JP2001335755A - Method for manufacturing base coated with thin sheet - Google Patents

Method for manufacturing base coated with thin sheet

Info

Publication number
JP2001335755A
JP2001335755A JP2000158403A JP2000158403A JP2001335755A JP 2001335755 A JP2001335755 A JP 2001335755A JP 2000158403 A JP2000158403 A JP 2000158403A JP 2000158403 A JP2000158403 A JP 2000158403A JP 2001335755 A JP2001335755 A JP 2001335755A
Authority
JP
Japan
Prior art keywords
substrate
adhesive
flat surface
thin plate
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000158403A
Other languages
Japanese (ja)
Other versions
JP4663061B2 (en
Inventor
Tomohiro Shinpo
保 朋 弘 新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2000158403A priority Critical patent/JP4663061B2/en
Publication of JP2001335755A publication Critical patent/JP2001335755A/en
Application granted granted Critical
Publication of JP4663061B2 publication Critical patent/JP4663061B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To precisely manufacture a base coated with a thin sheet without straining and distorting this sheet and without staining the base with excess adhesive. SOLUTION: A platen 21 having a flat surface 21a is placed and fixed on a chuck 20. A thin sheet glass 11 is allowed to adhere to the flat surface 21a of the platen 21, and an adhesive 12 is dropped on to the thin sheet glass 11. Then, a base 13 is placed on the adhesive 12, and the chuck 20 is rotated to diffuse the adhesive 12 between the thin sheet glass 11 and the base 13. Thus, the base coated with the sheet can be manufactured. Since the thin sheet glass 11 is placed on the flat surface 21 of the platen 21 all the time, this sheet glass 11 is neither strained nor distorted. Further, since the adhesive 12 between the thin sheet glass 11 and the base 13 is diffused by the rotation of the chuck 20 to outwardly discharge excess adhesive, the base 13 is never stained with excess adhesive 12.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、光学フィルム等を
貼り合せた機能性を有する基板に接着剤を介して薄いガ
ラス等薄板貼合せ、このようにして薄板で被覆された基
板を製造する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of bonding a thin plate such as thin glass to a functional substrate having an optical film or the like bonded thereto via an adhesive, and thus manufacturing a substrate covered with the thin plate. About.

【0002】[0002]

【従来の技術】従来、薄板で被覆された基板の製造方法
として、特願平10−340275に示されたものがあ
る。特開平10−340275に示された基板の製造方
法によれば、薄板で被覆された基板を製造することが可
能となる。
2. Description of the Related Art Conventionally, a method of manufacturing a substrate covered with a thin plate is disclosed in Japanese Patent Application No. 10-340275. According to the method for manufacturing a substrate disclosed in Japanese Patent Application Laid-Open No. H10-340275, a substrate covered with a thin plate can be manufactured.

【0003】[0003]

【発明が解決しようとする課題】上述のような従来技術
によれば、薄板で被覆された基板の製造が可能である。
しかしながら基板の製造中に薄板が歪んだりすることが
ある。
According to the prior art as described above, it is possible to manufacture a substrate covered with a thin plate.
However, the sheet may be distorted during the manufacture of the substrate.

【0004】本発明は、薄板がゆがんだり歪んだりする
ことなく、精度良く薄板で被覆された基板を製造するこ
とができる、薄板で被覆された基板の製造方法を提供す
ることを目的とする。
[0004] It is an object of the present invention to provide a method of manufacturing a substrate coated with a thin plate, which can accurately manufacture a substrate coated with the thin plate without warping or distorting the thin plate.

【0005】[0005]

【課題を解決するための手段】本発明は、回転自在チャ
ック上に、平坦面を有する定盤を平坦面を上側にして載
置し固定する工程と、定盤の平坦面に薄板を密着させる
工程と、薄板上に液体接着剤を滴下する工程と、接着剤
に基板を載置する工程と、チャックを回転させて薄板と
基板との間の接着剤を拡散させる工程と、を備えたこと
を特徴とする薄板で被覆された基板の製造方法である。
SUMMARY OF THE INVENTION According to the present invention, there is provided a step of placing and fixing a platen having a flat surface on a rotatable chuck with the flat surface facing upward, and bringing the thin plate into close contact with the flat surface of the platen. A step of dropping a liquid adhesive on the thin plate, a step of placing the substrate on the adhesive, and a step of rotating the chuck to diffuse the adhesive between the thin plate and the substrate. A method for producing a substrate covered with a thin plate.

