JP2001326210A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating device which can quickly decompose organic matters adhering to a substrate. SOLUTION: The ozone water generated from an ozone water generator 50 is ejected upon a substrate W from an eject nozzle 20 through a pipeline 40. When the ozone water is ejected upon the substrate W, the substrate W is heated to a temperature higher than that of the ozone water by means of an induction heating coil 60. Therefore, the ozone water is heated and supersaturated ozone water is temporarily generated in a local area near the interface which is in direct contact with the surface of the substrate W. The ozone concentration of the supersaturated ozone water is the same as that of the ozone water supplied from the nozzle 20, but the temperature of the supersaturated ozone water becomes higher, because the water is heated by the substrate W. Consequently, the high-temperature ozone water containing ozone at a high concentration comes into contact with and quickly decomposes the organic matters adhering to the substrate W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a flat panel display (FPD) such as a semiconductor substrate or a glass substrate for a liquid crystal display device.
l Display), a substrate for a photomask, a substrate for an optical disk, and the like (hereinafter, simply referred to as a “substrate”) by supplying ozone water to the substrate, for example, a process for removing organic substances attached to the substrate. The present invention relates to an apparatus for performing a substrate processing.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing the above substrate, a cleaning process of the substrate has been indispensable. As one of the cleaning apparatuses for performing the substrate cleaning processing, there is a single-wafer cleaning apparatus using ozone water. This apparatus supplies ozone water to the surface of a substrate and oxidizes organic substances such as a resist with ozone to remove the organic substances and clean the surface of the substrate. As is well known, ozone has an extremely strong oxidizing power, and the substrate is cleaned using such a strong oxidizing power of ozone.

[0003]

When a cleaning process using ozone water is performed, the higher the ozone concentration in the ozone water, the faster the decomposition rate of organic substances is increased, and the time required for the cleaning process can be shortened. In general, the solubility of gas in water increases as the temperature of the water decreases, and the same tendency applies to ozone water. That is, as the temperature of the ozone water is lowered, a large amount of ozone is dissolved in the water, so that a high-concentration ozone water can be obtained.

On the other hand, the decomposition rate of organic substances depends not only on the concentration of ozone in ozone water but also on the temperature during the reaction. As the reaction temperature increases, the oxidation reaction is activated, and the decomposition rate of organic substances increases.

Therefore, when low-temperature ozone water is supplied, the ozone concentration in the ozone water can be increased, but the reaction temperature is low, so that the decomposition rate of organic substances cannot be remarkably increased. Conversely, when high-temperature ozone water is supplied, the reaction temperature is high,
Because the ozone concentration in the ozone water must be low,
As a result, similarly to the above, the decomposition rate of organic substances could not be remarkably increased. In other words, in the conventional ozone water cleaning, the decomposition rate of organic substances cannot be remarkably increased due to the inconsistency of the characteristics of the ozone concentration in the ozone water and the decomposition rate of organic substances with respect to temperature. However, a relatively long time is required, and the throughput of the apparatus is reduced.

The present invention has been made in view of the above problems, and has as its object to provide a substrate processing apparatus capable of rapidly decomposing organic substances attached to a substrate.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for processing a substrate by supplying ozone water to the substrate.
Holding means for holding the substrate, ozone water supply means for supplying ozone water to the substrate held by the holding means,
Heating means for heating the substrate to a higher temperature than ozone water supplied by the ozone water supply means.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the holding means is a mounting table having a plane size larger than the plane size of the substrate to be held, and the ozone water supply is performed. The means includes an atmosphere blocking plate that is disposed to face the mounting table across the substrate held by the mounting table and has a plane size larger than the plane size of the substrate, and the mounting table holds the substrate. Means for supplying ozone water between the atmosphere blocking plate and the outer periphery of the substrate held by the mounting table, and a fluid resistance applying means for suppressing passage of fluid between the mounting table and the atmosphere blocking plate; Is provided.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the heating means includes a holding means heating means for heating the substrate by heating the holding means. Included.

According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to the first or second aspect, wherein the heating means directly heats the substrate held by the holding means by radiant heat. Is included.

According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects,
The ozone water supplied by the ozone water supply means is saturated ozone water.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<1. First Embodiment> FIG. 1 is a view showing an entire configuration of an example of a substrate processing apparatus according to the present invention. This substrate processing apparatus is an ozone water cleaning apparatus that removes organic substances such as a resist attached to a substrate by discharging ozone water onto the substrate, and mainly includes a spin base 10 for holding the substrate W, and an ozone water cleaning apparatus. Discharge nozzle 2 to discharge
0, an ozone water generator 50 that generates ozone water, a pipe 40 that guides the generated ozone water to the discharge nozzle 20,
And an induction heating coil 60.

