JP2001351802A - Electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic parts in which the variations of electrical characteristics are reduced by making the applied width of electrode paste which becomes side-face electrode sections uniform and the occurrence of short circuits between adjacent electrodes due to the electrode paste spread over the electrodes is prevented when the parts in a multiple resistor, etc. SOLUTION: The electronic parts are formed in such a way that electrode sections are arranged on an assembled insulating substrate having first and second dividing grooves cut into the substrate and a resistor and/or a dielectric material is arranged between the electrode sections, and then, the side-face electrode sections are arranged by applying the electrode paste to the side edge sections of bar-like substrates formed by dividing the insulating substrate along the first dividing grooves in the lengthwise direction and dividing the bar-like substrates along the second dividing grooves. Side- face electrode width control means which control the applied width of the electrode paste applied to the side edge sections of the bar-like substrates in the lengthwise direction are arranged on the bar-like substrates. In addition, the side-face electrode width control means are arranged in nearly parallel with the first dividing groves and the means are formed in the forms of step walls, projected line walls, or recessed line grooves.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly to an electronic component manufactured in a state of a collective insulating substrate in which a dividing groove is engraved, and finally divided by the dividing groove into a single unit. It is an electronic component that can accurately manufacture the electrode portion of the component.

[0002]

2. Description of the Related Art Conventionally, electronic components such as chip resistors and chip capacitors are provided with resistors and dielectrics in a state of a collective insulating substrate in which division grooves are formed in a lattice shape, and thereafter, are provided in the division grooves. A rod-shaped substrate is obtained by dividing the substrate along the line, as disclosed in JP-A-8-213222 and JP-A-8-213223.
By an electrode coating device as described in
An electrode paste is applied to a side surface portion of the rod-shaped substrate in the longitudinal direction to form a side electrode portion.

In the same electrode coating apparatus, as shown in FIG.
The rod-shaped substrate 1 is turned by a rod-shaped substrate holding jig 200 having a substantially U-shape in plan view with the longitudinal side surface of the rod-shaped substrate 100 facing downward.
00 and fix it, from below the rod-shaped substrate holding jig 200,
The paste film surface 300 on which the electrode paste is applied to a required thickness on the upper surface is raised, and the paste film surface 300 is applied by abutting the side surface of the rod-shaped substrate 100 in the longitudinal direction.

[0004]

However, in the above-mentioned coating method, the immersion width on the paste film surface becomes the application width of the electrode paste. However, the thickness variation of the paste film surface, the surface tension of the electrode paste, etc. Due to the various factors described above, the application width T of the electrode paste 400 is not uniform as shown in FIG. 7A, and a product having a different side electrode portion for each electronic component is completed. This causes large variations in electrical characteristics.

In the case of a multiple chip resistor or the like as shown in FIG. 7B, the width T of the electrode paste 400 applied is not constant, and the width of the electrode paste 400 is increased. There is a problem that the electrode paste 400 straddles between the electrodes, which causes a short circuit.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a plurality of mutually parallel first divided grooves.
Disposing an electrode portion on a collective insulating substrate in which a plurality of parallel second division grooves orthogonal to the first division groove are engraved, and disposing a resistor and / or a dielectric between the electrode portions; An electrode paste is applied to a longitudinal side edge portion of a rod-shaped substrate formed by dividing along the first dividing groove, and a side electrode portion is provided.
An electronic component formed by being divided along the second dividing groove, wherein a side electrode width regulating means is provided on the rod-shaped substrate, and an application width of an electrode paste applied to a longitudinal side edge of the rod-shaped substrate is reduced. It is intended to provide an electronic component characterized by regulation.

In particular, the invention is characterized in that the side electrode width regulating means is disposed substantially in parallel with the first dividing groove. Further, the side electrode width regulating means has a step wall or
It is also characterized in that it is a ridge wall or a concave groove.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In an electronic component of the present invention, a rod-shaped substrate formed by dividing a collective insulating substrate is provided on a longitudinal side edge thereof.
In order to uniformly apply the electrode paste and dispose the side electrode portion, a side electrode width regulating means is disposed on the rod-shaped substrate, and the width of the electrode paste applied to the longitudinal side edge of the rod-shaped substrate is applied. Is regulated.

