JP2001326253A - Apparatus and method for mounting electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount an electronic part surely while minimizing the effect of dust produced when the electronic part is punched out from a carrier. SOLUTION: When a TCP 12 is punched by means of a die unit 2, the TCP 12 is sucked to the punched part 6 of an upper die 3 and held in place. The TCP 12 is received, under that state, by a pickup nozzle 13 and delivered to a mount head 19 before being transferred to the mounting position of a glass substrate 22 and mounted thereon. When the TCP 12 is punched by means of the die unit 2, the pickup nozzle 13 is positioned on the outside of the lower region of the punched hole 5 of a lower die 4 or the die unit 2 is operated on condition that the pickup nozzle 13 is positioned on the outside of the lower region of the punched hole 5 of the lower die 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for punching electronic components from a carrier and mounting the punched electronic components on a substrate.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device, there is a process of mounting a TCP (Tape Carrier Package) as an electronic component on a glass substrate constituting a liquid crystal cell. In this mounting step, an electronic component is punched out of a resin tape carrier by a mold device, the electronic component is supplied to a mount head, and the electronic component held by the mount head is applied to a substrate via an anisotropic conductive film. Pressure bonding.

[0003] An example of a mounting apparatus used in this mounting step is described in Japanese Patent Application Laid-Open No. Hei 4-32064.
According to this, an electronic component is punched from a carrier using a mold device having an upper die and a lower die, and the punched electronic component is transferred to a take-out position by laterally moving the lower die while being held by the lower die. Is done. Then, the electronic component positioned at the take-out position is taken out of the lower die by the transfer nozzle and transferred to the intermediate stage. The electronic component transferred to the intermediate stage is then sucked and held by the mount head, transferred to the substrate, and pressed.

However, in the technique described here, since the lower die moves in the lateral direction, the next lower die positioned at the take-out position must return to below the upper die to perform the next operation. Since the electronic components cannot be punched out of the carrier, there is room for improvement in work efficiency.

In order to solve this problem, for example, as described in Japanese Patent Application Laid-Open No. 10-598, an electronic component punched from a carrier is suction-held on a lower surface of a punched portion of an upper die, and a lower die is held. A proposal has been made in which the electronic component is received by a pickup nozzle from below through a punched hole formed in a mold and transferred to a mount head. According to this technique, the punched electronic component can be held by the lower surface of the punched portion of the upper mold. Therefore, whether or not the pickup nozzle is positioned below the lower mold, that is, the pickup nozzle is The next electronic component punching operation can be started at any position, and the operation efficiency can be improved.

[0006]

By the way, when a carrier is punched by a mold apparatus, dust is inevitably generated by the punching, and the dust is generated.
In the technique described in No. 8, the dust falls downward through the punched hole of the lower die. If the pickup nozzle is positioned below the punched hole at the time of punching, the dropped dust collects in the pickup nozzle and adheres to the lead of the electronic component received from the punched portion. However, if the pickup nozzle holding the electronic component punched in the previous process is positioned in the lower region of the punched hole, dust will directly adhere to the leads of the electronic component. This causes a connection failure such as a short circuit when the electronic component is mounted on the substrate.

If the means for receiving from the lower surface of the punching portion of the upper die is constituted by a pickup nozzle, dust generated by punching may cause nozzle clogging, resulting in an electronic component transfer error. As a result, reliable mounting work cannot be performed.

Accordingly, the present invention minimizes the influence of dust generated when punching electronic components from a carrier,
It is an object of the present invention to provide an electronic component mounting apparatus and an electronic component mounting method capable of reliably mounting an electronic component on a substrate.

[0009]

According to a first aspect of the present invention, there is provided a lower mold having a punched hole, to which a carrier is supplied on an upper surface side, and being driven above the lower mold. While having a punching portion that is inserted into the punching hole and punches out an electronic component from the carrier,
A mold device having an upper mold having a suction hole formed therein for sucking and holding the electronic component punched by the punching portion at a lower end surface of the punching portion; and the upper mold punched by the mold device. A first transfer unit that receives the electronic component sucked and held by the punching unit and transfers the electronic component to a delivery position to a second transfer unit, which will be described later; a first driving unit that moves the first transfer unit; A second transfer unit that receives the electronic component transferred to the transfer position by one transfer unit and transfers the electronic component to a mounting position on a substrate; a second driving unit that moves the second transfer unit; A mold device, a first driving means, a control device for controlling a second driving means, and an electronic component mounting apparatus, comprising: the control means, when punching out the electronic component by the mold device, the first Transfer And controlling said first drive means to position the means outside the lower region of the lower tool of the punching holes.