The spin base 10 is a disk-shaped member made of a ferrite-based alloy (for example, ferrite-based stainless steel). The spin base 10 holds one substrate W in a substantially horizontal posture by gripping the edge of the substrate W with a plurality of holding pins 15 erected on its upper surface. Note that three or four holding pins 15 are provided upright on the upper surface of the spin base 10.
Only one is shown).

The center of the lower surface of the spin base 10 is connected to the motor shaft 11 of the motor 12. Accordingly, the motor 12 can rotate the spin base 10, and by rotating the spin base 10, the substrate W held on the spin base 10 can be rotated in a substantially horizontal plane about the vertical direction as an axis. . In addition,
The spin base 10 is not limited to a mode in which the edge of the substrate W is mechanically gripped, but may be a mode in which the substrate W is held by vacuum suction.

The discharge nozzle 20 is a straight type nozzle that discharges ozone water in a straight line (rod shape) substantially perpendicularly to the main surface of the substrate W held by the spin base 10, that is, substantially vertically downward. The discharge nozzle 20 is connected to the ozone water generator 50 via a pipe 40,
A valve 41 is provided in the middle of the pipe 40.
Note that the discharge nozzle 20 is not limited to a straight type nozzle, and may be a shower type nozzle that discharges ozone water in a shower shape, or a spray type nozzle that discharges ozone water in a spray shape. There may be.

The ozone water generator 50 has a pure water supply source 52.
And the ozone gas supply source 53 are connected. The ozone water generator 50 is supplied with pure water from a pure water supply source 52 by a pump 51 and is supplied with ozone gas from an ozone gas supply source 53. The ozone water generator 50 generates ozone water by dissolving ozone gas in the supplied pure water.

The ozone water generator 50 includes a cooling unit 5.
5 are provided. The cooling unit 55 has a function of cooling the supplied pure water or the generated ozone water.

The induction heating coil 60 includes the spin base 10
, And is electrically connected to the high-frequency power supply 65. The induction heating coil 60 receives power supply from the high frequency power supply 65 and heats the spin base 10 with a high frequency induction current. The spin base 10 is made of a ferrite-based alloy for induction heating, and the spin base 10 may be made of another material, for example, carbon as long as the material can perform induction heating. Note that a resistance heating element may be provided inside the spin base 10 in place of the induction heating coil 60 to heat the spin base 10.

In this embodiment, the spin base 10 corresponds to a holding unit, the discharge nozzle 20 corresponds to an ozone water supply unit, and the induction heating coil 60 corresponds to a heating unit.

Next, a procedure of a cleaning process using ozone water in the substrate processing apparatus having the above configuration will be described.
First, the ozone water generator 50 dissolves the ozone gas supplied from the ozone gas supply source 53 into the pure water supplied from the pure water supply source 52 to generate ozone water. At this time, the ozone water generator 50 generates saturated ozone water in which ozone gas is dissolved to the limit (solubility). Further, at the time of generating ozone water, the cooling unit 55 may cool the pure water or the ozone water being generated to increase the solubility of ozone to further increase the ozone concentration in the ozone water.

Next, the valve 41 is opened, the generated ozone water flows through the pipe 40, and the ozone water is discharged from the discharge nozzle 20 toward the substrate W. When the ozone water is discharged, the spin base 10 is heated by the induction heating coil 60, and the heat of the spin base 10 is transmitted to the substrate W by heat conduction, so that the substrate W is heated. That is, the induction heating coil 60 is connected to the spin base 10.
The substrate W is indirectly heated via the substrate. At this time, the induction heating coil 60 sets the substrate W to a temperature higher than ozone water supplied to the substrate W by the discharge nozzle 20.
Is heating.

The ozone water supplied from the discharge nozzle 20 onto the substrate W decomposes and removes organic substances and the like attached to the substrate W by oxidation, and cleans the substrate W. When supplying the ozone water, the ozone water may be discharged from the discharge nozzle 20 to the substrate W while the substrate W held on the spin base 10 is rotated by the motor 12.

