JP2001332576A - バンプ強度改善装置及び方法、並びにバンプ形成装置 - Google Patents

バンプ強度改善装置及び方法、並びにバンプ形成装置

Info

Publication number
JP2001332576A
JP2001332576A JP2000151287A JP2000151287A JP2001332576A JP 2001332576 A JP2001332576 A JP 2001332576A JP 2000151287 A JP2000151287 A JP 2000151287A JP 2000151287 A JP2000151287 A JP 2000151287A JP 2001332576 A JP2001332576 A JP 2001332576A
Authority
JP
Japan
Prior art keywords
bump
heating
bonding strength
improving
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000151287A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001332576A5 (https=
Inventor
幸一 ▲吉▼田
Koichi Yoshida
Makoto Imanishi
誠 今西
Takaharu Mae
貴晴 前
Kazuji Azuma
和司 東
Shinji Kanayama
真司 金山
Kenji Fukumoto
健治 福本
Hiroshi Wada
浩 和田
Masachika Narita
正力 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000151287A priority Critical patent/JP2001332576A/ja
Priority to TW090116269A priority patent/TW530357B/zh
Publication of JP2001332576A publication Critical patent/JP2001332576A/ja
Publication of JP2001332576A5 publication Critical patent/JP2001332576A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP2000151287A 2000-05-23 2000-05-23 バンプ強度改善装置及び方法、並びにバンプ形成装置 Pending JP2001332576A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000151287A JP2001332576A (ja) 2000-05-23 2000-05-23 バンプ強度改善装置及び方法、並びにバンプ形成装置
TW090116269A TW530357B (en) 2000-05-23 2001-07-03 Apparatus and method for forming bumps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000151287A JP2001332576A (ja) 2000-05-23 2000-05-23 バンプ強度改善装置及び方法、並びにバンプ形成装置

Publications (2)

Publication Number Publication Date
JP2001332576A true JP2001332576A (ja) 2001-11-30
JP2001332576A5 JP2001332576A5 (https=) 2006-08-03

Family

ID=18656871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000151287A Pending JP2001332576A (ja) 2000-05-23 2000-05-23 バンプ強度改善装置及び方法、並びにバンプ形成装置

Country Status (1)

Country Link
JP (1) JP2001332576A (https=)

Similar Documents

Publication Publication Date Title
JP7368962B2 (ja) 実装装置
CN100383915C (zh) 凸起形成装置和方法
JP3857949B2 (ja) 電子部品実装装置
JP3442615B2 (ja) 基板加熱方法
JP5688277B2 (ja) 加熱装置と加熱方法
WO2000025360A1 (en) Operating method and device
JP2001332576A (ja) バンプ強度改善装置及び方法、並びにバンプ形成装置
US7052984B2 (en) Bump formation method and bump forming apparatus for semiconductor wafer
JP7219991B2 (ja) 半導体装置の製造装置および製造方法
US20040149803A1 (en) Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore
JP6678503B2 (ja) 部品実装装置、部品実装方法、部品実装装置の制御用プログラムおよび記録媒体
US20040022037A1 (en) Electronic part mounting apparatus and method
JP2000036519A (ja) バンプ接合装置及び方法、並びに半導体部品製造装置
CN118992450A (zh) 控制装置、面板搬运系统、控制方法以及程序
TW201021138A (en) Integrated alignment and bonding system
JP3833812B2 (ja) バンプ付電子部品のボンディング方法
US20020030087A1 (en) Bump bonding device and bump bonding method
JP4050741B2 (ja) バンプボンダー
JP2003264358A (ja) 画像認識に用いるカメラの温度管理方法と装置
JP4547285B2 (ja) バンプ形成装置
JP3673051B2 (ja) バンプ形成方法及びバンプボンダー
TWI827972B (zh) 半導體裝置的製造裝置以及製造方法
TW202549009A (zh) 半導體製造裝置
JPH11186325A (ja) 半導体装置の製造方法
JPH0878418A (ja) バンプ形成装置およびバンプ形成方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060615

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060615

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070109

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080219

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080624