JP2002208506A - Shape of through-hole of multiple electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the shape of a through-hole which is provided to a multiple electronic part and capable of preventing side electrode paste from oozing out into the through-hole between terminal electrodes to cause a short-circuit between the adjacent terminal electrodes when side electrode paste is applied to serve as a side electrode in a manufacturing process. SOLUTION: A plurality of terminal electrodes 14 are formed in a line on the opposed side edges of an insulating board, and a recessed through-hole 3' is provided between the adjacent terminal electrodes 14 to form a cutout by which the terminal electrodes 14 are made to get protuberant for the formation of a multiple electronic part. The through-hole 3' is formed into an inverted trapezoid for getting the terminal electrode 14 protuberant, a sloping wall 16 is provided to each side of the terminal electrode 14, and the terminal electrode 14 is made to get gradually thick toward its tip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a through-hole shape of a multiple electronic component.

[0002]

2. Description of the Related Art Conventionally, there have been multiple electronic parts manufactured by screen-printing and firing a resistor paste or dielectric glass containing ruthenium or the like in a plurality of strips on a ceramic substrate which is an insulating substrate. I do.

[0003] Among these multiple electronic components, for example, multiple resistors are usually manufactured as follows. First, a plurality of first divided grooves parallel to each other and second parallel divided grooves orthogonal to the first divided grooves are engraved on a ceramic green sheet to be a large rectangular ceramic substrate. A plurality of substantially circular through holes are formed at predetermined intervals on the first divided groove, and the ceramic green sheet is fired.
A large-sized ceramic substrate in which chip substrates are assembled is formed.

[0004] Next, an upper electrode paste is printed over the first dividing groove provided on the large-sized ceramic substrate and between adjacent through holes, and the back surface of the large-sized ceramic substrate corresponding to the printing position of the upper electrode paste is printed. The lower electrode paste is printed and fired on the upper electrode,
A lower electrode is formed. A resistor is formed by printing and baking a resistor paste between opposing upper electrodes on a substrate serving as one chip substrate, and coating the resistor with a glass layer. The body's resistance is adjusted.

After adjusting the resistance value, further providing a glass layer to completely hermetically seal the resistor, and then dividing the large-sized ceramic substrate along the first dividing groove, a rod-like shape in which the chip substrates are connected in one direction. It is used as a substrate. Then, a side electrode paste is applied to the side edges of the rod-shaped substrate and baked, whereby the upper electrode and the lower electrode can be electrically connected by the side electrodes.
The upper electrode, the lower electrode, and the side electrode form a terminal electrode portion of a multiple resistor.

[0006] In particular, adjacent terminal electrode portions on one side edge of one multiple resistor are connected between the terminal electrode portions by the first terminal electrode portion.
Along with the division of the large-sized ceramic substrate along the dividing groove, a concave through hole that has become substantially semicircular is provided, so that the projecting state is obtained. It is made to be an electrode part.

After firing the side electrodes, the rod-shaped substrate is divided along the second dividing groove to divide the chip substrate into chips, and the upper terminal electrode portion is subjected to nickel plating and solder plating in a plating step, thereby providing a multiple resistance. I try to complete my body.

[0008] As described above, in a multiple electronic component, generally, a semi-circular through-hole is provided between a plurality of terminal electrode portions provided on one side edge, so that the side electrode paste is applied. The terminal electrode portion is formed easily.

[0009]

However, in the multiple electronic component in which the terminal electrode portion is formed by applying the side electrode paste as described above, the step of applying the side electrode paste applied in the state of the rod-shaped substrate is performed. In this method, it is difficult to uniformly adjust the amount of the side electrode paste to be applied, and in order to prevent the occurrence of unapplied portions, the side electrode paste is applied in a slightly larger amount.

At this time, the excess side electrode paste easily spreads along the surface of the substantially semicircular through-hole, and in some cases, the side electrode pastes of the adjacent terminal electrode portions come into contact with each other in the through hole. However, there is a problem that an electrical short circuit is caused by baking the same-side electrode paste in that state.