According to a second aspect of the present invention, there is provided a lower mold having a punched hole, to which a carrier is supplied on an upper surface side, and being provided above the lower mold and driven toward the lower mold to perform the punching. An upper mold having a punching portion that is inserted into the hole and punches out the electronic component from the carrier, and has a suction hole formed to suck and hold the electronic component punched out by the punching portion at a lower end surface of the punching portion. A first transfer means for receiving an electronic component punched out by the die apparatus and suction-held by the punching portion of the upper die, and transferring the electronic component to a transfer position to a second transfer means described below, A first drive unit for moving the first transfer unit; and a second transfer unit for receiving the electronic component transferred to the transfer position by the first transfer unit and transferring the electronic component to a mounting position on a substrate. Means, a second drive means for moving the second transfer means, and a control device for controlling the mold device, the first drive means, and the second drive means. The control means operates the mold apparatus on condition that the first transfer means is positioned outside a region below a punched hole of the lower mold.

According to a third aspect of the present invention, there is provided a lower mold having a punched hole, to which a carrier is supplied on an upper surface side, and the lower mold provided above the lower mold and driven toward the lower mold to perform the punching. An upper mold having a punching portion that is inserted into the hole and punches out the electronic component from the carrier, and has a suction hole formed to suck and hold the electronic component punched out by the punching portion at a lower end surface of the punching portion. Punching an electronic component from the carrier by using a provided die apparatus, holding the punched electronic component at the punched portion, and receiving the electronic component held at the punched portion by a first transfer means. Transferring the electronic component transferred to the transfer position by the first transfer means to the transfer position to the transfer position to the second transfer means; Transferring the electronic component to the board, and mounting the electronic component transferred to the board on the board, when the electronic component is punched by the mold apparatus, the first transfer means Is positioned outside the lower region of the punched hole of the lower die.

[0012]

According to the present invention, when an electronic component is punched out by the die apparatus, the electronic component is sucked and held by the punching portion of the upper die. Then, the electronic component in this state is received by the first transfer means and transferred to the delivery position. The electronic component positioned at the delivery position is transferred to the mounting position of the board by the second transfer means, and is mounted on the board. Here, in the present invention, when the electronic device is punched by the die apparatus, the first transfer means is positioned outside the area below the punched hole of the lower die, or the first transfer means is punched out of the lower die. The mold apparatus will be operated provided that it is positioned outside the lower region of the mold. Here, the region below the punched hole refers to a region including at least a region immediately below the punched hole provided in the lower die.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of the entire electronic component mounting apparatus according to the present invention, and FIG. 2 is a configuration diagram showing a state in which an upper mold of the die apparatus included in the electronic component mounting apparatus shown in FIG. 1 is closed.

First, the configuration of the entire electronic component mounting apparatus will be described with reference to FIG. The electronic component mounting apparatus 1 shown in FIG. The mold device 2
It has an upper mold 3 and a lower mold 4. In the center of the lower mold 4,
A punching hole 5 penetrating in the up-down direction is provided. On the other hand, when the upper die 3 is driven toward the lower die 4 by the action of a drive source (not shown), the punching hole 5 is formed. It has a punched part 6 to be inserted. The punching hole 5 is continuous with the downhole 7 having a larger diameter than this hole, and penetrates in the vertical direction.

The punching section 6 is provided with a suction hole 8. One end of the suction hole 8 is opened on the lower surface 6a of the punched portion 6, and the other end is connected to a suction pump 9 as a suction source via a tube (not shown). The drive of the suction pump 9 is controlled by a control device 10 as a control device.