【0006】本発明によれば、薄板は定盤の平坦面によ
り密着されるので、薄板で被覆された基板の製造中に薄
板が歪んだり、たわんだりすることはない。またチャッ
クの回転により、薄板と基板との間の接着剤を拡散させ
ることができるので、余分な接着剤により基板が汚れる
ことはない。
According to the present invention, the thin plate is adhered to the flat surface of the platen, so that the thin plate is not warped or bent during the production of the substrate covered with the thin plate. In addition, the rotation of the chuck allows the adhesive between the thin plate and the substrate to be diffused, so that the substrate is not contaminated by excess adhesive.

【0007】[0007]

【発明の実施の形態】以下、図面を参照して本発明の実
施の形態について説明する。図1乃至図7は、本発明に
よる薄板で被覆された基板の製造方法を示す図である。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 are views showing a method of manufacturing a substrate covered with a thin plate according to the present invention.

【0008】図1乃至図7において、回転自在のチャッ
ク20上に、平坦な上面(平坦面)21aを有する定盤
21(AL硝子:旭硝子社製、熱膨張係数37×10-7
/℃、厚さ6.35mm、150mm角、平坦性5μm
以下)を載置する(図1)。チャック20は真空吸着機
能を有し、定盤21を吸着固定するようになっている。
1 to 7, a platen 21 (AL glass: manufactured by Asahi Glass Co., Ltd., having a thermal expansion coefficient of 37 × 10 −7 ) having a flat upper surface (flat surface) 21 a on a rotatable chuck 20.
/ ° C, thickness 6.35 mm, 150 mm square, flatness 5 μm
(See FIG. 1). The chuck 20 has a vacuum suction function, and fixes the surface plate 21 by suction.

【0009】また、チャック20は所望により回転する
とともに、その上面外縁にストッパ22が設けられてい
る。
The chuck 20 is rotated as desired, and a stopper 22 is provided on the outer edge of the upper surface.

【0010】次に定盤21の平坦面21上に、定盤21
よりも小さい薄板ガラス11(AF45:ショット社
製、熱膨張係数45×10-7/℃、厚さ50μm、30
mm角)を載置する(図7参照)。
Next, the platen 21 is placed on the flat surface 21 of the platen 21.
Thinner glass 11 (AF45: manufactured by Shott Co., Ltd., thermal expansion coefficient 45 × 10 −7 / ° C., thickness 50 μm, 30
(mm square) (see FIG. 7).

【0011】この場合、予め定盤21の平坦面21上に
薄板ガラス11を載置しておき、その後定盤21をチャ
ック21上に載置固定してもよい。
In this case, the thin glass 11 may be placed on the flat surface 21 of the platen 21 in advance, and then the platen 21 may be placed and fixed on the chuck 21.

【0012】定盤21は平坦面21aを有しているが、
定盤21が平坦面21aを有するために、薄板ガラス1
1の平坦性を保つことができ、薄板で被覆された基板を
製造する際、基板ガラス11が歪むことはない。また後
述のようにチャック20の回転中に、定盤21から薄板
ガラス11側へ不均一な力が加わることはない。
The surface plate 21 has a flat surface 21a.
Since the platen 21 has the flat surface 21a, the thin glass 1
1 can be maintained, and the substrate glass 11 is not distorted when manufacturing a substrate covered with a thin plate. Further, as described later, during the rotation of the chuck 20, an uneven force is not applied from the platen 21 to the thin glass 11 side.

【0013】定盤21の平坦面21aの上に薄板ガラス
11を載置する場合、1枚の薄板ガラス11を載置して
もよく、複数の薄板ガラス11を載置してもよい。
When the thin glass 11 is placed on the flat surface 21a of the surface plate 21, one thin glass 11 may be placed or a plurality of thin glasses 11 may be placed.

【0014】定盤21の平坦面21aが十分な平坦性を
有する場合、平坦面21aと薄板ガラス11との間で確
実な真空密着を行なうことができるが、薄板11に対し
てブローエア28を吹付けてもよい(図6)。
When the flat surface 21a of the surface plate 21 has a sufficient flatness, reliable vacuum adhesion can be performed between the flat surface 21a and the thin glass 11, but blow air 28 is blown against the thin plate 11. (FIG. 6).