As described above, in the present embodiment, the substrate W is heated to a higher temperature than the ozone water supplied by the discharge nozzle 20. In simple terms, the substrate W is cleaned by supplying low-temperature ozone water to the high-temperature substrate W. The significance of such a cleaning method and the phenomenon occurring between the ozone water and the substrate W will be described in more detail.

FIG. 2 is a diagram showing the correlation between the concentration of ozone in ozone water and the decomposition rate of organic substances. In FIG. 2, the temperature of the ozone water is constant. As shown in the figure,
Under the condition of constant temperature, the organic substance decomposition rate is almost proportional to the ozone concentration in the ozone water, and the organic substance decomposition rate increases as the ozone concentration increases.

FIG. 3 is a diagram showing the correlation between the temperature of ozone water and the decomposition rate of organic substances. In FIG. 3, the ozone concentration in the ozone water is constant. As shown in the figure, under the condition that the ozone concentration is constant, the higher the temperature of the ozone water, the more the oxidation reaction is activated, and the faster the decomposition rate of organic substances.

From the above, it can be said that it is preferable to supply ozone water having a high ozone concentration and high temperature to the substrate W in order to quickly decompose and remove organic substances and the like attached to the substrate W.

FIG. 4 is a graph showing the correlation between the temperature of ozone water and the concentration of ozone in the ozone water, and is a so-called solubility curve of ozone in water. As with general gases, the higher the temperature, the lower the solubility of ozone in water. This means that it is impossible to obtain ozone water having a high ozone concentration and high temperature, that is, ozone water suitable for decomposing organic substances in an equilibrium state (stable form).

FIG. 3 and FIG. 4 show that the characteristics of the ozone concentration in the ozone water and the decomposition rate of the organic matter with respect to the respective temperatures are contradictory.
Conventionally, the decomposition rate of organic substances cannot be remarkably increased due to this.

For this reason, conventionally, ozone water having a temperature and an ozone concentration at which an optimum balance for the decomposition of organic substances is obtained is supplied to the substrate W. FIG. 5 is a diagram for explaining the actual organic matter decomposition rate in consideration of the temperature and the ozone concentration of the ozone water. Solid line L1 in the figure
FIG. 3 is a diagram showing a correlation between a temperature and an organic matter decomposition rate, which is the same as FIG. A dashed line L2 is a diagram showing a correlation between the temperature and the ozone concentration, and is the same as that in FIG. The actual organic substance decomposition rate including the influence of temperature on both the organic substance decomposition rate and the ozone concentration is as shown by a dashed line L3 in the figure. The actual decomposition rate of the organic substance is a curve that projects upward with respect to the temperature, and the point P1 in the curve L3 where the decomposition rate of the organic substance is maximized is the optimum point for cleaning the substrate. Therefore, conventionally, ozone water at a temperature corresponding to the point P1 is supplied to the substrate.

On the other hand, in the present embodiment, low-temperature ozone water is supplied to the substrate W having a higher temperature. As is clear from FIG. 4, if the temperature is low, ozone water having a high ozone concentration can be obtained in an equilibrium state. The high temperature substrate W
To supply. Since the ozone water is not heated until it comes into contact with the substrate W, a stable state (saturated state) can be maintained.

FIG. 6 is a diagram showing a state in which low-temperature ozone water is supplied to a high-temperature substrate W. Here, the temperature of the supplied ozone water OW is T1, and the temperature of the substrate W and the resist R attached thereto is T2 (where T2> T
1). When the low temperature / high ozone concentration saturated ozone water OW is supplied to the high temperature substrate W and comes into contact with the resist R, heat conduction occurs from the substrate W and the resist R toward the ozone water OW. In a local region near the interface, the temperature of the ozone water OW rises. Since the supplied ozone water OW is in a saturated state, its temperature is T
If it rises above 1, it becomes supersaturated ozone water.

That is, in a local region near the interface between the resist R and the ozone water OW which is in direct contact with the resist R, supersaturated ozone water is generated temporarily, and the supersaturated ozone water adheres to the substrate W. The resist R is decomposed and removed. The ozone concentration of the supersaturated ozone water generated near the interface between the resist R and the ozone water OW is as high as that of the ozone water supplied from the discharge nozzle 20 (the ozone water generated by the ozone water generator 50). Moreover, the temperature is higher than T1. That is, since the ozone water having a high ozone concentration and a high temperature comes into contact with the organic matter attached to the substrate W, the organic matter attached to the substrate W can be rapidly decomposed.