A carrier tape 1 is provided on the upper surface of the lower mold 4.
1 is supplied. The carrier tape 11 is packaged with semiconductor chips mounted at predetermined intervals, and each time a portion where the semiconductor chips are mounted is punched out of the tape carrier 11 by the operation of the mold apparatus 2, a feeding device (not shown) is provided. Is sent by one pitch. The punched one is TCP12 as an electronic component
Becomes

Below the lower mold 4, a pickup nozzle 13 constituting a first transfer means is arranged. A suction hole is provided on the upper surface of the pickup nozzle 13 to form a suction surface 13a, and a suction force is generated on the suction surface 13a by connecting the suction hole to a vacuum pump (not shown) as appropriate. Further, the pickup nozzle 13 is a movable body 1
The movable member 14 is configured to be moved in the vertical direction by driving means (not shown), and the movable body 14 itself is also configured to be movable on the table 15 in the XY directions.

An index unit 16 is provided beside the mold apparatus 2. The index unit 16
A predetermined angle by the drive source 17, 90 in this embodiment.
It is rotationally driven intermittently by degrees. The index unit 16 includes four vertical guides 18 at 90-degree intervals.
(Only two are shown on the left and right in the figure). Each guide 18 has a mount head 19 slidable in the vertical direction and biased upward by a built-in spring (not shown), and a raised position shown by a solid line in the drawing by a stopper (not shown). Is to be maintained. This mount head 19 constitutes a second transfer means.

These mount heads 19 are moved downward by the operation of the cylinder device 20. Each cylinder device 20 is provided so as to face an individual mount head 19 when the rotation of the index unit 16 is stopped, and when the cylinder device 20 extends its rod 21,
The mount head 19 can be moved downward along the vertical guide 18.

The mount head 19 has a suction hole (not shown) opened on the lower surface thereof. The suction hole is appropriately connected to a suction pump (not shown), and a suction force is generated on the lower surface of the mount head 19 by operating the suction pump.

As described above, in the present embodiment, the index unit 16 is configured to be intermittently driven by 90 degrees, but the position of the mount head 19 shown on the left side in FIG. The position of the mount head 19 shown on the right side is the mounting position.

At the mounting position, a mounting table 23 holding a glass substrate 22 is provided. The mounting table 23 is driven in the XY directions (horizontal direction) by the XY table 24, and positions the glass substrate 22 below the mount head 19 that has reached the mounting position.

The control device 10 controls the driving of the mold device 2, the movable body 14, the drive source 17, the cylinder device 20, the XY table 24 and the like in addition to the control of the suction pump 9 described above. In particular, in controlling the mold apparatus 2, when the mold apparatus 2 is driven and the TCP 12 is punched out of the carrier tape 11 by the downward movement of the upper mold 3, the pickup nozzle 13 is inserted into the punched hole 5 of the lower mold 4. The position of the movable body 14 is controlled so as to be positioned outside the lower area of the lower mold 4, and the position of the movable body 14 is learned from a sensor (not shown).
The above-described punching operation by the mold apparatus 2 is performed on condition that the punching operation is performed outside the lower region of the mold.

Next, the electronic component mounting apparatus 1 having the above configuration.
Will be described. First, the movable body 14 having the pickup nozzle 13 is positioned at a position shown by a two-dot chain line in FIG. That is, the pickup nozzle 13 constituting the first transfer means is positioned outside the area below the punched hole 5 provided in the lower mold 4.

Next, as shown in FIG. 1, when the carrier tape 11 is fed to a predetermined position with the upper mold 3 of the mold apparatus 2 raised and the mold opened, as shown in FIG. 3 descends and punches out the TCP 12 from the carrier tape 11.

The upper mold 3 is moved from the carrier tape 11 to the TCP.
Before the punching of the die 12, in this embodiment, before the upper die 3 starts to descend, the suction pump 9 is operated by the control device 10 and the lower surface 6 a of the punching part 6 of the upper die 3 is operated.
Suction force is generated. Therefore, the carrier tape 11
The TCP 12 punched out of the lower die 4 is sucked and held by the lower surface 6a of the punched portion 6 of the upper die 3 that has entered the punched hole 5 of the lower die 4.

When the upper mold 3 has finished descending, that is, when one punching operation of the carrier tape 11 by the mold apparatus 2 has been completed, the movable body 14 moves to the left in FIG.
The pickup nozzle 13 supported by the movable body 14 at the position indicated by the solid line in FIG. 1 is positioned below the punched hole 5. Then, the pickup nozzle 13 is driven in the ascending direction by driving means (not shown), and the lower surface 6 a of the punched portion 6 is driven.
The suction surface 13a on the upper end surface is brought into contact with the TCP 12 suction-held. At that time, the suction pump 9 stops and the suction force of the suction hole 8 disappears. Instead, the TCP 12 is suction-held by the suction surface 13a of the pickup nozzle 13 where the suction force is generated.