【0015】すなわち、図6に示すようにチャック20
をフード25で覆い、フード25内にブローエア28を
吹付ける。フード25内のブローエア28は、その後排
気管26から接着剤分離ボックス27を経て外方へ放出
される。このようにフード25内にブローエア28を吹
付けることにより、薄板11を定盤21の平坦面21a
に確実に密着させることができる。
That is, as shown in FIG.
Is covered with a hood 25, and blow air 28 is blown into the hood 25. The blow air 28 in the hood 25 is then discharged outward from the exhaust pipe 26 through the adhesive separation box 27. By blowing the blow air 28 into the hood 25 in this manner, the thin plate 11 is placed on the flat surface 21a of the surface plate 21.
Can be surely brought into close contact.

【0016】さらに、定盤21の平坦面21aと薄板ガ
ラス21との密着性を高めるため、定盤21上に揮発性
の有機溶剤を適量塗布してもよい。定盤21および薄板
ガラス11は、双方とも洗浄済のものを使用し、定盤2
1の平坦面21上に薄板ガラス11を載置する場合、定
盤21と薄板ガラス11との間に異物等が混入しないよ
うに、クリーンルーム内の清浄度の高いクリーンベンチ
内で載置してもよい。
Further, in order to enhance the adhesion between the flat surface 21a of the surface plate 21 and the thin glass plate 21, a suitable amount of a volatile organic solvent may be applied onto the surface plate 21. The platen 21 and the thin glass 11 are both cleaned and used.
When the thin glass 11 is placed on the flat surface 21, the glass 11 is placed on a clean bench having a high degree of cleanliness in a clean room so that foreign matter or the like is not mixed between the surface plate 21 and the thin glass 11. Is also good.

【0017】このように定盤21の平坦面21a上に薄
板ガラス11を載置することにより、薄板ガラス11自
体に多少のたわみがあっても、このたわみは定盤21の
平坦面21aにより矯正される。
By placing the thin glass 11 on the flat surface 21a of the surface plate 21 as described above, even if the thin glass 11 itself has some bending, the bending is corrected by the flat surface 21a of the surface plate 21. Is done.

【0018】次に定盤21の平坦面21a上に載置密着
された薄板ガラス11上に、ディスペンサ23から接着
剤12を滴下する(図1)。接着剤12は温度調製され
ている液送タンク(図示せず)からディスペンサ23へ
供給される。接着剤12の滴下量は、電解弁の開閉によ
り制御することができる。
Next, the adhesive 12 is dropped from the dispenser 23 onto the thin glass 11 placed and adhered on the flat surface 21a of the surface plate 21 (FIG. 1). The adhesive 12 is supplied to the dispenser 23 from a liquid feed tank (not shown) whose temperature is adjusted. The drop amount of the adhesive 12 can be controlled by opening and closing the electrolytic valve.

【0019】次に図2に示すように、薄板ガラス11に
滴下された接着剤12上に基板13が載置される。この
ような基板13としては、ソーダガラスが用いられる。
基板13を載置することにより、薄板ガラス11と基板
13との間の接着剤12は外方へ拡がっていく。
Next, as shown in FIG. 2, the substrate 13 is placed on the adhesive 12 dropped on the thin glass 11. As such a substrate 13, soda glass is used.
By mounting the substrate 13, the adhesive 12 between the thin glass 11 and the substrate 13 spreads outward.

【0020】次に図3に示すように、チャック20を高
速で回転させる。この場合、薄板ガラス11と基板13
との間に滴下された接着剤12は外周辺へ拡散し、一部
は外方へ放出される。これに伴なって、接着剤12の厚
みが低下する。薄板ガラス11と基板13との間から放
出された接着剤12は、図6に示す排気管26から接着
剤分離ボックス27において除去される。また基板13
はストッパ22により保持されるので、チャック20の
回転中に基板13が定盤20上でずれることはない。
Next, as shown in FIG. 3, the chuck 20 is rotated at a high speed. In this case, the thin glass 11 and the substrate 13
The adhesive 12 dropped between them spreads out to the outer periphery, and part of the adhesive 12 is released to the outside. Along with this, the thickness of the adhesive 12 decreases. The adhesive 12 released from between the thin glass 11 and the substrate 13 is removed from the exhaust pipe 26 shown in FIG. The substrate 13
Is held by the stopper 22, the substrate 13 does not shift on the surface plate 20 during the rotation of the chuck 20.

