, a tray transfer arm 205 described later, and a tray storage unit 200. As shown in the drawing, the customer tray KST carried to the loader unit 300 is placed on the substrate 105 of the loader unit 300.
05, a pair of windows 306 arranged so as to face the upper surface of
306 are established. Each of the windows 306 has a customer tray K transported to the window 306.
A holding hook 306 a for holding the ST is provided, and the customer tray KS is located at a position where the upper surface of the customer tray KST faces the surface of the substrate 105 via the window 306.
T is held.

Also, below each window 306,
An elevating table 307 for elevating and lowering the customer tray KST is provided.
Is loaded with the empty customer tray KST and lowered, and transfers the empty tray to the tray storage section of the tray transfer arm 205.

Chamber section 100 The electronic component test apparatus 1 of this embodiment tests (tests) whether or not the IC operates properly in a state where high or low temperature stress is applied to the IC or in a state where no temperature stress is applied to the IC. This is a device for classifying ICs according to the test results. In an operation test under such a temperature stressed condition, the IC under test is reloaded from a customer tray KST on which a large number of ICs under test are mounted to a test tray TST transported in the electronic component test apparatus 1. Implemented.

The test tray TST is loaded with the ICs to be tested by the loader unit 300 and then sent to the chamber unit 100. Each IC under test is tested in the chamber unit 100 while being mounted on the test tray TST. After the tested ICs are carried out to the unloader section 400, the ICs are replaced on the customer tray KST according to the test results in the unloader section 400. The tested IC is the customer tray KS
The test tray TST that has been emptied after being replaced with T
The test tray transport device 108 allows the loader unit 300
Is returned to the thermostat 101 via the.

The chamber section 100 includes a test tray TST
Temperature chamber 101 for applying a desired high or low temperature stress to the IC under test loaded in the
1. A test chamber 102 in which the IC under test subjected to the thermal stress in step 1 is brought into contact with a test head 104.
And a heat removal tank 103 for removing a given thermal streak from the IC under test tested in the test chamber 102.

In the heat removal tank 103, when a high temperature is applied in the constant temperature bath 101, the IC under test is cooled by blowing air to return it to room temperature, and when a low temperature of approximately -30 ° C. is applied in the constant temperature bath 101, Then, the IC under test is heated with warm air or a heater to return the temperature to a temperature at which dew condensation does not occur. And
The heat-removed IC under test is carried out to the unloader section 400.

[0033] Also in the unloader section 400 unloader section 400, X-Y transport device having the same structure as X-Y conveyor 304 provided in the loader section 300 40
4, 404 are provided, and the XY transfer devices 404, 4 are provided.
At 04, the tested IC under test is transferred from the test tray TST carried out to the unloader section 400 to the customer tray KST.

The substrate 105 and the tray transfer arm 20 shown in FIG.
5 and a vertical sectional view of the tray storage unit 200, the customer tray KST carried to the unloader unit 400 is provided on the substrate 105 of the unloader unit 400.
05, a pair of windows 406 arranged to face the upper surface of
406 are set up. Each of the window portions 406 is provided with a holding hook 406a for holding the customer tray KST carried to the window portion 406.
, The customer tray KST is held at a position facing the surface of the substrate 105. The specific configuration of the holding hook 406a is not particularly limited. For example, the customer tray KST can be mechanically grasped or the customer tray KST can be held by suction means.

In addition, below each window 406,
An elevating table 407 for elevating and lowering the customer tray KST is provided.
Is loaded with the full customer tray KST and lowered, and the full tray is moved to the tray transfer arm 20.
5 to the lower tray storage unit. Note that, instead of the elevating table 407, the customer tray KST can be raised and lowered by the elevator 204 of the stocker STK located immediately below each window 406.

In the electronic component test apparatus 1 of the present embodiment, the test tray TST of the unloader 400 and the window 4
A buffer section 405 is provided between the buffer section 605 and the buffer section 405 to temporarily store an IC under test of a category that rarely occurs.