This will be further described with reference to FIG. 5. In a local region near the interface between the resist R and the ozone water OW, the ozone water OW is heated to become supersaturated ozone water, and the correlation between the temperature and the ozone concentration is obtained. Is shifted to the high temperature side and moves to the solid line L4. That is, the ozone water in the region has a correlation between the temperature and the ozone concentration as indicated by a solid line L4 exceeding the actual solubility. Accordingly, the actual organic substance decomposition rate including the effect of temperature on both the organic substance decomposition rate (L1) and the ozone concentration (L4) is as shown by the solid line L5 in the figure. The decomposition rate of the organic substance also becomes a curve protruding upward with respect to the temperature, and the point P2 in the curve L5 where the decomposition rate of the organic substance is the maximum is the optimum point for the substrate cleaning. Therefore, in the present embodiment, if the temperature of the substrate W is set to a temperature corresponding to the point P2, the organic matter decomposition rate can be maximized. As shown in FIG. 5, the decomposition rate of the organic substance at the point P2 is higher than the decomposition rate of the organic substance at the point P1, and the organic substances attached to the substrate W can be decomposed more rapidly than in the related art.

When the temperature difference between the temperature T1 of the ozone water OW and the temperature T2 of the substrate W and the resist R attached thereto is relatively small, supersaturated ozone water is generated in a local region near the interface as described above. However, if the temperature difference is relatively large, ozone foaming may occur as shown in FIG. Such foaming is a phenomenon that occurs when ozone water that cannot maintain a supersaturated state returns to a saturated state. When foaming occurs, ozone water O
The ozone concentration of W drops to its solubility at that temperature.

However, such a bubble-like ozone gas has a role of compensating ozone in ozone water consumed for decomposing organic substances. That is, the decomposition of the organic matter is caused by the oxidation reaction, the ozone in the ozone water is consumed according to the amount of the decomposed organic matter, and the ozone concentration of the ozone water OW in the local region near the interface is higher than the solubility. descend. The ozone gas foamed in the ozone water OW in which the ozone concentration is lower than the solubility is redissolved, and the ozone concentration of the ozone water OW is returned to the solubility (to a saturated state).

Therefore, the foamed ozone gas is not wasted, but is redissolved and contributes to the decomposition of the organic matter. Therefore, the ozone concentration of the ozone water OW is maintained at the solubility for a long period of time (at a saturated state). Thus, the organic substances attached to the substrate W can be decomposed more quickly than before.

<2. Second Embodiment> FIG. 7 is a diagram showing a main part configuration of another example of the substrate processing apparatus according to the present invention. This substrate processing apparatus is also an ozone water cleaning apparatus that removes organic substances such as resist adhering to the substrate by discharging ozone water onto the substrate, and uses an atmosphere blocking plate 25 as an ozone water supply means and a lamp as a heating means. A labyrinth mechanism 80 as a fluid resistance applying means is provided between the spin base 10 and the atmosphere blocking plate 25 using the heater 70.
Is provided.

The spin base 10, which is a means for holding the substrate,
This is a mounting table having a plane size larger than the plane size of the substrate W to be held. Like the first embodiment, the edge of the substrate W is gripped by the plurality of holding pins 15 erected on the upper surface thereof. Holds one substrate W in a substantially horizontal posture. The spin base 10 is connected to a motor (not shown) via a motor shaft 11 and is rotatable in a substantially horizontal plane.

The atmosphere shielding plate 25 is a hollow plate-shaped member which is disposed to face the spin base 10 with the substrate W held by the spin base 10 therebetween and has a plane size larger than the plane size of the substrate W. The atmosphere shielding plate 25 is made of a material (for example, quartz) that transmits light well. The atmosphere blocking plate 25 is connected to an ozone water generator 50 (the same as that shown in FIG. 1) through a pipe 40, and has a number of small holes 26 at the bottom thereof. The ozone water sent from the ozone water generator 50 flows inside the atmosphere blocking plate 25 and is supplied from a number of small holes 26 to the space between the spin base 10 holding the substrate W and the atmosphere blocking plate 25. .

The lamp heater 70 is a light source that is connected to a power supply (not shown) and emits light by supplying power from the power supply. The lamp heater 70 is a radiant heat heating unit that irradiates light to the substrate W and directly heats the substrate W by radiant heat accompanying the light irradiation.