In particular, the side surface electrode width regulating means is disposed substantially in parallel with the first dividing groove, and the side surface electrode width regulating means is further provided by a step wall, a projecting wall, or a concave groove. Has formed.

Hereinafter, a detailed description will be given based on embodiments with reference to the drawings. In the following, the case of a multiple chip resistor will be described. However, the present invention is not limited to the multiple chip resistor, but a chip resistor in which one resistor or dielectric is disposed on one chip substrate or Side electrodes are provided on the division surface that appears along the division grooves, such as chip capacitors, further, multiple chip capacitors, and network electronic components in which resistors and dielectrics are arranged on one chip substrate. The present invention can be applied to any electronic component to be formed.

Further, in the following description of the embodiments, a plurality of embodiments will be described. However, the same reference numerals are used for the same components, and the description of the same contents as those of the first embodiment is omitted. .

[0012]

FIG. 1 is an explanatory view for explaining a manufacturing process of a chip resistor A1 according to a first embodiment.

As shown in FIG. 1A, the chip resistor A1 includes a plurality of first divided grooves 2 parallel to each other and a plurality of parallel second divided grooves perpendicular to the first divided grooves 2. 3 is manufactured in the state of a collective insulating substrate 4a made of ceramics engraved. Each rectangular body of ceramics divided by the first divided groove 2 and the second divided groove 3 is referred to as a chip substrate 1. In this embodiment, ceramics is used as the insulating substrate. However, the present invention is not limited to ceramics, and other insulating materials may be used.

In this embodiment, the chip resistor A1 to be manufactured is a multiple chip resistor in which a plurality of resistors 5 are arranged on one chip, so that each of the adjacent resistor 5 In order to provide the notch 6 in the portion between the electrodes, a through-hole 6 'is previously formed at a required position.

Further, in this embodiment, a step forming groove 8 is formed in advance on the both surfaces of the collective insulating substrate 4a along the first dividing groove 2 in order to form a step wall 7 serving as a side surface electrode width regulating means. . Therefore, as described later, by dividing the collective insulating substrate 4a along the first division groove 2, the first division groove 2
The step wall 7 can be substantially parallel to the step wall 7.

The step-forming groove 8 may be formed by carving the step-forming groove 8 in the collective insulating substrate 4a along the first division groove 2, or may correspond to the first division groove 2. Alternatively, the ceramic sheet may be formed by laminating a ceramic sheet having a punched portion on the collective insulating substrate 4a. In this embodiment,
A step forming groove 8 is formed by pressing the collective insulating substrate 4a before firing with a mold, and the first dividing groove 2 and the second dividing groove 3 are engraved.
Is formed on the collective insulating substrate 4a.

As shown in FIG. 1B, an electrode paste to be the upper electrode 9 is printed on the insulating substrate 4a.
Also, after printing and firing an electrode paste to be the lower electrode 10 on the back surface of the collective insulating substrate 4a, a resistor paste to be the resistor 5 is printed and fired between the upper electrodes 9 to form the resistor 5. I do. After that, after printing and baking a glass paste to be the protective glass layer 11 covering the resistor 5, the resistance is adjusted by trimming the resistor 5 with a laser or the like. Reference numeral 12 in the figure denotes a trimming groove formed by trimming.

After adjusting the resistance value, a glass paste to be an intermediate glass layer 13 (see FIG. 1E) is printed to refill the trimming groove 12, and a coating glass layer 14 is further coated so as to cover the intermediate glass layer 13. The resistor 5 is sealed by printing and baking a glass paste to be used (FIG. 1C).

After sealing the resistor 5 with the intermediate glass layer 13 and the covering glass layer 14, the collective insulating substrate is formed along the first dividing groove 2.
4a is divided into rod-shaped substrates 15a as shown in FIG. As described above, the step wall 7 is formed on both sides of the rod-shaped substrate 15a along with the formation of the step forming groove 8.