【0021】このように、薄板ガラス11と基板13と
の間の接着剤12を遠心力により外方へ放出することが
できるので、余分な接着剤12により基板13を汚すこ
とはない。また薄板ガラス11と基板13との間の接着
剤12の厚みは、チャック20の回転数、回転時間、接
着剤12の粘性を適宜選択することにより調整される。
As described above, since the adhesive 12 between the thin glass 11 and the substrate 13 can be discharged outward by centrifugal force, the substrate 13 is not contaminated by the excess adhesive 12. Further, the thickness of the adhesive 12 between the thin glass 11 and the substrate 13 is adjusted by appropriately selecting the number of rotations of the chuck 20, the rotation time, and the viscosity of the adhesive 12.

【0022】接着剤12として電離放射線硬化型のもの
を用いる場合は、その後薄板ガラス11と基板13との
間の接着剤12に対して電離放射線(紫外線または電子
線)を照射し、接着剤12を硬化する。
When an ionizing radiation-curable adhesive is used as the adhesive 12, the adhesive 12 between the thin glass 11 and the substrate 13 is irradiated with ionizing radiation (ultraviolet light or electron beam). To cure.

【0023】このようにして薄板ガラス11と基板13
とからなる、薄板で被覆された基板を製造することがで
きる。
Thus, the thin glass 11 and the substrate 13
And a substrate covered with a thin plate.

【0024】その後、薄板ガラス11と基板13を定盤
21から剥離用ヘラ30を用いて剥離して取除く(図5
(a)(b)(c))。この場合、分離用ヘラ30の代わりに
ブローエア28(図6参照)を用いて、薄板ガラス11
と基板13を定盤21から剥離してもよい。さらに定盤
21の平坦面21a上にリペア剤(図示せず)を塗布し
ておくことにより、薄板ガラス11と基板13の剥離を
容易に行なうことができる。
Thereafter, the thin glass 11 and the substrate 13 are peeled off from the surface plate 21 using a peeling spatula 30 (FIG. 5).
(a) (b) (c)). In this case, the blown air 28 (see FIG. 6) is used in place of the separation spatula 30, and the thin glass 11 is used.
And the substrate 13 may be separated from the surface plate 21. Further, by applying a repair agent (not shown) on the flat surface 21a of the platen 21, the thin glass 11 and the substrate 13 can be easily separated.

【0025】以上のように、本実施の形態によれば、薄
板ガラス11が歪むことなく、また余分な接着剤12に
より基板13が汚れることのない、基板で被覆された基
板を確実に製造することができる。
As described above, according to the present embodiment, a substrate covered with a substrate can be reliably manufactured without the thin glass 11 being distorted and the substrate 13 not being stained by the extra adhesive 12. be able to.

【0026】[0026]

【発明の効果】以上のように、本発明によれば、薄板が
歪んだりゆがんだりすることなく、また余分な接着剤に
より基板が汚れることのない、薄板で被覆された基板を
精度良く製造することができる。
As described above, according to the present invention, a substrate coated with a thin plate can be manufactured with high precision without distorting or distorting the thin plate and without staining the substrate with excess adhesive. be able to.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による薄板で被覆された基板の製造方法
を示す工程図。
FIG. 1 is a process chart showing a method for producing a substrate covered with a thin plate according to the present invention.

【図2】本発明による薄板で被覆された基板の製造方法
を示す工程図。
FIG. 2 is a process chart showing a method for producing a substrate covered with a thin plate according to the present invention.

【図3】本発明による薄板で被覆された基板の製造方法
を示す工程図。
FIG. 3 is a process chart showing a method for producing a substrate covered with a thin plate according to the present invention.

【図4】定盤および基板を示す平面図。FIG. 4 is a plan view showing a surface plate and a substrate.

【図5】定盤から薄板で被覆された基板を取除く工程を
示す図。
FIG. 5 is a view showing a step of removing a substrate covered with a thin plate from a surface plate.

【図6】フード内にブローエア28を吹付ける状態を示
す図。
FIG. 6 is a diagram showing a state in which blow air is blown into a hood.

【図7】定盤上に薄板ガラスを載置する状態を示す図。FIG. 7 is a diagram showing a state where thin glass is placed on a surface plate.