[0011]

In order to solve the above-mentioned problems, according to the present invention, a plurality of terminal electrode portions are formed in a row on each of opposite side edges of an insulating substrate. In a multiple electronic component that is notched by providing a concave through hole between the electrode parts and the terminal electrode part is protruding, both sides of the terminal electrode part that is protruded by forming the through hole in an inverted trapezoidal shape An inclined wall was formed, and the terminal electrode portion was tapered toward the tip.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION A multiple electronic component according to the present invention comprises a plurality of terminal electrode portions provided in a row on opposite side edges of an insulating substrate serving as a base of the multiple electronic component. An inverted trapezoidal through hole is provided.

By forming inverted trapezoidal through holes, inclined walls are formed on both sides of the terminal electrode portion.
The terminal electrode portion is made to protrude in a tapered shape toward the tip.

In particular, since the inclined walls are formed on both sides of the terminal electrode portion, the side electrode paste applied to the terminal electrode portion in the step of applying the side electrode paste extends along the inclined wall. In addition, since the extension distance can be increased, the holding amount of the side electrode paste on the inclined wall portion can be increased, and even if the side electrode paste is extended along the inclined wall, the adjacent terminal electrodes can be extended. There is no risk of contact between the side electrode pastes between the parts, and the occurrence of an electrical short after firing can be prevented.

Further, since the bottom wall of the through hole and the inclined wall intersect at an acute angle, the intersection between the bottom wall and the inclined wall becomes a liquid pool, and the side electrode paste reaches the intersection. Cause strong surface tension,
Further extension of the side electrode paste can be suppressed by the surface tension, and contact of the side electrode paste between adjacent terminal electrode portions can be prevented.

Further, the terminal electrode portion is formed as an inverted trapezoidal through hole so as to protrude in a tapered shape toward the tip, so that the lateral width of the tip of the terminal electrode portion is increased as compared with the conventional through hole shape. Therefore, the area of contact with the connection portion of the mounting board on which the multiple electronic components are provided can be increased, and the mounting on the mounting board can be performed more firmly.

Further, in order to cope with a case where the applied amount of the side electrode paste is extremely large, an extension preventing projection is provided on the bottom wall of the through hole to further extend the side electrode paste extending along the inclined wall. The extension may be stopped by the extension prevention protrusion, so that contact between the side surface electrode pastes between adjacent terminal electrode portions may be prevented.

[0018] Alternatively, by forming a blocking groove along the inclined wall in the bottom wall of the through hole, the side surface electrode paste extending along the inclined wall is received by the blocking groove, and further the electrode paste is received. By suppressing extension, contact between the side electrode pastes between adjacent terminal electrode portions may be prevented.

An embodiment will be described below with reference to the drawings. Although the present embodiment is an embodiment in a multiple resistor,
The present invention is not limited to the multiple resistors, and the same configuration can be applied to various multiple electronic components such as multiple capacitors and multiple network electronic components.

[0020]

FIG. 1 is a process explanatory view showing a manufacturing process of a multiple resistor according to the present embodiment. First, a lattice-shaped division groove is provided by engraving a plurality of first division grooves 1 parallel to each other and a second division groove 2 parallel to each other orthogonal to the first division groove 1 in a ceramic green sheet. Further, a plurality of through holes 3 are formed along the first division groove 1.

That is, by providing the through holes 3 between the portions to be the terminal electrode portions 14 of the multiple resistor, the terminal electrode portions 14 can be made to have a relatively protruding shape (FIG. 3). In particular, in this embodiment, the through hole 3 has a deformed hexagonal shape in which the central portion is depressed inward. That is, the two grooves 1 substantially parallel to the first division groove 1
In a substantially rectangular shape formed by a set of sides and a pair of sides substantially orthogonal to the first division groove 1, each of the first division grooves 1 on two sides orthogonal to the first division groove 1 Are protruded inward in the rectangular shape to form a deformed hexagonal shape. In other words, two trapezoids of the same shape have a deformed hexagonal shape in which the central part formed by abutting the short sides of each other is depressed inward, and the short sides of the two trapezoids are exactly It is provided so as to be located on one division groove 1.