When the TCP 12 sucks the TCP 12, the big-up nozzle 13 is driven in the downward direction to get out of the down hole 7 of the lower mold 4, and then driven horizontally to move to the position shown by the two-dot chain line in FIG. Move to the stated transfer position.

In this transfer position, one of the mount heads 19 (the left mount head 19 in FIG. 1) provided on the index unit 16 is stopped, and the pickup nozzle 13 holding the TCP 12 by suction is held.
Is positioned below the mount head 19 positioned at the transfer position.

When the upper mold 3 transfers the TCP 12 to the pickup nozzle 13, the upper mold 3 is driven in the upward direction. When the upper mold 3 is raised to a predetermined position, the carrier tape 11 is fed by a predetermined size. Next, when the suction pump 9 is operated and a suction force is generated in the suction hole 8 of the upper mold 3, the upper mold 3 is driven in the downward direction, and the carrier tape 11 is moved.
Then, the TCP 12 is punched out, and the TCP 12 stands by on the lower surface 6a of the punched portion 6 while being suction-held. In addition, at the time of this punching, similarly to the above-described punching operation,
The control device 10 knows the position of the movable body 14 from a sensor (not shown), and as a result, on condition that the pickup nozzle 13 is positioned outside the area below the punched hole 5 of the lower mold 4, 2 so as to perform the above-described punching operation. Therefore, even if the punched portion 6 is T
Even after the CP 12 is delivered to the pickup nozzle 13, until the pickup nozzle 13 is positioned outside the area below the punched hole 5 of the lower mold 4, the mold apparatus 2
Is not performed.

On the other hand, when the pickup nozzle 13 reaches below the mount head 19 at the transfer position,
The mount head 19 is driven by a cylinder device 20 in a downward direction, and the lower surface of the mount head 19 picks up the pickup nozzle 13.
Receives the TCP 12 that is adsorbed and held.

When the mount head 19 adsorbs the TCP 12 and moves up, the index unit 16 is rotated by 90 degrees. At the same time, the pickup nozzle 13 returns below the drop-out hole 7 of the lower mold 3 together with the movable body 14, and then rises into the drop-out hole 7 and is sucked and held by the lower surface 6 a of the punched portion 6 of the upper mold 3. After receiving the TCP 12, the cycle of descending and moving in the direction of the index unit 16 and delivering the TCP 12 to the mount head 19 is repeated.

The mount head 19 that has received the TCP 12 from the pickup nozzle 13 is
When the mounting position is reached by the intermittent rotation drive, the mount head 19 is driven in the downward direction by the opposed cylinder device 20 to temporarily press the TCP 12 on the glass substrate 22 held on the mounting table 23. .

The glass substrate 22 on which the plurality of TCPs 12 have been temporarily pressed in this way is conveyed to a post-process and subjected to a well-known final pressure bonding.

According to the electronic component mounting apparatus 1 described above,
In controlling the mold apparatus 2 by the control device 10, when the mold apparatus 2 is driven and the TCP 12 is punched from the carrier tape 11 by the downward movement of the upper mold 3, the pickup nozzle 13 is inserted into the punched hole 5 of the lower mold 4. The position of the movable body 14 is controlled so that the movable body 14 is positioned outside the lower region. Further, the position of the movable body 14 is known from a sensor (not shown), and the above-described punching operation by the die apparatus 2 is performed on condition that the pickup nozzle 13 is positioned outside the area below the punching hole 5 of the lower die 4. Is controlled to be executed. That is, when the TCP 12 is punched from the carrier tape 11, dust is generated, and the dust falls downward through the punched hole 5 provided in the lower mold 4 and the punched-down hole 7 connected thereto. Is generated, the pickup nozzle 13 is positioned outside the area below the punching hole 5, so that the dropped dust does not accumulate in the transfer means represented by the pickup nozzle 13, and the TCP 12 received from the punching unit 6.
Therefore, it is possible to prevent poor connection such as short-circuiting at the time of mounting the electronic component and the substrate caused by these factors.