[0037] In the electronic device testing apparatus 1 of the multi-classification stocker present embodiment, although the maximum sortable category is six, the unloader section 4
The window 406 of 00 has a maximum of four customer trays KST
Can only be deployed. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high-speed response elements, medium-speed response elements, and low-speed response elements, and four categories are added to this, including defective products. There may be categories that do not belong to these categories, such as things.

As described above, the window section 4 of the unloader section 400
When an IC under test classified into a category other than the category assigned to the four customer trays KST arranged at 06 is generated, the unloader unit 400 outputs one IC.
The customer trays KST are returned to the tray storage unit 200, and the test I
Unloader unit 4 stores customer tray KST in which C is to be stored.
00 and store the IC under test. However, if the customer tray KST is replaced during the sorting operation, the sorting operation must be interrupted during that time, which causes a problem that the throughput is reduced. For this reason, tested ICs of a category that rarely occurs are temporarily stored in the buffer unit 405 described above, and the customer tray KST corresponding to the category is transferred to the window unit 406 and transferred at an appropriate timing.

However, the maximum number of categories of the customer tray KST that can be called into the window 406 is six, and it is not possible to set more categories. To cope with such an increase in the number of classifications, a multi-class stocker 500 (STK
-OPT) is provided on the side of the tested IC stocker 202 (STK-6) as shown in FIG.

FIGS. 4 to 6 show the multi-class stocker 500 of this embodiment. The multi-class stocker 500 includes a table 501 on which the customer trays KST are mounted, and stores the respective tables 501 in the storage position ST and the discharge position D.
C, a linear guide 502 and a rodless cylinder 503 for moving the customer tray KST moved to the discharge position DC, and a table 504 for moving up and down.
It has a ball screw 505 and a stepping motor 506.

The table 501 on which the customer tray KST is mounted reciprocates in the ± X direction along the linear guide 502 by the operation of the rodless cylinder 503, and the table 501 is moved up and down so that only the customer tray KST is placed thereon. Are cut out so that the table 504 can pass through. In the multi-class stocker 500 of this example, since the table 501, the linear guide 502, and the rodless cylinder 503 are stacked in five stages, the maximum number of classes (six types) by the tested IC stocker 202 is obtained.
In addition to the above, five types of categories can be supported.

On the other hand, the table 504 is controlled by the operation of the stepping motor 506 so that ± Z
Go up and down in the direction. In this example, it is possible to reciprocate between a position below the customer tray KST mounted on the lowermost table 501 and a transfer position with the tray transfer arm 205 (see FIG. 7A).

Next, the operation will be described. Here, FIG.
To (C), the multi-class stocker 500 (S
TK-OPT) to one window 4 of the unloader section 400
A series of operations from setting the customer tray KST stored in the multi-class stocker 500 to setting the customer tray KST to the original position will be described. In other sequences,
The operation of the multi-class stocker 500 according to the present invention is basically the same and will not be described here. In the following description, it is assumed that the process starts from a state in which the customer tray KST is not set in the window 406.

First, a table 5 in which customer trays KST of categories corresponding to the category of the tested IC are stored.
01 is moved from the storage position ST to the discharge position DC. In the example shown in FIG. 7A, the fourth table 501 is advanced to the discharge position DC. Next, the stepping motor 506
Is operated to raise the table 504 from below the customer tray KST, which has been advanced to the discharge position DC, and transfer the customer tray KST to the table 504. At about the same time, the tray transfer arm 205 is driven in the X-axis direction and stopped immediately above the multi-class stocker 500.

Next, the target customer tray KST
Is moved up to a transfer position with the tray transfer arm 205. The above operation is shown in FIG.
Shown in

After the target customer tray KST has been transferred to one of the tray storage portions 205b of the tray transfer arm 205, the table 504 is slightly lowered, and
The tray transfer arm 205 is moved to the window 4 of the unloader 400.
Move in the X direction to just below 06. Then, the elevating table 407 provided in the window 406 is raised, and the customer tray KST held in the tray storage unit 205b of the tray transfer arm 205 is transferred to the elevating table 407. The above operation is shown in FIG.