【符号の説明】[Explanation of symbols]

11 薄板ガラス 12 接着剤 13 基板 20 チャック 21 定盤 22 ストッパ DESCRIPTION OF SYMBOLS 11 Thin glass 12 Adhesive 13 Substrate 20 Chuck 21 Surface plate 22 Stopper

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】回転自在チャック上に、平坦面を有する定
盤を平坦面を上側にして載置し固定する工程と、 定盤の平坦面に薄板を密着させる工程と、 薄板上に液体接着剤を滴下する工程と、 接着剤上に基板を載置する工程と、 チャックを回転させて薄板と基板との間の接着剤を拡散
させる工程と、を備えたことを特徴とする薄板で被覆さ
れた基板の製造方法。
1. A step of mounting and fixing a platen having a flat surface on a rotatable chuck with the flat surface facing upward, a step of bringing a thin plate into close contact with the flat surface of the platen, and bonding a liquid to the thin plate. A step of dropping an agent, a step of placing the substrate on the adhesive, and a step of rotating the chuck to diffuse the adhesive between the thin plate and the substrate. Manufacturing method of the substrate.
【請求項2】薄板と基板との間の接着剤を拡散させた
後、薄板と基板との間の接着剤を硬化する工程を更に備
えたことを特徴とする請求項1記載の薄板で被覆された
基板の製造方法。
2. The method according to claim 1, further comprising the step of: after the adhesive between the thin plate and the substrate is diffused, curing the adhesive between the thin plate and the substrate. Manufacturing method of the substrate.
【請求項3】接着剤は電離放射線硬化性接着剤からな
り、 接着剤を硬化させる工程は、電離放射線照射により接着
剤を硬化させることを特徴とする請求項2記載の薄板で
被覆された基板の製造方法。
3. The substrate coated with a thin plate according to claim 2, wherein the adhesive comprises an ionizing radiation curable adhesive, and wherein the step of curing the adhesive cures the adhesive by irradiation with ionizing radiation. Manufacturing method.
【請求項4】定盤の平坦面にリペア剤を塗布し、その後
定盤の平坦面から薄板と基板を取除く工程を更に備えた
ことを特徴とする請求項1記載の薄板で被覆された基板
の製造方法。
4. The method according to claim 1, further comprising a step of applying a repair agent to the flat surface of the surface plate, and thereafter removing the thin plate and the substrate from the flat surface of the surface plate. Substrate manufacturing method.
【請求項5】定盤の平坦面に複数の薄板を密着させるこ
とを特徴とする請求項1記載の薄板で被覆された基板の
製造方法。
5. The method for producing a substrate covered with a thin plate according to claim 1, wherein a plurality of thin plates are adhered to a flat surface of the platen.
JP2000158403A 2000-05-29 2000-05-29 Method for manufacturing a substrate coated with a thin plate Expired - Fee Related JP4663061B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000158403A JP4663061B2 (en) 2000-05-29 2000-05-29 Method for manufacturing a substrate coated with a thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000158403A JP4663061B2 (en) 2000-05-29 2000-05-29 Method for manufacturing a substrate coated with a thin plate

Publications (2)

Publication Number Publication Date
JP2001335755A true JP2001335755A (en) 2001-12-04
JP4663061B2 JP4663061B2 (en) 2011-03-30

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001262080A (en) * 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Method for manufacturing composite substrate

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JPH04309581A (en) * 1991-04-05 1992-11-02 Seiko Epson Corp Method for bonding thin plate
JPH0944917A (en) * 1995-05-20 1997-02-14 Kitano Eng Kk Production of optical disk and placing base plate to be used for the production
JP2000160107A (en) * 1998-11-30 2000-06-13 Dainippon Printing Co Ltd Production of substrate covered with thin plate
JP2001115101A (en) * 1999-10-22 2001-04-24 Dainippon Printing Co Ltd Preparation of substrate coverd with thin sheet and its making equipment
JP2001262080A (en) * 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Method for manufacturing composite substrate

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JPH04309581A (en) * 1991-04-05 1992-11-02 Seiko Epson Corp Method for bonding thin plate
JPH0944917A (en) * 1995-05-20 1997-02-14 Kitano Eng Kk Production of optical disk and placing base plate to be used for the production
JP2000160107A (en) * 1998-11-30 2000-06-13 Dainippon Printing Co Ltd Production of substrate covered with thin plate
JP2001115101A (en) * 1999-10-22 2001-04-24 Dainippon Printing Co Ltd Preparation of substrate coverd with thin sheet and its making equipment
JP2001262080A (en) * 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Method for manufacturing composite substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001262080A (en) * 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Method for manufacturing composite substrate

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