A UV cut filter 71 is arranged between the lamp heater 70 and the atmosphere blocking plate 25. UV
The cut filter 71 is a member that blocks ultraviolet light of light emitted from the lamp heater 70 and transmits light of other wavelengths. The reason that only the ultraviolet light out of the light emitted from the lamp heater 70 is blocked is that the ultraviolet light decomposes ozone and changes it into oxygen. The reason why the atmosphere blocking plate 25 is made of quartz or the like is to transmit light emitted from the lamp heater 70 toward the substrate W.

The labyrinth mechanism 80 includes the spin base 10
Outer periphery of the substrate W held by the spin base 10
And the atmosphere blocking plate 25. The labyrinth mechanism 80 is configured by alternately combining three fixed plates 81 provided on the spin base 10 and two fixed plates 82 provided below the atmosphere blocking plate 25.
As shown in FIG. 7, the atmosphere shielding plate 25 and the spin base 1
Although the space between 0 and 0 is communicated with the external space, the labyrinth mechanism 80 exists as a passage obstacle that suppresses the passage of the fluid. That is, the ozone water supplied from the small holes 26 to the space between the spin base 10 and the atmosphere blocking plate 25 flows through the labyrinth mechanism 80 and flows out to the outside. It is. Note that a thin tube may be provided in place of the labyrinth mechanism 80 as long as it can be a fluid resistance.

The configuration other than the above (for example, the ozone water generator 50) is the same as that of the first embodiment, and a description thereof will be omitted.

The procedure of the cleaning process using ozone water in the apparatus of the second embodiment is the same as that of the first embodiment.
That is, ozone water is generated in the ozone water generator 50, and the ozone water is supplied to the space between the spin base 10 and the atmosphere blocking plate 25 from the small holes 26 of the atmosphere blocking plate 25 via the pipe 40. The supplied ozone water forms a liquid flow toward the outer periphery of the substrate W, and flows out through the labyrinth mechanism 80 to the outside. When ozone water is supplied to the substrate W, light irradiation from the lamp heater 70 is performed, and the substrate W is heated by radiant heat. At this time, the substrate W is heated to a temperature higher than the supplied ozone water as in the first embodiment.

The low-temperature ozone water is replaced with the substrate W having a higher temperature.
The effect of supplying to the substrate W is as described above, and the organic substances attached to the substrate W can be decomposed more quickly than in the past.

In the second embodiment, since the labyrinth mechanism 80 has fluid resistance, the labyrinth mechanism 80
The amount of ozone water supplied from the atmosphere blocking plate 25 is larger than the amount of ozone water flowing out of the apparatus from outside, and the space between the spin base 10 and the atmosphere blocking plate 25 is filled with ozone water. Then, the atmosphere shielding plate 25
When the ozone water is further supplied from, a pressure higher than the atmospheric pressure is applied to the space between the spin base 10 and the atmosphere blocking plate 25.

Therefore, even if supersaturated ozone water in which ozone is dissolved in supersaturation is supplied from the ozone water generator 50,
Bubbling of ozone in the space between the spin base 10 and the atmosphere blocking plate 25 can be suppressed, and a decrease in ozone concentration of ozone water in contact with the substrate W can be prevented. Therefore, the surface of the substrate W can be cleaned with ozone water having a higher ozone concentration than in the first embodiment, and organic substances attached to the substrate W can be more quickly decomposed.

<3. Modifications> While the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described examples. For example, the lamp heater 70 of the second embodiment may be used as a heating unit instead of the induction heating coil 60 in the first embodiment. Conversely, in the second embodiment, instead of the lamp heater 70, the induction heating coil 60 or the resistance heating element of the first embodiment may be used as a heating unit. In this case, the material of the atmosphere shielding plate 25 is not limited to quartz, but may be ceramic or resin that does not transmit light.
That is, in either the first embodiment or the second embodiment, the substrate W is heated to a higher temperature than the supplied ozone water.
What is necessary is just to provide the heating means which can heat.

When the induction heating coil 60 or the resistance heating element is used as a heating means, the substrate W is indirectly heated via the spin base 10.
Must be considerably higher than the temperature of the substrate W, and the heat loss increases, but the ozone water is not heated at all until it comes into contact with the substrate W. Accordingly, it is possible to prevent a decrease in ozone concentration due to ozone foaming before the substrate W is supplied, and to supply ozone water having a low temperature and a high ozone concentration to the substrate W having a high temperature.