An electrode paste is applied to both sides of the rod-shaped substrate 15a by the electrode coating apparatus described in the section of the prior art and fired to electrically connect the upper electrode 9 and the lower electrode 10 as side electrodes 16. I try to connect.

In the application of the electrode paste to be the side electrodes 16, the spreading width of the electrode paste can be regulated by the step walls 7 by preventing the electrode paste from being extended by the step walls 7. The size can be evenly distributed. Therefore, variation in electrical characteristics can be suppressed, and in a multiple electronic component, occurrence of a short circuit between adjacent electrodes can be prevented.

After the formation of the side electrodes 16, the rod-shaped substrate 15a is
The outer connection terminals 17 are formed by dividing the upper electrode 9, the lower electrode 10, and the side surface electrodes 16 by nickel plating and solder plating by dividing along the dividing grooves 3. Thereby, the chip resistor A1 is completed.

As another embodiment of the method of forming the step wall 7,
As shown in FIG. 2A, a collective insulating substrate 4a having a plurality of mutually parallel first divided grooves 2 and a plurality of mutually parallel second divided grooves 3 orthogonal to the first divided grooves 2. '
The same set insulating substrate 4 in which the step forming groove 8 is not formed.
There is a method using a '. A through-hole 6 'is also formed in the collective insulating substrate 4a'.

As shown in FIG. 2 (b), after forming an upper electrode 9 and a lower electrode 10 on the collective insulating substrate 4a ', a resistor 5 is formed between the upper electrodes 9 and 9, and then the resistor 5 is formed. Body 5
Is covered with a protective glass layer 11 and trimmed with a laser or the like to adjust the resistance while engraving the trimming groove 12.

After adjusting the resistance value, a glass paste to be an intermediate glass layer 13 (see FIG. 2E) is printed to fill back the trimming groove 12, and a coating glass layer 14 is further coated so as to cover the intermediate glass layer 13. Print the glass paste
The resistor 5 is sealed by firing (FIG. 2)
(C)).

At this time, the coating glass layer 14 ′ not only covers the resistor 5 but also extends to the upper surface of the base end portion of the electrode terminal projection 20 which is formed by forming the through hole 6 ′. A glass paste is printed so as to cover, and in particular, a side edge portion is printed so as to be substantially parallel to the first dividing groove 2 and baked, so that the step walls 7 ′ and 7 ′ are formed by the covering glass layer 14 ′. Has formed.

Further, on the back side of the collective insulating substrate 4a ',
Although there is no resistor 5, a glass paste is printed using the same printing pattern as the coating glass layer 14 ′ and baked, thereby forming the step walls 7 ′ and 7 ′ by the coating glass layer 14 ′.

The step wall 7 ′ is formed not only by the covering glass layer 14 ′, but also when the protective glass layer 11 or the intermediate glass layer 13 is formed.
13 may be formed. Alternatively, protective glass layer 1
1, it may be formed in all of the intermediate glass layer 13 and the coating glass layer 14 '.

Thereafter, the collective insulating substrate 4a 'is
And the rod-shaped substrate 15a 'as shown in FIG.
And An electrode paste is applied to both sides of the rod-shaped substrate 15a 'by the electrode coating device described in the section of the related art, and the electrode paste is baked to form the side electrode 16, and the upper electrode 9 and the lower electrode 10 are electrically connected. .

As shown in FIG. 2 (e), when the electrode paste for forming the side electrode 16 is applied, the extension of the electrode paste is prevented by the stepped wall 7 'so that the width of the electrode paste to be applied is reduced. Can be regulated by 7 '
The size of the electrode portion can be made uniform. Therefore, variation in electrical characteristics can be suppressed, and in a multiple electronic component, occurrence of a short circuit between adjacent electrodes can be prevented.