When the target customer tray KST is transferred to the elevating table 407, the tray transfer arm 205
Is moved in any of the X-axis directions, and then the lifting table 4
07 is raised, and the customer tray KST is set in the window section 406 of the unloader section 400. The above operation is shown in FIG.
It is shown in (C).

According to the above sequence, the multi-class stocker 500 moves the window 406 of the unloader unit 400
The customer tray KST of the target category is set.

When a tested IC is mounted on the customer tray KST set in the window 406, the above sequence is reversed to execute the customer tray KST.
To the original table 501 of the multi-class stocker 500.

As described above, since the multi-class stocker 500 of this embodiment is provided in the tray storage unit 200,
It is possible to flexibly cope with an increase in categories without restricting the operation range of the XY transport devices 304 and 404. Further, since all the operations of discharging and storing the customer tray KST can be automated, the tray can be replaced at a high speed.

The embodiments described above are described for the purpose of facilitating the understanding of the present invention, but are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, when the customer tray KST is set from the multi-class stocker 500 to the window 406 of the unloader unit 400, the customer tray KST is transferred via the tray transfer arm 205. The electronic component testing device is a tray transfer arm 20
5 does not exist or customer tray KS exists even if it exists
T can be configured to be set directly on the window. FIG. 8 is a diagram showing an example of this case. In this case, a table 504 is provided immediately below the window 406 of the unloader unit 400, the customer tray KST advanced to the discharge position DC is placed on the table 504, and the customer tray KST is lifted as it is. The customer tray KST is set in the window 406. Then, when the tested IC is replaced, the table 504 is lowered as it is, and the customer tray KST is replaced on the table 501 that has been advanced to the discharge position DC.

[0053]

As described above, according to the present invention, since the multi-class stocker is provided alongside the tray stocker in the tray storage section, multi-class can be performed without increasing the outer shape of the test apparatus. In addition, the tray exchange can be automated by the first and second moving means.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention.

FIG. 2 is a conceptual diagram showing a method of routing trays in the electronic component test apparatus shown in FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a perspective view showing an embodiment of a multi-class stocker according to the present invention.

FIG. 5 is a view taken in the direction of the arrow V in FIG. 4;

FIG. 6 is a view taken in the direction of the arrow VI in FIG. 4;

FIG. 7 is a diagram showing an example of the operation of the multi-class stocker according to the present invention.

FIG. 8 is a cross-sectional view showing another embodiment of the multi-class stocker according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 100 ... Chamber part 101 ... Constant temperature chamber 102 ... Test chamber 103 ... Heat removal tank 104 ... Test head 200 ... Tray storage part 201 ... Pre-test IC stocker 202 ... Tested IC stocker 205 ... Tray transfer arm ( Third moving means) 300: loader unit 304: XY transfer device 306: window unit 306a: holding hook 307: elevating table 400: unloader unit 404: XY transfer device 406: window unit 406a: holding hook 407: lifting table 500: multi-class stocker 501: table 502: linear guide (first moving means) 503: rodless cylinder (first moving means) 504: table (second moving means) 505: ball screw (second 506 ... stepping motor (second moving means) ST Storage position DC ... discharge position KST ... customer tray (tray) TST ... test tray

Claims (4)

[Claims] 1. An electronic component test apparatus comprising a tray storage section for storing a tray for mounting an electronic component under test, comprising: a plurality of tables on which trays are mounted; First moving means for moving to
An electronic component test apparatus comprising: a second moving unit for moving a tray of the table moved to the discharge position to a predetermined position; and a multi-class stocker attached to a tray stocker provided in the tray storage unit. . 2. The electronic component test apparatus according to claim 1, wherein the predetermined position is a position where the tested electronic component is replaced on a tray. 3. The apparatus according to claim 1, further comprising: third moving means for moving a tray stored in the tray storing section, wherein the predetermined position is a transfer position of the tray with the third moving means. Electronic parts testing equipment. 4. A plurality of tables on which trays are mounted, first moving means for moving the tables to a storage position and a discharge position, and moving the trays of the tables moved to the discharge positions to predetermined positions. A multi-class stocker that has a second moving means and is provided alongside a tray stocker provided in a tray storage section of the electronic component test apparatus.