On the other hand, when the lamp heater 70 is used as a heating means, the supplied ozone water itself is heated by radiant heat due to light irradiation, and the ozone concentration is slightly reduced (ozone loss) due to ozone foaming. It is simple and can easily and uniformly heat the substrate W. Moreover, since the substrate W can be directly heated,
Heat loss can also be minimized.

In the second embodiment, a large number of small holes 26 are provided at the bottom of the atmosphere shielding plate 25. Instead, one discharge port directly connected to the pipe 40 is provided at the bottom of the atmosphere shielding plate 25. And ozone water may be supplied from the discharge port.

Further, the ozone water to be supplied does not necessarily need to be saturated ozone water, but may be ozone water having a solubility equal to or lower than the solubility. However, since the supply of the saturated ozone water has a higher ozone concentration, the organic substances attached to the substrate W can be decomposed more quickly.

[0054]

As described above, according to the first aspect of the present invention, since the substrate is heated to a higher temperature than the ozone water supplied by the ozone water supply means, the ozone having a low temperature and a high ozone concentration can be obtained. Since the water is supplied to the high-temperature substrate, the ozone water in contact with the substrate is heated, and the ozone water having a high ozone concentration and high temperature comes into contact with the organic substances adhered to the substrate. The decomposed organic matter can be rapidly decomposed.

According to the second aspect of the present invention, since the fluid resistance applying means for suppressing the passage of the fluid is provided, a pressure higher than the atmospheric pressure is applied to the space between the mounting table and the atmosphere blocking plate. As a result, supersaturated ozone water can be supplied, and organic substances attached to the substrate can be decomposed more quickly.

According to the third aspect of the present invention, since the substrate is heated by heating the holding means, the ozone water is not heated before being supplied to the substrate. A decrease in ozone concentration due to foaming can be prevented.

According to the fourth aspect of the present invention, since the substrate held by the holding means is directly heated by radiant heat, the substrate can be easily and uniformly heated.
Substrate heat loss can be minimized.

According to the fifth aspect of the present invention, since the supplied ozone water is saturated ozone water, it is possible to decompose organic substances attached to the substrate more quickly.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of an example of a substrate processing apparatus according to the present invention.

FIG. 2 is a diagram showing a correlation between an ozone concentration in ozone water and an organic matter decomposition rate.

FIG. 3 is a diagram showing the correlation between the temperature of ozone water and the decomposition rate of organic substances.

FIG. 4 is a diagram showing the correlation between the temperature of ozone water and the concentration of ozone in ozone water.

FIG. 5 is a diagram for explaining an actual organic matter decomposition rate in consideration of the temperature and ozone concentration of ozone water.

FIG. 6 is a diagram showing a state in which low-temperature ozone water is supplied to a high-temperature substrate.

FIG. 7 is a diagram showing a main part configuration of another example of the substrate processing apparatus according to the present invention.

[Explanation of symbols]

 Reference Signs List 10 spin base 20 discharge nozzle 25 atmosphere blocking plate 60 induction heating coil 70 lamp heater 80 labyrinth mechanism OW ozone water R resist W substrate

Claims (5)

[Claims] 1. A substrate processing apparatus for processing a substrate by supplying ozone water to the substrate, comprising: holding means for holding the substrate; and ozone for supplying ozone water to the substrate held by the holding means. A substrate processing apparatus comprising: a water supply unit; and a heating unit that heats the substrate to a temperature higher than ozone water supplied by the ozone water supply unit. 2. The substrate processing apparatus according to claim 1, wherein the holding unit is a mounting table having a plane size larger than a plane size of the substrate to be held, and the ozone water supply unit is held on the mounting table. An atmosphere blocking plate that is disposed to face the mounting table with the substrate sandwiched therebetween and has a plane size larger than the plane size of the substrate, and that ozone is placed between the mounting table and the atmosphere blocking plate that hold the substrate. A substrate processing unit that supplies water and is provided on a periphery of the substrate held by the mounting table, wherein a fluid resistance applying unit that suppresses passage of a fluid is provided between the mounting table and the atmosphere blocking plate. apparatus. 3. The substrate processing apparatus according to claim 1, wherein the heating unit includes a holding unit heating unit configured to heat the substrate by heating the holding unit. apparatus. 4. The substrate processing apparatus according to claim 1, wherein the heating unit includes a radiant heat heating unit that directly heats the substrate held by the holding unit by radiant heat. Processing equipment. 5. The substrate processing apparatus according to claim 1, wherein the ozone water supplied by the ozone water supply means is a saturated ozone water.