Further, for the same reason, TC
Even when the transfer means for receiving the P12 is constituted by a suction nozzle as in the embodiment, it is possible to prevent dust generated by punching of the TCP 12 from being clogged in the nozzle. Mounting work can be performed.

In the above-described embodiment, an example in which only one pickup nozzle 13 is provided has been described. However, a plurality of nozzles may be provided and, for example, an index type may be configured like the mount head 19.

Further, in the above-described embodiment, an example has been described in which the TCP 12 punched from the carrier tape 11 is directly transferred from the pickup nozzle 13 to the mount head 19, but a buffer function may be provided midway. good.

[0039]

As described above, according to the present invention, the electronic component can be securely mounted on the substrate without being affected by dust generated when the electronic component is punched out of the carrier.

[Brief description of the drawings]

FIG. 1 is a schematic view of an entire electronic component mounting apparatus according to the present invention.

FIG. 2 is a configuration diagram illustrating a state in which an upper mold of the mold device included in the electronic component mounting apparatus illustrated in FIG. 1 is closed.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA48 GA49 GA51 GA57 HA25 JB77 MA32 MA35 NA25 NA27 NA30 PA06 5E313 AA02 AA11 AA19 CC03 CD03 CE02 CE06 DD07 DD13 DD14 DD31 EE01 EE02 EE24 FF11 FF24 FF29 5F044 PP11

Claims (3)

[Claims] 1. A lower die having a punched hole, to which a carrier is supplied on an upper surface side, and being inserted into the punched hole by being driven toward the lower die provided above the lower die. A die having a punched portion for punching an electronic component from the carrier, and an upper die having a suction hole formed on a lower end surface of the punched portion for sucking and holding the electronic component punched by the punched portion. First transfer means for receiving an electronic component punched out by the die apparatus and sucked and held by the punching portion of the upper die, and transferring the electronic part to a transfer position to a second transfer means described later; First drive means for moving the means, second transfer means for receiving the electronic component transferred to the delivery position by the first transfer means, and transferring the electronic component to a mounting position on the board; An electronic component mounting apparatus comprising: a second driving unit that moves a second transfer unit; and a control unit that controls the mold device, the first driving unit, and the second driving unit. Controlling the first driving means so as to position the first transfer means outside a region below a punched hole of the lower mold when the electronic device is punched by the mold device. Mounting device. 2. A lower mold having a punched hole, to which a carrier is supplied on the upper surface side, and being inserted into the punched hole by being driven toward the lower die provided above the lower die. A die having a punched portion for punching an electronic component from the carrier, and an upper die having a suction hole formed on a lower end surface of the punched portion for sucking and holding the electronic component punched by the punched portion. First transfer means for receiving an electronic component punched out by the die apparatus and sucked and held by the punching portion of the upper die, and transferring the electronic part to a transfer position to a second transfer means described later; First drive means for moving the means, second transfer means for receiving the electronic component transferred to the delivery position by the first transfer means, and transferring the electronic component to a mounting position on the board; An electronic component mounting apparatus comprising: a second driving unit that moves a second transfer unit; and a control unit that controls the mold device, the first driving unit, and the second driving unit. An electronic component mounting apparatus for operating the mold apparatus on condition that the first transfer means is positioned outside a region below a punched hole of the lower mold. 3. A lower mold having a punched hole, to which a carrier is supplied on an upper surface side, and being inserted into the punched hole by being driven toward the lower die provided above the lower die. A die having a punched portion for punching an electronic component from the carrier, and an upper die having a suction hole formed on a lower end surface of the punched portion for sucking and holding the electronic component punched by the punched portion. A step of punching an electronic component from the carrier using the carrier, holding the punched electronic component at the punched portion, and receiving the electronic component held at the punched portion by a first transfer unit, and a second transfer unit to be described later. Transferring the electronic component to the transfer position by the first transfer means by the second transfer means, and mounting the electronic component to the mounting position on the board. A step of transferring in a step of mounting an electronic component is transferred to the substrate on the substrate,
An electronic component mounting method comprising: when punching out the electronic component by the mold device, the first transfer means is positioned outside a region below a punched hole of the lower die. Implementation method.