<Second embodiment (when side electrode width regulating means is a ridge wall)> FIG. 3 is an explanatory view for explaining a manufacturing process of a chip resistor A2 of a second embodiment.

As shown in FIG. 3A, the chip resistor A2 also has a plurality of mutually parallel first divided grooves 2 and a plurality of mutually parallel second divided grooves orthogonal to the first divided grooves 2. 3 is manufactured in the state of the collective insulating substrate 4b engraved with the above.

In this embodiment, the chip resistor A2
However, since it is a multiple chip resistor in which a plurality of resistors 5 are arranged on a single chip, it is necessary to penetrate the resistor 5 in advance to a required position in order to provide a cutout 6 between the electrodes of the adjacent resistors 5. Hole
6 '.

Further, in this embodiment, the ridge walls 18, 18 serving as the side surface electrode width regulating means are previously provided on both surfaces of the collective insulating substrate 4b in parallel with the first dividing groove 2, so that both surfaces of the chip substrate 1 are formed. Protrusions 18 are formed on both left and right sides. The ridge walls 18, 18 may be formed by printing and firing glass paste, or may be formed by arranging and sintering a linearly formed ceramic sheet at a required position. Is also good. Alternatively, it may be formed by simply printing a heat-resistant resin.

As shown in FIG. 3 (b), after forming an upper electrode 9 and a lower electrode 10 on the same insulating substrate 4b, a resistor 5 is formed between the upper electrodes 9, 9. Body 5
Is covered with a protective glass layer 11 and trimmed with a laser or the like to adjust the resistance while engraving the trimming groove 12.

After adjusting the resistance value, a glass paste for forming the intermediate glass layer 13 (see FIG. 3E) is printed so as to fill the trimming groove 12, and the coated glass layer 14 is further coated so as to cover the intermediate glass layer 13. The resistor 5 is sealed by printing and baking a glass paste to be used (see FIG. 3).
(C)).

After sealing the resistor 5 with the intermediate glass layer 13 and the covering glass layer 14, the collective insulating substrate is formed along the first dividing groove 2.
4b is divided into rod-shaped substrates 15b as shown in FIG. As described above, the ridge walls 18 are formed on both sides of both sides of the rod-shaped substrate 15b.

An electrode paste is applied to both side portions of the rod-shaped substrate 15b by the electrode coating apparatus described in the section of the prior art, and the electrode paste is baked to form the side electrode 16, and the upper electrode 9 and the lower electrode 10 are electrically connected. To connect to.

In the application of the electrode paste for forming the side electrodes 16, the width of the electrode paste to be applied can be regulated by the protrusions 18 by preventing the electrode paste from being extended by the protrusions 18. The size of the parts can be made uniform. Therefore, variation in electrical characteristics can be suppressed, and in a multiple electronic component, occurrence of a short circuit between adjacent electrodes can be prevented.

As another embodiment of the method of forming the ridge wall 18,
As shown in FIG. 4A, a collective insulating substrate 4b engraved with a plurality of mutually parallel first divided grooves 2 and a plurality of mutually parallel second divided grooves 3 which are orthogonal to the first divided grooves 2. '
The same set insulating substrate 4b 'in which the ridge wall 18 has not been formed in advance.
There is a method of using the method. A through hole 6 'is also formed in the collective insulating substrate 4b'.

As shown in FIG. 4 (b), after forming the upper electrode 9 and the lower electrode 10 on the collective insulating substrate 4b ', the resistor 5 is formed between the upper electrodes 9, 9, and then the resistor 5 is formed. Body 5
Is covered with a protective glass layer 11 and trimmed with a laser or the like to adjust the resistance while engraving the trimming groove 12.

After adjusting the resistance value, a glass paste to be an intermediate glass layer 13 (see FIG. 4E) is printed to refill the trimming groove 12, and a coating glass layer 14 is further coated so as to cover the intermediate glass layer 13. The resistor 5 is sealed by printing and baking a glass paste to be used (FIG. 4).
(C)).