The first divided groove 1 and the second divided groove 2 are engraved, and the ceramic green sheet provided with the through holes 3 is fired to form a large-sized ceramic substrate 4 (FIG. 1A). )).

Next, an upper electrode paste is printed and fired on the upper surface of the large ceramic substrate 4 to form an upper electrode 5. In this embodiment, two resistors are provided for one multiple resistor. Therefore, the upper electrode 5 is provided so as to sandwich the through hole 3 and is provided so as to straddle the first dividing groove 1 (FIG. 1B). Although not shown here, a lower electrode 6 (see FIG. 2) is provided at a position corresponding to the position of the upper electrode 5 on the back surface side of the large-sized ceramic substrate 4.

Next, a resistor 7 is provided between the upper electrodes 5 by printing and firing a resistor paste (FIG. 1).
(C)). Then, a glass paste is printed and fired on the upper surface of the resistor 7 to form a protective glass layer 8 (FIG. 1D).
The resistance value of the resistor 7 is adjusted by laser trimming (FIG. 1E). Reference numeral 9 denotes a trimming groove formed by laser trimming.

Thereafter, a glass paste is printed and fired to form a first sealing glass layer 10 so as to fill back the trimming grooves 9 formed in the resistor 7 (FIG. 1F). The second sealing glass layer 11 is formed by printing and baking a glass paste on the substrate 7 to completely hermetically seal the resistor 7 (FIG. 1 (g)).

Thereafter, the large-sized ceramic substrate 4 is
By dividing along the dividing groove 1, as shown in FIG. 2, a rod-shaped substrate 12 in which multiple resistors are arranged in one direction is formed.

When dividing the large-sized ceramic substrate 4 into the rod-shaped substrates 12, the through holes 3 provided along the first division grooves 1 are connected to the short sides of two trapezoids having the same shape as described above. By forming a deformed hexagonal shape formed by abutting each other while being positioned on the first divisional groove 1, the first divisional groove 1 protrudes in a mountain shape inward of the through hole 3, and The first dividing groove 1 can be located at a position where the mountain-shaped projecting portion is divided into two parts, and stress can be easily concentrated on the mountain-shaped projecting portion at the time of division. The ceramic substrate 4 can be easily divided.

After being divided into the rod-shaped substrates 12, side electrode pastes 13 are respectively applied to both side edges of the rod-shaped substrates 12 newly exposed by the division (FIG. 1 (h)). Then, by sintering the side electrode paste 13 to form side electrodes,
The upper electrode 5 and the lower electrode 6 are electrically connected by the same side surface electrode to form the terminal electrode portion 14.

As shown in FIG. 3, a reverse wall composed of a bottom wall 15 and two inclined walls 16, 16 formed based on the formation of the deformed hexagonal through hole 3 is provided between the terminal electrode portions 14, 14. A trapezoidal through hole 3 ′ is provided in a notched state, and the terminal electrode portion 14 is tapered toward the tip by an inclined wall 16.

When the side electrode paste 13 is applied to the side edge of such a rod-shaped substrate 12, the applied side electrode paste 13 is applied.
Some of them extend into the through hole 3 ′ along the inclined wall 16, but by extending the side surface of the terminal electrode portion 14 with the inclined wall 16, the distance that the side electrode paste 13 can extend can be increased. Therefore, the holding capacity of the side electrode paste 13 in the inclined wall 16 can be increased. Therefore, if the extension of the side electrode paste 13 to some extent, the extension can be suppressed by the inclined wall 16, there is no possibility of causing contact between the side electrode paste 13 between adjacent terminal electrode portions 14, The occurrence of an electrical short after firing can be prevented.

If the side-surface electrode paste 13 is further extended, the bottom wall 15 and the inclined wall 16 forming the through hole 3 'have a sharply intersecting state as shown in FIG. Since the intersection 17 is formed, the side electrode paste 13 extending to the intersection 17 accumulates, and a strong surface tension is generated in the accumulated side electrode paste 13. Further elongation of the paste 13 can be suppressed. Therefore, contact between the side surface electrode pastes 13 between the adjacent terminal electrode portions 14 does not occur, and occurrence of an electrical short after firing can be prevented.