At this time, at the same time as the printing of the glass paste to be the coating glass layer 14, the upper electrode 9 is traversed by the electrode terminal projections 20 which have been formed by forming the through holes 6 '. The glass paste is printed in a linear shape so as to be substantially parallel to the first dividing groove 2 and then fired to form a ridge wall.
18 'is formed.

Further, on the back side of the collective insulating substrate 4b ',
A glass paste is printed linearly on the electrode terminal protrusions 20 and fired to form the protrusions 18 '.
The ridge wall 18 ′ may be formed not at the time of forming the cover glass layer 14 but at the time of forming the protective glass layer 11 or the intermediate glass layer 13. Instead of using a glass paste, a resin having heat resistance may be used.

Thereafter, the collective insulating substrate 4b 'is
And the rod-like substrate 15b 'as shown in FIG.
And An electrode paste is applied to both sides of the rod-shaped substrate 15b 'by the electrode coating device described in the section of the related art, and the electrode paste is baked to form the side electrode 16, and the upper electrode 9 and the lower electrode 10 are electrically connected. .

In the application of the electrode paste to be the side electrode 16, as shown in FIG. 4E, the width of the electrode paste is reduced by the same step by preventing the extension of the electrode paste by the ridge wall 18 '. It can be regulated by the wall 7 ', and the size of the electrode portions can be made uniform. Therefore, variation in electrical characteristics can be suppressed, and in a multiple electronic component, occurrence of a short circuit between adjacent electrodes can be prevented.

<Third embodiment (when the side surface electrode width regulating means is a concave groove)> FIG. 5 is an explanatory view for explaining a manufacturing process of the chip resistor A3 of the third embodiment.

As shown in FIG. 5A, the chip resistor A3 also includes a plurality of first division grooves 2 parallel to each other and a plurality of parallel second division grooves orthogonal to the first division grooves 2. 3 is manufactured in the state of the collective insulating substrate 4c engraved.

In this embodiment, the chip resistor A3
However, since it is a multiple chip resistor in which a plurality of resistors 5 are arranged on a single chip, it is necessary to penetrate the resistor 5 in advance to a required position in order to provide a cutout 6 between the electrodes of the adjacent resistors 5. Hole
6 '.

Further, in this embodiment, the concave grooves 19, 19 serving as the side surface electrode width regulating means are formed in advance on both surfaces of the collective insulating substrate 4c in parallel with the first division groove 2. The formation of the concave grooves 19, 19 may be performed by using, for example, a laser used for trimming, or may be formed by laminating a ceramic sheet obtained by punching a portion corresponding to the concave grooves 19, 19. . Alternatively, a glass paste is printed on portions other than the concave grooves 19, 19, and baked, so that the concave grooves 19, 19,
It may be formed by raising portions other than 19. In this embodiment, the concave insulating grooves 19, 19 are formed by pressing the collective insulating substrate 4c before firing with a mold, the first dividing groove 2 and the second dividing groove 3 are engraved, and then fired. The collective insulating substrate 4c in which the concave grooves 19, 19 are formed.

As shown in FIG. 5B, an upper electrode 9 and a lower electrode 10 are formed on the collective insulating substrate 4c, and a resistor 5 is formed between the upper electrodes 9 and 9, and then the resistor 5 is formed. The body 5 is covered with a protective glass layer 11 and trimmed with a laser or the like to adjust the resistance value while engraving a trimming groove 12.

After adjusting the resistance value, a glass paste to be the intermediate glass layer 13 (see FIG. 5E) is printed to fill back the trimming groove 12, and the coated glass layer 14 is further coated so as to cover the intermediate glass layer 13. The resistor 5 is sealed by printing and baking a glass paste (see FIG. 5).
(C)).

After the resistor 5 is sealed by the intermediate glass layer 13 and the covering glass layer 14, the collective insulating substrate is formed along the first dividing groove 2.
4c is divided into rod-shaped substrates 15c as shown in FIG. As described above, the concave grooves 19 are formed on both sides of both sides of the rod-shaped substrate 15c.

An electrode paste is applied to both sides of the rod-shaped substrate 15c by the electrode coating apparatus described in the section of the prior art, and the electrode paste is baked to form the side electrodes 16 and the upper electrode 9
And the lower electrode 10 are electrically connected.

In the application of the electrode paste for forming the side electrodes 16, the extension of the electrode paste can be received by the concave grooves 19, so that the application width of the electrode paste can be regulated by the concave grooves 19. The size of the parts can be made uniform. Therefore, variation in electrical characteristics can be suppressed, and in a multiple electronic component,
The occurrence of a short circuit between the adjacent electrodes can be prevented.

In the above description of the embodiment, the protective glass layer 11, the intermediate glass layer 13, and the coating glass layers 14, 14 'are all formed by sintering a glass paste. May be used to seal the resistor 5.

[0057]

According to the present invention, the width of the electrode paste applied to the longitudinal side edge of the rod-shaped substrate is regulated by the side-surface electrode width regulating means, so that the electrode portions are made uniform in size. In a multiple electronic component, occurrence of a short circuit between adjacent electrode portions can be prevented.

In particular, by disposing the side surface electrode width regulating means substantially in parallel with the first dividing groove, the application width of the electrode paste can be made substantially constant in all the electrode portions. The size of the external electrode portion formed by plating can be made uniform, and variations in electrical characteristics of each electronic component can be suppressed.

In addition, the width of the electrode paste can be reliably regulated with a relatively simple structure by using the side wall electrode width regulating means as a step wall, a ridge wall, or a concave groove. it can.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a manufacturing process of a chip resistor according to a first embodiment.

FIG. 2 is an explanatory view illustrating a manufacturing process of a chip resistor according to another embodiment.

FIG. 3 is an explanatory diagram for explaining a manufacturing process of the chip resistor of the second embodiment.

FIG. 4 is an explanatory view illustrating a manufacturing process of a chip resistor according to another embodiment.

FIG. 5 is an explanatory diagram for explaining a manufacturing process of the chip resistor of the third embodiment.

FIG. 6 is an explanatory diagram of a method of applying an electrode paste to a side surface of a rod-shaped substrate.

FIG. 7 is an explanatory view showing a state in which an electrode paste is applied to the side surface of a rod-shaped substrate by a conventional electrode paste application method.

[Explanation of symbols]

 A1, A2, A3 Chip resistor 1 Chip substrate 2 First division groove 3 Second division groove 5 Resistor 6 Notch 6 'Through hole 7, 7' Step wall 8 Step formation groove 9 Upper electrode 10 Lower electrode 11 Protection Glass layer 12 Trimming groove 13 Intermediate glass layer 14, 14 'Coating glass layer 16 Side electrode 18, 18' Ridge wall 19 Concave groove 15c Rod-shaped substrate 4a, 4a ', 4b, 4b', 4c Collective insulating substrate 15a, 15a ' , 15b, 15b ', 15c Rod-shaped substrate

Claims (5)

[Claims] An electrode portion is provided on a collective insulating substrate in which a plurality of mutually parallel first divided grooves and a plurality of mutually parallel second divided grooves orthogonal to the first divided groove are provided. A resistor and / or a dielectric is provided between the electrode portions, and an electrode paste is applied to a longitudinal side edge portion of the rod-shaped substrate formed by dividing along the first dividing groove to provide a side electrode portion. And the second
An electronic component formed by being divided along a dividing groove, wherein a side electrode width regulating means is provided on the rod-shaped substrate to regulate a width of an electrode paste applied to a longitudinal side edge of the rod-shaped substrate. An electronic component characterized by the following. 2. The electronic component according to claim 1, wherein said side surface electrode width regulating means is disposed substantially parallel to said first dividing groove. 3. The electronic component according to claim 2, wherein said side surface electrode width regulating means is a step wall. 4. The electronic component according to claim 2, wherein said side electrode width regulating means is a ridge wall. 5. The electronic component according to claim 2, wherein said side surface electrode width regulating means is a concave groove.