In order to more reliably prevent the side electrode paste 13 from spreading, as shown in FIG.
An extension preventing projection 18 is provided so as to protrude from a substantially central portion of 15, so that the side surface electrode paste 13 extending along the bottom wall 15 can be pressed down by the extension preventing projection 18. By providing the extension preventing projections 18, the extension of the side electrode paste 13 beyond the extension preventing projections 18 can be reliably prevented, and the contact between the side electrode pastes 13 between the adjacent terminal electrode portions 14 can be achieved. And the occurrence of an electrical short after firing can be prevented.

Alternatively, as shown in FIG. 4 (b), at the intersection 17 between the bottom wall 15 and the inclined wall 16, a dam groove 19 is formed along the inclined wall 16 so as to be recessed. The side electrode paste 13 extending along the inclined wall 16 can be received at, and further extension of the side electrode paste 13 can be suppressed. Therefore, there is no possibility of causing contact between the side surface electrode pastes 13 between the adjacent terminal electrode portions 14,
The occurrence of an electrical short after firing can be prevented.

As described above, the extension of the side-surface electrode paste 13 is prevented, and the side-surface electrode paste 13 is baked to form the terminal electrode portion 14. Thereafter, the rod-shaped substrate 12 is formed along the second division groove 2. Is divided into a single multiple resistor. The multiple resistor A is completed by plating the same multiple resistor in a plating step and forming a nickel film and a solder film on the terminal electrode portion 14.

As described above, in the multiple resistor A, since the terminal electrode portion 14 is tapered toward the front end by the inclined wall 16, the width of the front end of the terminal electrode portion 14 is increased. Can be made larger than the conventional substantially semicircular through-hole. Therefore, as shown in FIG. 5, the bonding area with the connection portion b provided on the mounting board B by the solder C can be increased, and the bonding strength can be increased.

In the above-described embodiment, a configuration in which two resistors 7 are provided for one multiple resistor A has been described. However, the number of resistors 7 is not limited to two, and more resistors 7 may be used. It may be provided. Alternatively, as described above, the present invention is not limited to the resistor 7, but may be a capacitor, a composite of the resistor 7 and the capacitor, or a composite including a coil.

[0037]

According to the present invention, the through-holes are formed in an inverted trapezoidal shape, and the inclined terminal walls are formed on both sides of the protruding terminal electrode portion. When the side surface electrode paste spreads and spreads along the terminal electrode portion, it can be extended along the inclined wall, which can extend the extendable distance by being inclined, so that the inclined wall can be extended. Thus, the amount of holding of the side electrode paste can be increased, and the contact of the side electrode paste between adjacent terminal electrode portions can be prevented. Therefore, it is possible to prevent the occurrence of an electrical short after firing the side electrode paste.

Further, since the terminal electrode portion is tapered toward the front end, the connection area between the mounting portion of the mounting board and the terminal electrode portion of the multiple electronic component can be increased, so that the mounting strength can be improved. Can be increased.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a manufacturing process of a multiple resistor as one of multiple electronic components according to the present invention.

FIG. 2 is an explanatory diagram showing a state of division from a large-sized ceramic substrate to a rod-shaped substrate.

FIG. 3 is an explanatory plan view of a multiple resistor as one of multiple electronic components according to the present invention.

FIG. 4 is an explanatory diagram of another embodiment.

FIG. 5 is an explanatory view showing a state in which a multiple resistor as one of multiple electronic components according to the present invention is mounted on a mounting board.

[Explanation of symbols]

 3 'Through hole 5 Upper electrode 11 Second sealing glass layer 13 Side electrode paste 14 Terminal electrode part 15 Bottom wall 16 Inclined wall 17 Intersection 18 Extension prevention protrusion 19 Weir groove

Claims (1)

[Claims] A plurality of terminal electrode portions (14) are formed in rows on opposite side edges of an insulating substrate, and a concave through hole (3 ′) is formed between adjacent terminal electrode portions (14). ), The terminal electrode portion (14) is formed in a protruding shape by forming the through-hole (3 ') in an inverted trapezoidal shape. ), A slanted wall (16) is formed on both sides, and the terminal electrode portion (14) is tapered toward the tip.